Tuesday, June 25th 2019
GIGABYTE Launches X570 Aorus Master Motherboard
GIGABYTE today officially launched its latest addition to the Aorus series of motherboards, made for the new generation of Ryzen 3000 series processors. The "Master" as it is called, is an impressive feat of engineering designed to handle even the most power-hungry Ryzen CPUs like the 16 core Ryzen 9 AMD recently showcased.
For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.
Here are the specifications of X570 Master board:
For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.
- Supports AMD 3rd Gen Ryzen / 2nd Gen Ryzen / 2nd Gen Ryzen with Radeon Vega Graphics/ Ryzen with Radeon Vega Graphics Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- Direct 14 Phases Infineon Digital VRM Solution with PowIRstage
- Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
- Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
- Intel WiFi 6 802.11ax 2T2R & BT 5
- Rear 125dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9118 DAC with WIMA Audio Capacitors
- Realtek 2.5 GbE + Intel Gigabit LAN with cFosSpeed
- USB TurboCharger for Mobile Device Fast Charge Support
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
- Smart Fan 5 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection
- Front & Rear USB 3.2 Gen2 Type-C Headers
- Integrated Base Plate & I/O Shield Armor
- Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
29 Comments on GIGABYTE Launches X570 Aorus Master Motherboard
And now launched these expensive mobos without him...
If we disable these RGB LEDs available on every high end motherboard it's one of nicer GIGABYTE motherboard..
This Angled metal ATX 24pin look much newer and nicely replace 20 years old standard 24 pin.
Intel is probably full aware that PCI-E 4.0 Interface is not reason for upgrade instantly from PCI-E 3.0 but it's very small chance that informed enthusiasts who replace platform after 2-3-4-5 years because it's time for his upgrade to decide to buy old PCI-E 3.0 Interface and we all know that all next devices will be made in PCI-E 4.0 except cheaper.
How Intel allowed such scenario.