NVIDIA's upcoming GB300 NVL72 "Blackwell Ultra" rack-scale systems are reportedly going to get a humanoid robot assembly, according to sources close to Reuters. As readers are aware, most of the traditional manufacturing processes in silicon manufacturing, PCB manufacturing, and server manufacturing are automated, requiring little to no human intervention. However, rack-scale systems required humans for final assembly up until now. It appears that Foxconn and NVIDIA have made plans to open up the first AI-powered humanoid robot assembly plant in Houston, Texas. The central plan is that, in the coming months as the plant is completed, humanoid robots will take over the final assembly process entirely removing humans from the manufacturing loop.

And this is not a bad thing. Since server assembly typically requires lifting heavy server racks throughout the day, the humanoid robot system will aid humans by doing the hard work, thereby saving workers from excessive labor. Initially, humans will oversee these robots in their operations, with fully autonomous factories expected later on. The human element here will primarily involve inspecting the work. NVIDIA has been laying the groundwork for humanoid robots for some time, as the company has developed NVIDIA Isaac, a comprehensive CUDA-accelerated platform designed for humanoid robots. As models from Agility Robotics, Boston Dynamics, Fourier, Foxlink, Galbot, Mentee Robotics, NEURA Robotics, General Robotics, Skild AI, and XPENG require models that are aware of their surroundings, NVIDIA created Isaac GR00T N1, the world's first open humanoid robot foundation model, available for anyone to use and finetune.

During a recent Gigabyte Nan-Ping factory tour, members of the media/press encountered trays of brand-new bare motherboards and graphics cards. HWCooling's Jan Olšan noticed the presence of a not-yet-launched RDNA 4 product. Fortunately, the manufacturer granted photo access (two examples are below). A full report outlined multiple products and production pipelines, but Olšan's scoop serves as a nice preview of things to come. We anticipate TechPowerUp's W1zzard de-shrouding of numerous custom Radeon RX 9060 XT designs, early on next month. Prior to the publication of comprehensive evaluations, HWCooling's article provided an early insight: "a wild Radeon RX 9060 XT appears…take note of the graphics card in the top-right corner of the first lot of PCBs—this is likely the first publicly shown PCB of the Radeon RX 9060 XT, which, technically speaking, may still be under NDA. So enjoy this privileged look at the exposed Navi 44 chip."

Olšan linked the factory specimen to a freshly revealed design: "the card will go on sale June 5, with reviews a day earlier. Its design matches AMD's official renderings, and its identity is further pointed at by the unusual three display connectors. This should be the PCB for the Gaming version of the card, or more specifically, the Gaming OC model with three fans. The cooler will significantly overhang the PCB, with a pass-through window under the last fan." Last week, the TechPowerUp team spent hands-on time with Gigabyte's premium Radeon RX 9060 XT Gaming OC SKU. Prior to Computex 2025, product registration information pointed to the Taiwanese manufacturer readying Gaming OC 16 GB and 8 GB variants. Curiously, the company's RDNA 4 custom card portfolio is represented by a lone ultra-premium AORUS ELITE flagship option and various triple-fan Gaming OC models.

What if NVIDIA's GeForce RTX 5090 GPU had access to not one but four 16-pin power connectors? Not only would it draw much less power per connector, thus avoiding overheating of the connector in some cases, but the power coming into the GB202 could theoretically scale to 2,400 Watts. This is precisely what NVIDIA tested with its latest leaked GeForce RTX 5090 GPU engineering sample. Pictured below is a PCB that was destroyed after testing. Around the edges of the card, you can spot several USB headers, pin test points, and diagnostic connectors. These features are standard on development samples but are removed from retail models. On the I/O bracket, there are five display outputs, which are more than what you usually find on a gaming card. This suggests NVIDIA was testing output strength and signal quality under different loads. Since we can't see the back side of the board, it's unclear if the chip itself is from the GeForce RTX 5090 series or the RTX PRO 6000 Blackwell variant. However, it is most likely a super early sample of RTX 5090 before volume production began.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

Today, we are looking at the latest benchmark results for NVIDIA's upcoming RTX PRO 6000 "Blackwell" workstation-class GPU. Based on the new GB202 GPU, this professional visualization card features an impressive 24,064 CUDA cores distributed across 188 streaming multiprocessors, with boost clocks up to 2,617 MHz. It also introduces 96 GB of GDDR7 memory with full error‑correcting code, a capacity made possible by dual‑sided 3 GB modules. In Geekbench 6.4.0 OpenCL trials, the PRO 6000 Blackwell registered a total score of 368,219. That result trails the gaming‑oriented GeForce RTX 5090, which posted 376,858 points despite having fewer cores (21,760 vs. 24,064 of RTX PRO) and a lower peak clock of 2,410 MHz versus the 2617 MHz of RTX PRO.

A breakdown of subtests reveals that the workstation card falls behind in background blur (263.9 versus 310.7 images per second) and face detection (196.7 versus 241.5 images per second), yet it leads modestly in horizon detection and Gaussian blur. These mixed outcomes are attributed to pre‑release drivers, a temporary cap on visible memory (currently limited to 23.8 GB), and power‑limit settings. If the card ran on release drivers, software (especially OpenCL) could greatly benefit from more cores and higher max frequency. One significant distinction within the RTX PRO 6000 family concerns power consumption. The Max‑Q Workstation Edition is engineered for a 300 W thermal design point, making it suitable for compact chassis and environments where quiet operation is essential. It retains all 24,064 cores and the full 96 GB of memory, but clocks and voltages are adjusted to fit the 300 W budget. By contrast, the standard Workstation and Server models allow a thermal budget of up to 600 W, enabling higher sustained frequencies and heavier compute workloads in full‑size desktop towers and rack‑mounted systems.

Over the past weekend, members of the Chiphell discussion board started posting truly NDA-busting photo material—one example made headlines a few days ago. A fairly convincing list of next-gen NVIDIA RTX PRO Blackwell series graphics cards appeared online just over a month ago; only a smattering of physical specimens have emerged since then. As pointed out by interested Chiphellers, Leadtek Chinese language websites have started listing a small selection of upcoming "Blackwell" generation professional SKUs.

The previously leaked PCB design was linked to Leadtek/NVIDIA's "blower-style" RTX PRO 6000 Blackwell Max-Q Workstation Edition 96 GB model. A brave Chiphell forumite has shared shots of another alleged internal component; a shorter PCB design has come to light—in VideoCardz's expert opinion, this stubby unit is destined to be contained within the Leadtek-made (non-Max-Q) RTX PRO 6000 Blackwell Workstation Edition enclosure. Official Team Green promotional renders have already presented this darker alternative to existing Founders Edition gaming-oriented siblings. According to VideoCardz, Team Green's Professional Blackwell series review embargo is still in effect and official launch window information is still not a publicly-known quantity. The freshly leaked bare PCB seems to borrow design elements—namely a dual-sided GDDR7 memory module mounting setup—from NVIDIA's familiar GeForce RTX 5090 Founders Edition model.

NVIDIA has significantly advanced professional graphics by rebranding its workstation lineup as "RTX PRO" and incorporating an amazing 96 GB of GDDR7 memory capacity into a single RTX PRO 6000 card. This marks the first time 3 GB GDDR7 modules have been employed in a workstation GPU, each supporting error-correcting code for enhanced reliability. By arranging 16 such modules on each side of the PCB, NVIDIA achieves the remarkable 96 GB capacity while maintaining a TDP limit of 300 W for its Max-Q variant (pictured below) and up to 600 W for other SKUs. A recent leak on the Chiphell forum provides a clear insight into the new PCB layout. The customary 12 V-6×2 power connector has been omitted and replaced by four solder points intended for a cable extension.

This design choice suggests preparation for both Server and Max-Q editions, where power inputs are relocated to the rear of the card. Despite the simplified power interface and reduced footprint, the Max-Q model retains the full GB202 Blackwell GPU and the complete memory capacity. At the top of the series, the RTX PRO 6000 Blackwell will be offered in three distinct configurations. The Workstation and Server editions feature 24,064 CUDA cores, 96 GB of GDDR7 ECC memory, and a 600 W power budget, ensuring consistent performance in desktop towers and rack-mounted systems. The Max-Q edition employs the identical GPU and memory configuration but limits power consumption to 300 W through lower clocks and power limits, making it particularly well suited for compact chassis and noise-sensitive environments.

ASUS has quietly added a useful new feature called "Equipment Installation Check" to its ASUS ROG Astral GeForce RTX 5090 series graphics cards, and many users only noticed it after a recent GPU Tweak III update. This tool watches for any unwanted tilt or sag in the GPU and sends an alert if it spots more movement than ASUS thinks is safe. The secret sauce here is a tiny Bosch Sensortec BMI323 inertial measurement unit, or IMU. It's essentially an accelerometer and gyroscope in one, and it costs just a couple of US Dollars. Tracking the card's angle lets GPU Tweak III know when you might need to give your graphics card a little extra support. That's especially handy for models like the air-cooled ROG ASTRAL RTX 5090, which can weigh about 3 kg and put real stress on your motherboard's PCIe slot over time. Equipment Installation Check joins two other hardware monitoring tools ASUS already offers.

Additionally, some features like Power Detector+ monitors each of the 16-pin 12 V rails for any odd current spikes. Thermal Map shows temperatures from sensors scattered around the PCB so you can spot hotspots at a glance. Together, these features give you power, heat, and tilt monitoring all in one place. Most PC builders use third-party GPU brackets or reinforced PCIe slots to hold up heavy cards. Some of those supports might be optional because the software will remind you if it senses a problem or if a support bracket slips or loosens. That's a big deal if you only move your desktop once in a blue moon and don't notice slow shifts in component alignment. GPUs keep getting bigger and more demanding mechanically, so it's easy to forget that they're also a mechanical load on your system, especially when moving the PC for cleaning or part upgrades.

OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs. OTC is seeking to establish mass production technology by October 2025 at its Joetsu Plant in Joetsu City, Niigata Prefecture, which has a proven track record and advanced development and production capabilities in the field of high multilayer, high-precision, large-format PCBs for semiconductor inspection equipment.

AI processing requires the transmission of vast data volumes between graphics processing unit (GPU) semiconductors and memory. As semiconductor performance increases, the memory installed is also required to have high-speed, high-frequency, and high-density data transfer capabilities. HBM features a stacked DRAM structure, requiring technology capable of fabricating wafers even more thinly and precisely. This configuration also requires that the PCBs used in inspection equipment meet even higher levels of performance and quality.

GALAX has deliberated over the fine-tuning of its pedigree custom GeForce RTX 5090D design throughout early 2025—mid-way through April we heard about an imminent retail release of the Chinese manufacturer's finalized Hall of Fame (HOF) Extreme Overclock (XOC) Limited Edition card. According to the latest reports, the brand has announced the availability of its ultra-premium option; featuring the very best pre-binned GB202 GPU dies and GDDR7 memory modules. Apparently reserved for upper echelon buyers; with a 29,999 RMB (~$4117 USD) launch price tag.

In parallel, GALAX seems to be launching two "lesser" variants—as reported by VideoCardz, the "OC LAB Plus-X" (~$3595 USD) and "OC LAB" (~$3582 USD) SKUs make do with single 12V-2×6 power connectors. Despite this handicap, the Plus-X model is still a record breaker. Naturally, its XOC LE sibling—enabled with twin 12V-2×6 power inputs—sits atop global benchmark tables. GALAX currently boasts about this design achieving nine overclocking world records. Given the limited edition nature of GALAX's top 29,999 RMB offering, stock counts could be small—VideoCardz did not pick up on any local information about launch numbers or involved retail outlets/platforms. There are mutterings about a potential closing off of GB202 "Blackwell" GPU die shipments into China—in effect this could lead to the end of GeForce RTX 5090D 32 GB custom card production.

Igor's Lab has run independent testing and thermal analysis of NVIDIA's latest GeForce RTX 50-series graphics cards, including the add-in card partner design RTX 5080, 5070 Ti, and 5060 Ti, which are now attracting attention for surprising thermal "hotspots" on the back of their PCBs. These hotspots are just the areas on PCB that get hot under load, and not the "Hot Spot" sensor NVIDIA removed with RTX 50 series. Infrared tests have shown temperatures climbing above 100°C in the power delivery region, even though the GPU die stays below 80°C. This isn't a problem with the silicon but with concentrated heating in clusters of thin copper planes and via arrays. Card makers like Palit, PNY, and MSI have all seen the same issue since they closely follow NVIDIA's reference PCB layout and use similar cooler mounting. A big part of the trouble comes down to how PCB designers and cooler engineers work separately.

NVIDIA's Thermal Design Guide gives AIC partners detailed power-loss budgets, listing worst-case dissipation for the GPU, memory, NVVDD and FBVDDQ rails, inductors, MOSFETs, and other components, and it recommends ideal thermal interface materials and mounting pressures. The guide assumes that even heat is spreading and that there is perfect airflow in a wind tunnel, but actual consumer PCs don't match those conditions. Multi-layer PCBs force high currents through 35 to 70 µm copper layers, which join at tight via clusters under the VRMs. Without dedicated thermal bridges or reinforced vias, these areas become bottlenecks where heat builds up, and the standard backplate plus heat-pipe layout can't pull it away fast enough.

GIGABYTE's GeForce RTX 5060 Ti EAGLE OC graphics card model was officially unveiled on Tuesday (April 15). Two days later, the manufacturer's PR team disclosed extra in-depth details—a hype-up section stated: "(our) EAGLE series features a design inspired by the fusion of aerospace battleships and sci-fi elements, making it a preferred choice for sci-fi enthusiasts and younger users...These graphics cards are more than just components—they become battleships within the system, enhancing the overall aesthetic and immersive experience.⁠" Yesterday's press release did not delve into under-the-hood information, but reviewers have discovered that GIGABYTE's engineering department has bunged an extra short PCB design into the new-gen EAGLE's dual-fan enclosure.

Germany's HardwareLuxx received samples for evaluation purposes—directly from three brands: the aforementioned GeForce RTX 5060 Ti EAGLE OC 16 GB SKU, as well as MSI's GAMING TRIO model, and PALIT's Infinity 3 card. The site's editor—Andreas Schilling—was enchanted by the EAGLE's diminutive setup; both externally and internally. As explained at the beginning of HardwareLuxx's review, a main highlight is the brand-new product's size: "at 215 mm, the card is particularly short. Also striking is the 8-pin connector located directly behind the slot cover—an unusual position for the additional power supply. Equally striking is the short PCI Express connector. Since the GeForce RTX 5060 Ti features a PCI Express interface with eight lanes, Gigabyte eliminates the need for a longer PCB and shortens the connector accordingly." GIGABYTE has likely deployed its dinky PCB layout in new WINDFORCE (standard and overclocked) options. VideoCardz believes that the shorter design is reserved for dual-fan cards. By rule of thumb, triple-fan cooled cards are available with the regular length board and connector. Even GIGABYTE's upcoming GeForce RTX 5060 OC Low Profile 8G (182 mm) model sticks with a "full-sized" PCIe interface.

AMD Radeon RX 9070 XT and RX 9070 "MBA" models have turned up for sale through Chinese black market channels; with local PC hardware enthusiasts quickly snapping up these "reference design" curios—for "scientific" analysis, and in some cases: bragging rights. Officially, Team Red has relied on its board partners to produce an all-custom first wave of RDNA 4 gaming graphics cards. Recent discoveries of authentic-looking "Made by AMD" specimens suggested a very limited distribution of first-party units to trusted partners. According to a fresh ITHome news article, Team Red's Radeon RX 9070 XT reference PCB design was fully revealed via a comprehensive teardown. Kyogre shared heavily watermarked photos with the online publication; showcasing their disassembly of a "leaked" example.

Team Red's proprietary triple-fan cooling solution and backplate were removed; leading to the exposure of gory innards. ITHome provided a quick rundown visual clues—the analyzed unit features: "dual PCIe 8-Pin power supply interfaces, and a black shell with a tough and simple shape. It is about three slots thick and is equipped with a rear open and ventilated cooling backplane with a core back frame...Looking deeper into the internal structure of the graphics card, we can find that this graphics card is equipped with five heat pipes, the corresponding position of the GPU core uses a copper base, and the surrounding memory positions are also in contact with the metal frame through thermal pads. In addition, it is equipped with four video output interfaces."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the introduction of an enhanced revision of DDR5 R-DIMM memory to the market. Based on the newly released JEDEC revision standards for DDR5 R-DIMM, the new G.SKILL R-DIMM memory features a 16-layer PCB for improved signal integrity, as well as adding two transient voltage suppression (TVS) diodes and a fuse for voltage protection. Designed for enterprise servers and professional workstations, the new DDR5 R-DIMM memory brings cutting-edge advancements to performance and protection.

Improved Signal Integrity with 16-Layer PCB
These new DDR5 R-DIMM memory modules feature an advanced 16-layer PCB, a significant upgrade from previous 8- or 10-layer designs. The increase in the PCB layer count improves signal integrity for better reliability and stability in data transmission, even under high-performance or overclocked workloads - making it an ideal DDR5 R-DIMM memory choice for high-performance computing applications on servers or workstations.

German overclocking specialist Der8auer has showcased a custom water block for NVIDIA's flagship RTX 5090 Founders Edition, achieving a remarkable 30-degree Celsius reduction in core GPU temperatures. The prototype copper cooling solution demonstrated peak operating temperatures of just 43.8°C, compared to the stock cooler's 73.8°C under identical testing conditions. The design features an all-copper construction with a substantial 14 mm-thick cold plate, engineered specifically for optimal thermal transfer from the GB202 die. While maintaining the dual-slot form factor of the original Founders Edition cooler, the water block incorporates multiple cooling channels beneath a transparent top panel that reveals the coolant flow.

Memory temperatures also significantly improved, dropping by 38 degrees Celsius below stock measurements. Despite its impressive thermal performance, the prototype faces several engineering challenges. The team was constrained by the graphics card's display output ribbon cable, which prevented a more compact design closer to the actual PCB dimensions. Additionally, the Founders Edition card's unique split PCIe finger design presented structural concerns that require additional reinforcement before any potential commercial release. Der8auer's prototype prioritizes function over aesthetics, omitting common features like RGB lighting in favor of raw cooling performance. The water block's industrial design reflects its proof-of-concept nature, though the transparent top panel offers practical utility for monitoring coolant flow. While no retail release timeline has been announced, Der8auer indicated that addressing the PCIe slot structural support issue remains a critical milestone before any commercial version could be considered.

ASUS China has launched an extensive customer support program addressing potential graphics card damage linked to its PCIe Q-Release Slim mechanism. The initiative includes full motherboard replacements, compensation packages, and warranty coverage for affected customers. The compensation package encompasses a 200 RMB ($27) store credit and complete motherboard replacement for affected units across multiple product lines, including the Z790, B860, Z890, B850, and X870 series motherboards. Particularly, the affected motherboard lineup includes high-end models like the ROG Maximus Z890 Extreme and ROG Crosshair X870E Hero. The controversy centers on the mechanism's internal peg design, which reportedly can affect graphics card PCIe connectors during repeated installation and removal cycles.

ASUS China has confirmed the development of a revised Q-Release Slim design, though no specific timeline has been announced. Warranty coverage varies by graphics card manufacturer. ASUS and MSI have committed to priority repairs and free card replacements for both PCB wear and gold finger damage when repairs prove unsuccessful. However, Gigabyte and Colorful cards require evaluation at repair centers before determining coverage eligibility. This regional response contrasts sharply with ASUS's US position, which maintains that internal testing shows no correlation between the Q-Release Slim mechanism and graphics card damage. While ASUS continues to defend the mechanism's design integrity internationally, its comprehensive response in the Chinese market suggests a more cautious approach to potential hardware compatibility issues. We must wait and see if the worldwide ASUS position will change in the coming days and if the North American department issues any different response.

Yes, the title is correct. One of NVIDIA's GeForce RTX 5090D "China" edition GPUs, not the regular RTX 5090, managed to run at 3.4 GHz under liquid nitrogen. With a staggering 575 W default TDP, Tony Yu, ASUS China's general manager, has performed physical modifications that allow the card to run up to 1000 W TDP. The RTX 5090D is a China-exclusive variant with virtually no difference from the regular RTX 5090, just limited general AI capability due to US export regulations. ASUS China used its top-end Astral OC variant for this stunt, which, as we proved in our review of the regular ASUS RTX 5090 Astral OC, has some pretty good chip binning, allowing the card to reach the highest overclock. We pushed the regular RTX 5090 Astral OC GPU on air to 3086 MHz, a +277 MHz over the stock boost setting. However, the RTX 5090D equivalent under LN2 manages to reach 3,390 MHz at peak loads, which is a +581 MHz difference.

For memory, the overclock is equally impressive with 34 Gbps. Regarding performance, the LN2-overclocked RTX 5090D surpassed stock performance by approximately 16%. During benchmark tests, the GPU outperformed multiple previous-generation graphics cards, including a dual RTX 3090 Ti configuration in Port Royal and a quad GTX 1080 Ti setup in Fire Strike. Power consumption figures indicate that 1,760 W was used in total for a rig with ASUS ROG Astral RTX 5090D, which is paired with the Ryzen 7 9800X3D on the ASUS ROG X870E Hero motherboard. This roughly yields a 1,000 W power consumption by the card, which has seen its PCB get physical modifications to output such high power.

A fake AMD Ryzen 7 9800X3D processor was recently discovered through AMD's after-sales service inspection in China after a customer reported their CPU wouldn't boot. The counterfeit unit revealed several technical discrepancies that distinguish it from genuine processors, though these differences are difficult to spot without detailed examination. While authentic Ryzen 7 9800X3D processors use PCB number 33050, the counterfeit unit featured PCB number 32546—a designation typically associated with Ryzen 7000 series R7 or R9 processors. This suggests the counterfeiters may be repurposing older generation chips or PCBs to create fake 9000 series processors. The physical appearance of the counterfeit unit showed additional inconsistencies.

Genuine Ryzen 9000 series processors feature a distinctive blue PCB, while the fake unit displayed a dark green coloration characteristic of older models. Component patches adjacent to the PCB also failed to match the standard configuration of the Ryzen 9000 series. In a notable error, some counterfeit units were mislabeled as "Ryzen 9 9800X3D"—a model number that doesn't exist in AMD's product lineup. For comparison, legitimate Ryzen 7 9800X3D units can be identified by their blue-tinted PCB, while older models like the R9 7900X and R7 7700X feature dark green PCBs. The information was initially shared on Chiphell by sources within the PCB manufacturing industry, who provided side-by-side comparisons of authentic and counterfeit units. AMD's after-sales service has confirmed that processors purchased outside official distribution channels will not receive warranty support or service protection. Buyers should buy CPUs only thought official sale distributors to avoid such cases.

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

Details of ASUS' next generation BTF 2.0 (BTF stands for Back to the Future) platform have appeared online, courtesy of Andreas Schilling from HardwareLuxx. The editor posted pictures from an ASUS presentation over at Bluesky that details one major change to the power connector design, which will make the BTF 2.0 graphics cards compatible with non BTF systems. This suggests that ASUS might consider offering more graphics cards with BTF 2.0 support, since they can be used in any system with the proposed changes.

As you may or may not know, the first generation BTF graphics cards ended up with a power connector at the rear, bottom edge of the graphics cards, placed somewhat behind the PCIe gold fingers. The cards also lacked any other power connectors, which made them exclusive for BTF builds. To solve this conundrum, ASUS moved its GC-HPWR PCB power connector up on the PCB, making sure it clears any motherboard components. However, instead of increasing the height of the motherboard BTF 2.0 connector, the company provides a small adapter that plugs in between the motherboard and graphics card, to make its new BTF 2.0 cards compatible with any system.

YUNZII has introduced its latest mechanical keyboard, the AL65 QMK/VIA aluminium keyboard, at CES 2025. The AL65 features a CNC-anodized aluminium frame and a distinctive hollow side-cut design that enhances both its aesthetics and RGB lighting effects. The keyboard is equipped with south-facing LEDs capable of displaying 16.8 million colors, with transparent PC keycaps to amplify the lighting. It supports QMK/VIA, allowing users to remap keys, create macros, and adjust lighting on both Windows and macOS systems. The AL65 offers tri-mode connectivity with wired, Bluetooth, and 2.4 GHz wireless options, powered by an 8000mAh battery for extended use. Its gasket-mounted structure reduces typing noise and provides a softer feel while sound-dampening foam layers minimize vibrations. A hot-swappable PCB supports both 3-pin and 5-pin switches, enabling users to customize the keyboard with different mechanical switches easily. With its robust build, versatile connectivity, and customizable features, the AL65 is designed to cater to a wide range of users, from typists to gamers.

NVIDIA's GeForce RTX 5090 graphics card printed circuit board has allegedly been shown in the flesh, showing the memory layout and some interesting engineering choices. The custom PCB variant (non-Founders Edition) houses more than 40 capacitors, which is perhaps not standard on the FE reference board, and 16 GDDR7 memory modules. The leaked PCB, which extends beyond standard dimensions and traditional display connector configurations, is reportedly based on NVIDIA's PG145 reference design. The memory modules are distributed systematically: five on the left, two below, five on the right, and four above the GPU die. The interface is PCIe 5.0 x16.

As NVIDIA has reportedly designated 32 GB GDDR7 memory capacity for these cards, this roughly translates into 16 x 2 GB GDDR7 memory modules. At the heart of the card lies what sources claim to be the GB202 GPU, measuring 24×31 mm within a 63×56 mm package. Power delivery uses a 16-pin 12V-6x2 power connector, as expected. The entire PCB features only a single power connector, so the 16-pin 12V-2x6, but with an updated PCIe 6.0 CEM specification, is the logical choice.

Thermal Grizzly's Thermal Putty offers a premium alternative to traditional thermal pads. It is electrically non-conductive, easy to apply, and functions as a flexible gap filler that compensates for height differences. This makes it an ideal replacement for thermal pads in graphics cards. Graphics cards are typically equipped with thermal pads of varying heights from the factory. When replacing these pads or upgrading to a GPU water cooler, matching replacement pads are necessary.

TG Thermal Putty can compensate for height differences from 0.2 to 3.0 mm, making it a versatile solution. Thermal Putty can be applied in two ways. Firstly, it can be applied over large areas using the included spatulas. Alternatively, it can be applied manually (gloves are recommended). When applied by hand, small beads can be shaped to fit the specific contact surfaces (e.g., VRAM, SMD).

Both pictures and videos of a partial teardown of Apple's recently launched Mac mini with the M4 SoC have appeared online courtesy of various Chinese sources. There are at least two interesting parts to these partial teardowns and they're related to storage and WiFi. On the storage front, Apple has moved away from having soldered NAND chips straight on the main PCB of the Mac mini, to instead having them on a custom PCB which is similar to M.2, but a custom Apple design. The PCB pictured contained a pair of 128 GB NAND chips and with the source of the teardown being from China, there's also a video showing a repair shop desoldering the two chips and replacing them with two 1 TB chips, or in other words, the SSD was upgraded from 256 GB to 2 TB.

The upgrade brought with it some extra performance as well, even if the write speed remained at a comparatively slow 2900 MB/s, the read speed went up from 2000 MB/s to 3300 MB/s which is a significant gain in performance. This is obviously not a consumer friendly upgrade path, but we'd expect to see third party upgrade options at some point in the future, assuming there's no black listing of third party storage modules. The NAND controller is still likely to be integrated into Apple's SoC, but the PCB that the NAND flash chips are mounted onto appears to have some kind of SPI flash on it as well, which might make third party upgrades a lot harder.

Gigabyte, the world's leading computer brand, proudly announces that the AORUS Z890 series motherboards are now officially available for purchase. Designed to maximize the performance of the latest Intel Core Ultra processors, the groundbreaking D5 Bionic Corsa technology was introduced along with advanced thermal management and optimized power design on these boards. GIGABYTE's continuous partnership with HWiNFO further enhances the boards with real-time monitoring of CPU vCore power phase outputs and efficiency. With these powerful boards now on sale, users can enjoy unmatched performance and seamless customization, making them the ideal platform for enthusiasts and professionals.

D5 Bionic Corsa is the core technology for AORUS Z890 series motherboards, which leverages AI-enhanced innovations across software, hardware, and firmware to boost DDR5 memory speeds to an unprecedented 9500+ MT/s. The AI SNATCH Engine, powered by advanced AI overclocking models, optimizes configurations for DDR5 XMP memory and CPUs, enabling up to 20% faster speeds. With XMP AI BOOST and CPU AI BOOST, users can achieve world-class overclocking performance with just one click. The AI-driven PCB Design enhances signal integrity by reducing reflection by 28.2%, while HyperTune BIOS fine-tunes the Memory Reference Code (MRC) for peak performance. The VRM Thermal Balance mechanism ensures heat dissipation across the VRM with a heatpipe design, while optimized PWM firmware balances current output for superior stability.