New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Intel's Core Ultra 3 205 processor's spec sheet appeared online for a short period of time—members of the Team Blue subreddit discovered an official product page (now removed) and other related details. In part, discussion focused on the alleged lower-end "Arrow Lake-S" (ARL-S) desktop CPU being "reserved for OEMs." Previously, this SKU's existence was leaked out at various points back in 2024. VideoCardz has kindly preserved the latest set of information, prior to its removal from Intel's official web presence—showing a potential new addition to the Core Ultra 200S (Series 2) lineup.

The Core Ultra 3 205 model appears to slot into a segment previously occupied by (now retired) budget-oriented Pentium and Celeron products—based on the specification sheet listing of a 57 W TDP (aligning with past ratings). The Maximum Turbo Power limit is 76 W. Team Blue has inadvertently revealed that this is an eight-core processor, comprised of four Lion Cove P-Cores and four Skymont E-Cores—so 8 (4P + 4E). The performance-oriented cores can (Max Turbo) boost up to 4.9 GHz, while the efficiency-focused units are capable of reaching up to 4.4 GHz. The on-board AI Boost NPU is rated for a peak rating of 13 TOPS (Int8). The Core Ultra 3 205's GPU seems to only utilize two out of the four available Arc Xe-LPG cores. The product page mentioned that the Core Ultra 3 205 is due for launch in Q1 2025, although the "Market Status = Launched" segment adds to the confusion surrounding this now de-listed SKU.

The world of mini PCs keeps on growing, thanks to a boost in popularity made possible by the impressive efficiency and performance improvements brought to the table by the silicon giants, allowing compact systems to function just as well as full-fledged towers. The Morefine M6S Plus is yet another addition to the list of mini PCs, and it appears that the system prioritizes portability and compactness over raw performance. For a sizeable chunk of casual desktop users, even entry-level processors pack enough computing grunt to ease through their workloads, and that demographic is exactly what the M6S Plus targets.

With dimensions of 7.2 x 7.2 x 4.2 cm, the Morefine M6S Plus is commendably compact indeed. As mentioned, the computing horsepower offered is very limited, thanks to the quad-core Intel N150 processor that lacks Hyper-Threading. The memory is, unfortunately, not user upgradeable, so customers are will have to stick the 12 GB of LPDDR5-4800 memory on offer. The storage however, is upgradeable, thanks to the M.2 2242 slot which can accommodate up to 4 TB of storage. In terms of connectivity, the options are acceptable, including dual Type-C ports with DP, gigabit ethernet, triple USB 3.2 Gen 1Type-A ports (two on the front), HDMI 2.1, as well as a headphone jack.

Thanks to the informative breakdown by Chips and Cheese, we are learning that AMD's latest Ryzen AI processors for laptops, codenamed "Strix Halo," utilize a parallel "sea of wires" interconnect system between their chiplets, replacing the SERDES (serializer/deserializer) approach found in desktop Ryzen models. The processor's physical implementation consists of two Core Complex Dies (CCDs), each manufactured on TSMC's N4 (4 nm) process and containing up to eight Zen 5 cores with full 512-bit floating point units. Notably, the I/O die (IOD) is also produced using the N4 process, marking an advancement from the N6 (6 nm) process used in standard Ryzen IODs on desktops. The key change lies in the inter-chiplet communication system. While the Ryzen 9000 series (Granite Ridge) employs SERDES to convert parallel data to serial for transmission between chiplets, Strix Halo implements direct parallel data transmission through multiple physical connections.

This design achieves 32 bytes per clock cycle throughput and eliminates the latency overhead associated with serialization/deserialization processes. The parallel interconnect architecture also removes the need for connection retraining during power state transitions, a limitation present in SERDES implementations. However, this design choice necessitates additional substrate complexity due to increased connection density and requires more pins for external connections, suggesting possible modifications to the CCD design compared to desktop variants. AMD's implementation required more complex substrate manufacturing processes to accommodate the dense parallel connections between chiplets. The decision to prioritize this more challenging design approach was driven by requirements for lower latency and power consumption in data-intensive workloads, where consistent high-bandwidth communication between chiplets is crucial.

Courtesy of serial leaker @momomo_us, who dug up the product pages for Intel's two new retail boxed CPU coolers, we now know what they'll look like ahead of them shipping. The two coolers are known as the Laminar RH2 and Laminar RM2, with the RH2 being the higher-end model of the two. The RH2 has a copper heat column that attaches to aluminium fins and it's decorated with an aRGB LED ring, as well as a white Intel LED logo. It stands 71 mm tall from the base of the heatsink to the top of the fan and is overall 103 x 103 mm and it weighs in at 450 grams. It's rated for CPUs up to 65 W TDP and the fan operates between 1000 and 3000 rpm and supports variable speed via PWM control. It will output 23 dBA at 1600 RPM with the CPU at 40 degrees C, according to the specs. It appears to come with some kind of back plate and it's screwed in place. It will only ship with the Intel Core Ultra 9 Processor 285 for now.

The much more basic RM2 cooler is designed for 65 W TDP CPUs and it measures 100 x 100 mm, but it only stands 47 mm tall. Here only the base of the cooler is made out of copper, the fins are once again made from aluminium and this results in a lower weight of 340 grams. The fan speed range is 600 to 3250 rpm and we're looking at a PWM controlled fan here too. The downside is that the fan has to run at 2400 rpm to produce the same 40 degrees at the inlet with a 65 W CPU underneath it, which results in a noise level of 30 dBA, which is a lot louder than the RH2. Unlike the RH2, the RM2 uses standard Intel socket push-pins for mounting. The RM2 will ship with the Intel Core Ultra 5 Processor 225, 225F, 235, 265 and 265F CPUs, but according to the product page, it will also ship with some Core Ultra 7 desktop chips. Both coolers come with a three-year warranty. Design wise, both of the new coolers are a lot less flashy compared to the previous generation of Intel CPU coolers.

GIGABYTE, the world's leading computer brand, unveiled its next-gen AI PCs at CES 2025. GiMATE, a groundbreaking AI agent for seamless hardware and software control, takes center stage in the all-new lineup, redefining gaming, creation, and productivity in the AI era. Powered by NVIDIA GeForce RTX 50 Series Laptop GPUs and NVIDIA NIM microservices for advanced AI NIM and RTX AI, AMD Ryzen AI, Intel NPU AI, and enhanced by Microsoft Copilot, the AORUS MASTER, GIGABYTE AERO, and the GIGABYTE GAMING series deliver cutting-edge performance with upgraded WINDFORCE cooling in sleek, portable designs.

GiMATE, GIGABYTE's exclusive AI agent, integrates with an advanced Large Language Model (LLM) and the "Press and Speak" feature, making laptop control more natural and intuitive. From AI Power Gear II for optimal energy efficiency to AI Boost II's precision overclocking, GiMATE ensures optimal settings for every scenario. AI Cooling delivers 0dB ambiance, perfect for work environments, while AI Audio and AI Voice optimize sound for any setting. Safeguard your screen with AI Privacy, which detects prying eyes and activates protection instantly. GiMATE aims to be users' smart AI Mate, that redefines laptops in users' daily lives.

Acer today announced refreshes to the well-rounded Swift Go series and the eco-friendly Aspire Vero 16 laptops, combining enhanced computing performance, power efficiency, stunning displays, and sustainable designs in the evolving AI PC era. The Swift Go 14 and Swift Go 16 laptops offer seamless productivity and adaptability in any work environment, with streamlined AI task execution and multi-day battery life, wrapped in ultra-thin and light designs. Available with 3K OLED or 2K IPS touch display configurations, these laptops deliver striking visuals to complement their eye-catching exteriors.

The Aspire Vero 16, a carbon-neutral laptop and the world's first to incorporate bio-based oyster shell material, now features a chassis made from a combination of more than 70% post-consumer recycled (PCR) plastic and bio-based material. The bold innovation from Acer offers a sustainable laptop option without compromising performance or durability. All the new laptop devices are equipped with Intel Core Ultra 200H series processors and built-in Intel Arc graphics built-in, engineered to scale accelerated AI performance and maximize efficiency for work and creation. Mobile workers will also appreciate the new Acer Connect 5G mobile Wi-Fi and Acer Wave D7 Wi-Fi dongle, providing high-speed internet connections anywhere, anytime.

MSI, a global leader in computing solutions, is excited to announce the launch of its latest innovation in mini PCs: the Cubi NUC AI Series. This new lineup features the Cubi NUC AI+ 2M and the Cubi NUC AI 1UM, both carefully designed to deliver exceptional performance in impressively compact formats.

Cubi NUC AI+ 2M: The Ultimate Copilot+ PC
Measuring just 0.826 liters, the Cubi NUC AI+ 2M sets a new standard for mini PCs. Despite its compact size, it is powered by an Intel Core Ultra Processor from the Lunar Lake platform and comes with AI tools designed to enhance productivity and improve the user experience. Equipped with a dedicated AI Boost NPU, it functions as a Copilot+ PC, seamlessly integrating with AI-driven applications like CoCreator, Windows Studio Effects, Live Captions, and Live Translation—making it ideal for both professional and personal use. One of its standout features is the one-touch fingerprint power button, which provides both security and convenience. Additionally, a dedicated Copilot button offers instant access to AI assistance, streamlining workflows and daily tasks. The built-in microphone and speaker further enrich the user experience, enabling smooth communication and voice-activated commands. Connectivity is another strong point, with two Thunderbolt 4 ports, one of which supports up to 100 W Power Delivery input. This means the Cubi NUC AI+ 2M can be powered directly through a monitor using a Type-C connection, minimizing cable clutter and simplifying your setup.

Intel has ceased production of its basic RS1 Laminar CPU cooler, marking the end of its most affordable cooling solution. The RS1, which debuted alongside Intel's 12th-generation processors in 2021, represented a modest upgrade from earlier stock coolers. Its aluminium construction and 47 mm profile, coupled with a redesigned five-blade fan, delivered adequate cooling for 65-watt processors despite its lightweight 260-gram build. The decision to discontinue the RS1 appears largely driven by its limited application scope. The cooler shipped exclusively with two dual-core processors: the Pentium Gold G7400 and Celeron G6900. With both chips operating at a modest 46 W TPD, the basic cooling capacity of the RS1 proved sufficient but ultimately too specialized for broader market demands.

Moving forward, Intel will rely on its RM1 cooler as the primary replacement. The RM1 shares similar dimensions with the RS1 but incorporates a copper base plate for enhanced thermal transfer and features an LED accent light. Intel recently launched the Intel Processor 300, essentially a rebranded Pentium G7400, shipped with the RM1 cooler, suggesting the company had already begun phasing out the RS1. The RM1 now serves as Intel's standard cooling solution across most of its locked CPU lineup, from Core i3 through Core i7 processors in the 12th through 14th generations. This standardization will help the company cut costs, focusing on products with broader compatibility and market appeal. For users and system builders, the change should have minimal impact, as the RM1 offers superior cooling capabilities compared to its discontinued predecessor.

Intel and AMD are both widely expected to hit the market with new high-performance mobile chips at CES 2025. We expect Team Blue to lift the curtains on its Core Ultra 200H and 200HX lineup, whereas Team Red will strike back with its Strix Halo products, a few of which were leaked recently with promising performance. However, that's not all that we expect from the x86 behemoths, as both are poised to introduce mid-range and budget offerings as well.

Interestingly, it appears that Intel has already pulled back the veil on its Raptor Lake-H Refresh-based Core 200H lineup, which has been revealed as the Core Processor series. The lineup consists of mostly rebadged Raptor Lake-H chips, with some confusing choices. The products, based on the Intel 7 node, are as follows.

China has announced the development of its latest quantum system, combining the Xiaohong-504, a 504-qubit superconducting quantum chip, with the Tianyan-504 quantum computer. The breakthrough comes from China Telecom Quantum Group (CTQG), which will use the new supercomputer to boost national telecommunications security. The Xiaohong-504 chip reportedly demonstrates impressive specifications in critical areas including qubit lifetime, gate fidelity, and circuit depth, comparable with established quantum platforms such as IBM. The first Xiaohong-504 processor is scheduled for delivery to QuantumCTek, a quantum technology company based in Anhui Province, where it will begin extensive testing of kilo-qubit measurement and control systems.

While the Tianyan-504 represents a major achievement, it currently ranks behind some international competitors in terms of qubit count. Atom Computing's 1,180-qubit prototype was revealed in late 2023, and IBM's 1,121-qubit Condor processor maintains the lead in raw qubit numbers. The development of the Tianyan-504 was a collaborative effort between CTQG, the Chinese Academy of Sciences, and QuantumCTek. The system will be integrated into the Tianyan quantum cloud platform, which has already demonstrated significant international reach since its launch in November 2023, attracting more than 12 million visits from users across over 50 countries. Rather than focusing solely on achieving quantum supremacy, the Tianyan-504 project aim is developing infrastructure for large-scale quantum systems.

Google Quantum AI lab has announced a huge advancement in quantum computing with its new Willow processor. The chip demonstrated remarkable error correction capabilities and computational power beyond traditional supercomputers, including ExaFLOP machines such as Frontier and El Capitan. In research published in Nature, Google's team showed that Willow can exponentially reduce error rates as more qubits are added to the system—a feat known as operating "below threshold" that has been a major challenge in quantum computing since 1995. Using arrays of quantum bits in increasingly larger grids, the team successfully cut error rates in half with each expansion. The chip's performance is particularly recorded in random circuit sampling (RCS), where Willow completed calculations in under five minutes. Something like that would take today's fastest supercomputer approximately ten septillion years to solve—a timespan far greater than the universe's age.

Manufactured at Google's specialized facility in Santa Barbara, the 105-qubit Willow chip also achieved impressive coherence times, with qubits maintaining their quantum states for up to 100 microseconds—five times longer than previous generations. Dr. Hartmut Neven, who founded Google Quantum AI in 2012, emphasized that the breakthrough brings quantum computing closer to scaling into more complex systems for data processing. Potential applications include discovering new medicines, designing more efficient batteries for electric vehicles, and accelerating fusion energy research. The next challenge for Google's quantum team is demonstrating a "useful, beyond-classical" computation that addresses practical applications. While Willow has shown superior performance in benchmark tests, researchers are now focused on developing algorithms that can tackle commercially relevant problems that are impossible for traditional computers to solve.

A significant fix has been submitted to the Linux kernel 6.13-rc1 that addresses prolonged boot times affecting older AMD processors, specifically targeting "Zen 1" and "Zen 2" architectures. The issue, which has been present for approximately 18 months, could cause boot delays ranging from several seconds to multiple minutes in extreme cases. The problem was discovered by a Nokia engineer who reported inconsistent boot delays across multiple AMD EPYC servers. The most severe instances showed the initial unpacking process taking several minutes longer than expected, though not all boots were affected. Investigation revealed that the root cause stemmed from a kernel modification implemented in June 2023, specifically related to CPU microcode update handling.

The technical issue was identified as a missing step in the boot process: Zen 1 and Zen 2 processors require the patch buffer mapping to be flushed from the Translation Lookaside Buffer (TLB) after applying CPU microcode updates during startup. The fix, submitted as part of the "x86/urgent" material ahead of the Linux 6.13-rc1 release, implements the necessary TLB flush for affected AMD Ryzen and EPYC systems. This addition eliminates what developers described as "unnecessary and unnatural delays" in the boot process. While the solution will be included in the upcoming Linux 6.13 kernel release, plans are in place to back-port the fix to stable kernel versions to help cover most Linux users on older Zen architectures.

Recent Geekbench results have surfaced for Intel's unreleased Core Ultra 5 225F processor without an integrated GPU, showcasing interesting performance improvements over its predecessors. The benchmark results, initially shared by Benchleaks on X, reveal that this new 10-core chip delivers performance comparable to the higher-core-count Core i5-13600. The Core Ultra 5 225F achieved a single-core score of 2,653 points and a multi-core score of 13,028 points. The processor combines six P-cores, four E-cores, and 20 MB of L3 cache. During testing, the chip reached a maximum frequency of 4.887 GHz. When compared to its direct predecessor, the Core i5-14400F, the new 225F demonstrates significant improvements with approximately 13% better performance in both single and multi-core tests.

More impressively, it manages to edge out the 14-core Core i5-13600 by 5% across both metrics despite having fewer cores and threads. However, the 225F falls behind its premium sibling with four more E-cores, the Core Ultra 5 245K, which outperforms it by 16% in single-core and 44% in multi-core operations. The Core Ultra 5 225F is expected to be part of Intel's new 65 W TDP lineup, targeting mainstream desktop systems with limited overclocking capabilities. This positions it as a more energy-efficient alternative to the current 125 W TDP Core Ultra 200 series processors. While we wait for more firmware updates to boost Arrow Lake performance, Intel could target the launch of the F-series SKUs for CES 2025, which is just a few weeks away now.

For over half a century, general-purpose processors have been built on the Tomasulo algorithm, developed by IBM engineer Robert Tomasulo in 1967. It's a $500B industry built on specialized CPU, GPU and other chips for different computing tasks. Hardware startup Ubitium has shattered this paradigm with a breakthrough universal processor that handles all computing workloads on a single, efficient chip - unlocking simpler, smarter, and more cost-effective devices across industries - while revolutionizing a 57-year-old industry standard.

Alongside this, Ubitium is announcing a $3.7 million in seed funding round, co-led by Runa Capital, Inflection, and KBC Focus Fund. The investment will be used to develop the first prototypes and prepare initial development kits for customers, with the first chips planned for 2026.

- CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of two new 14" Chromebooks for enterprise: the CTL Chromebook Plus Enterprise PX141G Series and the CTL Chromebook Enterprise PX141E Series. Featuring an included Chrome Enterprise Upgrade license, these new Chromebooks offer professionals the speed, power, and connectivity they need for daily on-the-go productivity. Easy ChromeOS device manageability combined with CTL's life cycle services reduces the burden on IT departments.

"With an included Chrome Enterprise Upgrade license, these Chromebooks can be deployed instantly to serve in any number of enterprise applications, such as retail, healthcare, and front-line workers, for example. As a leader in the ChromeOS space, we know our customers will appreciate the design, performance, and, in the Chromebook Plus model, the enhanced AI and cybersecurity capabilities of this next-generation device," said Jason Mendenhall, CEO of CTL.

Q.ANT, the leading startup for photonic computing, today announced the launch of its first commercial product - a photonics-based Native Processing Unit (NPU) built on the company's compute architecture LENA - Light Empowered Native Arithmetics. The product is fully compatible with today's existing computing ecosystem as it comes on the industry-standard PCI-Express. The Q.ANT NPU executes complex, non-linear mathematics natively using light instead of electrons, promising to deliver at least 30 times greater energy efficiency and significant computational speed improvements over traditional CMOS technology. Designed for compute-intensive applications such as AI Inference, machine learning, and physics simulation, the Q.ANT NPU has been proven to solve real-world challenges, including number recognition for deep neural network inference (see the recent press release regarding Cloud Access to NPU).

"With our photonic chip technology now available on the standard PCIe interface, we're bringing the incredible power of photonics directly into real-world applications. For us, this is not just a processor—it's a statement of intent: Sustainability and performance can go hand in hand," said Dr. Michael Förtsch, CEO of Q.ANT. "For the first time, developers can create AI applications and explore the capabilities of photonic computing, particularly for complex, nonlinear calculations. For example, experts calculated that one GPT-4 query today uses 10 times more electricity than a regular internet search request. Our photonic computing chips offer the potential to reduce the energy consumption for that query by a factor of 30."

The 64th edition of the TOP500 reveals that El Capitan has achieved the top spot and is officially the third system to reach exascale computing after Frontier and Aurora. Both systems have since moved down to No. 2 and No. 3 spots, respectively. Additionally, new systems have found their way onto the Top 10.

The new El Capitan system at the Lawrence Livermore National Laboratory in California, U.S.A., has debuted as the most powerful system on the list with an HPL score of 1.742 EFlop/s. It has 11,039,616 combined CPU and GPU cores and is based on AMD 4th generation EPYC processors with 24 cores at 1.8 GHz and AMD Instinct MI300A accelerators. El Capitan relies on a Cray Slingshot 11 network for data transfer and achieves an energy efficiency of 58.89 GigaFLOPS/watt. This power efficiency rating helped El Capitan achieve No. 18 on the GREEN500 list as well.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and IPC solutions, is pleased to introduce the MT-N97 industrial computer. The BIOSTAR MT-N97 industrial computer is a compact, fanless powerhouse designed to meet the high demands of modern industrial applications. Tailor-made for system integrators, AIOT development, automation, edge computing, human-machine interfaces (HMI), and digital signage, the MT-N97 combines robust performance with unwavering stability, providing a reliable foundation for critical operations across various sectors.

Equipped with advanced specs that make it an ideal choice for high-performance, industrial-grade applications, the MT-N97 draws power from an Intel Alder Lake N SOC Processor (Intel N97, 4core, up to 3.6 GHz, TDP 12 W). It combines efficient performance with low power consumption, enhancing reliability and cost-effectiveness for continuous operation. The MT-N97's fanless design ensures quiet, noiseless performance, making it suitable for environments where minimal disruption is critical.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, announced today that its AM5 series motherboards are fully compatible with the AMD Ryzen 7 9800X3D processor, maximizing its impressive gaming performance. This allows PC enthusiasts worldwide to be among the first to experience the exceptional capabilities brought by the AMD Ryzen 7 9800X3D processor. The AMD Ryzen 7 9800X3D is the first model released in the 9000X3D processor series. ASRock AM5 motherboards will continue to receive updates to ensure seamless compatibility with upcoming Ryzen 9000 Series X3D processors, delivering outstanding performance for gaming enthusiasts.

Users can download and install the latest AGESA 1.2.0.2a BIOS from the ASRock website or use the BIOS Flashback and Instant Flash features for an easy upgrade. ASRock recommends updating to the latest BIOS version promptly to ensure optimal system compatibility and performance.

RISC-V is an industry standard instruction set architecture (ISA) born in UC Berkeley. RISC-V is the fifth iteration in the lineage of historic RISC processors. The core value of the RISC-V ISA is the freedom of usage it offers. Any organization can leverage the ISA to design the best possible core for their specific needs, with no regional restrictions or licensing costs. It attracts a massive ecosystem of developers and companies building systems using the RISC-V ISA. To support these efforts and grow the ecosystem, the brains behind RISC decided to form RISC-V International—a non-profit foundation that governs the ISA and guides the ecosystem.

We had the privilege of talking with Andrea Gallo, Vice President of Technology at RISC-V International. Andrea oversees the technological advancement of RISC-V, collaborating with vendors and institutions to overcome challenges and expand its global presence. Andrea's career in technology spans several influential roles at major companies. Before joining RISC-V International, he worked at Linaro, where he pioneered Arm data center engineering initiatives, later overseeing diverse technological sectors as Vice President of Segment Groups, and ultimately managing crucial business development activities as executive Vice President. During his earlier tenure as a Fellow at ST-Ericsson, he focused on smartphone and application processor technology, and at STMicroelectronics he optimized hardware-software architectures and established international development teams.

iBUYPOWER, a leading system integrator specializing in high-performance custom and pre-built gaming computers, announced today the availability of Intel's latest Intel Core Ultra 200S series processors across its line of gaming PCs. Starting today, those interested in experiencing the latest in AI augmented desktop gaming can now integrate an Intel Core Ultra 200S series processor into an iBUYPOWER system backed by its extensive warranty that offers three-years labor and two-years parts for comprehensive post-purchase support.

The new Intel Core Ultra desktop processors are designed for a great gaming performance with AI at the forefront and industry-leading compute, at significantly lower power for desktop PCs, as iBUYPOWER customers with the new CPU can fully optimize their PC experience by offloading various tasks, auto-framing the Neural Processing Unit (NPU) for smooth game streaming, and accelerating creative tasks - all of which is powered by three AI accelerators built into the processor to keep the user's data protected and private. This new generation of desktop processors also comes equipped with 20 CPU PCIe 5.0 lanes, 4 CPU PCIe 4.0 lanes, support for 2 integrated Thunderbolt 4 ports, Wi-Fi 6E and Bluetooth 5.3. Intel Killer Wi-Fi delivers supercharged wireless performance and enables seamless, immersive online gameplay through application priority auto-detection, bandwidth analysis and management, and smart AP selection and switching.

AMD continues to expand the AM4 platform with new processors, despite having already released 145 AM4 SKUs over the past nine years. According to Videocardz, citing a post from @momomo_us on the X platform, AMD plans to launch two new ones: the Ryzen 5 5600T and 5600XT. The leak was later confirmed on ASUS and MSI websites, with these 6-core CPUs appearing on lists of supported motherboards. The MSI page confirms that (at least) the 5600T is a Vermeer processor without integrated graphics. Additionally, AMD intends to make the Ryzen 3 5300G available to consumers as a boxed retail product; until now, this model has been available exclusively for OEM markets since its launch in 2021.

Going into more detail, these new SKUs have the following specifications: The Ryzen 5 5600XT features a 6-core design, 32 MB L3 cache, 65 W TDP, and a base frequency of 3.8 GHz. The Ryzen 5 5600T also has a 6-core design, 32 MB L3 cache, and 65 W TDP, but with a lower base frequency of 3.5 GHz. The Ryzen 3 5300G comes with a 4-core design, 8 MB L3 cache, 65 W TDP, a base frequency of 4 GHz, and is equipped with 6CU scale core graphics (no information regarding turbo clocks for any of these SKUs yet). As mentioned, the current lineup for the AM4 platform includes 145 SKUs, with the Ryzen 5000 series alone already having 20 models. While AMD's dedication to supporting the AM4 platform is admirable, a simple question arises: who will buy or distinguish these new AM4 SKUs from such a vast offering?

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."