Mark Gurman—Bloomberg's resident soothsayer of Apple inside track info—has disclosed predictive outlooks for next-generation M5 chip-based MacBooks. Early last month, we experienced the launch of the Northern Californian company's M4 MacBook Air series—starting at $999; also available in a refreshing metallic blue finish. The latest iteration of Apple's signature "extra slim" notebook family arrived with decent performance figures. As per usual, press and community attention has turned to a potential successor. Gurman's (March 30) Power On newsletter posited that engineers are already working on M5-powered super slim sequels—he believes that these offerings will arrive early next year, potentially reusing the current generation's 15-inch and 13-inch fanless chassis designs.

In a mid-February predictive report, Gurman theorized that Apple was planning a major overhaul of the MacBook Pro design. A radical reimagining of the long-running notebook series—that reportedly utilizes M6 chipsets and OLED panels—is a distant prospect; perhaps later on in 2026. The Cupertino-headquartered megacorp is expected to stick with its traditional release cadence, so 2025's "M5" refresh of MacBook Pro models could trickle out by October. Insiders believe that Apple will reuse existing MacBook Pro shells—the last major redesign occurred back in 2021. According to early February reportage, mass production of the much-rumored M5 chip started at some point earlier in the year. Industry moles posit that a 3 nm (N3P) node process was on the order books, chez TSMC foundries.

Tachyum today announced that it has successfully enabled DRAM Failover correct system on its Prodigy Universal Processor, demonstrating enhanced reliability for even larger-scale AI and HPC applications even in the case of DRAM chip failures.

Tachyum's DRAM Failover is an advanced memory error correction technology that improves the reliability of DRAM and provides a higher level of protection than traditional Error Correction Code (ECC). DRAM Failover can correct multi-bit errors within a single memory chip or across multiple memory chips, allowing continued memory operation in the event of device-level faults in memory. With DRAM Failover, even a whole DRAM chip failure can be tolerated without affecting the system and applications.

The status of Intel "Meteor Lake-S" (MTL-S) desktop processors was the subject of much speculation throughout 2023—by September of that year, Team Blue leadership projected an upcoming launch in 2024. Technically, Meteor Lake was deployed to "sort-of desktops" platforms—albeit in mini-PCs that utilized Core Ultra mobile chips. Industry moles insisted that Intel was still actively engaged in production of MTL-S samples in late 2023. According to a recent ITHome report, those insider tales turned out to be legitimate. On Monday (March 24), the online publication revealed the existence of a mysterious "Q46W" engineering sample—courtesy of Kyoka (a trusted source). A CPU-Z diagnostic revealed the unannounced CPU's turboboost capability reaching 4.5 GHz, while base frequency sat at the 2.8 GHz mark.

According to ITHome's investigative piece, Team Blue: "tested a very special desktop processor: it uses the Meteor Lake architecture, has 6 performance cores and 8 energy efficiency cores (6P+8E), but the performance cores (P-cores) do not support Hyper-Threading. The production date of the product in hand is the 51st week of 2023, which is obviously later than the time when Meteor Lake-S was reported to be cancelled for external sales. From this situation, 'Q46W' may be a development test processor for FCLGA1851 platform or the 800 series chipset. Kyoka believes that the processor should be in the ES2 stage." A Xianyu seller—tbNick_3u8k4—is reportedly offloading a surprising quantity of "Intel Confidential Q46W" processors, allegedly manufactured back in early 2024. Photos show tray-mounted units available for sale on Taobao's second hand market platform. tbNick_3u8k4 mentions that this particular batch of Q46W chips "requires a special motherboard to light up," suggesting that readily available Intel 800 Series chipset-based models are not fit for purpose.

Dune: Awakening, the multiplayer survival game inspired by Frank Herbert's legendary sci-fi novel and Legendary Entertainment's award-winning films, will launch on May 20th. Funcom is excited to share that pre-orders begin today, and gamers everywhere are now less than two months away from descending upon the most dangerous planet in the universe.

The standard edition, the Deluxe Edition, and the Ultimate Edition are now available for pre-order on Steam, with the latter including, among many other goodies, an incredible, 90-minute-long digital soundtrack. In celebration of this moment, Funcom has prepared a journey behind the scenes of the making of the music, giving viewers a unique glimpse at how award-winning composer Knut Avenstroup Haugen brought the album to life with a live orchestra at the legendary AIR Lyndhurst studio in London.

Last Friday, AMD confirmed finalized price points for its upcoming Ryzen 9 9950X3D ($699) and 9900X3D ($599) gaming processors—both launching on March 12. Media outlets are very likely finalizing their evaluations of review silicon; official embargoes are due for lifting tomorrow (March 11). By Team Red decree, a drip feed of pre-launch information was restricted to teasers, a loose March launch window, and an unveiling of basic specifications (at CES 2025). A trickle of mid-January to early March leaks have painted an incomplete picture of performance expectations for the 3D V-Cache-equipped 16 and 12-core parts. A fresh NDA-busting disclosure has arrived online, courtesy of an alleged Ryzen 9 9950X3D sample's set of benchmark scores.

A pre-release candidate posted single and multi-thread ratings of 4739 and 69,701 (respectively), upon completion of PassMark tests. Based on this information, a comparison chart was assembled—pitching the Ryzen 9 9950X3D against its direct predecessor (7950X3D), a Zen 5 relative (9950X), and competition from Intel (Core Ultra 9 285K). AMD's brand-new 16-core flagship managed to outpace the previous-gen Ryzen 9 7950X3D by ~14% in single thread stakes, and roughly 11% in multithreaded scenarios. Test system build details and settings were not mentioned with this leak—we expect to absorb a more complete picture tomorrow, upon publication of widespread reviews. The sampled Ryzen 9 9950X3D CPU surpassed its 9950X sibling by ~5% with its multi-thread result, both processors are just about equal in terms of single-core performance. The Intel Core Ultra 9 285K CPU posted the highest single-core result within the comparison—5078 points—exceeding the 9950X3D's tally by about 7%. The latter pulls ahead by ~3% in terms of recorded multi-thread performance. Keep an eye on TechPowerUp's review section; where W1zzard will be delivering his verdict(s) imminently.

Google security researchers have published comprehensive details on "EntrySign," a significant vulnerability affecting all AMD Zen processors through Zen 4. The flaw allows attackers with local administrator privileges to install custom microcode updates on affected CPUs, bypassing AMD's cryptographic verification system. The vulnerability stems from AMD's use of AES-CMAC as a hash function in its signature verification process—a critical cryptographic error. CMAC is designed as a message authentication code, not a secure hash function. The researchers discovered that AMD had been using a published example key from NIST documentation since Zen 1, allowing them to forge signatures and deploy arbitrary microcode modifications. These modifications can alter CPU behavior at the most fundamental level, enabling sophisticated attacks that persist until the next system reboot.

Google's security team has released "zentool," an open-source jailbreak toolkit allowing researchers to create, sign, and deploy custom microcode patches on vulnerable processors. The toolkit includes capabilities for microcode disassembly, patch authoring with limited assembly support, and cryptographic signing functions. As a proof-of-concept, the researchers demonstrated modifying the RDRAND instruction to consistently return predetermined values, effectively compromising the CPU's random number generation. AMD has issued microcode updates that replace the compromised validation routine with a custom secure hash function. The company's patches also leverage the AMD Secure Processor to update the validation routine before x86 cores can process potentially tampered microcode. While the attack requires local administrator access and doesn't persist through power cycles, it poses significant risks to confidential computing environments using technologies like SEV-SNP and DRTM. The researchers noted their findings could enable further CPU security research beyond exploit development, potentially allowing the implementation of new security features similar to those developed for Intel processors through similar techniques.

Codasip, the European RISC-V leader, announced that it has been selected to provide a general purpose, high-end processor as part of the large-scale European supercomputing project Digital Autonomy with RISC-V in Europe (DARE).

DARE is set to build a supercomputing compute stack, featuring high-performance and energy-efficient RISC-V-based processors and accelerators designed and developed in Europe. The European Union has committed 240 million Euros in funding for the first 3-year program phase. The selected partners will leverage hardware/software co-design to achieve competitive performance and efficiency.

One of the main pillars that vendors of Arm-based processors often cite as a competitive advantage versus x86 processors is a keen focus on energy efficiency and predictability of performance. In the quest for higher efficiency and performance, Arm vendors have largely designed out the ability to operate on multiple threads concurrently—something that most enterprise-class CPUs have enabled for years under the technology description of "SMT"—which was also created in the name of enabling performance and efficiency benefits.

Arm vendors often claim that SMT brings security risks, creates performance unpredictability from shared resource contention and drives added cost and energy needed to implement SMT. Interestingly, Arm does support multi-threading in its Neoverse E1-class processor family for embedded uses such as automotive. Given these incongruities, this blog intends to provide a bit more clarity to help customers assess what attributes of performance and efficiency really bring them value for their critical workloads.

Damo Academy—a research and development wing of Alibaba—launched its debut "server-grade processor" design late last week, in Beijing. According to a South China Morning Post (SCMP) news article, the C930 model is a brand-new addition to the e-commerce platform's XuanTie RISC-V CPU series. Company representatives stated that their latest product is designed as a server-level and high-performance computing (HPC) solution. Going back to March 2024, TechPowerUp and other Western hardware news outlets picked up on Alibaba's teasing of the Xuantie C930 SoC, and a related Xuantie 907 matrix processing unit. Fast-forward to the present day; Damo Academy has disclosed that initial shipments—of finalized C930 units—will be sent out to customers this month.

The newly released open-source RISC-V architecture-based HPC chip is an unknown quantity in terms of technical specifications. Damo Academy reps did not provide any detailed information during last Friday's conference (February 28). SCMP's report noted the R&D division's emphasizing of "its role in advancing RISC-V adoption" within various high-end fields. Apparently, the XuanTie engineering team has: "supported the implementation of more than thirty percent of RISC-V high-performance processors." Upcoming additions will arrive in the form of the C908X for AI acceleration, R908A for automotive processing solutions, and an XL200 model for high-speed interconnection. These XuanTie projects are reportedly still deep in development.

The AMD Ryzen 9 9950X3D processor will head to retail next month—a March 12 launch day is rumored—but a handful of folks seem to have early samples in their possession. Reviewers and online influencers have been tasked with evaluating pre-launch silicon, albeit under strict conditions; i.e. no leaking. Inevitably, NDA-shredding material has seeped out—yesterday, we reported on an alleged sample's ASUS Silicon Prediction rating. Following that, a Bulgarian system integrator/hardware retailer decided to upload Cinebench R23 and PCMark Time Spy results to Facebook. Evidence of this latest leak was scrubbed at the source, but VideoCardz preserved crucial details.

The publication noticed distinguishable QR and serial codes in PCbuild.bg's social media post; so tracing activities could sniff out points of origin. As expected, the leaked benchmark data points were compared to Ryzen 9 9950X and 7950X3D scores. The Ryzen 9 9950X3D sample recorded a score of 17,324 points in 3DMark Time Spy, as well as 2279 points (single-core) and 42,423 points (multi-core) in Cinebench R23. Notebookcheck observed that the pre-launch candidate came: "out ahead of the Ryzen 9 7950X3D in both counts, even if the gaming win is less than significant. Comparing the images of the benchmark results to our in-house testing and benchmark database shows the 9950X3D beating the 7950X3D by nearly 17% in Cinebench multicore." When compared to its non-3D V-Cache equivalent, the Ryzen 9 9950X3D leverages a slight performance advantage. A blurry shot of PCbuild.bg's HWiNFO session shows the leaked processor's core clock speeds; going up to 5.7 GHz (turbo) on a single CCD (non-X3D). The X3D-equipped portion seems capable of going up to 5.54 GHz.

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

MiTAC Computing Technology Corporation, a leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation, today announced the launch of its latest server systems and motherboards powered by the latest Intel Xeon 6 with P-core processors. These industry-leading processors are designed for compute-intensive workloads, providing up to twice the performance for the widest range of workloads including AI and HPC.

Driving Innovation in AI and High-Performance Computing
"For over a decade, MiTAC Computing has collaborated with Intel to push the boundaries of server technology, delivering cutting-edge solutions optimized for AI and high-performance computing (HPC)," said Rick Hwang, President of MiTAC Computing Technology Corporation. "With the integration of the latest Intel Xeon 6 P-core processors our servers now unlock groundbreaking AI acceleration, boost computational efficiency, and scale cloud operations to new heights. These innovations provide our customers with a competitive edge, empowering them to tackle demanding workloads with superior empower our customers with a competitive edge through superior performance and an optimized total cost of ownership."

LG Electronics USA (LG) today announced pricing and pre-order availability of its 2025 AI-enabled LG gram lineup, the company's first on-device AI-laptops powered by Intel Core Ultra Series 2 CPUs. Introduced at CES 2025, the new lineup includes the LG gram Pro Z90TP ($1999 to $2399), LG gram Pro Copilot+PC Z90TS ($1849 to $2399), LG gram Pro 2-in-1 T90TP ($1999 to $2399) and LG gram Copilot+PC Z90TL ($1999 to $2399). Leveraging LG's gram AI technology, and cloud AI capabilities powered by GPT-4o, these laptops deliver impressive hybrid AI performance while preserving the LG gram's iconic slim and lightweight design.

Throughout the duration of the pre-order period (Feb. 24, 2025 to March 23, 2025), customers will receive an LG gram +view IPS portable monitor (349.99 value) at no additional cost and $200 savings on select models. All standard terms of purchase apply.

MSI is pleased to announce support for the upcoming AMD Ryzen 9 9950X3D and 9900X3D processors, built on the Zen 5 architecture and featuring AMD's cutting-edge 2nd generation AMD 3D V-Cache technology. This innovative technology is designed to significantly increases the cache size, allowing faster data access and improved performance. Engineered to deliver exceptional performance, these processors meet the demands of even the most intensive gaming and content creation workloads.

At the heart of this experience is the MSI MEG X870E GODLIKE motherboard, which sets a new standard with its innovative design and robust features. The Dynamic Dashboard III, a 3.99-inch full-color LCD, offers real-time hardware monitoring, troubleshooting, BIOS update status, clock display, and personalization options, enhancing user experience and system control. MSI's EZ Link design complements this, streamlining cable management by consolidating the front panel, fan, and RGB headers into the EZ Bridge and EZ Control Hub, ensuring a cleaner build and simplified installation process.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

So far, this Friday (February 7) has been a bumper day for Intel CPU-related leaks. Golden Pig Upgrade and Jaykihn appear to be in competition with each other—they have uncovered all manner of speculative treasures across desktop and mobile segments. The latest revelation provides an early insight into unannounced feline-themed next-gen CPUs, courtesy of a Jaykihn social media post. Team Blue's Panther Lake processor family is slated for launch within the latter half of 2025—Intel officially stated that it would be their "lead product" on 18A. Older rumors had the "mobile-exclusive" Panther Lake processor family linked to a mixed configuration of new "Cougar Cove" P-cores and updated "Skymont" E-cores. According to today's leak, a variety of core configurations and feature sets are in the pipeline.

Jaykihn has listed three Panther Lake SKUs, and a "more mainstream" lower-end Wildcat Lake model. Common features include support for Thunderbolt 4 connectivity and LPDDR5X memory. Team Blue's rumored highest-end Panther Lake-H (PTL-H) processor appears to max out with a grand total of sixteen cores—consisting of 4 P-cores, 8 E-Cores, and 4 LP cores. The integrated graphics solution is (allegedly) a 12 core Xe3 "Celestial" GPU, with support for LPDDR5X memory—it is the only one on the list to completely jettison DDR5 compatibility. Insiders believe that the total platform (TOPS) rating is 180. As interpreted by VideoCardz, a 12-core "Panther Lake-U" (PTL-U) SKU is reportedly free of efficiency (E) units. The sole Wildcat Lake (WCL) model seems to sport a 2 P-core, 4-LP, and 2-Xe3 configuration.

Intel's data center business has experienced a lot of decline in recent years. Once the go-to choice for data center buildout, nowadays, Xeon processors have reached a 13-year low. According to SemiAnalysis analyst Sravan Kundojjala on X, the once mighty has fallen to a 13-year low number, less than 50% of its CPU sales in the peak observed in 2021. In a chart that is indexed to 2011 CPU volume, the analysis gathered from server volume and 10K fillings shows the decline that Intel has experienced in recent years. Following the 2021 peak, the volume of shipped CPUs has remained in free fall, reaching less than 50% of its once-dominant position. The main cause for this volume contraction is attributed to Intel's competitors gaining massive traction. AMD, with its EPYC CPUs, has been Intel's primary competitor, pushing the boundaries on CPU core count per socket and performance per watt, all at an attractive price point.

During a recent earnings call, Intel's interim c-CEO leadership admitted that Intel is still behind the competition with regard to performance, even with Granite Rapids and Clearwater Forest, which promised to be their advantage in the data center. "So I think it would not be unfathomable that I would put a data center product outside if that meant that I hit the right product, the right market window as well as the right performance for my customers," said Intel co-CEO Michelle Johnston Holthaus, adding that "Intel Foundry will need to earn my business every day, just as I need to earn the business of my customers." This confirms that the company is now dedicated to restoring its product leadership, even if its internal foundry is not doing okay. It will take some time before Intel CPU volume shipments recover, and with AMD executing well in data center, it is becoming a highly intense battle.

New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Intel's Core Ultra 3 205 processor's spec sheet appeared online for a short period of time—members of the Team Blue subreddit discovered an official product page (now removed) and other related details. In part, discussion focused on the alleged lower-end "Arrow Lake-S" (ARL-S) desktop CPU being "reserved for OEMs." Previously, this SKU's existence was leaked out at various points back in 2024. VideoCardz has kindly preserved the latest set of information, prior to its removal from Intel's official web presence—showing a potential new addition to the Core Ultra 200S (Series 2) lineup.

The Core Ultra 3 205 model appears to slot into a segment previously occupied by (now retired) budget-oriented Pentium and Celeron products—based on the specification sheet listing of a 57 W TDP (aligning with past ratings). The Maximum Turbo Power limit is 76 W. Team Blue has inadvertently revealed that this is an eight-core processor, comprised of four Lion Cove P-Cores and four Skymont E-Cores—so 8 (4P + 4E). The performance-oriented cores can (Max Turbo) boost up to 4.9 GHz, while the efficiency-focused units are capable of reaching up to 4.4 GHz. The on-board AI Boost NPU is rated for a peak rating of 13 TOPS (Int8). The Core Ultra 3 205's GPU seems to only utilize two out of the four available Arc Xe-LPG cores. The product page mentioned that the Core Ultra 3 205 is due for launch in Q1 2025, although the "Market Status = Launched" segment adds to the confusion surrounding this now de-listed SKU.

The world of mini PCs keeps on growing, thanks to a boost in popularity made possible by the impressive efficiency and performance improvements brought to the table by the silicon giants, allowing compact systems to function just as well as full-fledged towers. The Morefine M6S Plus is yet another addition to the list of mini PCs, and it appears that the system prioritizes portability and compactness over raw performance. For a sizeable chunk of casual desktop users, even entry-level processors pack enough computing grunt to ease through their workloads, and that demographic is exactly what the M6S Plus targets.

With dimensions of 7.2 x 7.2 x 4.2 cm, the Morefine M6S Plus is commendably compact indeed. As mentioned, the computing horsepower offered is very limited, thanks to the quad-core Intel N150 processor that lacks Hyper-Threading. The memory is, unfortunately, not user upgradeable, so customers are will have to stick the 12 GB of LPDDR5-4800 memory on offer. The storage however, is upgradeable, thanks to the M.2 2242 slot which can accommodate up to 4 TB of storage. In terms of connectivity, the options are acceptable, including dual Type-C ports with DP, gigabit ethernet, triple USB 3.2 Gen 1Type-A ports (two on the front), HDMI 2.1, as well as a headphone jack.

Thanks to the informative breakdown by Chips and Cheese, we are learning that AMD's latest Ryzen AI processors for laptops, codenamed "Strix Halo," utilize a parallel "sea of wires" interconnect system between their chiplets, replacing the SERDES (serializer/deserializer) approach found in desktop Ryzen models. The processor's physical implementation consists of two Core Complex Dies (CCDs), each manufactured on TSMC's N4 (4 nm) process and containing up to eight Zen 5 cores with full 512-bit floating point units. Notably, the I/O die (IOD) is also produced using the N4 process, marking an advancement from the N6 (6 nm) process used in standard Ryzen IODs on desktops. The key change lies in the inter-chiplet communication system. While the Ryzen 9000 series (Granite Ridge) employs SERDES to convert parallel data to serial for transmission between chiplets, Strix Halo implements direct parallel data transmission through multiple physical connections.

This design achieves 32 bytes per clock cycle throughput and eliminates the latency overhead associated with serialization/deserialization processes. The parallel interconnect architecture also removes the need for connection retraining during power state transitions, a limitation present in SERDES implementations. However, this design choice necessitates additional substrate complexity due to increased connection density and requires more pins for external connections, suggesting possible modifications to the CCD design compared to desktop variants. AMD's implementation required more complex substrate manufacturing processes to accommodate the dense parallel connections between chiplets. The decision to prioritize this more challenging design approach was driven by requirements for lower latency and power consumption in data-intensive workloads, where consistent high-bandwidth communication between chiplets is crucial.

Courtesy of serial leaker @momomo_us, who dug up the product pages for Intel's two new retail boxed CPU coolers, we now know what they'll look like ahead of them shipping. The two coolers are known as the Laminar RH2 and Laminar RM2, with the RH2 being the higher-end model of the two. The RH2 has a copper heat column that attaches to aluminium fins and it's decorated with an aRGB LED ring, as well as a white Intel LED logo. It stands 71 mm tall from the base of the heatsink to the top of the fan and is overall 103 x 103 mm and it weighs in at 450 grams. It's rated for CPUs up to 65 W TDP and the fan operates between 1000 and 3000 rpm and supports variable speed via PWM control. It will output 23 dBA at 1600 RPM with the CPU at 40 degrees C, according to the specs. It appears to come with some kind of back plate and it's screwed in place. It will only ship with the Intel Core Ultra 9 Processor 285 for now.

The much more basic RM2 cooler is designed for 65 W TDP CPUs and it measures 100 x 100 mm, but it only stands 47 mm tall. Here only the base of the cooler is made out of copper, the fins are once again made from aluminium and this results in a lower weight of 340 grams. The fan speed range is 600 to 3250 rpm and we're looking at a PWM controlled fan here too. The downside is that the fan has to run at 2400 rpm to produce the same 40 degrees at the inlet with a 65 W CPU underneath it, which results in a noise level of 30 dBA, which is a lot louder than the RH2. Unlike the RH2, the RM2 uses standard Intel socket push-pins for mounting. The RM2 will ship with the Intel Core Ultra 5 Processor 225, 225F, 235, 265 and 265F CPUs, but according to the product page, it will also ship with some Core Ultra 7 desktop chips. Both coolers come with a three-year warranty. Design wise, both of the new coolers are a lot less flashy compared to the previous generation of Intel CPU coolers.

GIGABYTE, the world's leading computer brand, unveiled its next-gen AI PCs at CES 2025. GiMATE, a groundbreaking AI agent for seamless hardware and software control, takes center stage in the all-new lineup, redefining gaming, creation, and productivity in the AI era. Powered by NVIDIA GeForce RTX 50 Series Laptop GPUs and NVIDIA NIM microservices for advanced AI NIM and RTX AI, AMD Ryzen AI, Intel NPU AI, and enhanced by Microsoft Copilot, the AORUS MASTER, GIGABYTE AERO, and the GIGABYTE GAMING series deliver cutting-edge performance with upgraded WINDFORCE cooling in sleek, portable designs.

GiMATE, GIGABYTE's exclusive AI agent, integrates with an advanced Large Language Model (LLM) and the "Press and Speak" feature, making laptop control more natural and intuitive. From AI Power Gear II for optimal energy efficiency to AI Boost II's precision overclocking, GiMATE ensures optimal settings for every scenario. AI Cooling delivers 0dB ambiance, perfect for work environments, while AI Audio and AI Voice optimize sound for any setting. Safeguard your screen with AI Privacy, which detects prying eyes and activates protection instantly. GiMATE aims to be users' smart AI Mate, that redefines laptops in users' daily lives.

Acer today announced refreshes to the well-rounded Swift Go series and the eco-friendly Aspire Vero 16 laptops, combining enhanced computing performance, power efficiency, stunning displays, and sustainable designs in the evolving AI PC era. The Swift Go 14 and Swift Go 16 laptops offer seamless productivity and adaptability in any work environment, with streamlined AI task execution and multi-day battery life, wrapped in ultra-thin and light designs. Available with 3K OLED or 2K IPS touch display configurations, these laptops deliver striking visuals to complement their eye-catching exteriors.

The Aspire Vero 16, a carbon-neutral laptop and the world's first to incorporate bio-based oyster shell material, now features a chassis made from a combination of more than 70% post-consumer recycled (PCR) plastic and bio-based material. The bold innovation from Acer offers a sustainable laptop option without compromising performance or durability. All the new laptop devices are equipped with Intel Core Ultra 200H series processors and built-in Intel Arc graphics built-in, engineered to scale accelerated AI performance and maximize efficiency for work and creation. Mobile workers will also appreciate the new Acer Connect 5G mobile Wi-Fi and Acer Wave D7 Wi-Fi dongle, providing high-speed internet connections anywhere, anytime.

MSI, a global leader in computing solutions, is excited to announce the launch of its latest innovation in mini PCs: the Cubi NUC AI Series. This new lineup features the Cubi NUC AI+ 2M and the Cubi NUC AI 1UM, both carefully designed to deliver exceptional performance in impressively compact formats.

Cubi NUC AI+ 2M: The Ultimate Copilot+ PC
Measuring just 0.826 liters, the Cubi NUC AI+ 2M sets a new standard for mini PCs. Despite its compact size, it is powered by an Intel Core Ultra Processor from the Lunar Lake platform and comes with AI tools designed to enhance productivity and improve the user experience. Equipped with a dedicated AI Boost NPU, it functions as a Copilot+ PC, seamlessly integrating with AI-driven applications like CoCreator, Windows Studio Effects, Live Captions, and Live Translation—making it ideal for both professional and personal use. One of its standout features is the one-touch fingerprint power button, which provides both security and convenience. Additionally, a dedicated Copilot button offers instant access to AI assistance, streamlining workflows and daily tasks. The built-in microphone and speaker further enrich the user experience, enabling smooth communication and voice-activated commands. Connectivity is another strong point, with two Thunderbolt 4 ports, one of which supports up to 100 W Power Delivery input. This means the Cubi NUC AI+ 2M can be powered directly through a monitor using a Type-C connection, minimizing cable clutter and simplifying your setup.