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Sony Electronics Announces the New WF-C700N Truly Wireless Noise Canceling Earbuds with Multipoint Connection

Sony Electronics Inc. today announced the addition of the WF-C700N truly wireless earbuds, WF-C700N, which are small and lightweight for all day comfort, perfect for those looking for their first pair of truly wireless noise canceling earbuds. In addition, Sony is also announcing the WH-1000XM5 in Midnight Blue, with all of the great noise canceling features of the critically acclaimed WH-1000XM5 in a stylish blue color.

A comfortable fit for on the go
The WF-C700N have been designed with comfort and stability in mind, for an inclusive fit. Sony has designed the WF-C700N by looking at extensive ear shape data collated since it introduced world's first in-ear headphones in 1982, as well as evaluation of the sensitivity of various types of ears. The WF-C700N earbuds combine a shape to perfectly match the human ear with an ergonomic surface design for a more stable fit, so users can wear them longer without needing a break.

AAEON Introduces BOXER-8224AI SBC for Field AI Applications

Diversifying its solutions based on the NVIDIA Jetson line of system-on-modules, AAEON have released the BOXER-8224AI, comprised of a carrier board with a heatsink and NVIDIA Jetson Nano module to offer system-level capabilities on a tiny form factor of just 4.7" x 3.1" x 0.8" (120 mm x 80 mm x 22 mm).

A first for this line of AAEON products, the BOXER-8224AI's board layout includes a wafer-based coastline rather than full I/O ports to provide users with the full functionality of AAEON's system-level edge AI solutions in a more flexible way. Included in this configuration are two MIPI-CSI camera connectors for the installation of smaller, more cost-effective peripheral cameras for space-limited applications such as drones.

Qualcomm's aptX and aptX HD Codecs Now Part of Android Open Source Project

One of the biggest issues with TWS and any other kind of wireless headphones for that matter, is limited support for various audio codecs, where many rely on the not so great SBC codec or AAC, simply because these are two codes that are supported by most of the devices that the headphones would be connected to. When it comes to smartphones, Qualcomm is by far the biggest chipset provider and as it happens, Qualcomm is also the owner of the various aptX audio codecs that many headphones support. Up until very recently, the phone makers had to pay a royalty fee to include support for the aptX codecs even if they used Qualcomm's chips in their phones and thus some companies—Samsung for example—decided not to include support for aptX.

Now it has come to light that just like Sony with its LDAC codec, Qualcomm has decided to add support for aptX to the Android Open Source Project (AOSP), which means all Android devices can support aptX as well as aptX HD without paying any royalty fees. However, more advanced versions of aptX, such as aptX Adaptive and the rarely used low latency version of aptX are not included. That said, headphone makers will still have to pay a royalty fee to Qualcomm, although there doesn't appear to be any headphones on the market that support aptX that aren't based on a Qualcomm or one of the older CSR chipsets from the time before Qualcomm acquired them. On the other hand, Sony's LDAC codec is used by a wide range of headphones, of which none rely on a Sony chipset. Regardless, this should be good news for consumers, who will be the ones reaping the benefits from this change in the long term.

MakeMyBOARD's ThunderBERRY5 Qualcomm-Based SBC Looks to Take on Raspberry Pi 4

It's been a busy week for embedded computers and SBCs with Embedded World 2023 going on. While a lot of larger brands have taken the focus during this time there has also been activity at the hobbyist level, specifically in the realm of Raspberry Pi clones. One of these that looks to be something of a novelty is the ThunderBERRY5 from French company MakeMyBOARD. This SBC claims to be, "the first Raspberry Pi-like SBC based on Qualcomm AI-CPU," and it features a combination of Qualcomm's 8-core QCS610 SoC and an RP2040 microcontroller. MakeMyBOARD's AI claims stem from the Qualcomm SoC's built-in Hexagon 685 DSP which supports dual vector extensions for their Neural Processing SDK and deep neural network models. The previously mentioned RP2040 fits to the board via the USB2 root and hosts the 40-pin HAT connector as well as an auxiliary debugging header.

Unlike most Pi clones on the market utilizing low-cost, lower performing processors, the ThunderBERRY5 looks like it may trounce the Pi 4 B in raw CPU power as the QCS610's Kryo 460 processor features a 2+6 core configuration: two "Gold" cores at 2.2 GHz and six "SIlver" cores at 1.8 GHz. On paper this looks to have quite the advantage over the aging Pi 4 B's 1.8 GHz quad-core Broadcom BCM2711. More important than beating the Pi 4 in performance would be beating it in availability as the tiny SBC is as hard to find in stock as it is ubiquitous even many years later. On this front there is little info from MakeMyBOARD as no availability date or price information has yet been released. Still, if you were hoping for a higher performance Pi-like SBC with AI acceleration capabilities and features, this may be something to keep an eye on.

DFI Announces Cutting-Edge Technologies and the World's First High-Performance SBC at Embedded World 2023

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

DFI Reveals New PCSF51 1.8" SBC with High Performance AMD Ryzen R2000 Processor

DFI, the global leader in embedded solutions, today announced their latest PCSF51 next-generation 1.8" Single Board Computer at Embedded World 2023. The 1.8" SBC powered by the revolutionary AMD Ryzen Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor. Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

"By leveraging the latest AMD Ryzen Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51," said DFI President Alexander Su. "We have a positive outlook for future Industrial Pi innovations." Compared to its previous generation GHF51 with the AMD Ryzen R1000 Processor, the latest R2000 processor built into the PCSF51 delivers upgraded performance with double the max CPU core count, scalability up to four CPU cores and eight threads, and a 50% increase in CPU power. Graphics performance is boosted by 15% with up to eight graphic compute units. The design of the PCSF51 has also been enhanced from the previous GHF51, with an easier-to-use on board power/reset and HDMI, in addition to a thinner thermal module. With rich multimedia capabilities, it can support ultra-high-resolution displays in 4K resolution.

MSI to Unveil MS-98M3 3.5" Single Board Computer and EV Products at Embedded World 2023

MSI is a top player in the ICT industry. With over 35 years of experience in R&D. By introducing AI systems, IoT, automation, and remote operations. Leveraging its many years of experience in ODM/OEM and its production capabilities, MSI delivers products that apply to smart transportation, smart cities, innovative automation, digital signage and intelligent retailing, offering top-quality, integrated solutions that best suit client needs. MSI commercial monitors offer crisp visuals and a range of features to enhance the computing experience.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance, providing reliability and high durability with lower power consumption, and actively deploy in multiple applications such as AMR-AI-PJ-UVGI Robot, which was verified by Texcell/France to effectively inactivate the new SARS-COV2 virus within seconds.

AAEON Unveils the UP Squared V2 Single-Board Computer

AAEON, renowned for its UP Board range, has announced the UP Squared V2, the successor to its UP Squared Developer Board. Providing dramatic improvements in processing power, graphic capability and expansion options on the same 3.37" x 3.54" (85 mm x 90 mm) form factor, the UP Squared V2 is designed to make the development process more efficient.

While still reflecting the competitive pricing of the previous generation, the UP Squared V2 boasts a 40% improvement in CPU performance due to its Intel Celeron N6210 Pentium J6426 Processor SoC (formerly Elkhart Lake). As a product of this, users can take advantage of 1.7x the single-thread performance and 1.5x the multi-thread performance along with up to 16 GB LPDDR4 system memory.

AAEON Introduces GENE-ADP6 Single-Board Computer Powered by Intel "Alder Lake"

AAEON's new GENE-ADP6 unlocks the door to elite edge computing, digital signage, and machine vision applications with enhanced features across the board. The GENE-ADP6 provides a 15% improvement in CPU performance through the Intel 12th Generation Core /Celeron CPU (formerly Alder Lake-P), featuring hybrid platform processor architectures with up to 12 cores and 16 threads. Along with an improvement in CPU power, the GENE-ADP6 shows greater AI-readiness, with Intel's Deep Learning Boost AI accelerator providing enhanced inferencing capabilities to make the GENE-ADP6 perfect for 5G and AI edge computing.

For faster, more advanced storage speeds, the GENE-ADP6 introduces 64GB system memory via two dual-channel DDR5 SODIMMs, being AAEON's first 3.5" SubCompact Board to do so. This improvement from DDR4 to DDR5 offers up to 50% faster data transfer speeds and a new, more efficient power management structure. The GENE-ADP6 supports M.2 3052/3042 and M.2 2230 modules, enabling 5G and Wi-Fi for enhanced application connectivity. Additionally, the board's FPC expansion slot provides sophisticated, high-performance PCIe x4 (Gen 4) speed. This also gives users the flexibility to expand the board's additional PCIe x4 slot for machine vision, smart retail and industrial automation applications.
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