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DFI Reveals New PCSF51 1.8" SBC with High Performance AMD Ryzen R2000 Processor

DFI, the global leader in embedded solutions, today announced their latest PCSF51 next-generation 1.8" Single Board Computer at Embedded World 2023. The 1.8" SBC powered by the revolutionary AMD Ryzen Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor. Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

"By leveraging the latest AMD Ryzen Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51," said DFI President Alexander Su. "We have a positive outlook for future Industrial Pi innovations." Compared to its previous generation GHF51 with the AMD Ryzen R1000 Processor, the latest R2000 processor built into the PCSF51 delivers upgraded performance with double the max CPU core count, scalability up to four CPU cores and eight threads, and a 50% increase in CPU power. Graphics performance is boosted by 15% with up to eight graphic compute units. The design of the PCSF51 has also been enhanced from the previous GHF51, with an easier-to-use on board power/reset and HDMI, in addition to a thinner thermal module. With rich multimedia capabilities, it can support ultra-high-resolution displays in 4K resolution.

MSI to Unveil MS-98M3 3.5" Single Board Computer and EV Products at Embedded World 2023

MSI is a top player in the ICT industry. With over 35 years of experience in R&D. By introducing AI systems, IoT, automation, and remote operations. Leveraging its many years of experience in ODM/OEM and its production capabilities, MSI delivers products that apply to smart transportation, smart cities, innovative automation, digital signage and intelligent retailing, offering top-quality, integrated solutions that best suit client needs. MSI commercial monitors offer crisp visuals and a range of features to enhance the computing experience.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance, providing reliability and high durability with lower power consumption, and actively deploy in multiple applications such as AMR-AI-PJ-UVGI Robot, which was verified by Texcell/France to effectively inactivate the new SARS-COV2 virus within seconds.

AAEON Unveils the UP Squared V2 Single-Board Computer

AAEON, renowned for its UP Board range, has announced the UP Squared V2, the successor to its UP Squared Developer Board. Providing dramatic improvements in processing power, graphic capability and expansion options on the same 3.37" x 3.54" (85 mm x 90 mm) form factor, the UP Squared V2 is designed to make the development process more efficient.

While still reflecting the competitive pricing of the previous generation, the UP Squared V2 boasts a 40% improvement in CPU performance due to its Intel Celeron N6210 Pentium J6426 Processor SoC (formerly Elkhart Lake). As a product of this, users can take advantage of 1.7x the single-thread performance and 1.5x the multi-thread performance along with up to 16 GB LPDDR4 system memory.

AAEON Introduces GENE-ADP6 Single-Board Computer Powered by Intel "Alder Lake"

AAEON's new GENE-ADP6 unlocks the door to elite edge computing, digital signage, and machine vision applications with enhanced features across the board. The GENE-ADP6 provides a 15% improvement in CPU performance through the Intel 12th Generation Core /Celeron CPU (formerly Alder Lake-P), featuring hybrid platform processor architectures with up to 12 cores and 16 threads. Along with an improvement in CPU power, the GENE-ADP6 shows greater AI-readiness, with Intel's Deep Learning Boost AI accelerator providing enhanced inferencing capabilities to make the GENE-ADP6 perfect for 5G and AI edge computing.

For faster, more advanced storage speeds, the GENE-ADP6 introduces 64GB system memory via two dual-channel DDR5 SODIMMs, being AAEON's first 3.5" SubCompact Board to do so. This improvement from DDR4 to DDR5 offers up to 50% faster data transfer speeds and a new, more efficient power management structure. The GENE-ADP6 supports M.2 3052/3042 and M.2 2230 modules, enabling 5G and Wi-Fi for enhanced application connectivity. Additionally, the board's FPC expansion slot provides sophisticated, high-performance PCIe x4 (Gen 4) speed. This also gives users the flexibility to expand the board's additional PCIe x4 slot for machine vision, smart retail and industrial automation applications.
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Sep 17th, 2024 02:51 EDT change timezone

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