Next week at Dell Technologies World, KIOXIA America, Inc. will be on hand to demonstrate how its innovative solid state drives (SSDs) are accelerating customer application performance and enabling product breakthroughs. From SSDs designed with PCIe 5.0 technology that boost power and performance to the industry's first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs, best in class drives from KIOXIA are used in a number of Dell product lines.

KIOXIA, the inventor of NAND flash, sits at the forefront of flash storage and SSD innovation. Achievements such as the introduction of 3D flash memory, XL-FLASH storage class memory, and new form factors and interfaces underscore the contributions the company has made toward enabling next-gen applications - and transforming the digital world.

Samsung Electronics today announced the release of its latest external storage device, the T7 Shield Portable Solid State Drive (PSSD), bringing exceptional performance and reliability in a durable, credit card size design. The T7 Shield is the newest addition to the Samsung T7 Portable SSD family that includes the T7, a daily driver that provides incredibly fast speeds in a sleek design, and the T7 Touch, a CES award-winning PSSD with a built-in fingerprint sensor for enhanced data protection. "Creative professionals and consumers want durable, high-performance and reliable SSDs with the assurance their data will remain safeguarded, even when dropped, exposed to water or used outdoors," said KyuYoung Lee, Vice President of Memory Brand Product Biz Team at Samsung Electronics. "The T7 Shield offers extensive compatibility, enabling consumers to use the new SSD on multiple devices including PC, android smartphone and game console."

The T7 Shield is Samsung's most durable PSSD to date, making it ideal for outdoor content creators or travelers who need data-rich experience without having to worry about data loss from exposure to the elements or life's mishaps. Carefully engineered by Samsung from the inside out, the T7 Shield is shock-resistant from drops of up to three meters, while being IP65-certified as dustproof and water resistant. Despite the new rugged design, the T7 Shield is compact and lightweight, weighing a mere 98 grams.

Today Solidigm is expanding its performance-optimized D7 Product Series with new solid-state storage drives (SSDs)—the D7-P5520 and the D7-P5620—for data center and enterprise use. These drives are optimized for real-world compute and storage server workloads and are available in an extended range of form factors and capacities. They offer accelerated performance and reduced total cost of ownership (TCO) by enabling a smaller storage footprint and lower power consumption. The D7-P5520 (designed for read-intensive and light mixed workloads), and the D7-P5620 (designed for mixed workloads), are the first family of products being introduced by Solidigm, which launched as a standalone company in December 2021.

The D7 Series comprises the industry's most advanced PCIe 4.0 SSD family of products given their capacity offerings, breadth of form factors and optimized performance capabilities. These SSDs are optimized for real-world workloads and reflect insights gained from deep technical engagements with leading cloud service providers, OEMs, and storage innovators. Designed and tested with zero tolerance for data errors, consistently durable IOPS and QoS, and with near-zero lifetime performance degradation, they can be deployed with the utmost confidence.

In a move that bolsters its comprehensive PCIe 4.0 solid-state drive (SSD) portfolio, Kioxia Corporation has introduced the KIOXIA XG8 Series of client SSDs for high-end notebooks, desktops, gaming systems, workstations, as well as data center boot applications. Designed to bring next-generation performance to demanding client environments, the XG8 Series enables power users to take advantage of PCIe Gen4 x4 speed and ample storage space.

The XG8 Series is available in an M.2 type 2280 form factor and supports optional security features using the latest TCG Pyrite 2.01 and TCG Opal 2.01 standards to ensure data is kept secure at home, in the office or on the road. In addition, the XG8 Series features end-to-end data path protection for greater data integrity.

AMD is preparing to launch its highly-anticipated AM5 socket for the next generation of motherboards. And today, thanks to the sources over at Tom's Hardware, we have information regarding memory support for B650 and X670 motherboards. According to the report, both B650 and X670 chipsets will limit the user's memory option to the latest DDR5 memory standard, making it impossible for users with already existing DDR4 memory to perform a seamless upgrade to a new platform. So far, we don't have a lot of details about Zen4's integrated memory controller, and we can't be certain if it supports DDR5 only or carries legacy DDR4 support. However, it seems like B650 and X670 motherboards will have no plans to enable the DDR4 standard memory usage.

Additionally, the report confirms that the B650 chipset is connected to the AM5 socket via PCIe 4.0 x4 connection and has eight lanes of PCIe 4.0 (four of which are for M.2 SSD), four SATA, and lots of USB ports. Documents suggest that the chipset-socket connection is available using PCIe 5.0 for some AM5 processors, so we have to wait and see how it works. As far as high-end X670 is concerned, this chipset is a combination of two chipset dies, presumably a combination of two B650 modules. This doesn't work as the older north/southbridge type of a solution but rather doubled connectivity of a single B650 chipset. We have to wait for the official launch to confirm this information.

For many years, TEAMGROUP has been developing high-quality products for industrial use and automation applications. In response to the growing market for 5G applications, the company this year is focusing on the new market demands of 5G infrastructure, AloT edge computing, and autonomous driving, as well as in-vehicle computing and environmental safety control applications. Today, TEAMGROUP is announcing its 745 SSD Series, which features the 5th generation BiCS NAND flash memory. It's a comprehensive industrial solution that comes with high capacities, low latencies, and high durability for the various application of industrial market.

The TEAMGROUP 745 SSD Series uses the new 112-layer 3D TLC and the latest 5th generation BiCS NAND flash memory, giving it approximately 40% more capacity and 50% better I/O performance than BiCS4 SSDs. This makes it fully suitable for the high-capacity, low-latency transmission requirements of edge computing. To meet the needs of a wide range of industrial applications, the 745 SSD Series is available in a variety of form factors with mainstream specifications, including models with SATA and PCIe Gen3x4 interfaces and capacities from 128 GB to 2 TB, offering the industry a variety of professional options. The 745 SSD Series is also equipped with SLC cache technology, which improves SSD read and write efficiency and supports high AI load for smart manufacturing and autonomous driving, while the AES 256-bit encryption prevents data security concerns and ensures safety and stability of the SSD.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of a proprietary management software that supports TCG OPAL data encryption technology, A+ OPAL. It applies to all ADATA's industrial-grade NVMe and SATA III solid state drives that support TCG OPAL. With an intuitive and simple interface, it enables users to safely manage storage devices, especially for data centers, servers, surveillance, healthcare, and other applications and meets the strict data security requirements of enterprises and governments.

Compared with other encryption software systems, the "Self-Encrypting Drive (SED)" hardware technology defined by TCG OPAL can provide more efficient and convenient management. A+ OPAL software not only greatly reduces the high threshold set by the TCG OPAL specification for users with non-technical backgrounds, but it also saves time and simplifies encrypting through the host system, making information security protection more efficient.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the ADATA SE880 external solid state drive (SSD). This latest external SSD from ADATA supports USB 3.2 Gen2 x2, is equipped with a Type-C port, and delivers read performance of up to 2000 MB/s. This is all packed into an ultra-compact form factor that is smaller than an AirPods case. These attributes make it perfect for content creators and console gamers on the go.

The SE880 supports USB 3.2 Gen2 x2 and is capable of delivering transmission speeds of 20 Gb/s. This is two times faster than USB 3.2 Gen 2x1 and four times faster than USB 3.2 Gen 1x1. This allows the SE880 to achieve read/Write speeds of up to 2000 MB/s, which is roughly twenty times faster than ordinary external hard drives. This incredible speed offers the ultimate convenience for creators, allowing them to access and edit large files directly on the SE880, doing away with the need to transfer files onto their PC beforehand. The SE880 comes in 500 GB and 1 TB variants.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces that it has been awarded six 2022 Red Dot Design Awards for product design excellence. The award winners include the XPG CASTER and SLAYER DDR5 DRAM, XPG ALPHA and PRIMER mice, and ADATA ELITE SE920 and SE880 external solid state drives (SSD).

"From three Red Dot winners last year to six winners this year, ADATA has shown its unwavering emphasis on product design as a key aspect of the user experience," said Ibsen Chen, Senior Product Marketing Director at ADATA. "Whether they be DRAM, gaming mice, or external SSDs, we not only offer users the performance and functionality they require but also a fitting industrial design that appeals to them on an emotional level." The Red Dot Design Award is a globally recognized award that honors innovative companies, praises design excellence, and ultimately recognizes those responsible for tomorrow's trends. An international jury of design experts with a variety of backgrounds assesses each submission on its merits.

Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, and Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, announced today plans to expand their SSD portfolio of next-gen high-performance, high-density enterprise NVMe SSDs. The new SSDs will help enterprises lower total cost ownership (TCO) through increased storage density, lower power consumption, and higher performance. The companies also announced that they have entered a long-term partnership that will strengthen the development cycle and distribution of enterprise-class SSDs.

Seagate and Phison have collaborated on Seagate's mainstream SATA SSD products since 2017. That close cooperation has continued through the company's performance-leading line of FireCuda consumer gaming NVMe PCIe Gen4 x4 SSDs and the world's first purpose-built NAS NVMe SSDs. The partnership will now focus on meeting the evolving global enterprise demand for higher density, faster, and smarter storage infrastructure needs that complement HDD storage to enable comprehensive enterprise applications such as hyperscale data center, high-performance computing and AI.

Kioxia Corporation, the world leader in memory solutions, today held a groundbreaking ceremony for its state-of-the-art semiconductor fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan. Utilizing AI-based cutting-edge manufacturing, the new facility will contribute towards possible expansion of production of its proprietary 3D flash memory BiCS FLASH at the Kitakami Plant. Construction of the Fab2 facility is scheduled to be completed in 2023. The Fab2 facility will have an earthquake-absorbing structure and environmentally friendly design that utilizes advanced energy saving manufacturing equipment and renewable energy sources. In addition, an administration building will be constructed to accommodate the control management and technical departments in response to the increased staff.

"As a leader in memory, this Fab2 facility will become Kioxia's key manufacturing hub to produce our memory products at scale. We are planning to introduce automated in-facility transfers and advanced production control to make Fab2 a truly world-class smart fabrication facility," said Nobuo Hayasaka, President and CEO, Kioxia. "Fab2 will be able to intelligently coordinate and optimize its production with Fab1 at Kitakami Plant as well as our fabs in the Yokkaichi Plant, enabling the company to seize opportunities in the growing memory market in a timely manner." Under its mission of uplifting the world with memory, Kioxia is focused on developing initiatives to strengthen the competitiveness of its memory and SSD business, which it has developed over the past 35 years since inventing NAND flash memory in 1987. Kioxia remains committed to creating consistent and sustainable growth through timely capital investments that meet growing market demand.

Today SK hynix and Solidigm jointly introduced their first collaborative product, a new enterprise solid-state drive (eSSD), P5530. This limited release product highlights the emerging partnership between SK hynix and Solidigm, which formed three months ago when SK hynix acquired Intel's NAND and SSD business. The P5530 combines SK hynix's 128-layer 4D NAND flash with Solidigm's SSD controller and firmware supporting a PCIe Gen 4 interface. The product is offered in 1 TB, 2 TB, and 4 TB capacity options. SK hynix and Solidigm worked together to optimize performance with specific data center use cases and targeted deployments in mind.

Since the launch of Solidigm, the companies have partnered to forge a forward-moving strategy and co-develop products while reinforcing common values across the companies. Through the ongoing partnership and collaboration with Solidigm, SK hynix expects to enhance its NAND flash business competitiveness to the same extent as its DRAM business.

"With in-time demonstration of the collaborative product based on the combined competence of SK hynix and Solidigm, we aim to not only enhance our NAND flash business competitiveness but also speed up our "Inside America" strategy," said Kevin (Jongwon) Noh, President and Chief Marketing Officer (CMO) at SK hynix. "SK hynix and Solidigm will continue to partner in order to optimize both companies' operations to create greater synergies."

We saw such a contraption taking shape for a while now, as M.2 NVMe SSD transfer-rates increase, and controller thermal-throttling begin to significantly impact performance. The new HR-09 2280 Pro by Thermalright is a humongous heatsink designed for SSDs in the M.2-2280 form-factor. Its design involves a nickel-plated copper base-plate, from which two 6 mm heat pipes convey heat through an aluminium fin-stack that's 74 mm tall. 24 mm wide, and 86 mm in length; weighing 90 g. The heatsink does not appear to have latches for fans, nor are any fan-clips included; but one can improvise clips for a 60 mm fan. The company developed a smaller version of this, called simply the HR-09 2280. This one uses a single 6 mm-thick heat-pipe, and its fin-stack is just 48 mm tall; with a total weight of 80 g. The company didn't reveal pricing.

MSI is launching a new blazing fast model to its SSD product line - SPATIUM M480 PCIe 4.0 NVMe M.2 PLAY, exceeding all performance requirements for PlayStation 5 use. MSI SSDs enhances our company's identity as a high-performance PC brand by expanding our ecosystem and covering the high-performance storage category. These SSDs are built with high-quality, high-density 3D NAND flash that delivers great performance with up to 7000 MB/sec read. On SPATIUM M480 PLAY, the sleek dual finish aluminium heatsink is designed to fit the PlayStation 5. This improves heat-dissipation to sustain transfer speeds across all platforms for professionals, content creators, and gamers. Other performance-improving technologies include DRAM cache buffer and an SLC cache.

SPATIUM M480 PLAY is the optimal product made for console gaming in the SPATIUM lineup with four storage capacities - 500 GB, 1 TB, 2 TB, and 4 TB. This brings next-level storage performance to players for PlayStation 5, content creators, and PC gamers. Expanding the storage device on the PS5 is a simple upgrade that allows for lightning-fast save and load times for large game files.

SilverStone today introduced the TP06, an M.2 NVMe SSD heatsink and cover for the PlayStation 5 system. The heatsink is designed for SSDs in the M.2-2280 form-factor that lack heatsinks, and is shaped to double up as a cover for the M.2 NVMe drive bay of the PlayStation 5. The heatsink is a 67.5 gram chunk of aluminium with a solid surface making contact with the drive, and ridges on the other side that dissipate heat. Besides the heatsink, the package includes a thermal pad, screws tested for compatibility with the PS5, and a screwdriver. The company didn't reveal pricing.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drive (SSD) and hybrid storage products announces the next generation of its DuraFlash ME2 family of SATA SSD products, which includes industry-standard M.2 2242, M.2 2280, mSATA, Slim SATA and 2.5" form factors. These SSDs are available in both industrial and commercial temperature grades and have versions that implement SMART's SafeDATA power-loss, data-protection technology for graceful handling of power fluctuations and sudden power loss events.

The new ME2 SSDs incorporate the latest generation 3D NAND-technology and SMART Modular's proprietary NVMSentry firmware to deliver high performance SSD products with endurance up to one drive writes per day (DWPD) for five years using JEDEC JESD219A enterprise endurance workload. The new NAND device offers better cost per bit over previous 64-layer and 96-layer NAND generations without sacrificing performance and reliability. Further optimization of the NVMSentry firmware also yields enhancements in read and write consistency over wide ranges of application workloads. High performance computing, data centers, networking, cloud systems and many other applications that demand high reliability and consistency over long operating lifetime can benefit from the new ME2 SSD products.

Samsung and Western Digital today signed a memorandum of understanding (MOU) that implies that the two companies will join their efforts to create next-generation data placement, processing, and fabrics (D2PF) storage technologies. The MOU states that the two companies will collaborate on creating Zoned Storage devices, including ZNS (Zoned Namespaces) SSDs and SMR (Shingled Magnetic Recording) HDDs. The ZNS SSD initiative is a challenge of creating entirely new SSDs that work on the ZNS principle instead of traditional block-based drives. Opposite to data in traditional SSDs written in blocks, ZNS SSDs will place data into zones and have software understand where each bit of information is written without excessive read/write action. Another benefit of ZNS is that managing data allows less garbage collection, thus higher efficiency.

Software adoption for ZNS makes it hard, and Samsung's conjoined efforts with Western Digital aim to simplify it. Western Digital notes that "In addition, this collaboration is expected to serve as a starting point to expand zone-based (e.g. ZNS, SMR) device interfaces, as well as future-generation, high-capacity storage devices with enhanced data placement and processing technologies. At a later stage, these initiatives will be expanded to include other emerging D2PF technologies such as computational storage and storage fabrics including NVMe over Fabrics (NVMe-oF)." So, with further development of ZNS, Samsung and Western Digital will collab on more advanced storage options as well.

TechPowerUp and ORICO brought our readers from across the globe, a unique chance to win an ORICO TB3-S2 NVMe SSD Docking Station; and an ORICO PSSD 1 TB biometric-encrypted portable SSD. The TB3-S2 is a 9-in-1 connectivity expander that takes advantage of Thunderbolt 3 to put out a plethora of USB, wired LAN, memory card, connectivity, while also serving as a handy dual M.2 NVMe enclosure. The PSSD is a rugged portable SSD for road-warriors, with a fingerprint reader, and an in-built drive encryption mechanism. The results are in! Without further ado, the winners:

• "vzangel" from Mexico (Twitch and Twitter handle), wins an ORICO TB3-S2 9-in-1 docking station
• "simiaelevatum" from the United States (Twitch handle), wins an ORICO PSSD 1 TB portable SSD

A huge congratulations to you two! ORICO and TechPowerUp will return with more such interesting giveaways.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a global leading brand of industrial-grade memory, including flash storage products and DRAM modules, today announces that its in-house developed firmware for 112-Layer (BiCS5) 3D NAND PCIe solid state drives has become University of New Hampshire InterOperability Laboratory (UNH-IOL) NVMe 1.4 certified. The certification reaffirms ADATA's core competencies in R&D and commitment to offering high performance SSDs. UNH-IOL is an independent test facility that provides interoperability and standards conformance testing for networking, telecommunications, data storage, and consumer technology products.

The IM2P32A8 M.2 2280 and IM2P32A4 M.2 2242 industrial-grade solid state drives will benefit from the newly certified firmware. What's more, both SSDs feature 112-layer 3D TLC Flash memory developed by WD and KIOXIA, supports the PCIe Gen3x4 interface, and provides large capacities of up to 2 TB. With ADATA's firmware, they provide improved performance and interoperability. In addition to processing large volumes of data, the SSDs can also serve as storage devices or a boot disk, which can fulfill the needs of applications such as 5G, Industrial Internet of Things (IIoT), smart cities, and telemedicine.

Apacer has taken 3D NAND Flash optimization to new heights. Today, it announces the release of SLC-liteX industrial SSDs that can provide an incredible 100,000 P/E cycles. That's 3 to 33 times higher than competing 2D MLC or 3D TLC products can offer. 5G and AIoT manufacturers who are invested in large-scale data collection and analysis, including those demanding higher capacities, higher performance and higher endurance, will quickly see the advantages of this development. According to Allied Market Research, "the global 3D NAND flash memory market size was valued at $12.38 billion in 2020, and is projected to reach $78.42 billion by 2030, registering a CAGR of 20.3% from 2021 to 2030."

The endurance of any NAND Flash product can be measured in P/E cycles. Every time a write or erase action is performed, the Flash cell will suffer irreparable damage. In the industrial world, 3,000 P/E cycles was considered quite a competitive number. But with increasing demands for greater endurance thresholds in applications such as 5G O-RAN and edge computing switches, the market was hungry for more - while still recognizing the paramount importance of cost-effectiveness. Apacer's crack team of firmware experts tackled the problem and were able to tweak the technology to deliver 100,000 P/E cycles. Careful cell distribution management of the 3D TLC structure was necessary in order to correctly adjust the voltage delta and charge sensing. Furthermore, powered by carefully selected industrial grade NAND components, the firmware structure is specifically optimized to enhance NAND flash stability during daily operations, and the error handling algorithm is significantly improved to avoid any unexpected ECC errors.

5G's rapid deployment is spiking demand for large amounts of data storage. Emerging 5G applications such as telemedicine, smart healthcare and smart poles require storage devices that can offer high-speed, low-latency and stable operation during high-quality, high-resolution image data transmission to permit AI image recognition and auxiliary diagnoses. Luckily, Apacer's latest PCIe Gen4 x4 SSD is stepping up to the plate. It adopts the latest BiCS5 112-layer 3D NAND Flash memory technology. This means ultra-high performance and reliability, a stable supply and - crucially - a more competitive cost per unit.

Real-time imaging data plays an important role in 5G healthcare applications. But to be effective, it requires high-resolution images that are extremely clear and focused. According to a recent report, "5G in Healthcare Market" released by MarketsandMarkets, telehealth and robotic surgery both grew in response to the challenges posed by COVID-19, and 5G wearable medical devices also became more prevalent for the same reason. Currently, the 5G healthcare market "is valued at an estimated USD 215 million in 2021 and is projected to reach USD 3,667 million by 2026, at a CAGR of 76.3% during the forecast period."

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched the 2-bay TS-233 NAS suitable for home/office environments. With a sleek design and quiet fan, the TS-233 provides a cost-effective centralized storage, backup, file sharing, and multimedia solution that features rich NAS applications for greater productivity and boundless entertainment.

The TS-233 features an ARM Cortex A55 quad-core processor with integrated 2 GB memory. It can be used with 3.5-inch SATA 6 Gb/s SSDs and supports AES-NI encryption acceleration, providing a secure, high-speed backup/restore, file access and sharing experience. With a built-in NPU (Neural network Processing Unit) processor, the TS-233 also boosts QNAP AI Core (the AI-powered engine for image recognition) performance for high-speed face and object recognition.

Kioxia Corporation, the world leader in memory solutions, today announced it will begin construction of a state-of-the-art new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH. Construction of the facility is scheduled to commence in April 2022 and is expected to be completed in 2023.

The new Fab2 facility will utilize AI-based cutting-edge manufacturing to increase production capacity of the entire Kitakami Plant and further enhance product quality, allowing Kioxia to expand its business organically and take advantage of the medium to long term growth of the flash memory market driven by the accelerating adoption of cloud services, 5G, IoT, AI, automated driving and the metaverse.

KIOXIA America, Inc., today announced that it is sampling its 2nd generation PCIe 5.0 SSD for enterprise and data center customers. After being the first vendor to offer a drive using the PCIe 5.0 interface, KIOXIA has now introduced the new CD8 Series data center NVMe SSD family. CD8 SSDs double the bandwidth per lane over PCIe 4.0 SSDs from 16 gigatransfers per second (GT/s) to 32GT/s and are optimized for hyperscale data center and enterprise server-attached workloads.

"Today, PCIe 4.0 SSDs are considered at the forefront in terms of delivering the highest levels of drive performance," commented Greg Wong, founder and principal analyst, Forward Insights. "Next generation PCIe 5.0 SSDs provide twice the level of performance, and will continue to propel the PCIe/NVMe SSD market - which is expected to grow at a CAGR of over 20% out to 2026."

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it closed out a prosperous 2021 in the number one spot for SSD Unit market share in the channel. SSD demand through Q4 2021 remained high due to continued growth in the client, enterprise and OEM sectors. In October, Kingston also broadened its portfolio by launching two new high performance client M.2 NVMe PCIe Gen 4 SSDs, KC3000 and Kingston FURY Renegade.

Market share data from analyst research company TRENDFOCUS showed Kingston as the number one client SSD vendor in the channel with 22.2% for unit market share and 22.3 million client SSDs shipped for all of 2021 in the channel. In Q4 alone, Kingston's client SSD market share grew to a substantial 26.8% in the channel which displays a healthy annual unit growth despite ongoing component shortages. According to TRENDFOCUS, total client SSD units increased 12.4% YoY in 2021. Notebook PC units increased 12% YoY while desktop PCs inched up 1% over the same period, reflecting the rapid adoption of solid-state drives by clients largely due to performance, size and reduced power consumption. Kingston maintains a competitive advantage by working closely with its suppliers, partners, and customers to remain flexible and adapt to ever-changing needs and market conditions.