Thanks to the development of 5G and the popularization of IoT, global industrial automation has entered a period of rapid development. With this trend in mind, Team Group has released its next-generation A501 CFast Memory Card, compliant with the CFast 2.0 specification and supports the SATA III 6.0 Gbps interface. With its high performance, large capacity, and light weight, the A501 can be installed on a variety of industrial-embedded hardware devices and automation tools, helping bring industrial automation to the next level.

The Team Group A501 CFast Memory Card is equipped with a major grade original 3D TLC IC, has a rated endurance of 3,000 P/E cycles, and features up to 512 GB of storage for large-capacity applications. Having undergone strict temperature testing, A501 is able to withstand temperatures from -40 °C to +85 °C, ensuring stable performance over long periods of operation in harsh temperature conditions. In addition, the card can deliver speeds of up to 550 MB/s read and 490 MB/s write (512 GB model) and supports DevSleep's low-power hibernation mode to significantly save power consumption and be used in a variety of automated applications. The newest-released CFast memory card also meets the specifications of industrial products, providing up-to-standard and highly customized solutions that satisfy customer needs.

Corsair has teased its fastest PCIe 5.0 SSD yet in an M.2 form factor. The company published some initial details about its upcoming product in a short video. However, the video has been taken private, indicating that the launch date may be at a later stage of the year. Thanks to Overclock3D, we saw its looks and got a slight peek at the product. Called the MP700, the SSD is supposedly boasting a fantastic 10 GB/s read capability. The write section is also impressive, with the NVMe SSD capable of reaching around 9 GB/s of what we suppose is a sustained write speed. It uses 3D TLC NAND Flash and supports Microsoft DirectStorage technology for faster load time. Below is a quote from Corsair about the MP700.

CorsairExperience the performance of PCIe Gen5 storage in your system, with up to 10,000MB/sec sequential read and 9,500MB/sec sequential write speeds for amazingly fast save, boot, and load times.
The high-bandwidth NVMe 2.0 interface and high-density 3D TLC NAND flash memory offer outstanding performance and longevity. Slot the MP700 directly into your motherboard thanks to its M.2 2280 form-factor, while a stylish aluminum heatsink helps manage temperatures and reduce throttling. Microsoft DirectStorage enables unprecedented load times when playing compatible games.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced the evolutionary AORUS Gen4 7300 SSD, which is the upgraded PCIe 4.0 SSD with read speed up to 7300 MB/s. Enhanced by the select PCIe 4.0 controller with advanced 3D-TLC NAND Flash, it provides superior performance than the previous generation PCIe 4.0 NVMe SSD. AORUS Gen4 7300 SSD with M.2 2280 interface comes in two capacity variants of 2 TB and 1 TB, along with a unique packaging design of separated SSD and heatsink packing to offer more flexible thermal solutions. Meanwhile, the GIGABYTE exclusive GCC software management platform provides the instant overview and adjustment of SSD status for a cool storage operation with high performance.

AORUS Gen4 7300 SSD equips the select Phison E18 8-channel controller, which provides users with ultimate random access rate, as well as the high-speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. Under the real test, AORUS Gen4 7300 SSD can reach a read speed up to 7300 MB/s and a write speed up to 6850 MB/s, which is faster than the previous gen. PCIe 4.0 NVMe SSD, two times faster than PCIe 3.0 SSD, and up to 13 times faster than SATA SSD. Enhanced by the multi-core architecture of the E18 controller, AORUS Gen4 7300 SSD not only improves AI multitasking to lessen the bottleneck of system performance, but powers up content creators, gamers, and users eager for extreme performance.

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

Mushkin at the 2023 International CES showed off its Vortex Redline and Vortex LX M.2 NVMe SSDs. The Vortex Redline is the company's top PCIe Gen 4 drive, combining an Innogrit IG5236 NVMe 1.4 controller with 3D TLC NAND flash, to offer transfer speeds of up to 7415 MB/s. The Vortex Redline comes in capacities of 512 GB, 1 TB, and 2 TB. The Vortex LX is a more value-oriented product, based on an unnamed Innogrit-sourced DRAMless controller. This drive features a PCIe Gen 4 interface, but offers slightly lower performance that the company didn't disclose.

The star attraction at the Mushkin booth was its Epsilon SSD that features a PCI-Express 5.0 x4 + NVMe 2.0 interface, a Phison E26-series controller, and next generation 3D NAND flash memory (possibly 232-layer). The drive features active cooling from a fan-heatsink, and while the company didn't talk about performance, drives based on this controller are known to offer up to 12 GB/s of sequential transfers. Lastly, the company showed off its lineup of 2.5-inch SATA 6 Gbps SSDs in capacities ranging all the way up to 16 TB, which are meant to be HDD replacements, and "warm" storage devices.

KIOXIA is betting big on enterprise flash storage, and demoed several of its new and already-launched NVMe products based on the company's 162-layer 3D NAND flash memory, aka 6th Generation BiCS flash. Starting off, we see several single-chip solutions, namely the BiCS5 eTLC, the BiCS Industial TLC, and the BiCS5-QLC. These are complete NVMe SSDs on a single package, targeting embedded systems, industrial PCs, and the likes. They can even be directly embedded on server motherboards to serve as boot drives, freeing up precious chassis space for the main storage devices.

The EM6 is an enterprise network-attached SSD in a 2.5-inch form-factor. This is a NAS-on-a-stick that can be deployed at large scale, and accessible as a network resource, or as an NVMe-over-Fiber device. The CM7 is a high-capacity 2.5-inch (EDSFF E3.S) SSD that comes in sizes of up to 30 TB, and has PCI-Express 5.0 x4 interface with NVMe 2.0 protocol, with endurance of up to 3 DWPD and offering FIPS 140-33 security. We also see the XD6 line of EDSFF E1.S form-factor NVMe SSDs with PCIe 4.0 interfaces, up to 3.84 TB capacity, and 1 DWPD endurance.

Acer at the 2023 International CES showed off its latest lineup of memory and storage products targeting the DIY PC enthusiast market segment under its high-end Predator brand. Leading the booth is the Vesta II line of DDR5 memory modules featuring a high-end product design, and RGB LED lighting. The one shown to us featured a rather modest DDR5-5200 speed and 2x 16 GB density, but the company assured it is spreading the lineup to higher frequencies. The Pallas II line of performance-segment memory targeting creators, for example, does DDR5-6000.

A star attraction in the booth was the Predator GM7 M.2 NVMe SSD. Built in the M.2-2280 form-factor, the drive features a PCI-Express 4.0 x4 + NVMe 2.0 host interface, and combines a Maxiotech MAP1602 controller with YMTC 232-layer 3D TLC NAND flash based on the Xtacking 3.0 architecture. The drive offers sequential transfer speeds of up to 7400 MB/s reads, with up to 6300 MB/s writes, and comes in sizes of 512 GB, 1 TB, and 2 TB, priced at USD $49.90, $89.90, and $159.99, respectively. Acer is backing these drives with a 5-year warranty.

Here are some of the first pictures of the yet-unnamed PCIe Gen 5-based NVMe SSD by ADATA XPG. Built in the M.2-2580 form-factor, the drive features a PCI-Express 5.0 x4 host interface and NVMe 2.0 protocol. At its core is a Silicon Motion SM2508 series controller, coupled with the latest generation 3D TLC NAND flash over a large number of flash channels; and a faster DRAM cache. The drive offers sequential transfer rates of up to 14 GB/s reads, with up to 12 GB/s writes. and 2 million IOPS 4K random transfers. It comes in capacity-based variants, with 8 TB being the largest one.

The most striking aspect about this drive is its active cooling solution. A ridged aluminium monoblock heatsink is used to cool the SM2508 controller. nestled in its center is what appears to be a miniature 10 mm lateral fan. The heatsink has surface-crystallization treatment to increase surface area for heat dissipation. A die-cast aluminium top-plate and 3-sided backplate sandwich the fan-heatsink and the main PCB. The fan is tightly controlled by temperature, and ADATA claims you should barely notice it. To use the drive to its fullest, you'll either need an AMD Ryzen 7000 "Zen 4" platform that has dedicated PCIe Gen 5 M.2 slots wired to the processor, or an Intel 700-series chipset motherboard that puts out a Gen 5 M.2 slot by subtracting lanes from the Gen 5 PEG slot.

Greenliant is now shipping mSATA and SATA M.2 2242 ArmourDrive EX Series solid state drives (SSDs) with EnduroSLC Technology for superior data retention and high endurance ranging from 60K and 120K to the industry-leading 300K program-erase (P/E) cycles. Built with Greenliant's advanced in-house controllers, these SSDs are available in 10 GB, 20 GB, 40 GB, 80 GB, 160 GB and 320 GB capacities.

mSATA and SATA M.2 2242 ArmourDrive EX Series SSDs are included in Greenliant's Long-Term Availability (LTA) program (http://bit.ly/SSD-LTA-program), providing customers with a stable portfolio of high-endurance data storage products for up to 10 years. Greenliant is also shipping mSATA and SATA M.2 2242 / 2280 ArmourDrive PX Series SSDs using cost-effective industrial 3-bit-per-cell (TLC) 3D NAND. These SSDs support 5K P/E cycles and are available in 64 GB, 128 GB, 256 GB and 512 GB capacities.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

TrendForce reports that the recent easing of tight supply for components has led to rising shipments for enterprise servers. Furthermore, ODMs for the most part have been able to sustain the momentum of data center build-out with the demand from ByteDance and the tenders issued by Chinese telecom companies. Nevertheless, the performance of the enterprise SSD market on the whole has been impacted by falling NAND Flash prices. For 3Q22, the NAND Flash industry's enterprise SSD revenue dropped by 28.7% QoQ to US$5.22 billion. Furthermore, all enterprise SSD suppliers recorded a negative performance for the period as well.

Regarding individual enterprise SSD suppliers' revenue figures for 3Q22, Samsung posted around US$2.12 billion. Its market share also shrank to 40.6% from 44.5% in 2Q22. Samsung's performance was mainly dragged down by the decline in its NAND Flash ASP. In the aspect of product development, SSDs featuring 128L NAND Flash and PCIe 4.0 will remain Samsung's main offerings for enterprise storage during 2023.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry's highest bit density. At 1 Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.

"As market demand for denser, greater-capacity storage pushes for higher V-NAND layer counts, Samsung has adopted its advanced 3D scaling technology to reduce surface area and height, while avoiding the cell-to-cell interference that normally occurs with scaling down," said SungHoi Hur, Executive Vice President of Flash Product & Technology at Samsung Electronics. "Our eighth-generation V-NAND will help meet rapidly growing market demand and better position us to deliver more differentiated products and solutions, which will be at the very foundation of future storage innovations."

Corsair has quietly launched two new SSD SKUs, the MP600 PRO NH and the MP600 GS. Although the model names seem similar, the two models couldn't be more different. Both are PCIe 4.0 x4 drives and in both cases controllers from Phison are used, but beyond both using a black PCB, the common features end here. The MP600 PRO NH is based around the Phison E18 and delivers sequential read speeds of up to 7000 MB/s, with the write speeds peaking at 6500 MB/s, depending on the storage capacity and this is where things get really interesting. Corsair is offering the MP600 PRO NH in capacities of up to 8 TB, but the SKU with the overall best performance is the 4 TB SKU. Random write performance is said to be up to 1.2 million IOPS, with random read performance topping out around 1 million IOPS. For some reason Corsair is offering a 500 GB SKU as well, but it offers fairly poor performance compared to its larger siblings. All drives use 3 TLC NAND, so we're not looking at QLC drives here.

The MP600 GS on the other hand is based on the Phison E21T, which is a DRAM-less controller that targets the more affordable drive segment. Here we're looking at only two SKUs, 500 GB or 1 TB, with the 1 TB drive offering sequential read speeds of up to 4800 MB/s and sequential write speeds of up to 3900 MB/s. The random read speed hits 580k IOPS with the random write speeds reaching 800k IOPS. This drive is also using 3D TLC NAND. The MP600 GS costs US$57.99 for the 500 GB SKU and US$92.99 for the 1 TB SKU. The MP600 PRO NH starts at US$72.99 for the 500 GB SKU, followed by US$112.99 for 1 TB, US$212.99 for 2 TB, US$529.99 for 4 TB and finally a rather steep US$1,074.99 for the 8 TB SKU. Both models come with a five year warranty.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest PCIe 4.0 M.2 SSD - AORUS Gen4 5000E which comes in two capacities of 500 GB and 1000 GB with 5000 MB/s read speed and 30% lower on overall power consumption. The AORUS Gen4 5000E has passed several comprehensive performance and stability tests to ensure users the most stable SSD with next-level performance.

"PCIe M.2 SSD dominates the present market with its advantages of small size and premium performance, making it the perfect choice for users to enhance storage performance, especially in the case of speedy PCIe 4.0 SSDs", said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. "Since the well-reputed PCIe 4.0 SSD first launched in 2019, GIGABYTE carries on with the belief in providing top-quality products to meet the needs of superior performance and ultra durability. AORUS Gen4 5000E SSD with 5000 MB/s read speed performs a key role in the improvement of storage performance."

Furthering its mission to address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced that it has expanded its broad portfolio of client, enterprise and data center SSDs with the addition of the XD7P Series. Designed for hyperscale and general server applications in the new Enterprise and Data Center Standard Form Factor (EDSFF) E1.S form factor, XD7P drives are the second generation of E1.S SSDs with Open Compute Project (OCP) Data Center NVMe SSD 2.0 specification support from KIOXIA, following its XD6 series. KIOXIA XD7P drives are now sampling to select data center customers.

"Hyperscale needs of density, power, performance and serviceability are driving PCIe 5.0, E1.S, as a form factor, and the OCP Data Center NVMe SSD specification V2.0 for the data center," said Ross Stenfort, hardware storage engineer, Meta. "The KIOXIA XD7P Series SSD supports these storage technologies to enable the next generation of hyperscale needs."

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022. An annual conference since 2017, the event returned to in-person attendance at the Signia by Hilton San Jose hotel after three years.

This year's event, attended by more than 800 customers and partners, featured presentations from Samsung's Memory and System LSI business leaders—including Jung-bae Lee, President and Head of Memory Business; Yong-In Park, President and Head of System LSI Business; and Jaeheon Jeong, Executive Vice President and Head of Device Solutions (DS) Americas Office—on the company's latest advancements and its vision for the future.

KIOXIA America, Inc. has introduced new Industrial Grade flash memory devices. This new lineup utilizes the latest generation KIOXIA BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package. Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the unique requirements of industrial applications - including telecommunication, networking, embedded computing and much more.

The storage requirements for many industrial applications stand in stark contrast to those of SSDs designed to be housed in climate-controlled data centers - including the need for extended temperature ranges and the ability to maintain high reliability and performance in rugged operating conditions. Designed with these needs in mind, the new KIOXIA devices support a wide temperature range (-40°C to +85°C) and offer suitable products for the industrial market.

Here are some of the first pictures of the GoodRAM IRDM Ultimate PCIe Gen 5 M.2 NVMe SSD. Built in the M.2-2580 form-factor, the drive combines Phison's upcoming E26 controller, with what's likely KIOXIA 162-layer 3D TLC NAND flash memory. The controller takes advantage of the PCI-Express 5.0 x4 interface, and NVMe 2.0 protocol, offering sequential transfer speeds of around 10 GB/s reads, with around 9.5 GB/s writes. The drive comes in capacities of 1 TB, 2 TB, and 4 TB. It comes with a fairly large heatsink included. AMD Socket AM5 will be the first platform to feature CPU-attached PCIe Gen 5 M.2 slots, which goes on sale by late-September. The first PCIe Gen 5 NVMe SSDs, according to AMD, should be here by November.

According to TrendForce research, material supply improvement and spiking demand for enterprise SSDs from North American hyperscale data center and enterprise clients in 2Q22 coupled with the Kioxia contamination incident in 1Q22 prompted customers to ramp up procurement to avoid future supply shortages. Manufacturers also give priority to meeting the needs of server customers due to the high pricing of enterprise SSD. In the second quarter, overall revenue of the enterprise SSD market increased by 31.3% to US$7.32 billion.

As the market leader, Samsung has grown its enterprise SSD revenue to US$3.26 billion with the recovery of enterprise SSD procurement. Especially in the second quarter, when orders for other consumer products continued to decline, enterprise SSD became the company's outlet for reducing production capacity. At present, Samsung has been continuously investing in the development of next-generation transmission specification products such as the CXL 2.0 product released at the Flash Summit in early August, in order to maintain a leading position in the market.

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products today announces its first industrial-grade PCIe Gen4 x4 M.2 2280 solid state drive, the IM2P41B8. Utilizing the ultra-high-speed PCIe Gen4 x4 interface, it delivers excellent read and write performance for processing large data loads, and the durability and security industrial-grade applications require.

The IM2P41B8 M.2 2280 is equipped with WDC's 112-layer 3D TLC flash memory with a maximum capacity of 4 TB. With the PCIe Gen4 x4 interface and NVMe 1.4 support, the IM2P41B8 offers performance that is 230% higher than PCIe 3.0, random read and write speeds of up to 220,000/175,000 IOPS, and sustained read and write speeds of up to 7000/6500 MB/s. What's more, it feature 3K P/E cycle rating for excellent durability.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen5 10000 SSD with 10 GB/s read speed. Enhanced by the new generation PCIe 5.0 controller with ultra-fast 3D-TLC NAND Flash, AORUS Gen5 10000 SSD provides boosted performance of more than 55% over PCIe 4.0 SSDs and comes in 1 TB to 4 TB capacity variants using an M.2 2280 interface to deliver easy installation and superb capability. Additionally, the separate SSD and heatsink offers more flexibility in system build and thermal options for users. GIGABYTE's exclusive SSD Tool Box application provides users real-time status of SSD to leverage performance, thermal, stability and capability.

"With PCIe 5.0 support on new motherboard platform, the bandwidth and transfer performance are raised to the next level. As the first manufacturer to have both motherboards and SSD product lines in the market, GIGABYTE is also the first to unveil the AORUS Gen5 10000 SSD. This new product brings blistering fast storage performance with ultra durability and compatibility to users for optimal quality and performance." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest 3D triple-level cell (TLC) flash storage solid state drives (SSDs): the N700 and N600 Series, which support the high-speed PCIe 3.0 interface x4 lanes and NVMe protocol. The new SSDs offer hardware-based security features, such as Write Protection and Quick Erase, by project and customer request. Enabled through the general input/output (GPIO) pins, HW Write Protect puts the SSD in "Read Only" mode, thus preventing the modification or tampering of stored data. HW Quick Erase, on the other hand, initiates a block-by-block data pattern write operation to systematically erase any trace of user data.

Available as M.2 2230 modules, they offer better power efficiency and are suitable for applications using small and light systems such as point-of-sale (POS) systems, mobile PCs, Internet of Things (IoT) devices, and server boot applications. The N700 and N600 Series accommodate a heatsink ball-grid array (HSBGA) on the M.2 2230 form factor. For customers who prefer a soldered-down, vibration-proof solution, ATP also offers M.2 Type 1620 HSBGA SSDs with the same firmware and NAND configuration.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

SK hynix Inc. announced today that it has developed the industry's highest 238-layer NAND Flash product. The company has recently shipped samples of the 238-layer 512Gb triple level cell (TLC) 4D NAND product to customers with a plan to start mass production in the first half of 2023. "The latest achievement follows development of the 176-layer NAND product in December 2020," the company stated. "It is notable that the latest 238-layer product is most layered and smallest in area at the same time."

The company unveiled development of the latest product at the Flash Memory Summit 2022 in Santa Clara. "SK hynix secured global top-tier competitiveness in perspective of cost, performance and quality by introducing the 238-layer product based on its 4D NAND technologies," said Jungdal Choi, Head of NAND Development at SK hynix in his keynote speech during the event. "We will continue innovations to find breakthroughs in technological challenges."