Amidst falling prices of NAND flash and increased desirability from users' part, companies have been expanding their portfolio of SSD offerings for the consumer side of the fence as well as the enterprise one. ADATA's XPG SX8200 Pro SSD was initially only offered in 256 GB, 512 GB, and 1 TB configurations, but in the case of SSD storage, "moar" is usually better. We'll see when do 256 GB offerings get discontinued, but I'd give it another pair of years at the most.

The ADATA XPG SX8200 Pro features Silicon Motion's SM2262EN controller packing eight NAND channels, four ARM Cortex-R5 cores, support for NVMe 1.3, LDPC ECC, RAID engine et all (eh), paired with Micron's 3D TLC NAND - no QLC here, folks. The SSD offers up to 3.5 GB/s sequential read speed and up to 3 GB/s sequential write speed, and up to 360K random read/write 4K IOPS. The ADATA SSD features a TBW rating of 1280 TB over a 5-year warranty period - and a MTBF (Mean Time Between Failures) rate of 2,000,000 hours (something like 83.333, 33 (3) days of continuous usage. Now that's north of two hundred years of continuous operation, which makes me sad just thinking about it and what I'd do with that time. In another conscience state, perhaps. ADATA's 2 TB XPG SX8200 Pro is $289.99, in select European countries (from eBay) at about €308, and in Japan for ¥36,680.

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced the introduction of three new families of SSD products on display this week at the 2019 Flash Memory Summit in Santa Clara, CA.

The three new Enterprise Grade SSD product families - the S1800, the Q400 and the R800 - offer the quality, performance and reliability expected in business critical applications in storage, networking, data communication and industrial embedded market segments. These SSD products are designed for performance consistency in continuous workload conditions.

Back at CES 2019 we shared a story on Kingston's then upcoming A2000 series NVMe drives. The company's development strategy for these was to undercut SATA SSDs in pricing while delivering non SATA-bound speeds. The company planned to leverage component cost falls for NVMe controllers, pairing that with the reduced materials cost of NVMe drives (smaller than their SATA counterparts) so as to be able to achieve below-SATA price points. The choice of Toshiba's BiCS4 3D TLC NAND also aimed to keep costs down, whilst delivering performance that's "at least three times as high as SATA-bound drives".

The company is offering a limited 5-year warranty on their A2000 series, which in itself is a sign of the company's confidence in these products - despite their entry-level classification and overall development strategy. The A2000 series will be available in 250 GB, 500 GB and 1 TB capacities, with speeds claimed of up to 2,200/2,000MB/s sequential read/writes; up to 250,000/220,000 IOPS in random 4K read/writes; and 600 TBW rating (all of these values are for the 1 TB solution, with TBW falling to 350 TBW for the 500 GB part and 150 TBW for the 250 GB drive. These drives make use of a PCIe 3.0 4x controller, which means savings weren't at the expense of 2x PCIe channels, as some solutions have done in the past in order to cut costs. Pricing is being quoted at $40 for the 250 GB part, $60 for the 500 GB one, and a mere $100 for the 1 TB part. The true democratization of NVMe SSDs has just caught some heavy favorable winds on its sails.

Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH. Based on the company's innovative BiCS FLASH 3D flash memory technology with 1-bit-per-cell SLC, XL-FLASH brings low latency and high performance to data center and enterprise storage. Sample shipments will start in September, with mass production expected to begin in 2020.

Classified as SCM (or persistent memory), with the ability to retain its contents like NAND flash memory, XL-FLASH bridges the performance gap that exists between DRAM and NAND. While volatile memory solutions such as DRAM provide the access speed needed by demanding applications, that performance comes at a high cost. As the cost-per-bit and scalability of DRAM levels off, this new SCM (or persistent memory) layer in the memory hierarchy addresses that issue with a high density, cost effective, non-volatile NAND flash memory solution. Poised for growth, industry analyst firm IDC estimates the SCM market is expected to reach in excess of $3B in 2022.

PNY today rolled out the XLR8 CS2311 line of SSDs. Built in the conventional 2.5-inch form-factors, the drives take advantage of the SATA 6 Gbps interface. The CS2311 offers sequential transfer rates of up to 560 MB/s reads with up to 530 MB/s writes, and comes in capacities of 250 GB, 500 GB, 1 TB, and 2 TB, priced at USD $49.99, $77.99, $129.99, and $279.99, respectively. The drives feature 3D TLC NAND flash, and cover all the basics: LPDC, ECC, 256-bit AES native encryption, and SMART. The company is backing these with 3-year warranties.

SK hynix Inc. today announced financial results for its second quarter 2019 ended on June 30, 2019. The consolidated second quarter revenue was 6.45 trillion won while the operating profit amounted to 638 billion won and the net income 537 billion won. Operating margin for the quarter was 10% and net margin was 8%.

As demand recovery did not meet expectations and price declines were steeper than expected, the revenue and the operating profit in the second quarter fell by 5% and 53%, respectively, quarter-over-quarter (QoQ). DRAM bit shipments increased by 13% QoQ as the Company actively responded to the mobile and PC DRAM markets, where demand growth was relatively high. However, DRAM prices remained weak and the average selling price dropped by 24%. For NAND Flash, the bit shipments increased by 40% QoQ because of demand recovery due to price declines, while the average selling price decreased by 25%.

Greenliant has started sampling its NVMe M.2 ArmourDrive solid state drive (SSD) modules to customers requiring high-performance, high-capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and 2280 form factors.

88 PX Series NVMe ArmourDrive SSDs provide high performance and low latency for high transactional and business critical applications. NVMe is a highly scalable protocol optimized for efficient data transport over PCIe for storage on NAND flash. Small form factor, power efficient M.2 2242 products support the PCIe Gen3x2 interface and can reach up to 1,550/950 MB/s sequential read/write performance. Offered with hardware encryption and DRAM, M.2 2280 products support the PCIe Gen3x4 interface and can reach up to 3,470/3,000 MB/s sequential read/write performance. These versatile NVMe M.2 ArmourDrive form factors are ideal for space-constrained, embedded and enterprise systems in cloud computing, broadcasting, industrial gaming, factory automation, networking and security.

First seen at Computex this year, Corsair seems to be first to market with a PCI-Express x4 Gen 4 SSD. Amazon Japan has the Corsair MP600 listed now for pre-order, with a "July 13" release date - it was also listed on Amazon US earlier today, but the product page has vanished since then. Corsair's MP600 SSD comes in capacities of 1 TB and 2 TB, and will be priced at $250 for the 1 TB version, and $450 for the 2 TB model. With PCIe 4.0, the bandwidth per pin is once again doubled over what 3.0 offered. According to Corsair, the MP600 SSD will reach up to 4.95 GB/s sequential write speed and up to 4.25 GB/s sequential read. Like most other PCI-E Gen 4 SSDs that we saw at Computex, the MP600 is based on Phison's PS5016-E16 controller and uses 3D TLC NAND memory.

Update Jul 1st: The drive is now listed at Amazon US, release date is "July 1st", so today: MP600 1 TB ($249.99) and 2 TB ($449.99). It is sold and shipped by Amazon itself.

American flash memory products manufacturer Sabrent announced a client-segment M.2 NVMe SSD that takes advantage of PCIe gen 4.0, the Rocket NVMe 4.0 series. Based on the same Phison PS5016-E16 controller as most PCIe gen 4.0 SSDs launched so far, the drive uses 96-layer 3D TLC NAND flash by Toshiba. It also appears to have higher on-paper performance numbers than most drives from other brands that use the same combination of controller and NAND flash, with up to 5,000 MB/s sequential reads, and up to 4,400 MB/s sequential writes, on both its 1 TB and 2 TB variants. The company didn't bother with a sub-terabyte variant. The 1 TB variant is priced at USD $229.99 ($0.23 per GB), and the 2 TB variant at $429.99 ($0.21 per GB).

SK hynix Inc. announced today that it has developed and started mass-producing the world's first 128-Layer 1 Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year.

The 128-Layer 1 Tb NAND chip offers the industry's highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip. To achieve this, SK hynix applied innovative technologies, such as "ultra-homogeneous vertical etching technology," "high-reliability multi-layer thin-film cell formation technology," and ultra-fast low-power circuit design, to its own 4D NAND technology.

The new product provides the industry's highest density of 1 Tb for TLC NAND Flash. A number of companies including SK hynix have developed 1 Tb QLC (Quad-Level Cell) NAND products, but SK hynix is the first to commercialize the 1 Tb TLC NAND Flash. TLC accounts for more than 85% of the NAND Flash market with excellent performance and reliability.

SK hynix Inc. announced today that it launched a new low-power Non-Volatile Memory express (NVMe) Enterprise SSD (eSSD) with the 72-layer TLC 3D NAND flash that offers best-in-class performance for power as well as Quality of Service. The product features an in-house NVMe controller on top of the 72-layer 3D NAND technology currently in mass production. With the launch, SK hynix has established itself as a memory producer that designs, develops, and mass-produces all key components, from NAND and DRAM to controllers, in-house, for not only Client but also Enterprise applications.

Meanwhile, power consumption of datacenters is an increasingly important concern in terms of energy and environmental preservation, as their footprint grows amid rising enterprise demand for cloud, Artificial Intelligence (AI), and Machine Learning (ML). As datacenters are expected to account for one-fifth of the world's energy consumption in 2025, low-power components that enable datacenter energy efficiency are expected to only grow in importance.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories announces that it has upgraded the endurance rating of its industrial-grade 3D TLC solid state drives (SSD) to 3K P/E cycles, bringing their endurance, reliability, and stability up to par with 2D MLC SSDs. Combined with their ability to operate in a wide range of temperatures (-40° C to 85° C), they are excellent solutions that provide the durability and consistency required by applications such as Artificial Intelligence, Internet of Things (IoT), Intelligent Transportation Systems, surveillance systems, data centers, network operations, defense systems, and energy exploration.

The continual improvements in NAND Flash design and manufacturing, as well as the ever-changing demands of the market, have driven 3D NAND to become a popular memory solution across many industries. Despite its growing prominence, 3D NAND has had two major deficiencies, namely the ability to operate in extreme temperatures and achieve higher endurance ratings. To fill this gap, ADATA has upgraded its industrial-grade 3D TLC SSDs to an endurance rating of 3K P/E cycles, which makes them comparable to 2D MLC SSDs. At the same, ADATA 3D TLC SSDs are also designed to operate in a wide temperature range (-40° C to 85° C), delivering a memory solution that is long-lasting, robust, and reliable.

A report from DigiTimes pits NAND manufacturers as accelerating their 120/128 layer 3D NAND technologies, aiming for volume production as early as 2020. Even as SK Hynix has begun sampling its 96-layer 4D NAND flash in March, Toshiba and Western Digital already had plans to introduce 128-layer technology, built on a TLC (Triple Level Cell) process technology so as to increase density while avoiding yield issues present with current QLC (Quad Level Cell) implementations.

The decision to accelerate deployment of the next generation of NAND comes from the fact that the market still faces an oversupply of NAND flash, mostly driven by the mature process of 64-layer NAND technology. With new technologies, higher ASPs and lower production scales are sustainable, which should enable supply to reduce enough so as to increase pricing of NAND-based technologies - and allow manufacturers to somewhat reset asking prices for new NAND chips.

With AMD "Valhalla" desktop platform mainstreaming PCI-Express gen 4.0, several SSD manufacturers put out their first products that can take advantage of it, this Computex. The drive with the highest on-paper transfer rates has to be the HOF E16 from GALAX, which will also be sold under the Galaxy and KFA2 brands in various markets. Built in the M.2-2280 form-factor, the drive features an M.2 PCI-Express 4.0 x4 host interface (backwards-compatible with older PCIe generations), with 64 Gbps of interface bandwidth on tap. The drive comes in capacities of 1 TB, 2 TB, and segment-first 4 TB.

The HOF E16 uses the same heatsink GALAX deployed on the older generation of HOF M.2. A block of aluminium pulls heat from the drive's controller, while a flattened copper heat-pipe spreads heat across. The drive is based on the new Phison E16 controller that's cushioned by an LPDDR4 DRAM chip, and wired to 96-layer 3D TLC NAND flash memory. The drive offers sequential read speeds of up to 4,800 MB/s, and sequential writes of up to 4,000 MB/s. 4K random reads are rated at up to 750,000 IOPS, and 4K random writes up to 700,000 IOPS.

Toshiba today announced the XG6-P solid state drive (SSD) series, a derivative of its NVMe M.2-based XG6 Series featuring class-leading write performance. Offering up to 2,048 gigabytes (GB) of capacity, XG6-P SSDs are ideal for high-end workstation PCs and gaming systems, as well as cost-optimized data center and composable infrastructures. With over 30 percent higher sequential and random write speeds and over 15 percent higher random read speeds than its predecessor, the XG6-P Series enables enhanced application performance and data access.

It looks like SSDs will beat graphics cards to utilizing (and benefiting) from the bandwidth of PCI-Express gen 4.0 bus. AMD X570 platform motherboards offer 2-3 M.2 slots with PCIe gen 4.0 x4 wiring (64 Gbps). Corsair formally launched the MP600, and now ADATA joins the party with its unnamed drive. Based on the Silicon Motion SM2267 controller, the drive comes in an unbelievable capacity of up to 8 TB, probably using 96-layer QLC NAND flash.

The controller features DRAM cache, and dynamic SLC caching (all of the NAND flash is treated as SLC until storage demands force portions of them to be treated as MLC, TLC, and eventually QLC). It takes advantage of NVMe 1.3 protocol. As for performance, ADATA claims sequential speeds of up to 4000 MB/s reads. Such speeds were impossible of PCIe gen 3.0 x4 due to various overheads. Sequential writes are still up to 3000 MB/s. 4K random read/write access is rated at 400k IOPS. The company didn't reveal availability details.

CORSAIR , a world leader in PC gaming peripherals and enthusiast components, today unveiled the new CORSAIR Force Series MP600 NVMe PCIe Gen4 x4 M.2 SSD, one of the world's first PCIe 4.0 M.2 SSDs compatible with the new AMD X570 chipset, also revealed today. Unleashed by the PCIe 4.0 ready AMD X570 chipset, the MP600 reaches new heights of enthusiast single-drive storage performance, delivering up to 4950MB/sec sequential read - ten times the performance of many SATA SSDs, and fifty times faster than some hard disk drives.

The MP600's phenomenal performance stems from the hugely increased bandwidth of PCIe 4.0 (PCI-Express Generation 4), a feature that will be made available to customers for the first time as part of the AMD X570 chipset and 3rd Generation AMD Ryzen Desktop Processors. Easily fitting into a PCIe 4.0 x4 M.2 slot, the MP600's NVMe interface and high-density 3D TLC NAND combine with a Phison PS5016-E16 controller to enable a new level of single-drive SSD performance. Boasting up to 4,950MB/s sequential read and 4,250MB/s sequential write speeds, the MP600 is ready to become the storage center of your new 3rd Gen AMD Ryzen Desktop Processor and AMD X570 chipset-based system.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced KC2000, its next generation M.2 NVMe PCIe SSD for enterprise and power users. Kingston's KC2000 NVMe PCIe SSD delivers powerful performance using the latest Gen 3.0 x 4 controller and 96-layer 3D TLC NAND. Offering superior read and write speeds up to 3,200 and 2,200MB/s, respectively, KC2000 delivers outstanding performance and endurance, and improves workflow in desktop, workstations and high-performance computing (HPC) systems.

KC2000 is a self-encrypting drive that supports end-to-end data protection using 256-bit AES Hardware-based encryption and allows the usage of independent software vendors with TCG Opal 2.0 security management solutions such as Symantec , McAfee , WinMagic and others. KC2000 also has built-in Microsoft eDrive support, a security storage specification for use with BitLocker.

Western Digital Corp. is addressing the automotive industry's increasing need for storage by equipping vehicle manufacturers and system solution providers with the technology and capacity to support both current and future applications including e-cockpits, Artificial Intelligence (AI) databases, ADAS, advanced infotainment systems, and autonomous computers. As the first 256GB e.MMC using 64-Layer 3D NAND TLC flash technology in the automotive market, the new Western Digital iNAND AT EM132 EFD extends the life of e.MMC beyond 2D NAND to meet evolving application needs and growing capacity requirements.

According to Neil Shah, partner and research director, Counterpoint Research, "Storage is one of the fastest growing semiconductor applications in a connected autonomous car. The advanced in-vehicle infotainment (IVI), AI and sensor-driven autonomous driving systems generate large amounts of data that needs to be processed and stored locally at the edge. The average capacity of storage required per vehicle is expected to balloon beyond 2TB by 2022."

Western Digital is launching a behemoth, consumer-oriented 4 TB SSD based on its WD Blue product line. The WD Blue 4 TB uses the SATA interface (for which controllers are still slightly cheaper than for NVMe solutions) with a Marvell 88SS1074 4-channel controller with a 64-layer 3D TLC NAND from SanDisk. Read and write speeds are basically SATA III-bound (sequential 560MB/s read and 530MB/s write speeds, with random 4K read/write of 95K/82K IOPS.)

The WD Blue 4TB SATA SSD has its official availability date on May 13th, but it's already popping up here and there around retailers' shops in Europe. The 4 TB SSD is being priced at €545, which seems to be inline with expectations for such a capacity level. Quick napkin math saying that these should find a home at the sub-$500 level is very likely accurate, considering past pricing practices from manufacturers between the European and US markets.

If you aim for the top, don't skimp on your SSD drives! Check out Apacer's brand-new AS2880P4 M.2 PCIe Gen3 x4 SSD, which boasts stronger-than-ever performance at reasonable price. This SSD now brings reading/writing speeds of 3,200/2,000MB/sec and 360,000 operations per second (IOPS) within easy reach of eSports players! NVMe1.3-compliant, the AS2880P4 uses the latest 3D NAND TLC technology to make it an ultra-compact, high-capacity that frees up space for you to further modify and expand your gaming devices. Its max capacity of 480GB makes it perfect for hardcore eSports players, post-production CAD 3D modeling designers, and users demanding high speed and high capacity.

The M.2 PCIe Gen3 x4 is definitely the top choice for high performance demands in ultra-thin notebooks, high-power computers, e-sports consoles, mini-PCs, and embedded devices. As a trend-defining SSD brand, Apacer has led the global market with its groundbreaking PCIe Gen3 x4 NVMe 1.3 SSD and is now writing history again with its successor, the brand-new AS2280P4.

GIGABYTE today rolled out the Aorus RGB AIC NVMe SSD series. Built in the full-height single-slot AIC form-factor with PCI-Express 3.0 x4 host interface, the card combines a Phison PS5012-E12 NVMe 1.3 controller with Toshiba BiCS3 TLC NAND flash, and comes in capacities of 512 GB and 1 TB, which are equipped with 512 MB and 1 GB of DRAM cache, respectively. The 1 TB variant offers sequential transfer speeds of up to 3,480 MB/s reads, with up to 3,080 MB/s writes; up to 610,000 IOPS 4K random reads, and up to 530,000 IOPS 4K random writes. The 512 GB variant, on the other hand, gives you up to 3,480 MB/s sequential reads, up to 2,100 MB/s sequential writes; up to 360,000 IOPS 4K random reads, and up to 510,000 IOPS random writes.

GIGABYTE deployed a passive cooling system, consisting of a thermal pad that makes contact with the controller, NAND flash chips, and DRAM chips on one side, and on the other side the card's top aluminium shroud that doubles up as a heatspreader. There's an equally thick aluminium back-plate which holds the card's acrylic RGB LED diffuser that runs along the top edge. You use GIGABYTE RGB Fusion software to control the lighting on this card. Both cards are backed by 5-year warranties, provided the card stays below their rated endurance of 800 TBW for the 512 GB model, and 1600 TBW for the 1 TB model. The company didn't reveal pricing.

High-end M.2 NVMe SSDs are beginning to come with integrated heatsinks as overheating controllers impact sustained performance. The latest such drive is a new edition of the Hall of Fame (HOF) M.2 PCIe series from Galaxy, which come with a chunky aluminium heatsink, only this one isn't just another hunk of metal. This heatsink uses a flattened copper heat pipe to pull heat from the drive's hot components and spread it evenly along both sides of the aluminium block. The heat pipe makes direct contact with the drive's Phison PS5012-E12 8-channel controller and Toshiba-made 64-layer 3D TLC NAND flash chips.

The heatsink wraps around sideways of the drive and so it may not be a perfect fit for NVMe RAID cards with multiple M.2 slots side-by-side, although for most applications, such as the M.2 slot on the motherboard, the design could click. The drive comes in capacities of 512 GB, 1 TB, and 2 TB. All three models offer sequential read speeds of up to 3400 MB/s. The 1 TB and 2 TB models write at up to 2800 MB/s, while the 512 GB writes at up to 2000 MB/s. 4K random access performance of the 2 TB and 1 TB models are rated at up to 400,000 IOPS reads with up to 600,000 IOPS writes; and up to 400,000 IOPS reads with up to 540,000 IOPS writes for the 512 GB model. The drive is initially being launched in China, and could make its way to western markets under the Galax and KFA2 brands later this year.

Micron has curiously been releasing client-segment SSDs these recent weeks. The company's main brand was focused on enterprise products, while subsidiary brands Crucial and Ballistix catered to the client-segment. Following up on its late-February launch of the 1300-series client-segment SSDs, Micron unveiled the even faster 2200-series. These drives ditch Silicon Motion-sourced controllers in favor of a new controller Micron designed in-house. Built in the M.2-2280 form-factor with PCI-Express 3.0 x4 interface, taking advantage of the NVMe protocol. This in-house controller is mated with Micron's 64-layer 3D TLC NAND flash, cushioned by its own LPDDR4 DRAM cache.

Available in capacities of 256 GB, 512 GB, and 1 TB, the Micron 2200 is rated to offer sequential transfer rates of up to 3000 MB/s reads, with up to 1600 MB/s writes, up to 240,000 IOPS 4K random reads, and up to 210,000 IOPS 4K random writes, with an endurance rating of 75 TB, 150 TB, and 300 TB, for the 256 GB, 512 GB, and 1 TB variants, respectively. Micron-exclusive features also make their way, such as native power-loss data-protection, and TCG Opal SED. The company hasn't revealed pricing or availability for these drives.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it is shipping the Data Center DC500R Enterprise SSD optimized for read-intensive applications. This is the first drive in the DC500 series that implements Kingston's strict Quality of Service (QoS) requirements to ensure predictable random I/O performance as well as predictable low latencies over a wide range of read and write workloads. Next week, the company will ship its DC500M SSD optimized for mixed-use workloads.

DC500R is ideal for read-intensive applications such as boot up, web servers, virtual desktop infrastructure, operational databases and real-time analytics. Cloud service providers and software-defined storage architects can leverage the drive's consistent I/O and latency performance to deliver the QoS needed in demanding read-centric environments. At .5 DWPD (drive writes per day), DC500R allows IT administrators to maximize their investment in storage hardware with a drive that delivers on performance, endurance and reliability. DC500R is available in 480GB, 960GB, 1.92TB and 3.84TB capacities.