Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

As the IT sector continues to seek answers for scaling data processing performance while simultaneously improving efficiency - in terms of performance and density per watt, per system, per rack, and per dollar of CapEx and OpEx - ScaleFlux is answering the call with innovative design choices in its SSD controllers. The SFX 5016 promises to set new standards both for performance and for power efficiency.

In addition to carrying forward the transparent compression feature that ScaleFlux first released in 2020 in upgraded in 2022 with the SFX 3016 computational storage drive controller, the new SFX 5016 SOC processor includes a number of design advances.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage, and gaming peripherals, proudly introduces the Viper PV553 M.2 2280 PCIe Gen 5 x4 SSD. This groundbreaking SSD is designed with the core idea of delivering next-gen performance, featuring an innovative active cooling system.

The PV553 introduces a revolutionary cooling solution as Patriot's first SSD with a blower fan design. Patriot Memory's cutting-edge advancements ensure active thermal dissipation, providing consistent cooling even during extended usage for intense gaming sessions. Crafted with premium materials and a slim 16.5 mm aluminium heat shield, the PV553 incorporates an embedded thermal sensor, guaranteeing unwavering high performance. With a 5-year warranty, this SSD exemplifies quality and reliability.

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.

While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.

SK hynix Inc. showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the industry's first NAND with more than 300 layers. The company gave a presentation on the progress on the development of its 321-layer 1 Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara.

SK hynix is the first in the industry to unveil the progress on the development of a NAND with more than 300 layers in detail. The company plans to raise the level of completion of the 321-layer product and start mass production from the first half of 2025. The company said its technological competitiveness accumulated from the success of the world's highest 238-layer NAND, already in mass production, paved the way for a smooth progress for the development of the 321-layer product. "With another breakthrough to address stacking limitations, SK hynix will open the era of NAND with more than 300 layers and lead the market."

Micron Technology, Inc., today announced the Crucial X9 Pro Portable SSD and Crucial X10 Pro Portable SSD, two new performance offerings in the Crucial Pro Series product portfolio, designed for content creators such as photographers, videographers, designers, or any performance-seeking consumer. Both drives utilize Micron TLC NAND and leverage a revolutionary single-ASIC portable storage architecture to enable a breakthrough, ultra-compact, lightweight form factor and allows Micron to ship the most capacity per square millimeter in the industry. With either the Crucial X9 Pro and X10 Pro, users can safely store, transport and backup important videos, photos, files and more on the go, without cloud or internet access at lightning-fast speeds.

"We recognize that fast, efficient workflow processes are essential to the success of videographers, photographers and other content creators," said Jonathan Weech, senior director of product marketing for Micron's Commercial Products Group. "We designed and built our two new portable SSDs, the Crucial X9 Pro and the Crucial X10 Pro, to specifically address these demanding workloads. With more photos and videos being taken than ever before, consumers are looking for ways to save, preserve and protect their digital lives reliably and quickly. These two new Crucial Pro Portable SSDs are a great choice for anyone who needs dependable, fast, high-capacity storage."

Seagate Technology Holdings today introduced the next generation of SSD technology to its lineup, the FireCuda 540. The PCIe Gen 5 NVMe SSD delivers unparalleled performance to gamers, creators, and tech enthusiasts - adding the fastest speeds and endurance to the company's line of PC storage products.

Seagate's fastest and highest performance M.2 2280 SSD, the FireCuda 540 delivers sequential read speeds of up to 10,000 MB/s and sequential write speeds of up to 10,000 MB/s. Built for sustained, pro-level gaming and accelerated content creation, the new drive performs up to 50% faster than Gen 4 M.2 NVMe drives and 17 times faster than SATA-based SSDs. With the latest 3D TLC NAND technology and built with a Seagate-validated E26 controller, the FireCuda 540 provides the most advanced speed and durability - allowing users to push limits when gaming or creating content. Plug-and-play compatible with all PCIe Gen 5 motherboards and backwards compatible with PCIe Gen 4, the drive is accessible and ready for trailblazing.

A trend we've seen in the 2023 Computex is that SSD manufacturers aren't advertising their feisty Gen 5 NVMe SSDs with the elaborate cooling solutions that they sorely need, but rather as bare drives, with the cooling options marketed separately. In practice, manufacturers could get retailers to bundle Gen 5 SSDs with a selection of their coolers. This lets them trim some of the criticism of just how hot SSDs have gotten over just one generation. Team Group showed off its T-Force Cardea Z5 lines of M.2 Gen 5 NVMe SSDs. There are two distinct lines with the same names. One of these comes with a maximum sequential read speed of 12 GB/s, while the other comes with 14 GB/s. Both have their respective 1 TB, 2 TB, and 4 TB capacity variants. Both use 3D TLC NAND flash. The under-the-hood difference between the 12 GB/s and 14 GB/s versions of the Cardea Z5 is that while the 12 GB/s variant uses a Phison E26-series controller, the 14 GB/s one uses an InnoGrit IG5666 controller. Team Group intends to eventually re-brand the 14 GB/s variant as the Cardea Z54A series.

Team Group also announced a handful cooling solutions to pair with these Gen 5 SSDs. The most striking of these is the T-Force Siren, an all-in-one (AIO) closed loop liquid M.2 NVMe SSD cooler, with as 120 mm radiator. The name is a bit of a misnomer, as SSD coolers with 20 mm fans is what a siren might sound like. Obviously, this cooler is overkill, and helps the SSD deliver its best performance, but there are other options from the company. The T-Force AirFlow I uses two copper heatpipes that run through the base-plate, pulling heat from the controller, NAND flash, and DRAM, and pushing it through an aluminium fin-stack arranged vertically. This is then ventilated by a 30 mm fan. The T-Force Airflow II uses a slightly different approach, with a single thicker heat pipe arranged in a C-shape, with radially-projecting finnage that have the appearance of a cylinder. At the other end of this is a 30 mm fan.

Kioxia Corporation, a world leader in memory solutions, today announced new consumer SSDs scheduled to be released in the third quarter of 2023. The EXCERIA PLUS G3 Series will leverage PCIe 4.0 technology and offer up to 2 terabytes (TB) of capacity. The new series is well-suited to mainstream users of high performance gaming PCs, desktops and notebooks, bringing the speed and affordability that they require. The EXCERIA PLUS G3 Series, which is a product under development, will be on reference exhibit at COMPUTEX TAIPEI from May 30 to June 2 at the Taipei Nangang Exhibition Center.

Featuring Kioxia's BiCS FLASH 3D flash memory TLC (Triple-Level-Cell), the EXCERIA PLUS G3 Series utilizes an M.2 2280 type single-sided form factor suitable for both desktops and mobile systems. The new drives will also support Kioxia's SSD Utility Management Software, which assists users with SSD monitoring and maintenance.

Micron Technology, Inc., today announced the release of two SSDs, the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD. Designed to keep pace with the accelerating growth of data, these drives provide a major advancement for data centers by lowering operating costs and improving storage efficiency. The Micron 6500 ION is a high-capacity SSD that offers a superior value over competitive QLC-based drives by providing best-in-class performance and enabling a more environmentally sustainable data center. The 6500 ION is able to deliver TLC performance and QLC-like cost due to Micron's 232-layer technology node leadership compared to the competition's use of sub-200-layer QLC technology. When paired with Micron 6500 ION drives or other SSDs, the Micron XTR SSD delivers extreme endurance that enhances system performance.

"Customers are looking for new capabilities to address the data growth and performance needs of artificial intelligence data lakes and other demanding workloads. As a result, we are seeing tremendous traction on the 6500 ION and XTR with customers who are deploying storage at scale due to their unrivaled combination of large capacity, superior performance, and amazing endurance," said Alvaro Toledo, vice president and general manager of Micron's Data Center Storage group. "The 6500 ION SSD offers QLC value with TLC performance and up to a 20% reduction in power consumption versus competing QLC SSDs, allowing our customers to reduce their carbon footprint. Together, these SSDs enable customers to leap ahead and harness the power of artificial intelligence without compromising performance."

Crucial's T700 PCIe Gen 5 NVMe SSD series has been previewed a couple of times, showing some impressive sequential read and write performance, and now, Crucial has announced that it is available for pre-order, directly from Crucial's own store. The release date is set for May 30th.

In case you missed it earlier, the Crucial T700 PCIe Gen 5 NVMe SSD offers sequential performance of up to 12,400 MB/s for read and up to 11,800 MB/s for write (11,700 MB/s and 9,500 MB/s for the 1 TB version). Available in 1 TB, 2 TB, and 4 TB capacities, and with or without the heatsink, the Crucial T700 uses Micron 232-layer TLC NAND paired up with Phison's E26 controller. The endurance rating (TBW) for the Crucial T700 SSD series is set at 600 TB for the 1 TB version, 1200 TB for the 2 TB version, and 2400 TB for the 4 TB version, and it is backed by a 5-year limited warranty.

Global memory brand, Team Group, is committed to providing the best solutions in the storage market. Today, it's launching three M.2 SSDs to meet various needs in size and performance. Equipped with a special breakthrough of cooling technology, they are the MP44 M.2 PCIe 4.0 SSD, the MP44S M.2 PCIe 4.0 SSD, and the Gen 3-supported MP34S M.2 PCIe SSD. They offer expanded capacity and reliable stability with compatibility across different generations, making them the perfect choices for your next storage upgrade.

The MP44 M.2 PCIe 4.0 SSD features read and write speeds of up to 7,400 MB/s and 7,000 MB/s, respectively, and has a massive storage capacity of up to 8 TB. Not only does it satisfy your large capacity needs, but it also provides silky-smooth performance. It features the industry's first patented and exclusive ultra-thin graphene cooling label with a thermally conductive material of less than 1 mm thick and closely attached to the M.2 SSD. MP44 measures 22 mm wide and 80 mm long, allowing for quick and easy installation and pairing with a motherboard's original M.2 slot heat sink to greatly enhance thermal performance of the SSD.

Transcend Memory introduced a high-capacity 4 TB variant of its MTE250H (with heatsink) and MTE250S (without heatsink) M.2 NVMe Gen 4 SSD that the company debuted in October 2022. The former comes with an extruded-aluminium heatsink, while the latter has a graphene-coated film on top of the hot components. The drive offers an NVMe 1.4-compliant 8-channel controller that uses a DRAM cache; paired with 3D TLC NAND flash memory. The drives take advantage of PCI-Express 4.0 x4 host interface. The 4 TB variant offers sequential transfer rates of up to 7.5 GB/s reads, with up to 6.7 GB/s writes; up to 540k IOPS random reads, and up to 440k IOPS random writes; along with a rated endurance of 3,120 TBW. Transcend is backing these drives with 5-year warranties.

Cervoz Technology, a leading supplier of industrial-grade storage and memory solutions, is excited to announce the new NVMe PCIe Gen 4x4 SSDs, the T441. Purposefully designed to cater to the growing automaticity trend of the industry, the T441 is the ideal choice for companies seeking cutting-edge technology in high-performance storage solutions.

Blazing Speeds with High Capacity
The Cervoz T441 SSDs leverage the power of 112-layer 3D TLC NAND flash technology, offering storage capacities of up to 3840 GB in a compact and energy-efficient design. In addition, the high-speed PCIe Gen 4x4 interface enables faster and more efficient data access, with Read/Write speeds of up to 7,100/6,190 MB/s and 4K random IOPS of up to 1,000K. This exceptional performance makes the T441 an ideal solution for applications requiring real-time processing of vast data, such as surveillance, machine vision, and edge AI, as well as those handling massive data sets like CAD, biomedical engineering, and atmospheric sciences.

Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.

"The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership," said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. "By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions."

Although NAND suppliers have continued to roll back production, there is still an oversupply of NAND Flash as demand for products such as servers, smartphones, and notebooks is still too weak. Therefore, TrendForce predicts that the ASP of NAND Flash will continue to fall in 2Q23, though that decline may shrink to 5~10%. The key to supply and demand returning to a market equilibrium lies in whether NAND suppliers can cut back on production even more. TrendForce believes if demand remains stable, then the ASP of NAND Flash will have an opportunity to rebound in 4Q23; if demand is weaker than expected, then ASP will take longer to recover.

Client SSD: Currently, PC OEM's have managed to liquidate most of their component inventory, and are now gearing up in preparation for mid-year sales events. Suppliers are cutting prices to clear out their inventories of PCIe Gen 3 SSDs, which are gradually being phased out. Meanwhile, prices of PCIe Gen 4 SSDs continue to face downward pressure due to a slow intake of new customer orders. The continuous decline of QLC products in 1Q23 has also dragged down the prices of TLC products, and there is relatively little room for prices to keep falling in 2Q23. While it still remains unclear whether or not demand will recover, TrendForce projects that the prices of PC client SSDs will drop 5~10% in 2Q23.

TrendForce's latest investigations reveal that the global NAND Flash market has been facing a demand headwind since 2H22. In response, the supply chain has been scrambling to clear out inventory, driving down NAND Flash contract prices by 20-25%. Enterprise SSD took the brunt of the fall with prices plummeting 23-28%. Despite manufacturers lowering prices in an attempt to drive up demand, clients are hesitant to purchase more components for fear of overstock. As a result, NAND Flash bit shipments rose by a mere 5.3% as ASP fell 22.8%. Global NAND Flash revenue was reported to be US$10.29 billion in 4Q22—down 25% QoQ.

TrendForce reports that Kioxia and Micron saw both a reduction in production and price in 4Q22. Kioxia's revenue plunged 30.5% due to weak demand from PC and smartphone clients and data centers readjusting their inventory. Micron generated a quarterly revenue of US$1.1 billion—a staggering 34.7% QoQ drop—that has led them to drastically decrease their capacity utilization rate for fabs. Luckily, Micron was able to ship their 232-layer client SSDs in 4Q22 as scheduled, and with the 176-layer QLC enterprise SSD hot on its heels, Micron's bit shipments are predicted to steadily improve in 2023 with their revenue climbing gradually quarter by quarter.

Looking back at 2H22, as server OEMs slowed down the momentum of their product shipments, Chinese server buyers also held a conservative outlook on future demand and focused on inventory reduction. Thus, the flow of orders for enterprise SSDs remained sluggish. However, NAND Flash suppliers had to step up shipments of enterprise SSDs during 2H22 because the demand for storage components equipped in notebook (laptop) computers and smartphones had undergone very large downward corrections. Compared with other categories of NAND Flash products, enterprise SSDs represented the only significant source of bit consumption. Ultimately, due to the imbalance between supply and demand, the QoQ decline in prices of enterprise SSDs widened to 25% for 4Q22. This price plunge, in turn, caused the quarterly total revenue from enterprise SSDs to drop by 27.4% QoQ to around US$3.79 billion. TrendForce projects that the NAND Flash industry will again post a QoQ decline in the revenue from this product category for 1Q23.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the SM2268XT, its latest high-performance PCIe Gen 4 SSD controller solution optimized for higher speed NAND transfer rates. The SM2268XT's superior performance and robust reliability allows customers to accelerate development of next-generation SSDs using current and future TLC and QLC 3D NAND flash with comprehensive data integrity and correction without compromising throughput and latency.

The SM2268XT features a dual-core ARM R8 CPU with four lanes of 16 Gb/s PCIe data flow and supports four NAND channels with up to 3,200 MT/s per channel, enabling designers to take advantage of higher throughput next-generation high-speed TLC and QLC 3D NAND flash. Its multi-core design automatically balances the compute load to deliver industry-leading sequential read and write speeds of 7,400 MB/s & 6,500 MB/s, and random read & write speed of 1,200K IOPS. In addition, its advanced architecture enables lower power consumption and rigorous data protection, providing high performance and reliability in a cost-effective DRAM-less PCIe Gen 4 NVMe SSD solution.

Thanks to the development of 5G and the popularization of IoT, global industrial automation has entered a period of rapid development. With this trend in mind, Team Group has released its next-generation A501 CFast Memory Card, compliant with the CFast 2.0 specification and supports the SATA III 6.0 Gbps interface. With its high performance, large capacity, and light weight, the A501 can be installed on a variety of industrial-embedded hardware devices and automation tools, helping bring industrial automation to the next level.

The Team Group A501 CFast Memory Card is equipped with a major grade original 3D TLC IC, has a rated endurance of 3,000 P/E cycles, and features up to 512 GB of storage for large-capacity applications. Having undergone strict temperature testing, A501 is able to withstand temperatures from -40 °C to +85 °C, ensuring stable performance over long periods of operation in harsh temperature conditions. In addition, the card can deliver speeds of up to 550 MB/s read and 490 MB/s write (512 GB model) and supports DevSleep's low-power hibernation mode to significantly save power consumption and be used in a variety of automated applications. The newest-released CFast memory card also meets the specifications of industrial products, providing up-to-standard and highly customized solutions that satisfy customer needs.

Corsair has teased its fastest PCIe 5.0 SSD yet in an M.2 form factor. The company published some initial details about its upcoming product in a short video. However, the video has been taken private, indicating that the launch date may be at a later stage of the year. Thanks to Overclock3D, we saw its looks and got a slight peek at the product. Called the MP700, the SSD is supposedly boasting a fantastic 10 GB/s read capability. The write section is also impressive, with the NVMe SSD capable of reaching around 9 GB/s of what we suppose is a sustained write speed. It uses 3D TLC NAND Flash and supports Microsoft DirectStorage technology for faster load time. Below is a quote from Corsair about the MP700.

CorsairExperience the performance of PCIe Gen5 storage in your system, with up to 10,000MB/sec sequential read and 9,500MB/sec sequential write speeds for amazingly fast save, boot, and load times.
The high-bandwidth NVMe 2.0 interface and high-density 3D TLC NAND flash memory offer outstanding performance and longevity. Slot the MP700 directly into your motherboard thanks to its M.2 2280 form-factor, while a stylish aluminum heatsink helps manage temperatures and reduce throttling. Microsoft DirectStorage enables unprecedented load times when playing compatible games.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced the evolutionary AORUS Gen4 7300 SSD, which is the upgraded PCIe 4.0 SSD with read speed up to 7300 MB/s. Enhanced by the select PCIe 4.0 controller with advanced 3D-TLC NAND Flash, it provides superior performance than the previous generation PCIe 4.0 NVMe SSD. AORUS Gen4 7300 SSD with M.2 2280 interface comes in two capacity variants of 2 TB and 1 TB, along with a unique packaging design of separated SSD and heatsink packing to offer more flexible thermal solutions. Meanwhile, the GIGABYTE exclusive GCC software management platform provides the instant overview and adjustment of SSD status for a cool storage operation with high performance.

AORUS Gen4 7300 SSD equips the select Phison E18 8-channel controller, which provides users with ultimate random access rate, as well as the high-speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. Under the real test, AORUS Gen4 7300 SSD can reach a read speed up to 7300 MB/s and a write speed up to 6850 MB/s, which is faster than the previous gen. PCIe 4.0 NVMe SSD, two times faster than PCIe 3.0 SSD, and up to 13 times faster than SATA SSD. Enhanced by the multi-core architecture of the E18 controller, AORUS Gen4 7300 SSD not only improves AI multitasking to lessen the bottleneck of system performance, but powers up content creators, gamers, and users eager for extreme performance.

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

Mushkin at the 2023 International CES showed off its Vortex Redline and Vortex LX M.2 NVMe SSDs. The Vortex Redline is the company's top PCIe Gen 4 drive, combining an Innogrit IG5236 NVMe 1.4 controller with 3D TLC NAND flash, to offer transfer speeds of up to 7415 MB/s. The Vortex Redline comes in capacities of 512 GB, 1 TB, and 2 TB. The Vortex LX is a more value-oriented product, based on an unnamed Innogrit-sourced DRAMless controller. This drive features a PCIe Gen 4 interface, but offers slightly lower performance that the company didn't disclose.

The star attraction at the Mushkin booth was its Epsilon SSD that features a PCI-Express 5.0 x4 + NVMe 2.0 interface, a Phison E26-series controller, and next generation 3D NAND flash memory (possibly 232-layer). The drive features active cooling from a fan-heatsink, and while the company didn't talk about performance, drives based on this controller are known to offer up to 12 GB/s of sequential transfers. Lastly, the company showed off its lineup of 2.5-inch SATA 6 Gbps SSDs in capacities ranging all the way up to 16 TB, which are meant to be HDD replacements, and "warm" storage devices.