The leading industrial memory and storage provider, Team Group has employed its advanced R&D capabilities and manufacturing processes to launch the industrial P745 SSD, which combines 112-layer 3D NAND flash memory, PCIe Gen 4x4 level speeds, and 8-channel controllers. Emphasizing high transfer speeds, power efficiency, and low latency, the P745 SSD delivers sequential read and write speeds of up to 7,000 MB/s and 6,200 MB/s, respectively, delivering excellent IOPS performance. To meet the demands of AI applications, temperature control was enhanced to maintain stable and high-speed performance. In the rapidly developing era of AI and high-performance computing, Team Group continues to provide the best industrial storage solutions.

The P745 SSD is available in both standard temperature (0 to 70°C) and wide temperature (-40 to 85°C) models. It integrates Team Group's cooling technology, the patented graphene and fin heat sinks, resulting in a significant temperature reduction of about 8-15% compared to common products without fin heat sinks. The P745 can be configured to meet the needs of different application environments, enabling the product to maintain stable operation at high temperatures and high performance. The P745 is also equipped with advanced firmware that protects data by automatically adjusting speeds when temperatures exceed the safe range. With a maximum capacity of 4 TB, the P745 is an NVMe 1.4 drive that uses the PCIe Gen 4x4 interface and is backward compatible with PCIe 3.0 platforms. It features a built-in DRAM cache buffer for high-speed AI computing that enhances system loading and data caching, reducing NAND flash wear and increasing product life span. In addition, the P745 is equipped with an LDPC error correction function and AES 256-bit high-level encryption technology to ensure the accuracy and security of data transmission.

T-FORCE, the gaming brand under the leading memory and storage provider Team Group Inc., is committed to excellence in product research and development while constantly pushing the boundaries of limits. Today, Team Group is announcing the new Generation of Gen 5 SSD, the T-FORCE GE PRO PCIe 5.0 SSD which uses the PCIe Gen 5 x4 interface and NVMe 2.0 standard. The new multi-core, low-wattage Gen 5 SSD is designed for extreme storage speeds and is perfect for gamers and users who desire the ultimate performance.

The T-FORCE GE PRO PCIe 5.0 SSD is powered by InnoGrit's new 12 nm, multi-core, and energy-efficient IG5666 controller, paired with a high-performance 2,400MT/s NAND flash that supports DRAM and SLC caching with read speeds up to 14,000 MB/s. It features a smart thermal regulation technology that utilizes internal temperature sensors to automatically adjust performance and prevent overheating. It also supports 4K LDPC (low-density parity-check code) technology, which ensures data transfer accuracy. This allows the T-FORCE GE PRO SSD to provide excellent and stable performance, extending the product's lifespan. With Team Group's patented S.M.A.R.T. monitoring software, users can easily keep track of the SSD's health at any time.

TechPowerUp and Team Group got together for the 2023 Black Friday and Cyber Monday shopping season to announce a hardware giveaway open worldwide. The Giveaway spans three of the company's most popular consumer memory brands, Team Xtreem, T-Force Cardea, and T-Create. Up for grabs were some of their fastest memory kits and client SSDs. The entries are in, and we have four lucky winners!

• Adam from Hungary, wins a Team Group T-Force Xtreem DDR5-8200 48 GB (2x 24 GB) memory kit!
• Nicolas from France, wins a Team Group T-Create Expert DDR5-7200 32 GB (2x 16 GB) memory kit
• Ruben from the United States, wins a Team Group MP44 2 TB M.2 NVMe Gen 4 SSD
• Faron from the United States, wins a Team Group T-Force Cardea A440 Pro 1 TB M.2 NVMe Gen 4 SSD

A huge Congratulations! TechPowerUp and Team Group will return with more such interesting giveaways!

Aimed at the thriving creator market, T-CREATE, the creator brand under the leading memory provider Team Group Inc., has announced the T-CREATE CinemaPr P31 Portable External SSD, providing professional photographers, movie creators, and users of smartphones such as the iPhone 15 Pro/Pro Max with fast and reliable expanded storage, perfect for capturing breathtaking content. For digital creations, this top-of-the-line portable storage device is your best choice.

The T-CREATE CinemaPr P31 Portable External SSD utilizes patent-pending technology and designs, featuring proprietary, first-of-their-kind 12 1/4" screw holes and a bundled screw set that fits all 1/4" screw hole cages. Whether on a cage for a cinema camera, digital SLR camera, or an iPhone 15 Pro/Pro Max, the CinemaPr P31 can be installed multi-directionally and is suitable for a variety of situations. Its flexibility makes expansion and setup a breeze. Compact and weighing only 110 g, this lightweight and easy-to-carry external SSD can be installed on photography and video equipment effortlessly.

T-FORCE, the gaming brand under Team Group Inc., today launched the T-FORCE SIREN GD120S AIO Cooler, a unique all-in-one liquid cooling solution for PCIe 2280 SSDs that uses exclusive patented technology (Taiwan Invention Patent No.: I778726). The SSD water block fits perfectly with M.2 2280 SSDs and provides superb cooling performance, enabling SSDs to maintain optimal low-temperatures and stable operation. Based on tests, the SIREN GD120 allows PCIe 5.0 SSDs to stay under 54°C even during heavy load, providing global players with more diverse cooling solutions for M.2 SSD high temperatures.

The T-FORCE SIREN GD120S AIO SSD Cooler boasts excellent cooling performance by equipping the precision aluminium alloy dual-tube water blocks with double-layered thermal pads, which allow the SSD controller chip and IC to be tightly affixed to the copper base of the cooler. The pump utilizes a ceramic shaft design and three silent motors to achieve silent, highly efficient, and stable liquid cooling. Furthermore, the T-FORCE SIREN GD120S AIO SSD Cooler uses a 120 mm radiator with 13 high-density aluminium fins to increase the cooling area, effectively removing the high temperatures generated by M.2 PCIe 5.0 SSDs. Its 12 cm ARGB PWM fan can also accurately adjust speeds based on system temperature to achieve optimal heat dissipation while saving energy and providing a customized lighting effect.

T-FORCE, the gaming brand of the leading memory and storage provider Team Group Inc., continues to push the boundaries of product development. Today, T-FORCE is launching four new gaming SSDs, the T-FORCE G70, G70 PRO, G50, and G50 PRO, which all use the PCIe Gen 4x4 interface. The SSDs feature international manufacturer InnoGrit's controller, which provides outstanding stability.

The G70, G50, and their PRO variants are available in the M.2-2280 form factor and come with patented ultra-thin graphene heat sinks. The G70 PRO also comes with an aluminium alloy heatsink, giving users an additional cooling option. Since every SSD cooling module in this series is compatible with the PS5 SSD expansion slot, both PC and console gamers alike can enjoy the high performance of these brand-new PCIe 4.0 SSDs. The T-FORCE G70 and G70 PRO SSDs have read speeds of up to 7000 MB/s, while the G50 and G50 PRO SSDs can clock up to 5000 MB/s. The T-FORCE G70 and G50 SSDs support SLC cache technology, and their PRO variants support both DRAM and SLC caching, giving players options to fit their needs. All four M.2 2280 SSDs use controllers produced by international manufacturer InnoGrit, which provide excellent stability and peace of mind for gamers.

In support of World Environment Day, Team Group released the C175 ECO Net-Zero Flash Drive previously, which received positive reception from consumers worldwide. To encourage action against environmental pollution, Team Group has continued to devote itself to the development and design of environmentally friendly products. Now Team Group is launching the industry's first memory module with a recycled aluminium heat sink: the T-FORCE VULCAN ECO DDR5 Desktop Overclocking Memory.

Team Group takes social responsibility seriously, promoting sustainability through green research and development. For every 10,000 recycled aluminium T-FORCE VULCAN ECO DDR5 heat sinks made, carbon emissions are reduced by 73% or about 1,665 kg of carbon emissions. That is equivalent to the carbon footprint of 550,000 hand towels, 310,000 plastic straws, 30,000 plastic bags, and 10,000 PET bottles. The T-FORCE VULCAN ECO DDR5 also uses FSC-certified eco-packaging for the entire product, further contributing to the reduction of material and electronic waste.

TechPowerUp partners with Team Group to bring you the Black Friday and Cyber Monday (BF-CM) Bonanza Giveaway! Open worldwide, our Giveaway presents a chance to grab one of four Team Group high performance memory and SSD products spanning across its popular brands, T-Force Xtreem, T-Force Cardea, and T-Create. There are four prizes up for grabs, which include a Team Group T-Force Xtreem DDR5-8200 48 GB (2x 24 GB) memory kit, a Team Group T-Create Expert DDR5-7200 32 GB (2x 16 GB) White memory kit; a Team Group T-Force Cardea A440 Pro Graphene 1 TB M.2 NVMe SSD, and a Team Group MP44 2 TB M.2 NVMe Gen 4 SSD.

The T-Force Xtreem DDR5-8200 48 GB memory kit is the star attraction here, the perfect match for a high-end build. The T-Create Expert DDR5-7200 32 GB is pretty much all the speed and capacity you need to crush creator workloads. The MP44 is a well balanced Gen 4 SSD with 2 TB for your entire game library. The Cardea A440 Pro would make for an excellent game library addition to your build. To participate, simply fill up a short form to help us get back to you if you've won, and answer and answer a few Team Group product-related questions. The Giveaway is open until November 15, 2023. Good Luck!

For more information, and to participate, visit this page.

TrendForce reports that consumer appetite for electronic products took a hit from high inflation, with global DRAM module sales in 2022 reaching US$17.3 billion—a 4.6% YoY decline. Revenue performance varied significantly among module makers due to the different domains they supply.

TrendForce's data indicated that the top five memory suppliers in 2022 accounted for 90% of total sales, with the top ten collectively capturing 96% of global market revenue. Kingston maintained its dominant market share of 78%. Even with a slight revenue dip, it held steadfast to its position as the global leader. Despite poor end-market demand, Kingston's robust brand scale, along with its comprehensive product supply chain, limited its revenue decline to a modest 5.3%, keeping it firmly at the top of market share rankings.

T-CREATE, the creator brand under Team Group Inc., the global leading memory provider, today introduced the T-CREATE CLASSIC C4 Series PCIe 4.0 SSD, which comes in various specifications and capacities. Featured with an ultra-thin graphene-patented heat-sink (US invention patent: US 110,513,92 B2; Taiwan invention patent: I703921), it conducts more stable performance, allowing creators to freely express their artistic creativity with a peace of mind. With the growing landscape of creators and an expanding, diverse field of creative content within the market, the T-CREATE series of products has given creators a more stable space to unleash their creativity.

The T-CREATE CLASSIC C4 Series PCIe 4.0 SSD offers three different models: C47, C45, and C43, providing three different speed specifications, with a maximum reading speed of 7000 MB/s, 5000 MB/s, and 3000 MB/s, and capacities ranging from 512 GB to 4 TB. With multiple speeds, it allows creators to freely choose to meet their creative needs. The T-CREATE CLASSIC C4 Series PCIe 4.0 SSD is equipped with the ultra-thin graphene patented heat-sink label (US invention patent: US 110,513,92 B2; Taiwan invention patent: I703921), enabling the SSD to achieve high performance while effectively stabilizing system operation by mitigating heat-related concerns. Supporting the SLC Caching technology and employing a customized high-stability controller and firmware, with intelligent algorithms and a high-rate LDPC (Low-Density Parity Check) debugging mechanism, the SSD improves the efficiency of data operations by taking into account the security and integrity of data transmission, thereby enhancing the reliability of the creation process.

Leading memory provider, Team Group, has tapped into T-FORCE Lab's superb R&D capabilities to create the latest iteration of the T-FORCE XTREEM DDR5 memory. By utilizing a patented IC classification test and verification technology, the upper limits of the DDR5 frequency have been raised to create a high-clock rate memory module designed specifically for gamers. Decorated with the glorious T-FORCE logo badge, the XTREEM's design exudes both confidence and style, befitting the newest king of overclocking memory modules.

T-FORCE XTREEM DDR5 memory demonstrates incredible overclocking performance to satisfy overclocking enthusiasts around the world. Not only using 2 mm-thick aluminium alloy fin heatsinks to enhance its thermal capacity, but also uses special heat-conducting silicone to tightly adhere the heatsinks with the memory to achieve the most optimal cooling effect. The surface is also treated with an anodized surface that is resistant to acid, corrosion, rust and is non-electrically conductive, providing gamers with greater peace of mind. The T-FORCE XTREEM DDR5's two-piece heat spreader is made of thick metal and underwent sandblasted surface treatment to give it the appearance of hard basalt and the matte black texture reminiscent of a black sand beach. Users can enjoy the excellent overclocking capabilities of the XTREEM DDR5 while admiring its elegant design.

T-CREATE, the creator sub-brand of the global memory provider Team Group, today launched the T-CREATE MASTER DDR5 OC R-DIMM, an overclocking DDR5 ECC Registered DIMM memory. T-CREATE's MASTER series is designed specifically for workstations and servers. With its high specifications and large capacity, it fully satisfies the needs of professionals in handling large-scale projects, analyzing large data sets, and running multiple specialized applications concurrently. The T-CREATE MASTER DDR5 OC R-DIMM features a one-piece heat spreader with ventilation holes and thermally conductive silicone for quick heat dissipation. It also has on-die ECC, which allows systems to run more stably and provide excellent performance.

The T-CREATE MASTER memory module is an overclocking ECC Registered DIMM memory available in frequencies of 6000 MHz, 6400 MHz, and 6800 MHz. When the module is paired with workstation motherboards, memory capacity can reach up to a massive 384 GB, allowing professional creators to quickly complete all types of work and enjoy the creative flexibility that comes with large capacities. In addition to the on-die ECC that corrects bit errors within the DRAM chip, the MASTER memory also supports an ECC feature that corrects errors outside the chip and fixes data corruption, allowing for stable operation and greater peace of mind when creating. The MASTER R-DIMM is compatible with W790 series workstation motherboards and is made for creative professionals, developers, and engineers. When combined with the powerful computing of the latest Intel Xeon processors, the T-CREATE MASTER DDR5 OC R-DIMM memory delivers incredible performance and stability for content creation, graphic rendering, and the demanding applications of high-end workstations.

Team Group, the world's leading brand in memory technology, launches two memory cards T-Create Expert S.M.A.R.T. microSDXC and Team Group PRO+ SDXC today. The two products offer consumers smooth read and write speed and diverse memory storage options, covering both storage needs for daily and professional use. A solution to satisfy all the different storage needs, the two memory cards are the perfect choice for adding more storage on mobile devices, taking high-quality photos on an action camera and a drone in extreme environments, or shooting 4K videos on a camera.

Designed especially for creative users, T-Create Expert S.M.A.R.T. microSDXC uses the S.M.A.R.T. software, which can be downloaded on Team Group's official website. Team Group's extensive research and understanding of creative users' usage scenarios tell us that such users tend to edit and produce photos and videos on their computers only when the memory card storage on their device has been ultimately used up. Based on this finding, Team Group particularly designed the S.M.A.R.T software to begin instant memory card condition monitoring with just one click. Through NAND Flash wear-out detection technology, the condition of the memory is monitored to secure videos filmed and avoid the need to conduct data recovery. T-Create Expert S.M.A.R.T. microSDXC is a U3 and V30 memory card that also fulfills requirements of the Application Performance Class 2 (A2), capable of reaching a read and write speed of 160 MB/s and 150 MB/s with storage space up to 1 TB when used with professional card readers, and supports 4K Ultra HD and 1080p Full HD video shooting and bursts photo on action camera and drones. Its superb performance, capturing people, inanimate objects, or scenic details, allows creative users to create in all sorts of outdoor environments.

In order to meet the evolving needs of Netcom data center computing, global memory provider TEAMGROUP is proud to introduce the new DDR5 VLP ECC U-DIMM normal and wide temperature (-40° to +85°C) memory module. It features DDR5 high performance, high frequencies, and large-capacity industrial ICs. Designed to have an extremely low profile for greater performance and more compact hardware configurations, the U-DIMM provides users with better performance and reliability than ever before.

Team Group's DDR5 VLP ECC U-DIMM memory modules come in frequencies up to 4800 MHz and 5600 MHz to ensure fast data processing and enhance computing performance. The memory is also offered in a wide range of capacity options, from 16 GB to 48 GB, allowing users to select the most suitable capacity kit for their platform's workload and computing needs. This module comes in an ultra-low-profile design, with a board height of only 0.738 inches, half of the normal modules. This allows it to meet the hardware configuration requirements of blade servers and helps maximize space for the user's configuration of components, and achieves higher server density.

T-FORCE, the gaming division of Team Group, today announced the addition of new coolers to its lineup, including the T-FORCE DARK AirFlow I SSD Cooler and the T-FORCE RT-X120 ARGB Fan. In response to the rapid development of consumer storage products, especially the transition from PCIe Gen 4 SSDs to PCIe Gen 5 SSDs, Team Group provides a complete cooling solution for the hotter temperatures of PCIe Gen 5 SSDs during high transfer speeds. Team Group cooler allows SSDs to maintain optimal operating temperatures and achieve stable high-speed operation over sustained periods, providing consumers with a flawless read and write experience with the latest Gen 5 SSDs.

The T-FORCE DARK AirFlow I SSD Cooler was granted a Taiwan Utility Model Patent this year. It uses graphene patented dual-layer structure for cooling and two 5 mm diameter pure copper heat pipes with multi-layered aluminium alloy cooling fins to multiply the cooling area and accelerate heat transfer and dispersion. In addition, it features a high-pressure smart PWM fan that can precisely adjust fan speeds according to the temperature to efficiently remove heat accumulated in the aluminium fins. The cooling structure utilizes patented ultra-thin graphene, excellent thermal conductive material, increased cooling area, and a high air pressure smart PWM fan, and other cooling methods to make the M.2 2280 Gen 5 SSDs run stably and transfer at extremely fast speeds, creating the highest performing active M.2 2280 Gen 5 SSD cooler.

Team Group Inc., a leading provider of memory storage products announces today its partnership with ASI Computer Technologies Inc a high-profile provider of IT hardware components and systems. By combining ASI Computer Technologies'35 years of channel experience and extensive distribution resources with Team Group's vast lineup of performance focused DRAM, the two companies are strategically focused to grow share across the entire North America market.

Since 2015, Team Group has earned its reputation within the US eSports arena as a high-performance, high-quality memory brand. With complete line of T-Force products, Team Group designs solutions that are innovative in style, efficient in cooling, and consistent in functionality. As the company continued to invest in other markets with T-Create and TEAMS product lineup, we saw sales grow 50% in the B2B segment.

Team Group today announced the launch of its industrial ultra-wide temperature products series that can withstand operating temperatures of up to 105° Celsius, outperforming the standard industrial-wide temperature range. It includes PCIe Gen 3 M.2 SSDs, DDR4 U-DIMM/SO-DIMM and DDR5 U-DIMM/SO-DIMM memory modules, and microSD memory cards. The 105° operating temperature PCIe M.2 SSDs have been granted Taiwan Utility Model Patent (No. M644258).

All products in the ultra-wide temperature series under Team Group's industrial product line have passed the ISO-16750 Road Vehicles - 5.1.2 High-Temperature and AEC-Q104 Temperature Cycling tests. Both of these standards are widely used in the verification of automotive electronic components. The AEC (Automotive Electronics Council) is a group jointly established by major automobile manufacturers and major component manufacturers, with the main purpose of standardizing the reliability and certification standards for automotive electronic components.

Global memory provider, Team Group, has announced two high-end memory cards today under its creator sub-brand T-CREATE for high-resolution works: The T-CREATE EXPERT CFexpress Plus Type B and T-CREATE EXPERT CFexpress Type B Memory Cards. Designed to unleash the top performance of Digital Single Lens Reflex Camera (DSLR), cinema, and high-end SLR cameras, they fulfill the needs of creators that take continuous high-speed shots and can handle the shooting of 4K and 8K RAW high-bitrate videos over long periods, allowing users to capture every key moment.

The T-CREATE EXPERT CFexpress Plus Type B card and the T-CREATE EXPERT CFexpress Type B card both use the CFexpress standard and offer write speeds of up to 1,700 MB/s and read speeds of up to 1,800 MB/s, excellent for file transfers to PCs and viewing all valuable files instantly and smoothly. The T-CREATE EXPERT CFexpress Plus Type B Memory Card adopts pSLC technology, which enables the CFexpress memory cards to have SLC-like read and write speeds in addition to superb durability.

Global memory brand Team Group announced the launch of its updated ELITE memory modules with enhanced frequencies today: the ELITE PLUS DDR5 and ELITE DDR5 Desktop Memory 6400 MHz (1.1 V CL52-52-52-103). Both comply with JEDEC memory standards and fulfill the needs of demanding applications and high-performance computing.

In response to the growing demand for high-speed computing and digital technology, Team Group has introduced the upgraded ELITE PLUS DDR5 6400 MHz and ELITE DDR5 6400 MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of learning, entertainment, and more on desktop computers. With the modules' low operating voltage of 1.1 V, power consumption is significantly reduced, and the computer's lifespan is extended. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process the double amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.

The leading memory brand Team Group has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48 GB module, as well as a lower 24 GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.

Current industrial DDR5 memory on the market has a maximum capacity of about 32 GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, Team Group has made capacity upgrades across its industrial DDR5 memory products, offering new 24 GB and 48 GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

Last month, in the run up to the 2023 Computex, TechPowerUp in partnership with Team Group, brought you the Team Group Computex Giveaway. This year's edition of the greatest PC hardware show on Earth, saw Team Group re-introduce its iconic Team Xtreem brand of enthusiast-class PC memory, besides its Gen 5 NVMe SSDs, and a plethora of new memory products. Up for grabs celebrating this event, were a Team Group Delta DDR5-6400 32 GB (2x 16 GB) memory kit, a Team Group M200 4 TB portable SSD; a Team Group Classic DDR4-3200 32 GB (2x 16 GB) kit, and a Team Group Vulcan Z 1 TB 2.5-inch SATA SSD. The entries are in, and without further ado, here are the winners!

• Merrick from the United States, wins a Team Group Delta DDR5-6400 2x 16 GB dual-channel memory kit
• Sihastru from Romania wins a Team Group M200 4 TB portable SSD
• Daniel from the United States, wins a Team Group Classic DDR4-3200 2x 16 GB dual-channel memory kit
• Dimas from Taiwan, wins a Team Group Vulcan Z 1 TB SATA SSD

A huge Congratulations to the Winners! Team Group and TechPowerUp will return with more such interesting Giveaways!

Leading memory provider Team Group today launched the Team Group PRO+ MicroSDXC UHS-I U3 A2 V30 Memory Card. It meets the Application Performance Class A2, UHS Speed Class 3, and Video Speed Class V30 standards and has read and write speeds of up to 160 MB/s and 110 MB/s, respectively. Not only is it compatible with a wide range of mobile devices and cameras, but it also allows consumers to experience high-definition 4K videos and photos and cherish every precious moment.

The Team Group PRO+ MicroSDXC UHS-I U3 A2 V30 Memory Card features high reliability and stable performance and is rated at UHS Speed Class 3 and Video Speed Class V30. Read speed can reach up to 160 MB/s, and write speed maxes out at 110 MB/s[1]. It's perfect for storing high-definition 4K photos and video recordings, allowing you to capture every moment. Rated at an Application Performance Class of A2 and capable of high IOPS, this brand-new top-performing card provides a fast and smooth performance on mobile devices. Expand your storage easily with this card, which is available in 128 GB, 256 GB, 512 GB, and 1 TB capacities and is compatible with a wide range of smart devices, cameras, and other equipment. It has passed rigorous testing for its waterproof, dustproof, shockproof, anti-static, anti-X-ray, and extreme temperature resistant design. Users can record and play with peace of mind.

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

A trend we've seen in the 2023 Computex is that SSD manufacturers aren't advertising their feisty Gen 5 NVMe SSDs with the elaborate cooling solutions that they sorely need, but rather as bare drives, with the cooling options marketed separately. In practice, manufacturers could get retailers to bundle Gen 5 SSDs with a selection of their coolers. This lets them trim some of the criticism of just how hot SSDs have gotten over just one generation. Team Group showed off its T-Force Cardea Z5 lines of M.2 Gen 5 NVMe SSDs. There are two distinct lines with the same names. One of these comes with a maximum sequential read speed of 12 GB/s, while the other comes with 14 GB/s. Both have their respective 1 TB, 2 TB, and 4 TB capacity variants. Both use 3D TLC NAND flash. The under-the-hood difference between the 12 GB/s and 14 GB/s versions of the Cardea Z5 is that while the 12 GB/s variant uses a Phison E26-series controller, the 14 GB/s one uses an InnoGrit IG5666 controller. Team Group intends to eventually re-brand the 14 GB/s variant as the Cardea Z54A series.

Team Group also announced a handful cooling solutions to pair with these Gen 5 SSDs. The most striking of these is the T-Force Siren, an all-in-one (AIO) closed loop liquid M.2 NVMe SSD cooler, with as 120 mm radiator. The name is a bit of a misnomer, as SSD coolers with 20 mm fans is what a siren might sound like. Obviously, this cooler is overkill, and helps the SSD deliver its best performance, but there are other options from the company. The T-Force AirFlow I uses two copper heatpipes that run through the base-plate, pulling heat from the controller, NAND flash, and DRAM, and pushing it through an aluminium fin-stack arranged vertically. This is then ventilated by a 30 mm fan. The T-Force Airflow II uses a slightly different approach, with a single thicker heat pipe arranged in a C-shape, with radially-projecting finnage that have the appearance of a cylinder. At the other end of this is a 30 mm fan.