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Team Group Announces Collaboration with ASI Computer Technologies

Team Group Inc., a leading provider of memory storage products announces today its partnership with ASI Computer Technologies Inc a high-profile provider of IT hardware components and systems. By combining ASI Computer Technologies'35 years of channel experience and extensive distribution resources with Team Group's vast lineup of performance focused DRAM, the two companies are strategically focused to grow share across the entire North America market.

Since 2015, Team Group has earned its reputation within the US eSports arena as a high-performance, high-quality memory brand. With complete line of T-Force products, Team Group designs solutions that are innovative in style, efficient in cooling, and consistent in functionality. As the company continued to invest in other markets with T-Create and TEAMS product lineup, we saw sales grow 50% in the B2B segment.

Team Group Releases High-Performing Industrial Ultra-Wide Temperature Product Series

Team Group today announced the launch of its industrial ultra-wide temperature products series that can withstand operating temperatures of up to 105° Celsius, outperforming the standard industrial-wide temperature range. It includes PCIe Gen 3 M.2 SSDs, DDR4 U-DIMM/SO-DIMM and DDR5 U-DIMM/SO-DIMM memory modules, and microSD memory cards. The 105° operating temperature PCIe M.2 SSDs have been granted Taiwan Utility Model Patent (No. M644258).

All products in the ultra-wide temperature series under Team Group's industrial product line have passed the ISO-16750 Road Vehicles - 5.1.2 High-Temperature and AEC-Q104 Temperature Cycling tests. Both of these standards are widely used in the verification of automotive electronic components. The AEC (Automotive Electronics Council) is a group jointly established by major automobile manufacturers and major component manufacturers, with the main purpose of standardizing the reliability and certification standards for automotive electronic components.

Team Group Launches T-Create Expert CFexpress Plus and CFexpress Type-B Memory Cards

Global memory provider, Team Group, has announced two high-end memory cards today under its creator sub-brand T-CREATE for high-resolution works: The T-CREATE EXPERT CFexpress Plus Type B and T-CREATE EXPERT CFexpress Type B Memory Cards. Designed to unleash the top performance of Digital Single Lens Reflex Camera (DSLR), cinema, and high-end SLR cameras, they fulfill the needs of creators that take continuous high-speed shots and can handle the shooting of 4K and 8K RAW high-bitrate videos over long periods, allowing users to capture every key moment.

The T-CREATE EXPERT CFexpress Plus Type B card and the T-CREATE EXPERT CFexpress Type B card both use the CFexpress standard and offer write speeds of up to 1,700 MB/s and read speeds of up to 1,800 MB/s, excellent for file transfers to PCs and viewing all valuable files instantly and smoothly. The T-CREATE EXPERT CFexpress Plus Type B Memory Card adopts pSLC technology, which enables the CFexpress memory cards to have SLC-like read and write speeds in addition to superb durability.

Team Group ELITE PLUS DDR5 and ELITE DDR5-6400 Desktop Memory Modules Hit the Market

Global memory brand Team Group announced the launch of its updated ELITE memory modules with enhanced frequencies today: the ELITE PLUS DDR5 and ELITE DDR5 Desktop Memory 6400 MHz (1.1 V CL52-52-52-103). Both comply with JEDEC memory standards and fulfill the needs of demanding applications and high-performance computing.

In response to the growing demand for high-speed computing and digital technology, Team Group has introduced the upgraded ELITE PLUS DDR5 6400 MHz and ELITE DDR5 6400 MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of learning, entertainment, and more on desktop computers. With the modules' low operating voltage of 1.1 V, power consumption is significantly reduced, and the computer's lifespan is extended. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process the double amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.

Team Group Upgrades Industrial DDR5 Memory Capacities

The leading memory brand Team Group has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48 GB module, as well as a lower 24 GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.

Current industrial DDR5 memory on the market has a maximum capacity of about 32 GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, Team Group has made capacity upgrades across its industrial DDR5 memory products, offering new 24 GB and 48 GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.

Team Group Launches Industrial ULTRA Wide Temperature Memory and SSD

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

TechPowerUp and Team Group Computex Giveaway: The Winners!

Last month, in the run up to the 2023 Computex, TechPowerUp in partnership with Team Group, brought you the Team Group Computex Giveaway. This year's edition of the greatest PC hardware show on Earth, saw Team Group re-introduce its iconic Team Xtreem brand of enthusiast-class PC memory, besides its Gen 5 NVMe SSDs, and a plethora of new memory products. Up for grabs celebrating this event, were a Team Group Delta DDR5-6400 32 GB (2x 16 GB) memory kit, a Team Group M200 4 TB portable SSD; a Team Group Classic DDR4-3200 32 GB (2x 16 GB) kit, and a Team Group Vulcan Z 1 TB 2.5-inch SATA SSD. The entries are in, and without further ado, here are the winners!
  • Merrick from the United States, wins a Team Group Delta DDR5-6400 2x 16 GB dual-channel memory kit
  • Sihastru from Romania wins a Team Group M200 4 TB portable SSD
  • Daniel from the United States, wins a Team Group Classic DDR4-3200 2x 16 GB dual-channel memory kit
  • Dimas from Taiwan, wins a Team Group Vulcan Z 1 TB SATA SSD
A huge Congratulations to the Winners! Team Group and TechPowerUp will return with more such interesting Giveaways!

Team Group Releases PRO+ MicroSDXC UHS-I U3 A2 V30 Memory Card

Leading memory provider Team Group today launched the Team Group PRO+ MicroSDXC UHS-I U3 A2 V30 Memory Card. It meets the Application Performance Class A2, UHS Speed Class 3, and Video Speed Class V30 standards and has read and write speeds of up to 160 MB/s and 110 MB/s, respectively. Not only is it compatible with a wide range of mobile devices and cameras, but it also allows consumers to experience high-definition 4K videos and photos and cherish every precious moment.

The Team Group PRO+ MicroSDXC UHS-I U3 A2 V30 Memory Card features high reliability and stable performance and is rated at UHS Speed Class 3 and Video Speed Class V30. Read speed can reach up to 160 MB/s, and write speed maxes out at 110 MB/s[1]. It's perfect for storing high-definition 4K photos and video recordings, allowing you to capture every moment. Rated at an Application Performance Class of A2 and capable of high IOPS, this brand-new top-performing card provides a fast and smooth performance on mobile devices. Expand your storage easily with this card, which is available in 128 GB, 256 GB, 512 GB, and 1 TB capacities and is compatible with a wide range of smart devices, cameras, and other equipment. It has passed rigorous testing for its waterproof, dustproof, shockproof, anti-static, anti-X-ray, and extreme temperature resistant design. Users can record and play with peace of mind.

Team Group Unveils Several T-Create Series Memory Products for Creators at Computex

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

Team Group Shows Off Gen 5 NVMe SSD with AIO Cooling, and T-Force Z5 Gen 5 SSDs

A trend we've seen in the 2023 Computex is that SSD manufacturers aren't advertising their feisty Gen 5 NVMe SSDs with the elaborate cooling solutions that they sorely need, but rather as bare drives, with the cooling options marketed separately. In practice, manufacturers could get retailers to bundle Gen 5 SSDs with a selection of their coolers. This lets them trim some of the criticism of just how hot SSDs have gotten over just one generation. Team Group showed off its T-Force Cardea Z5 lines of M.2 Gen 5 NVMe SSDs. There are two distinct lines with the same names. One of these comes with a maximum sequential read speed of 12 GB/s, while the other comes with 14 GB/s. Both have their respective 1 TB, 2 TB, and 4 TB capacity variants. Both use 3D TLC NAND flash. The under-the-hood difference between the 12 GB/s and 14 GB/s versions of the Cardea Z5 is that while the 12 GB/s variant uses a Phison E26-series controller, the 14 GB/s one uses an InnoGrit IG5666 controller. Team Group intends to eventually re-brand the 14 GB/s variant as the Cardea Z54A series.

Team Group also announced a handful cooling solutions to pair with these Gen 5 SSDs. The most striking of these is the T-Force Siren, an all-in-one (AIO) closed loop liquid M.2 NVMe SSD cooler, with as 120 mm radiator. The name is a bit of a misnomer, as SSD coolers with 20 mm fans is what a siren might sound like. Obviously, this cooler is overkill, and helps the SSD deliver its best performance, but there are other options from the company. The T-Force AirFlow I uses two copper heatpipes that run through the base-plate, pulling heat from the controller, NAND flash, and DRAM, and pushing it through an aluminium fin-stack arranged vertically. This is then ventilated by a 30 mm fan. The T-Force Airflow II uses a slightly different approach, with a single thicker heat pipe arranged in a C-shape, with radially-projecting finnage that have the appearance of a cylinder. At the other end of this is a 30 mm fan.

Team Unveils the Mighty Team Xtreem DDR5 Memory at Computex

Team Group unveiled its mighty Team Xtreem DDR5 memory for overclocking, at the 2023 Computex. These modules are designed such that their PCBs are shorter than their height, and instead of cramming RGB LEDs on top, the 2 mm-thick aluminium heat spreader turns into an extruded heatsink. Some of the higher speed versions of these run at DRAM voltages as high as 1.45 V, so the heatsink design should come in handy. The T-Force Xtreem comes in speeds ranging between DDR5-6400 and DDR5-8266, and in capacities ranging from 16 GB (2x 8 GB), going all the way up to 96 GB (2x 48 GB). The T-Force Xtreem RGB has an additional design element in the form of an acrylic RGB LED diffuser, although from the looks of it, this acrylic bit seems to be covering the fins of the heat spreader. It comes in the same speed-based and capacity based variants, as the regular Xtreem DDR5.

TechPowerUp and Team Group Present Computex Giveaway

TechPowerUp partners with Team Group, the premier PC enthusiast memory and cooling solutions company, to bring you our Computex Giveaway. Team Group will be making a big splash this Computex, with the resurrection of the iconic Team Xtreem enthusiast memory brand, along with new PCIe Gen 5 NVMe SSDs, flash drives, and liquid cooling solutions. Don't forget to check out our in depth coverage of Team Group next week!

Up for grabs are a Team Group Delta DDR5-6400 32 GB (2x 16 GB) memory kit, a Team Group M200 4 TB portable SSD; a Team Group Classic DDR4-3200 32 GB (2x 16 GB) kit, and a Team Group Vulcan Z 1 TB 2.5-inch SATA SSD. The Giveaway is open worldwide, with entries closing on June 6, 2023. All you need to do to participate, is fill up a tiny form, and answer a few Team Group-related questions. Good Luck!

For more information, and to Participate, visit this page.

Team Group to Bring Back the Iconic Team Xtreem Memory Brand, Showcase New Memory and Cooling Products

Leading memory brand, Team Group, returns to COMPUTEX 2023 with the theme "DAZZLE.CHILL.INTEGRATE" to introduce six new products in the memory, cooling solution, and storage device categories. They will be unveiled for the first time at COMPUTEX (5/30-6/2), showcasing Team Group's latest cooling solutions and "aurora" RGB lighting tech as the highlights of the grand exhibition. This year's exhibition is split into two display areas for T-FORCE and T-CREATE's new products. In addition to a large gradient LED screen that will demonstrate T-FORCE's industry-leading RGB technology, there will be physical display areas for the new products, each of which will create an immersive interactive experience that displays the cooling and aurora theme of the exhibition. Attendees will be met with a visual feast of colorful lighting and cool tech.

T-FORCE XTREEM ARGB DDR5 Gaming Overclocking Memory is equipped with innovative dual light pipes which utilize black translucent acrylic and multi-optical designs to display a soft aurora-like flow of light. The matte heat spreader of the XTREEM ARGB DDR5 is made of high-quality 2 mm black aluminium alloy, which has undergone aluminium extrusion, CNC processing, sandblasting, and black anodizing, creating a unique material that combines the hardness and durability of basalt and the soft texture of black beach sand. It comes in a variety of frequencies starting from DDR5-7000 to DDR5-8266 and is specially designed for gamers after an extreme performance and dazzling RGB lighting.

Team Group and InnoGrit Partner to Develop 14 GB/s M.2 NVMe Gen 5 SSD

Team Group's gaming brand, T-FORCE's Z54A series, develops the pioneering new generation PCIe Gen 5 SSD with outstanding performance, with read and write speeds up to 14,000 MB/s and 10,000 MB/s, respectively. Team Group exclusively cooperates with globe-leading advancing storage supplier, InnoGrit Corporation, producing the ultra-fast PCIe SSD products for certain high-performance fields, such as computers, workstations, data centers, servers, gaming consoles, video making, and editing.

T-FORCE offers the most comprehensive heat-sink solutions for the M.2 SSD, tailored for the heat sinks of the ultra-fast Gen 5 PCIe SSD. The circular AIO liquid cooling systems with a Taiwanese invention patent (I778726) bring a group of high-level computer users the solution to the problem of low speed caused by the high-temperature operation of the PCIe M.2 SSDs. The solution that the T-FORCE M.2 SSD brings has the ability to perfectly release performance and extend the lifespan of SSDs. It is the product of the SSD heat sink that brings the benefit of saving power to the new generation.

Team Group Releases M.2-2230 PCIe Gen 4 SSDs

Global memory leader, Team Group, continues to develop and manufacture innovative, high-performance, and reliable industrial memory storage products, providing customers with convenient and flexible solutions. Today, it is releasing the brand new P845-M30 SSD, designed for the M.2 2230 form factor and PCIe Gen 4 interface. This compact, high-performance SSD is suitable for mini industrial PCs, handheld embedded applications, and AIoT-related tasks.

The P845-M30 comes with 112 layers of high-quality 3D NAND flash memory and uses page mapping technology to reduce its block P/E cycling frequency, extending its lifespan, and increasing its random access speeds. It is available in capacities ranging from 256 GB to 1 TB and measures only 30 mm in length. In addition, its support of the PCIe Gen 4 interface allows it to provide high-speed transfers with low power consumption. The P845-M30 can upgrade your device's performance without taking up space, making it the ideal SSD solution for mini industrial computers, which require a small form factor and large capacities.

Team Group Announces the MP44, MP44S, and MP34S M.2 SSDs in Various Sizes

Global memory brand, Team Group, is committed to providing the best solutions in the storage market. Today, it's launching three M.2 SSDs to meet various needs in size and performance. Equipped with a special breakthrough of cooling technology, they are the MP44 M.2 PCIe 4.0 SSD, the MP44S M.2 PCIe 4.0 SSD, and the Gen 3-supported MP34S M.2 PCIe SSD. They offer expanded capacity and reliable stability with compatibility across different generations, making them the perfect choices for your next storage upgrade.

The MP44 M.2 PCIe 4.0 SSD features read and write speeds of up to 7,400 MB/s and 7,000 MB/s, respectively, and has a massive storage capacity of up to 8 TB. Not only does it satisfy your large capacity needs, but it also provides silky-smooth performance. It features the industry's first patented and exclusive ultra-thin graphene cooling label with a thermally conductive material of less than 1 mm thick and closely attached to the M.2 SSD. MP44 measures 22 mm wide and 80 mm long, allowing for quick and easy installation and pairing with a motherboard's original M.2 slot heat sink to greatly enhance thermal performance of the SSD.

Team Group T-CREATE EXPERT DDR5 wins Red Dot Design Award 2023

Global memory leader Team Group announced today that its desktop memory T-CREATE EXPERT DDR5 won the Red Dot Design Award 2023. T-CREATE is an exceptional product line elaborately crafted for creators, providing powerful performances with strong reliability and stability. T-CREATE EXPERT DDR5 memory stood out from 7900 global entries and won unanimous recognition among professional jurors. The latest award received reaffirms Team Group's presence in the international design competitions by showcasing the company's strength and creativity in product development.

The Red Dot Design Award is a German prize among the four primary world design awards. Founded by the reputed design institution, Design Zentrum Nordrhein Westfalen, it is highly influential in the industry and serves as a key indicator for designers worldwide. Starting from 1955, its international jury comprising experts judges on entries' creativity, solutions, design and concepts. Over 7900 entries from 60 countries competed in the award this year, and T-CREATE EXPERT DDR5 desktop memory prevailed with its sophisticated and high-quality design.

Team Group Diversifies with Encryption Product Series

As the development of global technology continues to accelerate, the Internet of Things (IoT) and AI applications have become closely linked at the consumer and enterprise application levels, creating a new highly-efficient information age. As the evolution brings greater information security risks, Team Group has integrated hardware-based encryption technology and security key applications, launching its highly customized data protection product series "Security Solutions" Geared toward keeping user information safe, the first products to be released under this series are the MicroSD Hidden Memory Card, the MicroSD Security Memory Card, and the FIDO USB.

Team Group MicroSD Hidden Memory Card's special design allows it to hide sensitive data stored in the cards. With its increased information security, it's suitable for industries like industrial automation, IoT, and smart manufacturing. The MicroSD Security Memory Card features strong encryption technology to protect sensitive data in memory cards, making it perfect for industries that require a high level of security, such as the finance, medical, and defense industries.

Team Group Launches Overclocking DDR5 Memory in 24GB and 48GB DIMM Densities

Leading memory brand Team Group has announced its gaming brand T-FORCE and creator brand T-CREATE will launch non-binary DDR5 overclocking memory modules in capacities of 24 GB and 48 GB. The company has worked closely with major motherboard makers to complete compatibility testing with Intel 700 and 600 series motherboards of the modules' frequency and capability advancements. The modules will not only support XMP 3.0 but also come in various frequencies of 6,000 MHz and up, making them the fastest non-binary DDR5 high-capacity memory modules available. With excellent compatibility, capacity, and speed, they are the perfect RAM upgrades for gamers and creators.

T-FORCE LAB is committed to providing gamers with both great-performing and highly-compatible products, with T-FORCE DELTA RGB DDR5 taking the lead, launching 48 GB (2x 24 GB) dual-channel kits in 6,000 MHz, 6,400 MHz, 6,800 MHz, 7,200 MHz, 7,600 MHz and 8,000 MHz variants. It allows even motherboards with only two memory slots to harness the power of massive capacities and provide a next-level gaming experience. T-FORCE's latest 2x24GB dual-channel kit supports Intel XMP 3.0, allowing gamers to enjoy the smooth experience that high-capacity memory brings to system performance by simply enabling XMP 3.0 overclocking in BIOS.

Team Group Announces MP33Q M.2 PCIe SSD and T-FORCE VULCAN Z QLC SSD

No more to traditional mechanical drives as the era of high-capacity QLC has arrived. Leading memory brand Team Group today has announced the launch of two QLC SSDs to meet the various needs of users: Team Group MP33Q M.2 PCIe SSD and T-FORCE VULCAN Z QLC SSD come in capacities of up to 2 TB and 4 TB, respectively. Whether for more storage for installing or storing OSs, programs, games, or documents, they are the perfect upgrade solutions for your computer.

In response to different storage upgrade needs of consumers, Team Group MP33Q M.2 PCIe SSD is designed with 3D QLC flash memory chips, PCIe Gen 3 x4 interface and NVMe 1.3 protocol. With up to 2,500 MB/s in read speed and 2,100 MB/s in write speed, it outperforms SATA III SSDs by five times and is available in capacities of up to 2 TB. With its carefully selected 3D QLC NAND flash and SLC Cache technology, Team Group MP33Q M.2 PCIe SSD brings a top-of-the-line solution to the storage market.

Team Group Launches T-FORCE VULCAN SO-DIMM DDR5 Memory for Gaming Laptops

T-FORCE, the gaming sub-brand of Team Group, has launched the blazing-fast VULCAN SO-DIMM DDR5 Memory for laptop gamers looking to upgrade to next-generation DDR5 memory. The VULCAN Memory delivers incredible performance with a simple installation and comes in a range of large capacities, making it the perfect choice for boosting one's gaming experience as well as productivity. Thanks to its ultra-thin graphene heatspreader that enhances cooling; it keeps laptops stable during intensive gaming and allows players to seize victory at the most critical moments.

Following the release of DDR5 desktop memory, the new generation of extremely-fast RAM from T-FORCE has swept the PC hardware world. Today, T-FORCE is launching its first VULCAN SO-DIMM DDR5 Memory designed specifically for gaming laptops. Offering a max clock rate of DDR5-5200 and featuring an ultra-thin graphene heatspreader, gamers will experience shorter load times and faster boot-up speeds while still maintaining low laptop temperatures. With up to 64 GB of capacity, players will enjoy unimpeded gaming and use work applications simultaneously. The new release of VULCAN SO-DIMM brings a whole new level of performance and user experience.

Team Group Announces T-Force Cardea Z540 M.2 PCIe 5.0 SSD

With the releases of the latest generation of Intel and AMD platforms, the era of PCIe 5.0 SSD has officially arrived. Team Group today has launched the T-FORCE CARDEA Z540 M.2 PCIe 5.0 SSD. Developed with outstanding technological expertise, it is the SSD gamers of all kinds have been waiting for. Now it's ready to lead the consumer SSD market into the new era of Gen 5. The Z540 PCIe 5.0 SSD uses the latest PCIe Gen 5 x 4 interface and supports the latest NVMe 2.0 protocol, allowing it to reach read and write speeds of up to 12,000 MB/s and 10,000 MB/s respectively, nearly double the theoretical speed limit of PCIe 4.0. Possessing cutting-edge specifications, Z540 SSD brings gamers an unprecedented, next-generation gaming experience.

The T-FORCE CARDEA Z540 M.2 PCIe 5.0 SSD is equipped with an exclusive ultra-thin graphene heatspreader that combines multiple patented technologies. It's made of 100% recyclable graphene material and utilizes the advantages of hexagonal honeycomb lattice structures to rapidly and evenly disperse heat horizontally, providing Z540 SSD with top-notch cooling. The Z540's ultra-thin graphene heatspreader is less than 1 mm thick and is compatible with various PCIe 5.0 motherboard heatsinks. Based on T-FORCE LAB's internal testing, the operating temperature of Z540 SSD combining motherboard heatsink and graphene heatspreader is 3-5°C lower than the temperature with only motherboard heatsinks. Moreover, CARDEA Z540 uses the latest intelligent thermal regulation technology with built-in temperature sensing to automatically adjust performance and prevent overheating. T-FORCE LAB has created numerous temperature solutions for the Z540 SSD to not only enhance and protect data integrity of the SSD but also maintain good operating temperatures at high speeds, extending the lifespan of the SSD.

Team Group Releases A501 Series Industrial CFast Card

Thanks to the development of 5G and the popularization of IoT, global industrial automation has entered a period of rapid development. With this trend in mind, Team Group has released its next-generation A501 CFast Memory Card, compliant with the CFast 2.0 specification and supports the SATA III 6.0 Gbps interface. With its high performance, large capacity, and light weight, the A501 can be installed on a variety of industrial-embedded hardware devices and automation tools, helping bring industrial automation to the next level.

The Team Group A501 CFast Memory Card is equipped with a major grade original 3D TLC IC, has a rated endurance of 3,000 P/E cycles, and features up to 512 GB of storage for large-capacity applications. Having undergone strict temperature testing, A501 is able to withstand temperatures from -40 °C to +85 °C, ensuring stable performance over long periods of operation in harsh temperature conditions. In addition, the card can deliver speeds of up to 550 MB/s read and 490 MB/s write (512 GB model) and supports DevSleep's low-power hibernation mode to significantly save power consumption and be used in a variety of automated applications. The newest-released CFast memory card also meets the specifications of industrial products, providing up-to-standard and highly customized solutions that satisfy customer needs.

Team Group Announces JEDEC-standard DDR5-6400 Memory with Client Clock Drivers

World-leading memory brand, Team Group, has announced new breakthroughs in the Team Group ELITE U-DIMM DDR5 Standard Memory. To ensure compatibility with next-generation platforms, Team Group has pioneered the first high-performance 6400 MHz spec per JEDEC definitions for consumers to enjoy upgraded performances with ease in the DDR5 generation.

To ensure a stable performance of 6400 MHz and above of the DDR5, Team Group has adopted the new CKD (client clock driver) components designed to strengthen, buffer, and steadily output high-frequency signals from the CPU to DDR5 memory kits, effectively ensuring high frequencies while supporting reliable high-speed transmissions. Team Group is dedicated to R&D and working simultaneously with motherboard manufacturers for rigorous compatibility testing, offering high-quality and highly compatible memory products for desktops and laptops to consumers around the world, fulfilling user demands for PC, laptops, or other small systems.

Team Group Announces T-Create Expert DDR5-6400 Memory

Team Group's creator series T-CREATE launches three DDR5 memory products: T-CREATE EXPERT DDR5 Desktop Memory, T-CREATE CLASSIC DDR5 Desktop Memory, and T-CREATE CLASSIC DDR5 Laptop Memory, comprehensively tailored for creators' demands. Equipped with a variety of frequency specifications from 5,200 to 6,400 MHz and a maximum storage capacity of 32 GB per module, the newly launched products offer a smooth experience for creators working on 4K/8K ultra-high-resolution video editing, professional 3D illustration software and system, as well as multitasking on their desktop computers and laptops.

Specifically built for heavy and complicated processing needs, T-CREATE EXPERT DDR5 Desktop Memory comes in ultra-high frequency options of 6,400 MHz and 6,000 MHz. Paired with low latency specifications, it features unprecedentedly exceptional performance and robust stability to fully support the complex operations and computing demands in professional 3D rendering and long-form super-high resolution video editing. Creators can ensure authenticity and optimal quality in each frame.
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