Thermal Grizzly, a high-performance cooling solutions provider, introduces a new series of thermal pads, consisting of the Minus Pad Basic, Minus Pad Advance, and Minus Pad Pro.

The non-electrically conductive thermal pads Minus Pad Basic, Minus Pad Advance, and Minus Pad Pro are based on the proven Minus Pad 8 and have been specifically optimized to significantly improve thermal conductivity, compressibility, and price-performance ratio. These thermal pads are suitable for SSDs, graphics card coolers, GPU water coolers, and electronic components such as voltage regulators and memory modules.

We build our TUF Gaming components for users who want an emphasis on substance, meaning you're paying for pure performance when you go TUF. That focus on function is where the TUF Gaming GeForce RTX 5090 and TUF Gaming GeForce RTX 5080 graphics cards excel, providing you with next-gen graphics capabilities as well as high-performance thermal solutions that'll hold up under 4K AAA gaming pressure. If you've been waiting to upgrade your rig and want to treat yourself to a premium power bump, now's the time to pull the trigger. You're in for a truly substantial generational leap with these high-end components featuring the power of NVIDIA's latest GPU architecture alongside the sophistication of our latest graphics card designs.

Next-gen tech for tomorrow's heavyweight games
The GeForce RTX 5090 and 5080 comprise the top of the power stack for NVIDIA's 50 Series GPUs, so when you invest in either a TUF Gaming GeForce RTX 5090 or 5080 graphics card, you're setting yourself up for years to come. The 50 Series is powered by NVIDIA's Blackwell architecture, meaning these GPUs feature 4th generation RT cores to give gamers the best ray tracing performance yet. They also pack neural shaders, which compress textures to cut down on memory usage and produce incredible real-time visuals. And NVIDIA has ensured its 50 Series is equipped for neural processing via a built-in AI management processor, so you'll get an optimal experience when harnessing the power of NVIDIA DLSS 4. Powered by 5th generation Tensor Cores, DLSS 4 uses a Multi Frame Generation solution to boost your framerate to new heights.

Thermal Grizzly, a high-performance cooling solutions provider, introduces new size of KryoSheet for the specific adaptation of GeForce RTX 5090 graphics cards to a water cooling solution. KryoSheet graphene thermal pads are an excellent alternative for thermal pastes and have a conformable surface with very high thermal conductivity. The KryoSheet in the size of 44 × 37 mm comes with a Kapton Insulation Sheet.

The new size makes it suitable as a replacement for thermal paste on air-cooled RTX 5090 graphics cards, as the size of the GPU chip can lead to an acceleration of the pump-out effect. The KryoSheet, with dimensions of 44 × 37 mm, fully covers the GB202-300-A1 GPU of the NVIDIA GeForce RTX 5090 and slightly extends beyond the chip's edges. This makes it necessary to electrically insulate the surrounding electronic components. For this purpose, the new size comes with the TG Kapton Insulation Sheet.

With the PhaseSheet PTM, Thermal Grizzly Holding GmbH presents an electrically non-conductive thermal pad based on a phase change material (PCM). With PhaseSheet PTM, Thermal Grizzly closes the gap between traditional thermal paste and thermal pads based on graphene or carbon thermal pads. This means that the respective advantages in terms of application and thermal conductivity can be combined in one product.

PhaseSheet PTM is a thermal pad that has been optimized for applications where maintenance cycles are subject to long intervals. It is more durable than traditional thermal conductive pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM develops and stabilizes after around ten thermal cycles above 60 degrees Celsius.

Thermalright has taken yet another low-key approach to announcing new products—the Taiwan hardware cooling specialist has updated its website with Heilos thermal pads. The model name looks to be a typo—should they have used "Helios" instead? A prominent sun graphic is placed on the bottom left of Thermalright's packaging for both of the Intel and AMD variants. It is unfortunate that something got lost in translation, or a spellcheck did not pick up on the small error before going to print/publication. Anyway...Thermalright is offering two sizes, with an identical 0.2 mm thickness—40x40 mm for AMD's AM4/AM5 CPU platforms, and a smaller pad (40x30 mm) for Intel LGA115X/1200/1700 CPUs. Pricing and availability is TBD.

These easy-peel away applicators provide an alternative route for users who fret about the best way to deal with traditional tubes of thermal paste. Tom's Hardware has pored over the Heilos specs—these pads offer thermal conductivity performance (8.5 W/mK) and resistance (0.04°C cm²/W), comparable (in their opinion) to "inexpensive" tubes of Arctic MX-4 and MX-5. The latter ranks at number four on the publication's "list of the best thermal pastes." Older thermal pads from other manufacturers have been criticized for falling short in terms of cooling performance, when cross-referenced against market leading thermal pastes—it is encouraging to see Thermalright addressing these concerns (specs-wise). We hope that evaluation samples have been sent out to review outlets.

Excellent thermal conductivity thanks to the new Apex thermal pads Soft! Alphacool's high-performance thermal pads offer a variety of advantages compared to a standard pad. Given the high compressibility and natural stickiness, they nestle perfectly to surfaces, compensate for unevenness between electronic components and thus provide a significant improvement in heat transfer. As a result, the enormous waste heat not only from voltage converters and VRAMs of graphics cards, but also from PlayStation and Xbox game consoles can be effectively dissipated, significantly increasing performance and durability. The heat conduction pads can also be used to cool a wide variety of electronic components far away from PC water cooling due to their considerable electrical insulation as well as the large number of variants in terms of thickness and dimensions.

More thermal conductivity with the new Core Soft thermal pads! The performance thermal pads from Alphacool offer a variety of advantages compared to a standard pad. They perfectly cling to surfaces, compensate for unevenness between electronic components and thus provide a significant improvement in heat transfer. This means that the enormous waste heat not only from voltage converters and VRAMs of graphics cards, but also from Playstation and Xbox game consoles, can be effectively dissipated and performance and durability significantly increased. Due to their excellent electrical insulation as well as the large number of variants in terms of thickness and dimensions, the Core thermal pads can also be used to cool a wide variety of electronic components apart from PC water cooling.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, expands its wide array of thermal interfaces with today's launch of the TP-3 Premium Performance thermal pads.

The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances.Thanks to their good compression properties, they adapt to the surface profile without putting too much stress on the components. This ensures optimum heat transfer even on rough surfaces. The ARCTIC TP-3 Pads are heat-conducting, vibration-damping, deformable, electrically insulating and therefore safe and easy to use. They are versatile and are therefore ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.

Thermalright today introduced the Valor Odin series of thermal pads that you can use to improve the cooling performance of your motherboard's VRM heatsinks, M.2 SSD heatsinks, or your graphics card's coolers (to better pull heat from the memory chips or VRM). The company claims that the pad offers thermal conductivity of 15 W/mK, which is in the league of thermal pastes. The pad uses aluminium nitride as a key ingredient, while maintaining electrical non-conductivity up to 9.8 kV, and has a density of 3.1 g/cc. There are three variants of the Thermalright Valor Odin based on pad thickness—1.0 mm, 1.5 mm, and 2.0 mm, all with the same density and thermal characteristics. Each pack includes a sheet measuring 95 mm x 50 mm, which you cut to size. The company didn't reveal pricing.

A user discovered a manufacturing defect with their PowerColor Radeon RX 6700 XT graphics card. Apparently a card still has the protective covers of its thermal pads still in place on a finished graphics card. "angry_kitten" on Reddit posted pictures of a disassembled PowerColor RX 6700 XT graphics card showing protective covers over the thermal pads that pull heat from secondary components such as memory chips and VRM. The user spotted the blue protective film before installing the card, and decided to take the card apart. With modern memory chips and MOSFETs capable of heating up beyond 100 °C, this card would have raised quite a stink. This is likely a defect at the plant that assembles the card, installing the cooler onto the PCB, rather than at the OEM that makes these coolers. These protective covers are meant to be removed at the final assembly line. There's no evidence at this point to suggest that the issue is widespread.

Today, Alphacool presents a new generation of thermal pads. The Alphacool Apex Soft and Rise Ultra Soft thermal pads can be compared thermal paste due to their outstanding properties and efficiency.

The Apex Soft and Rise Ultra Soft thermal pads fill up the unevenness of components significantly better than standard pads. As they can nestle between components better, heat transfer between the cooler and component is significantly increased. The softer consistency of the thermal pads also prevents taller components such as voltage converters or VRAM from being subjected to increased contact pressure from the cooler. The special material does not dry out as easily as standard thermal pads, allowing them to be used for a much longer period without any significant loss of performance.

Tech innovator GELID Solutions unveils the ultimate performance GP-Ultimate 120x20 thermal pad. The GP-Ultimate 120x20 is a product of GELID Solutions GAMER product line. The GP-Ultimate 120x20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.

Thanks to its enhanced multilayer matrix, advanced material composition, and the ultimate 15 W/mK thermal conductivity, the GP-Ultimate 120x20 offers the best performance in class. It is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60° to 220°C. The GP-Ultimate 120x20 features seamless application and has the thermal pad dimensions of 120x20mm with 0.5 mm, 1 mm, 1.5 mm and 2 mm thickness to best fit enlarged PCB surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.