ASUS today announced ASUS NUC 14 Pro AI, the world's first mini PC featuring Intel Core Ultra processors (Series 2) integrated with Microsoft Copilot+. This revolutionary device is engineered to deliver unparalleled performance for use across diverse sectors, easily handling business, entertainment, and industrial apps. Boasting compact dimensions and advanced AI capabilities, ASUS NUC 14 Pro AI sets a new benchmark for mini PC innovation, offering an alternative to traditional desktops in a compact package.

World's first AI-enabled mini PC, powered by Intel Core Ultra processors (Series 2)
ASUS NUC 14 Pro AI represents a major leap in AI mini PC technology. It's powered by up to the latest Intel Core Ultra 9 processors (Series 2) that feature a multi-architecture design incorporating CPU, GPU, and NPU technologies. Delivering a total of 120 platform TOPS and 48 NPU TOPS, ASUS NUC 14 Pro AI provides 3X the AI performance of previous-generation NUC models, making it ideal for commercial use, edge computing, and IoT applications.

Zyxel Networks, a leader in delivering secure, AI-powered cloud networking solutions, has announced four new Wi-Fi 7 access points (APs), adding further strength to its industry-leading range and providing customers of all sizes with even more ways to tailor wireless connectivity to meet the needs of their users. The new access points join three existing models, making Zyxel Networks' Wi-Fi 7 portfolio the most extensive and comprehensive in the industry, providing options to suit every size and type of organization.

When it comes to Wi-Fi performance, antenna design is crucial to signal strength, coverage and reliability. Offering speeds of between 6500 Mbps and 12300 Mbps, Zyxel Networks' four new Wi-Fi 7 APs are designed to provide the best possible user experience across different use-case scenarios.

• The NWA110BE and NWA210BE come with internal antennas, making them ideal for ceiling mount and simple, general purpose Wi-Fi environments.
• Designed for more complex Wi-Fi environments, the WBE510D has dual-optimized antennas and can be ceiling or wall mounted. Network admins can easily adjust the radio pattern without compromising performance.
• The WBE630S provides advanced capabilities for the most challenging and crowded environments, with smart antennas that intelligently shape signal patterns to mitigate interference.

TP-Link Systems Inc., a global leader in networking and smart home solutions, today introduced its new lineup of Wi-Fi 7 networking solutions: the Deco BE5000 and Deco BE3600 Mesh Systems, alongside the Archer BE3600 Router. As the first-to-market Wi-Fi 7 brand, TP-Link continues to lead the industry into a new generation, offering the latest Wi-Fi technology to consumers across a range of accessible price points.

"Consumers are often resigned to seeing new generations of technology siloed off behind high costs, relegated to businesses, technology enthusiasts and dedicated hobbyists," said Jeff Barney, President at TP-Link Systems Inc. "As leaders in Wi-Fi 7, we believe everyone should have access to the latest technologies. This is why we're offering these new products at accessible price points today."

Today, Sony Interactive Entertainment expands the PlayStation 5 (PS5) family of products with the release of the new PlayStation 5 Pro (PS5 Pro) console - the company's most advanced and innovative gaming console to date. PlayStation 5 Pro was designed with deeply engaged players and game creators in mind and includes key performance features that allow games to run with higher fidelity graphics at smoother frame rates.

"With PlayStation 5 Pro, we wanted to make sure that the most dedicated gamers, as well as game creators, could utilize the most advanced console technology, taking the PlayStation 5 experience even farther," said Hideaki Nishino, CEO Platform Business Group, Sony Interactive Entertainment. "This is our most advanced PlayStation to date, and it gives our community of players the opportunity to experience games the way that developers intended for them to be. Players will be thrilled with how this console enhances some of their favorite titles, while opening avenues to discover new ones."

At eero, we've been delivering world-class wifi in homes and businesses across 24 countries for almost a decade, and one of my favorite things is seeing tens of millions of eeros providing fast, reliable, and secure wifi to customers around the world.

Even better than seeing our products out in the world is hearing regularly from our incredibly passionate community. Since we shipped our first systems in 2016, customers have wanted to expand their eero networks beyond their four walls and cover every inch of their property in wifi. Over the years, we've seen our customers come up with all sorts of inventive solutions like eero devices inside weatherproof boxes, in outdoor closets, and even strapping them to poles with rubber bands. We wanted to build something extraordinary for our customers that is tough enough to keep all their outdoor devices connected in snowstorms, rain, and the summer heat. Today, I'm excited to introduce eero Outdoor 7, which will take your wifi beyond your walls and into the great outdoors.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, is excited to introduce the all-new Z890A-SILVER motherboard designed for the latest Intel Core Ultra series-2 processors. Based on Intel Z890 single-chip architecture, this new SILVER series motherboard brings cutting-edge features, fine-tuned to deliver top-notch performance tailored for gamers, content creators, and casual users.

The BIOSTAR Z890A-SILVER motherboard supports up to 192 GB of DDR5 memory across 4 DIMM slots, providing exceptional bandwidth and enhanced performance for multitasking, which is ideal for high-performance computing setups. Furthermore, the Z890A-SILVER motherboard supports PCIe 5.0 M.2, delivering blazing-fast storage speeds for faster load times and overall system responsiveness. With 2.5 GbE LAN support, it ensures high-speed and stable network connectivity, while the inclusion of USB 3.2 Gen 2 Type-C provides versatile and fast data transfer options. The motherboard is also ready for Wi-Fi 7 and 6E modules (no Wi-Fi card included), allowing for the latest wireless connectivity standards.

MSI is thrilled to announce the Unknown 9: Awakening Game Bundle promotion, running from October 18 to November 18, 2024. Participants can enroll while supplies last for a chance to receive a free game code for the PC standard edition of Unknown 9: Awakening - Standard Edition PC valued at USD $49.99 with the purchase of select eligible X870/X870E motherboards.

Delve into the mysterious world of the Unknown 9, and uncover mysteries hidden in plain sight. You are Haroona, a Quaestor born with the ability to venture into a mysterious dimension that overlaps our own, known only as the Fold. On her quest for powerful hidden knowledge, Haroona will learn to master her unique connection to the Fold, which allows her to channel its powers into our world... But such power does not go unnoticed and Haroona quickly becomes the target of the Ascendants, who want to use the Fold to alter the course of human history.

MSI, a leading brand in gaming hardware, is thrilled to announce an exciting collaboration with SEGA, a prominent Japanese game publisher, to bring gamers on an epic journey through the expansive world of Metaphor: ReFantazio.

Embark on an epic journey in Metaphor: ReFantazio with MSI's Cutting-Edge Motherboards
From 2024 October 11th to November 11th, MSI is offering a special promotion: purchase an X870(E) motherboard and receive a Metaphor: ReFantazio Standard Edition PC digital game key for free.

ASRock has unveiled a full lineup of Z890 motherboards, led by the new Taichi series flagship models. This series offers a powerful mix of options for extreme enthusiasts, including the ASRock Z890 Taichi AQUA, Taichi OCF, Taichi, and Taichi Lite. Other ASRock Z890 motherboards include the gaming-focused Phantom Gaming series, featuring the Nova, Riptide, and Lightning models, as well as the popular Steel Legend, LiveMixer, and Pro series for mainstream users. The new Z890 motherboards support the latest Intel Core Ultra 200 series processors, offering more high-speed expansion such as PCI-Express 5.0 support for a graphics card, as well as M.2 SSD, and more importantly up to two Thunderbolt 4 ports for all Z890 motherboards.

The New Era of Taichi
The white-styled ASRock Z890 Taichi AQUA introduces a unique hybrid thermal design developed in collaboration with Alphacool, which combines air and water cooling for the VRM and M.2 block. The Z890 Taichi AQUA also features the first detachable M.2 water block for Gen-5 SSDs, simplifying and streamlining installation.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its revolutionary Z890 motherboards. These next-generation motherboards are set to redefine the standards in performance, AI integration, and user experience for enthusiasts and professionals alike. Powered by state-of-the-art artificial intelligence, these motherboards push the boundaries of what's possible in computing.⁠

Infinite Memory Performance
GIGABYTE Z890 lineup equips the D5 Bionic Corsa technology to create phenomenal new peaks in memory performance to DDR5 XMP 9500 and above. A true marvel of AI-enhanced overclocking technology for DDR5 memory, D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards. The AORUS AI SNATCH is an auto-overclocking software by AI model, and enables users to unleash utmost performance with one-click activation. The AI SNATCH Engine is the AI model served as the core of AORUS AI SNATCH software, trained by AI TOP on diverse overclocking datasets to improve precision and optimize performance with stability. The AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups, while the Hypertune BIOS uses AI to optimize MRC and adapt to signals for peak efficiency, significant memory clock boost, and enhanced overall performance.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, unveils a pioneering AI-powered FWA solution based on Snapdragon X75 5G Modem-RF System during Network X 2024. The solution aims to simplify configuration, enhance user experience and foster service personalization. The integration of AI into the 5G FWA devices significantly revolutionizes the user interaction with end devices and improves experience.

The 5G AI FWA solution is designed to utilize AI intelligence to understand and respond to users' requests and streamline task management processes through voice input or text messages to OpenAI's Whisper service, or the conversations can be realized through the web interface. Offering a seamless, intuitive communication system, significantly expands the CPE capability and improves user experience. The AI-powered FWA solution also extends its intelligence to network optimization, latency reduction to meet customer satisfaction, serving as a hub for unified task management.

MediaTek today launched the Dimensity 9400, the company's new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek's flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm's v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.

The Dimensity 9400 adopts MediaTek's second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek's previous generation flagship chipset, the Dimensity 9300. Built on TSMC's second-generation 3 nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.

TCL, a pioneer in display across feature-rich smartphones, tablets, and connected devices, today showcased its latest 5G AI CPE device and 5G RedCap Family products at the Broadband World Forum 2024, part of Network X, held from 8-10 October in Paris, France. The event featured the AI-driven 5G CPE TCL LINKHUB 5G HH516, a device enhancing user experiences with advanced AI technology, and the TCL LINKPORT IK511, the industry's first 5G RedCap USB Dongle for consumer & M2M scenarios. These recent releases highlight TCL router's commitment to 'Connect the Unconnected and Create Seamless Connection' by leveraging its technological prowess and supporting global 5G adoption with a diverse range of products.

"With over two decades of experience in cellular technology, TCL continues to forge paths in 5G connectivity by broadening access to advanced network technologies through our innovative product offerings," said Jesse Wu, General Manager of Smart Connected Device Business Unit at TCL. "Entering the 5G RedCap market is a strategic move to address the burgeoning demand for enhanced 5G capabilities in a variety of consumer and industrial applications."

Qualcomm Technologies, Inc., a global leader in wireless technology innovation, today announced the launch of the Qualcomm Networking Pro A7 Elite, a groundbreaking wireless networking platform set to transform how people will experience their networks with edge AI integration. Leveraging an AI co-processor with 40 TOPS of NPU processing power, the platform delivers elevated Wi-Fi 7 connectivity and networking performance, while also equipping connected devices with powerful and centralized generative AI processing capabilities.

This transformative integration of computing power into the network unlocks opportunities for operators and enterprises to deploy innovative applications and services in areas such as security and surveillance, energy management and automation, personalized virtual assistants, aging in place and health monitoring among others. Edge AI can enhance privacy by processing sensitive information on the gateway, while enabling personalization through contextualized understanding of the environment and immediacy through near real-time responses. This approach unlocks the power of advanced AI for more devices, even legacy ones, enabling a more reliable and harmonized user experience across connected devices.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

As we continue our celebrations leading up to the 30th anniversary of the first PlayStation console launch, we have a special treat to reveal today that brings the past together with the present. Introducing our PlayStation 30th Anniversary Collection to celebrate this wonderful milestone.

The new limited edition designs pay homage to 30 wonderful years of gaming, a journey made possible by the passion and support of our fans and talented game developers. Reminiscent of the very first PlayStation console to launch on December 3, 1994, this limited edition offering utilizes the original PlayStation color design and integrates it into the latest line of PS5 hardware products.

ASUS today announced Zenbook S 14 (UX5406), one of the thinnest and most portable 14-inch new-era ASUS AI PCs on the market, blending performance with sophistication. The premium Zenbook S 14 showcases a new functional aesthetic, and has been completely redesigned inside and out. The chassis features the new, innovative ASUS Ceraluminum, a high-tech ceramic hybrid material available in a range of nature-inspired colors. This industry-first material offers exceptional strength, effortlessly resisting scratches and wear.

Zenbook S 14 is powered by up to the latest AI-enabled Intel Core Ultra 9 processor (Series 2) and Intel Arc graphics, delivering up to 48 NPU TOPS. Advanced CNC milling enables the integration of an ultraslim vapor chamber in the ultra-quiet ambient cooling system—unique for such a thin device—ensuring up to 28-watt CPU TDP performance with minimal noise. The functional design features a dedicated Copilot key and an enlarged 16:10 seamless touchpad that supports smart gestures.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

Acer today unveiled the new TravelMate P6 14 AI, leading the market with Copilot+ PCs under 1 kg. This new Windows 11 Pro laptop delivers exceptional performance, mobility and AI capabilities for businesses and institutions. It is powered by Intel Core Ultra processors (Series 2) with a built-in NPU boasting up to 120 total platform TOPS AI performance in a compact, carbon fiber chassis.

This latest TravelMate boasts a stunning 14-inch WQXGA+ (2880x1800) 16:10 display with IPS technology or WUXGA (1920x1200) panel featuring high 400 nit brightness and 100% sRGB color gamut, supporting outstanding picture quality. Thin bezels and a high 82% screen-to-body ratio maximize the screen area for more immersive viewing experiences.

Samsung Electronics today announced the Galaxy Book4 Edge (15-inch), the latest addition to Samsung's Galaxy Book lineup, now powered by Qualcomm's cutting-edge Snapdragon X Plus 8-core platform. This new Copilot+ PC seamlessly integrates advanced AI capabilities, which elevate productivity and creativity to new heights.

Enhanced connectivity with the Samsung Galaxy ecosystem allows for one easy and efficient workflow across multiple devices, and further improves access to trailblazing Galaxy AI tools. All of these innovations are housed in a slim design featuring a 15.6-inch FHD display, a long-lasting battery with Super-Fast Charging and Samsung's multi-layer Samsung Knox security. The Galaxy Book4 Edge (15-inch) is available in select markets starting October in an iconic Sapphire Blue finish.

Samsung Electronics today announced the Galaxy Book5 Pro 360, a Copilot+ PC and the first in the all-new Galaxy Book5 series. Performance upgrades made possible by the Intel Core Ultra processors (Series 2) bring next-level computing power, with up to 47 total TOPs NPU - and more than 300 AI-accelerated features across 100+ creativity, productivity, gaming and entertainment apps. Microsoft Phone Link provides access to your Galaxy phone screen on a larger, more immersive PC display, enabling use of fan-favorite Galaxy AI features like Circle to Search with Google, Chat Assist, Live Translate and more. And with the Intel ARC GPU, graphics performance is improved by 17%. When paired with stunning features like the Dynamic AMOLED 2X display with Vision Booster and 10-point multi-touchscreen, Galaxy Book5 Pro 360 allows creation anytime, anywhere.

"The Galaxy Book5 series brings even more cutting-edge AI experiences to Galaxy users around the world who want to enhance and simplify their everyday tasks - a vision made possible by our continued collaboration with longtime industry partners," said Dr. Hark-Sang Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "As one of our most powerful PCs, Galaxy Book5 Pro 360 brings together top-tier performance with Galaxy's expansive mobile AI ecosystem for the ultimate AI PC experience."

Intel today launched its most efficient family of x86 processors ever, the Intel Core Ultra 200V series processors. They deliver exceptional performance, breakthrough x86 power efficiency, a massive leap in graphics performance, no-compromise application compatibility, enhanced security and unmatched AI compute. The technology will power the industry's most complete and capable AI PCs with more than 80 consumer designs from more than 20 of the world's top manufacturing partners, including Acer, ASUS, Dell Technologies, HP, Lenovo, LG, MSI and Samsung. Pre-orders begin today with systems available globally on-shelf and online at over 30 global retailers starting Sept. 24. All designs featuring Intel Core Ultra 200V series processors and running the latest version of Windows are eligible to receive Copilot+ PC features as a free update starting in November.

"Intel's newest Core Ultra processors set the industry standard for mobile AI and graphics performance, and smash misconceptions about x86 efficiency. Only Intel has the scale through our partnerships with ISVs and OEMs, and the broader technology ecosystem, to provide consumers with a no-compromise AI PC experience."
--Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group