ASUS today announced its participation in the NAB Show 2025. Visitors to the ASUS booth will have the opportunity to experience the future of content creation with live demonstrations of the latest ASUS ProArt offerings. The showcase includes the debut of the ProArt Cinema PQ09 monitor, featuring the largest-ever ASUS microLED display. The ProArt Display 6K PA32QCV and the ProArt CaliContrO MCA02 three-in-one calibrator will also be showcased. Also on show will be the 16-inch ProArt P16, a creative powerhouse laptop equipped with a 50 TOPS NPU, AMD Ryzen AI 9 HX 370 processor, and up to an NVIDIA GeForce RTX 5070 Laptop GPU. In addition, the NAB Show 2025 will feature the latest installment of the ProArt Masters' Talks series, with renowned creatives sharing their perspectives on current trends.

The ProArt Cinema PQ09 is the latest addition to the ProArt Cinema microLED display lineup. This 162-inch 4K HDR monitor features advanced panel technologies, ultrasmall 0.93 mm pixel pitch, 1200nits peak brightness, high 1,000,000:1 contrast ratio, and 97% DCI-P3 color gamut. Compared to conventional microLED displays with a 1.2 or 1.5 mm pixel pitch, ProArt Cinema PQ09 delivers smoother and more vibrant visuals, making it the perfect large-screen display for home cinema, broadcasting or other uses.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled its new 2025 pre-configured MG-1 gaming systems, equipped with NVIDIA's cutting-edge GeForce RTX 50-Series GPUs and powered by the latest AMD Ryzen 9000 Series CPUs and Intel Core Ultra Series 2 processors. This exciting lineup offers gamers a significant leap in power, performance, and value, reinforcing MAINGEAR's commitment to redefining the gaming experience across all levels of play.

"2025 is bound to be the best year yet for PC gamers, and the introduction of our newest MG-1 systems continues to drive MAINGEAR's mission to deliver the ultimate gaming experience," said Wallace Santos, CEO of MAINGEAR. "With NVIDIA's RTX 50-Series GPUs, and the latest AMD Ryzen and Intel Core Ultra processors, we've got more options than ever before, ensuring the perfect fit for gamers of all skill levels and budgets."

Here are some of the first pictures of the ASUS ROG Crosshair X870E Extreme, the company's new flagship Socket AM5 motherboard. Until now, the company's AMD 800-series chipset motherboard lineup topped off with the ROG Crosshair X870E Hero for connectivity and the ROG Crosshair X870E Apex for overclocking chops, and the company is looking to push things up a notch, especially given that AMD's Ryzen 9000X3D series is established as the fastest processor series for gaming PC builds. This board is designed to compete with the likes of the MSI MEG X870E Godlike and the GIGABYTE X870E AORUS Xtreme. It is firmly into the E-ATX territory in terms of dimensions. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an 8-pin PCIe power. It uses the company's most powerful CPU VRM solution for the AMD platform, above even the 22-phase solution of the Hero.

The ASUS ROG Crosshair X870E Extreme comes with a large number of 4-pin PWM fan and water pump headers. Storage connectivity includes one M.2-22110 Gen 5 on the board with a chunky heat pipe-based cooler; a second Gen 5 and two Gen 4 slots on the board, and a DIMM.2 module that provides additional slots. The expansion slots provided are a PCI-Express 5.0 x16 and a second PCI-Express 4.0 x4 (physical x16). There are a boat-load of USB ports, including a couple of 40 Gbps USB4, 20 Gbps USB 3.2 Gen 2x2, and several 10 Gbps and 5 Gbps USB 3.2 ports. Networking interfaces include Wi-Fi 7, a 10 GbE, and a 5 GbE. The board features the company's most premium onboard audio solution that probably combines a Realtek ALC4082 with an ESS ES9219 DAC for the front channels, an audiophile-grade OPAMP, and premium capacitors. The board offers many of the exclusive overclocker-friendly features found in the company's ROG Maximus Extreme motherboards. A star-attraction is its 4-inch true-color display over the VRM heatsinks, which can be programmed to show anything. There is no word on availability or pricing.

Over a week ago, ASUS "quietly" unveiled a revamped Q-Release Slim mechanism—eagle-eyed hardware media outlet—Uniko's Hardware—spotted this revised quick release PCIe system on a freshly detailed premium ROG CROSSHAIR X870E APEX motherboard model. Wider press reportage jumped on the manufacturer's mixed bag of official responses; regarding reported damage inflicted by a "problematic" design. The ASUS North American office downplayed the severity of this matter, while colleagues in China launched a fairly comprehensive compensation program. According to VideoCardz, the latter organization has confirmed—as of last week—that a problem-free/improved Q-Release Slim system is on the way.

On Monday, Tweakers divulged its direct communication with ASUS—a spokesperson answered the Dutch site's query: "yes, a change has been made to the Q-Release Slim system for new X870 motherboards. Based on user feedback, we have modified the PCIe slot for the Q-Release Slim system, including removing a metal component to reduce the possibility of damage to the video card." The company representative noted that newly introduced/attached stickers will inform users about "correct system usage." Based on the aforementioned ASUS statement, Tweakers reported: "that both the original and revised versions of the system have been extensively tested and that users should study the included documentation to use the Q-Release Slim system properly. According to the manufacturer, both versions of the technology meet 'industry standards for wear resistance'." That last point suggests that ASUS will not be issuing a wide recall of currently released boards that feature original Q-Release Slim mechanisms.

A member of GIGABYTE's gaming subreddit has shared a worrying HWiNFO diagnostics readout accompanied by a simple title: "X870E AORUS XTREME AI TOP Chipset with AMD Ryzen 9 9950X3D—Chipset 2 (xHCI) 109.9 °C." Xabiro's initial post attracted replies that disclosed additional feedback regarding higher than expected temperature measurements. Another member—RyanOCallaghan01—exclaimed in the comments section: "damn. I am having the same problem, Chipset 2 is almost reaching 100 degrees Celcius, and I have not even got a high-powered GPU installed. I have seen your image and starting to suspect mine may be the same." The original poster proceeded to disassemble their thermally-challenged X870E AORUS XTREME AI TOP specimen, and quickly identified the root cause—affecting one of the board design's two daisy-chained Promontory 21 chipsets.

Xabiro described this problem-solving process: "I removed the heat sink and actually the top AMD chipset is not touching the heat sink no matter what I do...I didn't have any GPU installed yet, but I just solved (the temperature problem) yesterday, with thermal paste combined with Thermal Grizzly (TG) KryoSheet, just because I didn't have TG Putty Pro. Now the maximum temperature is 65 °C—also on the bottom one was just changed to TG Kryonaut, and it is under 50 °C. Quite ironically, GIGABYTE recently engaged in some public mocking of a troubled ASUS motherboard feature. Xabiro suspected that the X870E AORUS XTREME AI TOP mainboard's EZ Latch Plus GPU quick release system is preventing good contact between surfaces. They observed that: "the plastic ornament which goes from the PCIe to the release button is too high and the top part of the heat sink stays on it, and just simply cannot touch the chipset die."

At CES 2025, ASUS unveiled their elite-tier ROG Crosshair X870E Apex motherboard design. Additionally, early January press material teased another top contender: "ROG Crosshair X870E Extreme is also waiting in the wings, with details to be shared on the way to its expected release in the first quarter (of 2025)." As reported by VideoCardz, the Taiwanese manufacturer seems to be readying its mysterious ultra-premium model for an imminent launch. Last week, HWiNFO v8.23-5685 Beta release notes turned up—revealing the existence of "enhanced sensor monitoring on ASUS ROG Crosshair X870E Extreme." Concurrently, a smattering of retail/e-tail listings have turned up in Europe. The lowest observed asking price (including VAT) was €1202.80, courtesy of Max ICT's (Netherlands) premature publishing of a product page.

Hopping across the Atlantic, industry watchdogs noted that Newegg was demanding a cool $749 for ASUS ROG Crosshair X870E Apex pre-orders. Potential European customers will likely be greeted by a ~€827 (inc. VAT) price point. Since January, the Republic of Gamers marketing team has kept quiet on the X870E Extreme front. Their fancily-appointed board is still an unknown quantity in many regards; recent retail leaks lack technical information and visual representation. As noted by VideoCardz, time is running out for a Q1 2025 launch. As we head into April, Q2 looms in the near distance.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

ASUS has discreetly modified its controversial Q-Release Slim mechanism in the newly launched ROG Crosshair X870E Apex motherboard, removing a metal bracket linked to GPU PCIe connector scratches. The unannounced revision, spotted by Uniko's Hardware, follows months of backlash from enthusiasts who reported cosmetic damage to high-end GPUs after repeated use of the quick-release feature. While ASUS has not formally addressed the redesign, it acknowledges the issue—a stark contrast to its earlier dismissal of concerns as "typical wear-and-tear" after 60+ removal cycles. The controversy, first spotted in January 2025, escalated when users shared evidence of scratched PCIe pins on platforms like Reddit and Bilibili.

ASUS's global responses varied sharply: its US division downplayed functional risks, while ASUS China rolled out compensation, including motherboard replacements and store credits, and confirmed a redesign was underway. This regional split shows differing consumer protection norms, with China's aggressive compensation contrasting Western markets' reliance on warranty assurances. Competitors seized the moment. GIGABYTE's AORUS Japan publicly mocked ASUS with a 100-cycle stress test of its EZ Latch Plus, showcasing zero GPU damage—a direct jab at Q-Release Slim's durability. The campaign, echoed by GIGABYTE's Western accounts, emphasized rivalries in the premium motherboard segment. ASUS's quiet hardware fix avoids a formal recall, likely due to the niche impact—frequent GPU swaps are rare among mainstream users.

A new case of catastrophic CPU failure has emerged involving AMD's Ryzen 7 9800X3D processor, marking the latest in a series of reported incidents within the last few days involving high-performance GPUs and CPUs. The failure occurred during routine use when a system equipped with the 9800X3D and an ASRock Nova X870E motherboard suddenly shut down, resulting in visible thermal damage to both components. The incident is particularly noteworthy as the system operated under stock settings, with only AMD EXPO memory optimization enabled. The affected user, who has two decades of PC building experience, reported that the system had been operational for approximately 20 days before the failure, with no temperature anomalies recorded through HWMonitor during its operation.

The hardware was running the ASRock BIOS version 3.16. This case differs significantly from the previous AMD Ryzen 7 9800X3D failure, where user error during installation was identified as the primary cause, with the user force-installing the CPU in the socket. The timing of the failure—during a low-intensity workload of streaming video content—further complicates the investigation into root causes. While isolated cases of hardware failure are not uncommon in the PC component market, this case may be the first one caused entirely by the CPU/motherboard combination, not user error. The user also faces uncertainty regarding warranty coverage, as the CPU and motherboard were purchased separately from different retailers. We hope the warranty case goes well, and the user gets a replacement!

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of low latency DDR5-6400 CL30-39-39-102 memory specification in high-capacity kit configurations, up to 96 GB (2x 48 GB) kit capacity. This high performance memory kit specification will be available under the Trident Z5 RGB and Trident Z5 Royal series, with Intel XMP 3.0 memory overclock profile support.

The G.SKILL DDR5-6400 CL30 memory kit at 96 GB (2x 48 GB) combines high-capacity and low-latency to enable higher performance for memory intensive platforms and uses. The screenshot below shows this 96 GB (2x 48 GB) memory kit operating at DDR5-6400 CL30-39-39-102 with the ASUS ROG Maximus Z890 Hero motherboard and Intel Core Ultra 7 265K desktop processor.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, in cooperation with the ASUS ROG team, is showcasing multiple overclock achievements on the newly announced ASUS ROG Crosshair X870E Apex motherboard, including a high memory speed of DDR5-10600 and another operating at DDR5-6800 CL28 in 1:1 mode, both under Memtest stress-test. Additionally, G.SKILL DDR5 memory is used by ASUS in-house overclocker, Safedisk, to break several overclock records with the latest AMD Ryzen 9 9950X desktop processor.

Exploring OC Limits at DDR5-10600 2x24 GB
Aiming to explore the limits of memory overclock potential of the new motherboard, Safedisk challenged the fastest possible dual-channel memory speed with Memtest stress-test running. The screenshot below shows a 48 GB (2x24GB) memory kit operating at DDR5-10600 with the ASUS ROG Crosshair X870E Apex motherboard and AMD Ryzen 5 8500G desktop processor, completing the Memtest stress-test with CPU and memory under water chiller cooling.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

The ASUS ROG Apex brand extension is reserved for motherboards with the best CPU and memory overclocking capabilities. Since Intel processors tended to overclock better than AMD, Apex remained confined to the Intel platform, until now. ASUS at CES showed off the ROG Crosshair X870E Apex, the first AMD platform motherboard to feature this brand extension. The board features a powerful CPU VRM solution meant for sub-zero overclocking of Ryzen 9000X3D processors that are fully capable of overclocking. It also comes with a 1 DIMM-per-channel memory topology, with just two DDR5 DIMM slots. 1DPC is the most optimal dual-channel topology for memory overclocking.

The topmost M.2 Gen 5 NVMe slot features an elaborate fan-heatsink solution. Right next to the two DDR5 DIMM slots, is a breakout DIMM.2 module that provides additional M.2 NVMe slots. There are a couple of more Gen 4 NVMe slots scattered across the board. The board features an I/O feature-set that's at least as good as the ROG Crosshair X870E Hero. The board draws power from two 8-pin EPS, a 24-pin ATX, and an additional 8-pin PCIe power input. The board is packed to the gills with features professional overclockers would look for, including onboard buttons, diagnostic readouts, a hydrophobic PCB surface treatment, dual-BIOS, and clearly labelled voltage domains.

MSI is proud to unveil its latest lineup of motherboards designed for AMD Ryzen B850 and B840 chipsets. These motherboards deliver a perfect blend of performance and innovation, ensuring exceptional reliability and ease of use. With their high performance and reliable design, they are built to empower mainstream users, gamers, and creators with next-level computing capabilities.

In addition to the new B850 and B840 motherboards, MSI is also expanding its X870E lineup with two new models: the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI. These additions offer even more options tailored to diverse user needs—top-tier performance and, most importantly, cutting-edge connectivity. With the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI, MSI continues to deliver innovative solutions that empower gamers, creators, and PC enthusiasts alike.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

AMD has unveiled its latest chipset driver update 6.10.17.152, bringing new features and improvements to enhance system performance and compatibility, along with support for X870E / X870 chipsets. The release introduces expanded program support and optimized Windows 11 integration through CETCOMPACT implementation across select drivers, a security feature that helps protect against certain types of malware attacks by enforcing Control-flow Enforcement Technology (CET) in a compatible mode for legacy software. This technology ensures better security while maintaining compatibility with existing applications.

The update comes with several bug fixes addressing previous version issues. However, users should be aware of certain limitations that are currently present in this release. Some driver names may appear in English when running on non-English operating systems, users might encounter instances where the uninstall summary incorrectly displays a "Failed" status despite successful removal, and some users may experience installation or upgrade issues related explicitly to Ryzen PPKG. AMD recommends users backup their systems before updating and follow the standard installation procedures, with the company maintaining dedicated technical support resources through their customer service portal for users requiring additional assistance.

DOWNLOAD: AMD Chipset Drivers 6.10.17.152

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, is proud to announce the launch of X3D Turbo Mode, a revolutionary BIOS feature designed to maximize gaming performance on X870E, X870, and 600 series motherboards with AMD Ryzen 7000 X3D and Ryzen 9000 series processors.⁠

GIGABYTE X3D Turbo Mode is a cutting-edge BIOS feature that pushes the boundaries of gaming performance. Empirical testing demonstrates that this innovative BIOS feature delivers tangible benefits to gamers, with performance increases of up to 35% for incoming Ryzen 9000 X3D processors and an astounding 20% for Ryzen 9000 non-X3D processors. Moreover, X3D Turbo Mode's unique optimization parameters allow even Ryzen 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency by GIGABYTE's BIOS wizardry-X3D Turbo Mode.

MSI is thrilled to announce the Unknown 9: Awakening Game Bundle promotion, running from October 18 to November 18, 2024. Participants can enroll while supplies last for a chance to receive a free game code for the PC standard edition of Unknown 9: Awakening - Standard Edition PC valued at USD $49.99 with the purchase of select eligible X870/X870E motherboards.

Delve into the mysterious world of the Unknown 9, and uncover mysteries hidden in plain sight. You are Haroona, a Quaestor born with the ability to venture into a mysterious dimension that overlaps our own, known only as the Fold. On her quest for powerful hidden knowledge, Haroona will learn to master her unique connection to the Fold, which allows her to channel its powers into our world... But such power does not go unnoticed and Haroona quickly becomes the target of the Ascendants, who want to use the Fold to alter the course of human history.

MSI, a leading brand in gaming hardware, is thrilled to announce an exciting collaboration with SEGA, a prominent Japanese game publisher, to bring gamers on an epic journey through the expansive world of Metaphor: ReFantazio.

Embark on an epic journey in Metaphor: ReFantazio with MSI's Cutting-Edge Motherboards
From 2024 October 11th to November 11th, MSI is offering a special promotion: purchase an X870(E) motherboard and receive a Metaphor: ReFantazio Standard Edition PC digital game key for free.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.