According to the latest South Korean semiconductor industry whispers, Samsung's 2 nm GAA node process (aka SF2) development team has hit another pleasing experimental production milestone. An Asia Economy SK news article has sourced insights from inside track players—one unnamed mole posited that: "the 2 nm yield currently under development at Samsung Foundry is much better than previously known...and more positive than the (reportedly abandoned) 3 nm process." A combination of relatively new leadership and a rumored welcoming of first wave High-NA EUV equipment has likely bolstered next-gen efforts, after late 2024's alleged failure of 3 nm prototypes. Leaks from earlier in 2025 indicated SF2 test yields wavering around 20-30%; far from ideal—back then, insider reports suggested that TSMC was well on the way to achieving 60% rates with a competing 2 nm product line. Asia Economy has picked up on mutterings about Samsung's current progress—latest outputs: "have exceeded 40% in the wafer testing stage at a post-processing company."

Industry watchdogs reckon that the South Korean's foundry business is making good progress; perhaps on track to commence speculated mass production by the third quarter of this year—just in time to get finalized flagship "Exynos 2600" mobile chips in the manufacturing pipeline. The Taiwanese rumor mill indicated a major milestone "completion" of TSMC's 2 nm trial phase at some point last month—insiders mentioned excellent yield rates: in the region of 70-80%. Cross-facility mass production could start later this year, but experts propose that the market leader will be implementing price hikes. These "elevated charges" could send loyal TSMC customers in the direction of an alternate source of 2 nm wafers: Samsung. Fresh semicon biz gossip has the likes of Apple, AMD and NVIDIA in the picture.

AMD's Radeon RX 9070 XT and RX 9070 "MBA" graphics cards are no longer "best kept secrets"—as demonstrated recently by the "leaking out" of supposed reference models through black market/back alley channels in China. Late last month, a dual-fan non-XT specimen was snapped up by Chiphell forum member—alleged benchmark results were soon shared within that community. A few days later, a "Made-by-AMD" Radeon RX 9070 XT sample was dissected and compared to Sapphire's PULSE Radeon RX 9070 XT 16 GB SKU. An additional MBA XT example emerged last week, courtesy of another in-depth Chiphell thread. A "bored" enthusiast happened upon a 5499 RMB (~$748 USD) when idly browsing through Xianyu listings (Taobao's Ebay equivalent platform). Their buying experience was described as follows: "(I) found a 'public version' Radeon RX 9070 XT in Tianjin. It was said to be manufactured by (an) OEM, so I bought it without hesitation...I made an appointment to meet today and got it successfully. I don't have to wait for a graphics card anymore."

For unknown reasons, AMD decided to launch its first wave of RDNA 4 gaming graphics cards sans first-party designs. Leaked specimens have attracted much attention in China; with owners bragging about their respective ownerships of reasonably priced rarities. The latest back channel customer expressed satisfaction when inspecting Team Red's all-black flagship Navi 48 GPU-based solution: "after I got it, I have to say that it is not very heavy and is quite light. But the appearance is really what I like." After initial tests, they discovered that VRAM temperatures were not up to snuff—as alluded to (pre-launch) by other Chiphell figures. Their personal DIY improvements were described: "(I) took it apart to measure the thickness of the thermal grease pad. Everyone said the temperature of the video memory was high, so I decided to change to something better....(with) original silicone grease FurMark 2K resolution for 20 minutes: maximum core temperature was 62 degrees, maximum hot spot temperature was 84 degrees, maximum memory temperature was 88 degrees, maximum power was consumption 346 W."

A fresh leak suggests that MSI is "all in" with its upcoming rollout of GeForce RTX 5060 Ti 16 GB custom card lineup. Earlier today, I_Leak_VN uploaded a fuzzy list of nine unannounced models to social media. By some undisclosed means, the reliable Vietnamese tracker of inside info had acquired a pre-launch chart of VANGUARD, GAMING TRIO, INSPIRE, VENTUS and SHADOW options—mostly in factory overclocked forms. Late last week, GIGABYTE—another Taiwanese manufacturer—registered a wide variety of competing 16 GB VRAM-equipped offerings in South Korea. MSI's alleged card count is greater (9 vs. 7); having the advantage with four different VENTUS models.

Unlike its nearby rival, MSI has opted out of the AMD Radeon battle for this generation (RDNA 4). With full concentration on Team Green, the "Blackwell" GB206 GPU was seemingly deemed worthy of bearing the brand's premium VANGUARD cooling solution—as implied by a headlining position on I_Leak_VN's screenshot. Sitting at the bottom is MSI's barebones SHADOW 2X design; we do not know whether a new entrant will reuse the exact same dinky enclosure that is present on their GeForce RTX 5070 SHADOW 2X cards (standard and OC). Visual confirmation is expected to arrive next week; industry insiders believe that global retail stock will appear on April 16.

Since its summer 2023 launch, Apple's pricey Vision Pro mixed reality headset has not exactly attracted a mainstream audience. Roughly a year later, rumors of a (then) recently canceled successor appeared online—insiders posited that company engineers had pivoted onto the development of a cheaper alternative model. Vision Pro "Version 1.0" arrived with an intimidating $3499 price tag; thus eliminating interest from a wide swath of potential AR/VR headset enthusiast customers. Industry insiders reckon that Apple had "abruptly reduced production" of the current-gen model last October, with further whispers suggesting a complete cessation of manufacturing activities by the end of 2024. Yesterday, an ITHome article cited compelling claims made by supply chain insiders—the initiation of mass production for a speculated second generation "Apple XR/Vision Pro" device.

The online report stated that: "multiple independent sources (have) confirmed that the panels, shells and other key components of the second-generation Apple XR headset are already in production." Very specific leaked information indicates Lens Technology being the exclusive supplier of glass panel pieces, and Changying Precision tasked with the making of the next-gen model's casing. Additionally, several contract circuit manufacturers are supposedly "rushing to complete orders." Secretive figures posit that Apple will release its sequel mixed reality headset later on in 2025. Differing "expert opinions" have not determined whether this incoming set of fancy goggles will be the predicted "cheaper" model, or a proper "M5 SoC-powered" successor.

Samsung's foundry business seems to be busying itself with the rumored refinement of a 2 nm GAA (SF2) manufacturing node process—for possible mass production by the end of 2025, but company leadership will very likely be considering longer term goals. Mid-way through last month, industry moles posited that the megacorporation's semiconductor branch was questioning the future of a further out 1.4 nm (SF1.4) production line. Officially published roadmaps have this advanced technology rolling out by 2027. Despite present day "turmoil," insiders believe that a new team has been established—tasked with the creation of a so-called "dream semiconductor process." According to a fresh Sedaily news article, this fledgling department has started development of a 1 nm foundry process.

Anonymous sources claim that Samsung executives are keeping a watchful eye on a main competitor—as stated in the latest South Korean report: "there is a realistic gap with Taiwan's TSMC in technologies that are close to mass production, such as the 2 nm process, the company plans to speed up the development of the 1 nm process, a future technology, to create an opportunity for a turnaround." A portion of the alleged "1 nm development chip team" reportedly consists of veteran researchers from prior-gen projects. Semiconductor industry watchdogs theorize that a canceled SF1.4 line could be replaced by an even more advanced process. Sedaily outlined necessary hardware upgrades: "the 1.0 nanometer process requires a new technology concept that breaks the mold of existing designs as well as the introduction of next-generation equipment such as high-NA EUV exposure equipment. The company is targeting mass production after 2029." Samsung's current Advanced Technology Roadmap does not extend beyond 2027—inside sources claim that the decision to roll with 1.0 nm was made at some point last month.

According to reports from last year, Xiaomi was expected to unveil an oft-rumored proprietary mobile chipset design at some point in 2025. By October 2024, the Chinese technology giant allegedly reached the tape-out phase of its first 3 nm SoC—at the time, insiders posited that Xiaomi was seeking a manufacturing partner. Months earlier, a prototype design was linked to TSMC's 4 nm "N4P" node process—this rumor raised many smartphone watchdog eyebrows. Unlike many other Chinese firms, Xiaomi was reportedly allowed to select a fairly advanced manufacturing process at Taiwan's premier foundry service. In a past weekend news article, Wccftech outlined interesting circumstances: "(US) export controls have yet to affect Xiaomi, which is supposedly on track to launch its first in-house chipset later this year. However, while we reported last year that the company was scheduled to unveil its custom 3 nm SoC in 2025, we were disappointed to learn just the specifications of this version that will utilize TSMC's 'N4P' process. According to more details, this silicon will not sport any homegrown cores like Qualcomm has adopted for the Snapdragon 8 Elite."

Late last week, Jukanlosreve highlighted another leaker's prediction—regarding the technological foundations of Xiaomi's mystery flagship mobile processor. Fixed Focus Digital's Weibo post mentioned the "N4P" node, as well the utilization of current generation Arm Cortex-X925, Cortex-A725 and Cortex-A520 units. A speculated Imagination Technologies "IMG DXT 72-2304" integrated graphics solution is touted to outperform Qualcomm's Adreno 740 iGPU; as featured in their Snapdragon 8 Gen 2 (2022) SoC. As highlighted by Wccftech's report, one of the publication's associates has deemed Fixed Focus Digital to be an unreliable source of inside track info. In response to Jukanlosreve's tweeted question, Mochamad Farido Fanani opined: "that's right, how does Xiaomi use N4P in its new chipset? But this guy always guesses blindly." Older leaks—based on "N4P" rumors—projected performance levels roughly on par with Qualcomm's first generation Snapdragon 8 chip. This model was introduced at the tail end of 2021.

Last week, industry reports pointed to evidence of NVIDIA H20 AI GPU shortages in China—supply chain insiders expressed frustration about limited availability, and alleged price hikes. Days later, local media outlets have disclosed staggering sales figures. Two unnamed sources opine that the likes of Tencent, Alibaba and ByteDance have spent roughly US$16 billion on H20 purchases, across the first three months of 2025. Back in February, Reuters noted an extraordinary surge in orders for: "(Team Green's) H20 model—the most advanced AI processor legally available in China under U.S. export controls—driven by booming demand for Chinese startup DeepSeek's low-cost AI models." The unprecedented rush—to secure precious AI-crunching hardware—was likely motivated by whispers of elevated restrictions; coming from across the Pacific Ocean.

Curiously, local government bodies have allegedly "advised" a stoppage of H20 orders—a recent Financial Times article suggested that this message was directed at the nation's largest AI players (mentioned above). A few industry moles believe that NVIDIA's engineering department is working on another Chinese market exclusive AI chip, although it is not clear whether a new entrant will be designed to conform to recently introduced "not very strict" environmental regulations. Anonymous sources have made noise about an upgraded H20 variant; sporting fancy HBM3E modules.

Over the past weekend Jukanlosreve declared via social media that Samsung's: "Exynos 2600 (mobile SoC) is definitely back, and it will be used in the Galaxy S26 series. But the chip volume is so limited that it'll likely be similar to the Exynos 990 situation. I'm not sure if SF2 is actually any good." Mid-way through March, the keen observer of semiconductor industry conditions posited that Samsung's Foundry business could abandon a 1.4 nm (SF1.4) process node. SF2 (aka 2 nm GAA) seems to be in a healthier place, according to insiders—thanks to rumored assistance from an external AI-specialist partner. The development of next-generation flagship Exynos smartphone processors are allegedly closely tied with Samsung Foundry's 2 nm GAA manufacturing process.

As alluded to by Jukanlosreve's recent prediction, the statuses of leaked 2 nm-based "Exynos 2600" and "Exynos 2500" chips were often questioned by industry watchdogs in the past. The latter is purportedly destined for rollout in forthcoming affordable "Galaxy Z Flip FE" models, albeit in mature 4 nm form. Vhsss_God—another source of inside track info—has weighed in on the topic of Samsung's next-gen chipset roadmap. Compared to Jukanlosreve's musings, their similarly-timed weekend projection seemed to be quite fanciful: "exclusive leak...Samsung doesn't want to use Exynos or Qualcomm Snapdragon chips anymore. S26 line is targeted to launch with the new Samsung developed chip (2 nm)—formerly referred to as Exynos 2600. (The company) will try its hardest to ditch Snapdragon on the entire Galaxy line next year." Perhaps there is too much of a negative stigma attached to Samsung's long-running chipset nomenclature, but the majority of foundry moles continue to label incoming designs as Exynos processors.

Digital Chat Station (DCS)—a tenured leaker of Qualcomm pre-release information—has shared new "Snapdragon 8 Elite Gen 2" chipset details. Earlier today, their Weibo feed was updated with a couple of technological predictions. The announced smartphone chip's "SM8850" identifier was disclosed once again, along with the repeated claim that Qualcomm has selected a 3 nm "N3P" node process. Industry watchdogs expect to see the San Diego-headquartered fabless semiconductor designer introduce its next-generation flagship smartphone SoC in October. The current-gen Snapdragon 8 Elite platform was unveiled last Fall; sporting cutting-edge "Oryon" (aka Phoenix) processor cores and an integrated Adreno 830 graphics solution. DCS reckons that the natural successor will reuse a familiar "2 + 6" core configuration; comprised of two prime "big performance" units, and six "normal" performance-tuned units. An Adreno 840 iGPU was listed as DCS's final point of conjecture.

The incoming "Snapdragon 8 Elite Gen 2" chipset was mentioned in the same sentence as rumored "Pegasus" cores (Phoenix's sequel)—slightly far-fetched rumors from 2024 suggested Qualcomm's upgraded processor architecture being tested at maximum frequencies of 5.0 GHz (on performance cores). As pointed out by Wccftech, Gen 1's performance cores run at 4.47 GHz (by default). In today's follow-up post, DCS claimed that Qualcomm's: "self-developed CPU architecture is now in the second generation, with a performance setting of over 380 W+." Industry watchdogs reckon that the "Snapdragon 8 Elite 2" chip will be capable of recording 3.8+ million point tallies in AnTuTu V10 gauntlets, thanks to the alleged utilization of ArmV9 architecture. DCS theorized that the speculated "SM8850" SoC will support ARM's Scalable Matrix Extension 1 (SME 1) and Scalable Vector Extension 2 (SVE2) instruction sets.

Intel GPU enthusiasts have been waiting patiently for news regarding higher-end models; ever since the launches of wallet-friendly Arc Xe2 "Battlemage" B580 and B570 graphics cards. As the cliché goes; recent silence has been deafening—we last heard about a speculative expanded lineup of B-series SKUs around late January. At the time, three mysterious "Battlemage" PCI identifiers turned up online; courtesy of Tomasz Gawroński's detective work. Opinions were split about the exact nature of these leaked "BMG" IDs; one camp envisioned Team Blue having professional variants of their existing B580 in the pipeline—presumably with generously specced pools of 24 GB VRAM onboard. A more optimistic group posited that Intel's Arc Xe2 desktop gaming family would welcome more potent "B750, B770," and (maybe) "B780" SKUs.

Yesterday, Tomasz Gawroński (aka GawroskiT) interacted with another notable source of inside track information: Jaykihn (jaykihn0). Plenty of Team Blue-related "scoops" have emerged via Jaykihn's social media channel; mostly predictions regarding upcoming desktop, mobile and enterprise CPUs. Their latest leak indicates Intel's alleged abandoning of a high-end/larger "BMG-G31" GPU die in 2024; within the third quarter of that year. Insiders have long insisted that the Arc Xe2 "Battlemage" project navigated choppy waters during development; hence the appearance of endless theories about the whole caboodle being called off. Jaykihn clarified that he believes that a "retail" launch of "BMG-G31" dGPUs will no longer take place. Many watchdogs will assume that a gap will be filled by forthcoming Arc Xe3 "Celestial" discrete GPUs. Jaykihn stated that they have no fresh insights into how that project is going.

Shipping manifests have served as fairly reliable sources of pre-launch information—Everest (aka Olrak29) has discovered many juicy details in recent times. Their latest sleuthing session—combing through NBD documents—has indicated AMD's (alleged) prepping of a larger socket design for next-generation mobile processors. A leaked document alludes to the existence of various "MEDUSA01" jig and block "FP10" socket validation parts. Current-generation Ryzen AI "Strix Point" 300 series APUs utilize the FP8 socket format. Based on the "MEDUSA01" shipping manifest, it seems that a successor will arrive with a larger footprint—measurements of 25 mm x 42.5 mm are repeated throughout the leaked description list. Industry watchdogs surmise that "Medusa Point's" BGA FP10 socket will be approximately 6% larger than its predecessor.

Mid-way through last month, insider theorizations pointed to "Medusa Point" being a chiplet-based design. A "single 12-core Zen 6 CCD" was linked to a TSMC 3 nm-class node, with "N4P" reportedly selected for a separate mobile client I/O die. Readily available 4 nm Ryzen AI "Strix Point" processors are monolithic in nature. Initial inside track info mentioned RDNA 4 technology in the same equation as "Medusa Point," but recent Team Red's recent-ish targeting of "GFX1153" places RDNA 3.5 as the de facto choice.

The status of Intel "Meteor Lake-S" (MTL-S) desktop processors was the subject of much speculation throughout 2023—by September of that year, Team Blue leadership projected an upcoming launch in 2024. Technically, Meteor Lake was deployed to "sort-of desktops" platforms—albeit in mini-PCs that utilized Core Ultra mobile chips. Industry moles insisted that Intel was still actively engaged in production of MTL-S samples in late 2023. According to a recent ITHome report, those insider tales turned out to be legitimate. On Monday (March 24), the online publication revealed the existence of a mysterious "Q46W" engineering sample—courtesy of Kyoka (a trusted source). A CPU-Z diagnostic revealed the unannounced CPU's turboboost capability reaching 4.5 GHz, while base frequency sat at the 2.8 GHz mark.

According to ITHome's investigative piece, Team Blue: "tested a very special desktop processor: it uses the Meteor Lake architecture, has 6 performance cores and 8 energy efficiency cores (6P+8E), but the performance cores (P-cores) do not support Hyper-Threading. The production date of the product in hand is the 51st week of 2023, which is obviously later than the time when Meteor Lake-S was reported to be cancelled for external sales. From this situation, 'Q46W' may be a development test processor for FCLGA1851 platform or the 800 series chipset. Kyoka believes that the processor should be in the ES2 stage." A Xianyu seller—tbNick_3u8k4—is reportedly offloading a surprising quantity of "Intel Confidential Q46W" processors, allegedly manufactured back in early 2024. Photos show tray-mounted units available for sale on Taobao's second hand market platform. tbNick_3u8k4 mentions that this particular batch of Q46W chips "requires a special motherboard to light up," suggesting that readily available Intel 800 Series chipset-based models are not fit for purpose.

Square Enix's long-running Front Mission franchise was set to expand with an all-new entry—Front Mission 2089: Borderscape—first revealed back in April 2022. The Japanese multinational publisher announced BlackJack Studio as their chosen development partner on this fledgling project, destined for launch on mobile platforms (Android and iOS). Months later, this collaboration was terminated. Video game news outlets have picked up on a new-ish lawsuit; filed on March 13 in a Seattle, Washington court. Contained information indicates that Square Enix ended a licensing agreement and canceled development in October 2022. The 26-page legal document alleges that HK Ten Tree Limited (aka BlackJack Studio) had produced a "Front Mission-style" game that reuses assets from the shelved "2089: Borderscape" title.

BlackJack's Mecharashi IP is advertised on Steam as a: "mecha-themed tactical turn-based game. The game adopts a Front Mission-style combat system, where you can assemble mechas however you want, equip a wide selection of weapons, and choose your favorite pilots to engage in battle." According to the latest reports, Mecharashi/Metal Storm has already launched in China and Japan—a Western release is "coming soon." Square Enix seems intent on preventing the game from reaching a wider audience. According to Polygon, the Japanese video game giant has: "sent multiple DMCA takedown notices to get the game removed from storefronts; it was removed from Steam, but is back after a counter-claim was submitted. Square Enix said it also filed a lawsuit in Japanese court." Additionally, Square is seeking "maximum statutory damages of $150,000 for each copyright infringed." The Front Mission IP lives on in the shape of remakes—under license, Forever Entertainment S. A. developed and published Front Mission 1st: Remake (2022). Front Mission 2: Remake arrived roughly a year later, with Storm Trident S.A. taking care of development duties. Front Mission 3: Remake was unveiled last year at the Tokyo Game Show 2024.

Microsoft launched its Majorana 1 chip—the world's first quantum processor powered by a Topological Core architecture—last month. The company's debuting of its Majorana design was celebrated as a significant milestone—in 2023, an ambitious roadmap was published by Microsoft's research department. At the time, a tall Majorana particle-based task was set: the building of a proprietary quantum supercomputer within a decade. Returning to the present day; outside parties have criticized Microsoft's February announcements. The Register published an investigative piece earlier today, based on quotes from key players specializing in the field of Quantum studies. Many propose a theoretical existence of Majorana particles, while Microsoft R&D employees have claimed detection and utilization. The Register referred back to recent history: "(Microsoft) made big claims about Majorana particles before, but it didn't end well: in 2021 Redmond's researchers retracted a 2018 paper in which they claimed to have detected the particles."

As pointed out by Microsoft researcher Chetan Nayak; their latest paper was actually authored last March 2024, but only made public in recent weeks. Further details of progress are expected next week, at the American Physical Society (APS) 2025 Joint March Meeting. The Register has compiled quotes from vocal critics; starting with Henry Legg—a lecturer in theoretical physics at the University of St Andrews, Scotland. The noted scholar believes—as divulged in a scientific online comment—that Microsoft's claimed Quantum breakthrough: "is not reliable and must be revisited." Similarly, collaborators from Germany's Forschungszentrum Jülich institute and the University of Pittsburgh, USA released a joint video statement. (Respectively) Experimental physicist Vincent Mourik and by Professor Sergey Frolov outlined: "distractions caused by unreliable scientific claims from Microsoft Quantum."

According to a Reuters technology report, Meta's engineering department is engaged in the testing of their "first in-house chip for training artificial intelligence systems." Two inside sources have declared this significant development milestone; involving a small-scale deployment of early samples. The owner of Facebook could ramp up production, upon initial batches passing muster. Despite a recent-ish showcasing of an open-architecture NVIDIA "Blackwell" GB200 system for enterprise, Meta leadership is reported to be pursuing proprietary solutions. Multiple big players—in the field of artificial intelligence—are attempting to breakaway from a total reliance on Team Green. Last month, press outlets concentrated on OpenAI's alleged finalization of an in-house design, with rumored involvement coming from Broadcom and TSMC.

One of the Reuters industry moles believes that Meta has signed up with TSMC—supposedly, the Taiwanese foundry was responsible for the production of test batches. Tom's Hardware reckons that Meta and Broadcom were working together with the tape out of the social media giant's "first AI training accelerator." Development of the company's "Meta Training and Inference Accelerator" (MTIA) series has stretched back a couple of years—according to Reuters, this multi-part project: "had a wobbly start for years, and at one point scrapped a chip at a similar phase of development...Meta last year, started using an MTIA chip to perform inference, or the process involved in running an AI system as users interact with it, for the recommendation systems that determine which content shows up on Facebook and Instagram news feeds." Leadership is reportedly aiming to get custom silicon solutions up and running for AI training by next year. Past examples of MTIA hardware were deployed with open-source RISC-V cores (for inference tasks), but is not clear whether this architecture will form the basis of Meta's latest AI chip design.

An alleged AMD Radeon RX 9070 XT graphics card has posted an overall score of 7931 points in a Furmark v2.5 OpenGL test session. Earlier today, Tomasz Gawroński shared a hastily prepared screenshot, accompanied by his observations: "I found an AMD (RDNA 4) Radeon RX 9070 XT GPU and Ryzen 9 9950X3D CPU with hacked drivers. Device ID (1002-7550) matches the recently leaked Geekbench entry. There are multiple benches with 9950X3D on Furmark. Scores are impressive: 41-48% higher than Radeon 7800 XT." VideoCardz believes that the Furmark leak points to the true potential of Team Red's upcoming Navi 48-based graphics cards. Recent Geekbench results—reportedly produced by Radeon RX 9070 XT and 9070 (non-XT) pre-release samples—have indicated underwhelming performance; closer to previous-gen mid-range levels.

The "hacked" Radeon RX 9070 XT sample's Furmark tally—of 7931—places it higher than previously perceived; when compared to Team Red's middle-to-high range portfolio of RDNA 3 offerings. VideoCardz posited that the leaked candidate's score: "puts it almost at the Radeon RX 7900 XTX's level, faster than the Radeon RX 7900 XT, RX 7900 GRE, and over 50% higher than the 7800 XT. Based on rumors we heard this week, AMD is said to be claiming over ~40% higher performance at 4K (games) than the 7900 GRE, so this would be in line with these claims."

Apple's unannounced M4 MacBook Air family is likely reaching market availability status at some point next month. Last December, slimline notebook enthusiasts started hearing about an updated lineup; macOS's Sequoia 15.2 update reportedly referenced upcoming MacBook Air M4 13-inch and 15-inch models. An early sample unit—named "Mac16,12"—has participated in a Geekbench 6.4.0 (macOS AArch64) gauntlet; results appeared online yesterday. The alleged "MacBook Air 13" candidate posted an overall Metal score of 54,806, and an overall OpenCL tally of 36,305. The two separate Geekbench Browser entries confirm that the sampled device makes use of a 10-core M4 processor, with Cluster 1 containing four performance cores. Cluster 2 consists of six power efficiency-oriented cores. Base frequency is listed at 4.41 GHz; reportedly the highest recorded for an M4 SoC. Said chip accessed 24 GB of unified memory, during its macOS 15.2 (Build 24C2101)-based test session.

Notebookcheck and Wccftech compared the aforementioned data points with slightly older M4-equipped hardware, including a premium model. Both outlets observed a "measly" five percent performance difference. Elaborating on their findings, Notebookcheck stated: "as always, we would recommend taking early benchmark results with a healthy amount of skepticism for the time being. With that being said, the MacBook Air 13 benchmarked falls about 5% short of the median Geekbench OpenCL and Geekbench Metal results we achieved so far when benchmarking the M4 versions of Apple's Mac Mini and MacBook Pro 14." The rumored next-gen MacBook Air is expected to operate with a fan-less cooling system—press outlets reckon that the MacBook Pro's air-cooled operation puts it at a slight advantage (in benchmarks).

Over the past three weeks, press outlets and the buying public have levelled heavy criticism at NVIDIA board partners. The launches of three GeForce RTX 50-series "Blackwell" GPUs have—so far—been problematic; based on news reports and community feedback. Prior to release (on February 20), VideoCardz anticipated major price fluctuations for an all-custom portfolio of GeForce RTX 5070 Ti graphics cards. The publication did not hold back with its targeting of ASUS; one of Team Green's big time AIBs. Only a small selection of baseline MSRP ($749) conformant models were available on day one, and VideoCardz posited that manufacturers would implement price hikes soon after launch. A follow-up report continues their investigation into a lack of baseline MSRP options, as well as so-called "fake promotions."

VideoCardz repeated its belief that ASUS will jack-up the asking price for its PRIME GeForce RTX 5070 Ti model. When looking at Newegg's listing of baseline MSRP cards, the intrepid investigator stumbled up another notable absence: "we wrote three articles about the ASUS RTX 5070 Ti PRIME model not being listed as an MSRP card by retailers, which finally led ASUS to intervene (most likely for a limited time) to sell this card at the promised price. What we can immediately notice is the lack of the VENTUS 3X model from MSI, which was basically 90% of the MSRP card review coverage yesterday, as NVIDIA had no Founders Edition card for this launch and relied on board partners. In fact, the VENTUS 3X non-OC is not even included in the official launch, meaning that the card you saw yesterday in reviews is simply not available anywhere." It should be noted that TechPowerUp received an MSI GeForce RTX 5070 Ti Ventus 3X OC sample unit for evaluation purposes (review guide pricing was $749); Newegg lists this particular model with a current $829.99 price point, but stock is unavailable (at the time of writing).

The late 2024 news cycle suggested that Samsung's semiconductor business was going through tough times. Alleged yield problems—affecting the 3 nm Gate-All-Around (GAA) process—were highlighted last November. Fast-forward to January 2025; the South Korean megacorp has launched its cutting-edge Galaxy S25 smartphone series. The entire lineup of newly unveiled flagship smartphones contains Qualcomm's Snapdragon 8 Elite mobile chipsets; the Southern Californian chip designer is reportedly pulling in a tidy sum from this partnership. Fresh reports from South Korean news outlets indicate that Samsung System LSI employees have received an "encouraging" email from their boss, regarding current production predicaments.

Businesskorea and Sedaily reports include quotes extracted from the (apparently) leaked internal memo. LSI division president, Park Yong-in, reportedly stated: "we are currently in a situation where we have to develop two flagship products at the same time." Both articles allege that Samsung's semiconductor teams are expected to "cultivate roots and withstand storms." Industry watchdogs believe that the aforementioned "flagship products" are the Exynos 2500 mobile chipset, and Samsung Electronic's next-gen Galaxy S26 smartphone family. Earlier this month, we heard whispers about the much-delayed in-house chip design being readied (with a 2 nm process) for a possible late 2025 launch, inside unannounced Galaxy Z Flip 7 and Fold 7 devices. Park disclosed anticipated incoming obstacles in 2025: "last year's business division profit was higher than expected, but this was a temporary phenomenon...Looking at the entire business division, there will be monthly surpluses and deficits." Last month, inside sources proposed the notion that foundry investments were slashed in half.

GeForce RTX 5070 Ti graphics cards are due to hit international markets this Thursday (February 20), only in custom design form. NVIDIA will not be rolling out a Founders Edition model for this mid-to-high GPU product tier. Yesterday, an NDA-busting leak emerged online; hinting at a mixed bag of synthetic benchmark scores. When compared to new-gen and past-gen siblings, the incoming GB203 GPU-based family's "price-to-performance ratio" was greeted with plenty of online community skepticism. Considering that only a minority of AIB companies are reportedly engaged in the supply of cheaper offerings, the early outlook for overall GeForce RTX 5070 Ti launch pricing is generating further dissatisfaction. Team Green's first wave of "Blackwell" gaming GPUs launched late last month, straight into chaotic market conditions.

At CES 2025, NVIDIA set a baseline MSRP of $749. Fresh reports suggest that hardware review outlets will be delivering comprehensive verdicts tomorrow. VideoCardz believes that the lifted review embargo will be "exclusively for MSRP cards," based on information gleaned from their network of press contacts. The GPU specialist publication has kept tabs on fluctuating GeForce RTX 50-series prices for a while—several recent reports have levelled criticism at prominent Team Green board partners; namely ASUS and MSI. Plenty of venom was directed at the former, due to last month's launch of the: "GeForce RTX 5080 PRIME non-OC model at MSRP, and it was covered in the first reviews...Except, it was increased by 26% the following week. This way, ASUS has cheated the system and got both the early coverage and was still able to sell cards at a higher price." VideoCardz predicts a similar pattern for this week's release of custom GeForce RTX 5070 Ti designs, in particular ASUS PRIME and TUF Gaming SKUs. Their latest report directed additional ire toward the source of all things Blackwell: "unless NVIDIA has no problem with this, this is not how MSRP cards should be announced. It is very misleading for customers and puts reviewers in a very bad light. Their conclusions might be completely different if the card is said to cost much more."

Retailers are set to open up pre-order floodgates for upcoming GeForce RTX 50-series laptops on February 25, as we learned earlier this week. According to a new DigiTimes report, the launch of mobile devices—sporting Team Green "Blackwell" GPUs—is expected to be "significantly delayed." A loose March launch window was teased during Jensen Huang's keynote presentation at CES 2025, but supply chain insiders have claimed that high-end RTX 50 laptops were "originally planned to be launched in January 2025." Additionally, they surmise that mid-range and low-end offerings are postponed to April. DigiTimes believes that the rumored postponements have surprised supply chain moles; Team Green is not known to delay product launches. Extenuating circumstances are cited as the reason behind alleged deferred release windows, but insiders have not yet determined the extent of lengthened launch parameters.

An anonymous source stated: "NVIDIA, which has never been late in the past, also encountered this situation. It is probably related to NVIDIA's full sprint to AI servers. Even though there are differences in server and PC chip design and manufacturing processes, the company's resource allocation may still affect the debugging efficiency of new products." Other insiders have murmured about GeForce RTX 50-series mobile GPU performance not meeting expectations. Rumors have swirled about problems with early sample units; most notably the encountering of major screen issues when the "hardware is turned on." Laptop/notebook supply chain insiders reckon that manufacturers have anticipated a healthy level of growth in 2025—thanks to the emergence of new NVIDIA graphics cards—but targets have been reduced, due to anticipated delays. Optimistic industry chatter predicts higher education students and esport enthusiasts driving unit sales upward, following a stagnant 2024 market.

AMD's Radeon RX 9070 GPU series is due for release next month; a specific date has not been set, but we will likely find out more through official channels at the end of this month. Team Red and its board partners have chosen to remain silent on the subject of RDNA 4's technical makeup; post-CES 2025, hardware news outlets have relied on a steady trickle of Radeon RX 9070 XT and RX 9070-related leaks. Very basic sleuthing pointed to pools of 16 GB VRAM for both models, while insiders kept on mentioning an unannounced "Navi 48" GPU. The latest—courtesy of HKEPC—seems to confirm that the Radeon RX 9070 XT will utilize the aforementioned new RDNA 4 Navi chip. Earlier today, a screenshot was uploaded to social media—the leaker shared graphics card information displayed in a TechPowerUp GPU-Z (v2.62) session. Despite patch notes not disclosing compatibility, the latest version of GPU-Z is seemingly able to identify key aspects of the alleged "RX 9070 XT (Navi 48)" sample.

The card's name is obscured, but HKEPC and several press outlets believe that it is the genuine article. The fundamental details appear to be: 16 GB GDDR6 VRAM (Hynix-made), a 256-bit memory bus, 4096 stream processors, and a boost clock reaching a maximum frequency of 3.1 GHz. Older leaks have indicated that the first wave of RDNA 4 cards will make do with PCI-Express 4.0 x16 interfaces, but the GPU-Z screenshot shows a PCI-Express 5.0 x16 bus interface (detection could be bugged). The driver version was identified as Adrenalin 24.30.01.05. The unnamed card appears to feature a steep factory overclock; industry experts reckon that the sample could be a very high-end AIB model. Past reports suggest that PowerColor's Radeon RX 9070 XT Red Devil card is capable of boosting up to 3060 MHz. HKEPC uploaded another incriminating screenshot; showcasing performance results produced by Capcom's Monster Hunter Wilds PC performance benchmark tool. The test system—featuring Intel's Core Ultra 9 285K CPU and 48 GB of RAM—scored 36102 points and achieved a maximum frame rate of 211.71 FPS at 1080p, with "Very High" profile settings. The leaker confirmed that FSR and Frame Generation were enabled during the benchmark session.

Unannounced Intel processor families have emerged online over the past week—one source, Jaykihn, has unearthed a treasure trove of speculative mobile SKUs. Today's discovery pushes into the enterprise market segment; focusing on Team Blue's "Granite Rapids-W" (GNR-W) platform, likely equipped with Redwood Cove cores. The latest leak suggests an upcoming emergence of "Mainstream" and "Expert" workstation-oriented product tiers, allegedly prepared with the company's rumored W890 motherboard chipset. Past generations of "Xeon W" HEDT processor families have rolled out with entry-level and high-end offerings.

The leaker reckons that the mainstream Intel Granite Rapids-W "Xeon W" lineup will arrive with 4-channel memory support and 80 PCIe Gen 5 Lanes. Team Blue's higher-end "Expert" tier is anticipated with 128 PCIe Gen 5 lanes and 8-channel memory support. In addition to leaking processor information, Jaykihn outlined basic details regarding the W890 chipset—they believe that board designs will have access to 24 PCIe Gen 4 lanes, as well as 8 Gen 4 lanes for Intel's proprietary link (DMI) between northbridge and southbridge. The leaker did not divulge details of upcoming socket types—Team Blue is notorious for its elaborate rollout out of multiple LGA platforms.

Going back a year, we started hearing about an OpenAI proprietary AI chip project—this (allegedly) highly ambitious endeavor included grand plans for a dedicated fabrication network. TSMC was reportedly in the equation, but indirectly laughed at the AI research organization's ardent requests. Fast-forward to the present day; OpenAI appears to be actively pursuing a proprietary GPU design through traditional means. A Reuters exclusive report points to 2025 being an important year for the company's aforementioned "in-house" AI chip—the publication believes that OpenAI's debut silicon design has reached the finalization stage. Insiders have divulged that the project is only months away from being submitted to TSMC for "taping out." The foundry's advanced 3-nanometer process technology is reported to be on the cards. A Reuters source reckons that the unnamed chip features: "a commonly used systolic array architecture with high-bandwidth memory (HBM)...and extensive networking capabilities."

Broadcom is reportedly assisting with the development of OpenAI's in-house design—we heard about rumored negotiations taking place last summer. Jim Keller's tempting offer—of creating an AI chip for less than $1 trillion—was ignored early last year; OpenAI has instead assembled its own internal team of industry veterans. The October 2024 news cycle posited that former Google TPU engineers were drafted in as team leaders, with a targeted mass production window scheduled for 2026. The latest Reuters news article reiterates this projected timeframe, albeit dependent on the initial tape going "smoothly." OpenAI's chip department has grown to around forty individuals with recent months, according to industry moles—a small number relative to the headcounts at "Google or Amazon's AI chip program."

Bloomberg's Mark Gurman believes that Apple's headset design department has cancelled a long-gestating project. Development of the company's augmented reality (AR) smart glasses—allegedly codenamed "N107"—ceased not long ago, according to the journalist's insider network. At first, Apple's augmented reality engineering team supposedly envisioned the (regular/normal-sized) glasses being powered via a direct connection to a wearer's iPhone. Gurman reckons that the smartphone-connected system was a mega-drainer of batteries, due to the onboard chipset being a bit of a power hog. Apple proceeded to experiment with a glasses-linked up-to-Mac concept—reportedly, company leadership canceled the project after rejecting the inelegant personal computer-powered solution.

Apple's AR smart glasses could have competed with a similar next-gen offering, upon a rumored 2027 launch—Meta's "Orion" solution is still in a concept phase. Leaked feature set information indicates functionality akin to Xreal's One AR series, albeit with a required connection to a compatible Mac computer. The Apple headset department has struggled (allegedly) with the development of various concepts—going far back as 2017, according to several of Gurman's reports. Two years ago, he heard whispers about the AR/VR team labelling their N107 project as a "hopeless" prospect. By Mid-2024, industry leaks indicated an end of development for the "expensive Vision Pro 2" mixed reality headset.