NVIDIA and AMD have launched an acceleration of their next-generation GPU production and shipping schedules, racing to beat impending Trump administration tariffs that could inflate prices by up to 60%. The companies are prioritizing delivery to US warehouses before January 20, when the new trade measures are supposed to take effect. This aggressive timeline represents a significant departure from traditional GPU rollout strategies, which typically maintain controlled production rates during initial manufacturing phases. The urgent push aims to protect both consumer prices and profit margins, with manufacturers breaking from their usual conservative supply approach to ensure maximum inventory reaches American shores before the tariff deadline. NVIDIA is boosting shipments of its next-gen GeForce RTX 50 series, while AMD is busy with Radeon RX 9000 series.

The impact of these tariffs could reshape the GPU market prices, with flagship products like NVIDIA's GeForce RTX 5090 potentially seeing price increases from the rumored $1,799 to approximately $2,500. Following similar moves by Microsoft, Dell, and HP, this strategic rush to beat tariff implementation shows the technology sector's response to evolving trade policies. These price hikes could trigger a surge in the secondary GPU market as consumers seek more affordable options. While manufacturers work to shield customers from immediate price impacts through pre-tariff stockpiling, the long-term outlook for GPU pricing and availability remains uncertain as the industry adapts to these new trade dynamics. Increasing the prices dramatically will result in a rapid fall in demand, so the supply chain is working overtime to assess and address the potential tariff issue.

Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, matching non-X3D variants. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. Early leaks indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.

AMD's upcoming Radeon RX 9070 XT graphics card can boost its engine clock up to 3.10 GHz, a new leak that surfaced on ChipHell says. Depending on the board design, its total board power can reach up to 330 W, the leak adds. The GPU should come with a very high base frequency for the engine clock, with the leaker claiming a 2.80 GHz base frequency (can be interpreted as Game clocks), with the GPU boosting itself up to 3.10 GHz when the power and thermals permit. The RX 9070 XT will be the fastest graphics card from AMD to be based on its next-generation RDNA 4 graphics architecture. The company isn't targeting the enthusiast segment with this card, but rather the performance segment, where it is expected to go up against NVIDIA's GeForce RTX 5070 series.

RDNA 4 is expected to introduce massive generational gains in ray tracing performance, as AMD is rumored to have significantly developed its ray tracing hardware, to reduce the performance cost of ray tracing. However, as it stands, the "Navi 48" silicon that the RX 9070 XT is based on, is still a performance-segment chip, which succeeds the "Navi 32" and "Navi 22," with a rumored compute unit count of 64, or 4,096 stream processors. Performance-related rumors swing wildly. One set of rumors say that the card's raster graphics performance is in league of the RX 7900 GRE but with ray tracing performance exceeding that of the RX 7900 XTX; while another set of rumors say it beats the RX 7900 XT in raster performance, and sneaks up on the RTX 4080. We'll know for sure in about a month's time.

Here are some of the first pictures of ASRock's upcoming Live Mixer series motherboards based on mid-range chipsets from AMD and Intel. The Live Mixer brand of motherboards has a similar positioning in ASRock's product stack as Steel Legend, but with a variation in product design, and a mid-range onboard audio solution that uses audio codecs such as the ALC1200 or ALC4080. There's nothing that particularly stands out in this audio solution (no fancy amp circuits or exotic I/O). The B850 Live Mixer Wi-Fi is an ATX board based on the AMD B850 chipset. This is essentially a re-brand of the popular B650, but with out-of-the-box support for the latest Ryzen 9000 series processors, including the 9000X3D series. The board offers three M.2 NVMe slots, one of which is Gen 5, and the others Gen 4. The WLAN solution is very likely Wi-Fi 6E.

Next up, is the ASRock B860 Live Mixer Wi-Fi. This Socket LGA1851 motherboard is based on Intel's mid-range chipset for its "Arrow Lake" processors, the Intel B860. Much like the previous generation B760, it is expected to lack CPU overclocking support. This board visually looks a lot similar to its AMD B850-based sibling, you could almost confuse the two if you're not looking at the CPU socket. You get three M.2 NVMe slots here, too; one of which is Gen 5, and doesn't eat into the x16 PEG slot. We expect this board to offer Wi-Fi 6E, just like the B850 Live Mixer Wi-Fi. Lastly, there's the B860M Live Mixer Wi-Fi, a Micro-ATX variant of this board, with mostly the same feature-set, it's just that the third M.2 slot is without a heatsink; and the second PCIe slot is physically x8 instead of x16, which shouldn't matter since the slot is likely electrical x4 on both motherboard models. Intel and AMD are expected to debut the B850 and B860 in January.

Recent benchmark leaks have revealed that AMD's upcoming Radeon RX 9070 XT graphics card may not deliver the groundbreaking performance initially hoped for by enthusiasts. According to leaked 3DMark Time Spy results shared by hardware leaker @All_The_Watts, the RDNA 4-based GPU achieved a graphics score of 22,894 points. The benchmark results indicate that the RX 9070 XT performs only marginally better than AMD's current RX 7900 GRE, showing a mere 2% improvement. It falls significantly behind the RX 7900 XT, which maintains almost a 17% performance advantage over the new card. These findings contradict earlier speculation that suggested the RX 9070 XT would compete directly with NVIDIA's RTX 4080.

However, synthetic benchmarks tell only part of the story. The GPU's real-world gaming performance remains to be seen, and rumors indicate that the RX 9070 XT may offer significantly improved ray tracing capabilities compared to its RX 7000 series predecessors. This could be crucial for market competitiveness, particularly given the strong ray tracing performance of NVIDIA's RTX 40 and the upcoming RTX 50 series cards. The success of the RX 9070 XT depends on how well it can differentiate itself through features like ray tracing while maintaining an attractive price-to-performance ratio in an increasingly competitive GPU market. We expect these scores not to be the final tale in the AMD RDNA 4 story, as we must wait and see what AMD delivers during CES. Third-party reviews and benchmarks will give the final verdict in the RDNA 4 market launch.

AMD's client computing division is expected to have an action-packed 2025 International CES. On the CPU front, the company is expected to expand its Ryzen 9000X3D family with high-core count models, such as the Ryzen 9 9950X3D and Ryzen 9 9900X3D. It is also expected to introduce certain power-efficient 65 W models of its non-X3D Ryzen 9000 series "Zen 5" chips, which serve as value options within this processor generation, to try and lure buyers off the 65 W Intel Core Ultra "Arrow Lake-S" models. On the gaming graphics side, the company is expected to debut its Radeon RX 9000 series, led by the RX 9070 XT and RX 9070, both of which are based on the "Navi 48" silicon, and powered by the RDNA 4 graphics architecture.

That's not all, AMD is also expected to announce the new FSR 4 technology for gamers. Leaks describe FSR 4 as being a performance enhancement that's a generation ahead of FSR 3.x. While FSR 3.x combines super-resolution based performance enhancement, and algorithmic frame-generation that nearly doubles framerates; FSR 4 is expected to be AMD's first performance enhancement to incorporate AI to not just enhance the visual detail in super-resolution, but also to improve accuracy of frame-generation. At this point, it is not known if FSR 4 will be available as a feature at launch of the Radeon RX 9070 series. VideoCardz reports that the early-January announcements could be followed by late-January availability of the hardware.

The battle of AI acceleration in the data center is, as most readers are aware, insanely competitive, with NVIDIA offering a top-tier software stack. However, AMD has tried in recent years to capture a part of the revenue that hyperscalers and OEMs are willing to spend with its Instinct MI300X accelerator lineup for AI and HPC. Despite having decent hardware, the company is not close to bridging the gap software-wise with its competitor, NVIDIA. According to the latest report from SemiAnalysis, a research and consultancy firm, they have run a five-month experiment using Instinct MI300X for training and benchmark runs. And the findings were surprising: even with better hardware, AMD's software stack, including ROCm, has massively degraded AMD's performance.

"When comparing NVIDIA's GPUs to AMD's MI300X, we found that the potential on paper advantage of the MI300X was not realized due to a lack within AMD public release software stack and the lack of testing from AMD," noted SemiAnalysis, breaking down arguments in the report further, adding that "AMD's software experience is riddled with bugs rendering out of the box training with AMD is impossible. We were hopeful that AMD could emerge as a strong competitor to NVIDIA in training workloads, but, as of today, this is unfortunately not the case. The CUDA moat has yet to be crossed by AMD due to AMD's weaker-than-expected software Quality Assurance (QA) culture and its challenging out-of-the-box experience."

The AMD Ryzen 7 9800X3D launched this November remains the fastest processor for PC gaming, but with just an 8-core/16-thread configuration, its performance in multithreaded productivity pales in comparison to the alternatives, including from AMD's own camp, such as the Ryzen 9 7950X3D. The company is planning to expand the Zen 5 X3D line of desktop processors in Q1-2025, with the introduction of its high core-count Ryzen 9 series SKUs, the Ryzen 9 9950X3D, and the Ryzen 9 9900X3D. HXL, a reliable source with hardware leaks, says that the Ryzen 9 X3D SKUs will lack the kind of "frequency debuff" we've seen with the older generation Ryzen 9 X3D chips such as the 7950X3D and 7900X3D.

On the 7950X3D, only one of the two 8-core CCDs comes with 3D V-Cache, the other is a regular CCD with 32 MB on-die L3 cache. The CCD with the 3D V-Cache has its frequency "debuffed" compared to the other CCD, mainly to deal with the thermal limitations of the way the 3D V-Cache is stacked on top of the CCD. With the Ryzen 9000 X3D generation, AMD has redesigned this CCD + L3D stacking such that the CCD is now above, directly interfacing with the STIM and IHS; with no conductive structural silicon along the way. This means that the CCD now thermally behaves like a regular Zen 5 CCD; and for this reason, not only will the CCD with 3D V-Cache on the 9950X3D/9900X3D have the same clock speeds and boosting behavior as the one without 3D V-Cache; but also the 9950X3D and 9900X3D are expected to ship with similar, if not identical clock speeds to the 9950X and 9900X.

AMD's interim RDNA 3.5 architecture will power the Radeon RX 8000 series integrated graphics in "Strix Halo" mobile processors, while the more advanced RDNA 4 architecture is reserved for the higher-tier Radeon RX 9000 series of discrete graphics, according to @9550pro on X. We previously believed that AMD's Ryzen AI MAX 300 Strix Halo processors would carry an iGPU with Radeon 8000S branding. However, at the same time, we expected the Radeon RX 8000 series of desktop GPUs to have a similar branding while being powered by RDNA 4. The new Radeon naming scheme is now transparent, thanks to the latest leaks of the naming schemes and early glimpses of reference design.

The RDNA 4-based RX 9000 series will be powered by the Radeon RX 9070 XT, built on the Navi 48 silicon. This GPU represents AMD's new focus on the high-volume midrange performance segment rather than competing in the ultra-enthusiast high-end space. The architecture promises enhanced SIMD IPC performance and a specialized ray tracing solution that significantly reduces performance overhead compared to current offerings. According to All The Watts, the RX 9000 lineup is expected to include various SKUs across different performance tiers, including the RX 9060, 9050, and 9040 series. Meanwhile, the RDNA 3.5-powered RX 8000 series will serve as a refined iteration of the current RDNA 3 generation. Still, they will be exclusive to AMD's mobile segment in the form of iGPU, integrated inside Strix Halo APU. Both RDNA 4 GPUs and RDNA 3.5-based APUs are scheduled for the CES 2025 event unveiling in January.

It turns out that the Radeon RX 8800 XT, the top SKU in AMD's next generation gaming GPU series, is actually named the Radeon RX 9070 XT. European computer hardware retailer may have leaked the name, along with that of the Radeon RX 9070 (non-XT), ahead of its January 2025 reveal. The two cards appeared in the store's search filters, where it was screengrabbed by enthusiasts. The RX 9070 XT is what was supposed to be the RX 8800 XT; while the RX 9070 is the RX 8800. Extrapolating this, the series could include the RX 9060 series, the RX 9050 series, and the RX 9040 series, says All The Watts.

What prompted this change in nomenclature probably has to do with the company's decision to withdraw from the enthusiast segment of gaming GPUs. While the RX 9070 XT technically succeeds the RX 7800 XT, a performance-segment, 1440p-class SKU, the company wouldn't want its product stack to have a "void" left by the lack of an "RX 8900 series." The company also took the opportunity to skip the RX 8000 series altogether, which probably give it room to rebadge some SKUs from the RX 7000 series over to the RX 8000 series. The RX 9070 XT and RX 9070 are based on the "Navi 48" silicon, and implement the RDNA 4 graphics architecture.

These are possibly the first pictures of the reference-design AMD Radeon RX 8800 XT graphics card. The pics surfaced on Reddit by a user who claimed to have access to an investor presentation that features images of the card placed next to an AMD Ryzen 9 PIB retail box. The card's design looks quite similar to MSI's Ventus 3X—a silver baseplate frames inlets to a triple fan setup, which cools a heatsink underneath. This is a fairly large card, roughly the size of a reference RX 7900 XT. The dark background accent which the silver plate contrasts, features a front-facing illuminated Radeon logo. This card is designed to look better when installed in a vertical slot, than it is with a standard installation.

The Radeon RX 8800 XT is expected to be the fastest SKU available from the generation, as AMD has ceded the enthusiast segment to focus on high-volume performance and mainstream market segments. The RX 8800 XT is based on the "Navi 48" silicon, and is powered by the RDNA 4 graphics architecture. Besides incorporating many of the graphics stack enhancements RDNA 3.5 introduced over RDNA 3, RDNA 4 is expected to improve the SIMD IPC, and come with a highly specialized ray tracing hardware solution that reduces the performance cost of ray tracing. It is also expected to implement a newer foundry node.

Update 15:43 UTC: It's likely that this card is called "Radeon RX 9070 XT," read our newer report for more.

Last week, we reported on a massive leak that gave us a glimpse at a surfeit of upcoming ROG gaming laptops from ASUS boasting Arrow Lake-HX and Strix Halo processors, along with RTX 50-series Laptop GPUs. The company has now gone ahead and officially teased its ROG Flow Z13 laptop and the ROG Strix 18 laptop, the videos for which were obtained by VideoCardz. Considering that these were just teasers, the details shared were sparse, but undoubtedly intriguing regardless.

The ROG Strix 18, will likely boast the Core Ultra 9 285HX and Core Ultra 9 275HX CPUs along with NVIDIA "Blackwell" Laptop GPUs, with up to an 175-watt RTX 5090 Laptop with 16 GB of GDDR7 VRAM. Multiple other GPU options will also be available, with the RTX 5070 Ti Laptop GPU being the entry-point as per the leaked listings. Clearly, the Strix 18 is poised to be a powerful and power-hungry desktop replacement-class laptop, along with a massive 18-inch mini LED screen with a speedy 240 Hz refresh rate. Needless to say, the G18 has no intention of being affordable.

Intel has announced it will not proceed with X86S, an experimental instruction set architecture that aims to simplify its processor design by removing legacy support for older 32-bit and 16-bit operating modes. The decision comes after gathering feedback from the technology ecosystem on a draft specification that was released for evaluation. The x86, and its 64-bit x86-64 we use today, is a giant cluster of specifications that contains so many instructions rarely anyone can say with precision how many are there. All of this stems from the era of original 8086 processor, which has its own 16-bit instructions. Later on we transitioned to 32, then 64-bit systems with all have brought their own specific instructions. Adding support for processing of vector, matrix, and other data types has increased the ISA specification so much that no one outside a few select engineers at Intel (and AMD) understands in full. From that x86S idea was born to solve the issue of supporting legacy systems and legacy code, and moving on to the x86S ISA, where "S" stands for simplified.

The X86S proposal included several notable modifications, such as eliminating support for rings 1 and 2 in the processor's protection model, removing 16-bit addressing capabilities, and discontinuing legacy interrupt controller support. These changes would have potentially reduced hardware complexity and modernized the platform's architecture. A key feature of the proposed design was a simplified boot process that would have allowed processors to start directly in 64-bit mode, eliminating the current requirement for systems to boot through various legacy modes before reaching 64-bit operation. The architecture also promised improvements in handling modern features like 5-level paging. "Intel will continue to maintain its longstanding commitment to software compatibility," the company stated in the official document on its website, acknowledging that the x86S dream is over.

OneXPlayer has pulled back the veil on its G1 gaming notebook, and the product sure does look intriguing. Calling it a notebook might not even be fair, considering that its 8.8-inch display barely exceeds tablet territory. However, for lovers of compact gaming systems and handhelds, the G1 looks like it ticks many boxes, and its detachable keyboard is undoubtedly a welcome addition.

The system is powered by AMD's 12-core Ryzen AI 9 HX 370 "Strix Point" APU with 4 Zen 5 and 8 Zen 5c cores, along with a powerful Radeon 890M iGPU with 16 CUs based on the RDNA 3.5 architecture. The aforementioned 8.8-inch display is quite the looker as well, featuring a 2.5K resolution with a speedy 144 Hz refresh rate. At least on paper, it appears that the OneXPlayer G1 leaves very little room for complaint.

AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

According to Tweakers, AMD's Radeon RX 7900 GRE graphics card has reached end-of-life status, as confirmed by multiple AMD board partners they have contacted. The announcement comes just months after the card's expansion into European markets following its initial 2023 exclusive launch in China. Tweakers report that the supply of the RX 7900 GRE is rapidly declining across retail channels. While ASUS models remain somewhat available, the manufacturer has informed Tweakers that deliveries are currently "limited." AMD has not responded to their multiple requests for comment regarding the discontinuation. The RX 7900 GRE offers compelling specifications that position it as a slightly scaled-down variant of the more premium RX 7900 XT.

Built on AMD's RDNA 3 architecture, the card features 80 CUs and 16 GB of GDDR6 memory and operates at a 260 W TDP. The timing of this discontinuation is particularly interesting as AMD prepares to unveil its next-generation RDNA 4-based Radeon RX 8000 series. Perhaps AMD is trying to flush out its remaining inventory to make room for its Radeon RX 8000 series GPUs, which should mainly target the middle-range of the next-generation GPU families, including competition like NVIDIA with "Blackwell" and Intel with "Battlemage." With the new card scheduled to appear during AMD's CES keynote on January 6 in Las Vegas, we have to wait and see what products AMD puts out before analyzing why AMD decided to EOL its Radeon RX 7900 GRE.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

PowerColor is planning to introduce a new line of custom-design graphics cards called "Reaper." This fits into the scheme of PowerColor's naming that include Red Devil, Red Dragon, HellHound, and Fighter. The company is planning to debut Reaper with AMD's upcoming Radeon RX 8000 series based on the RDNA 4 graphics architecture. It remains to be seen if Reaper is positioned above the flagship Red Devil series, or something lower, replacing Fighter.

Things are moving rather quickly with the AMD Radeon RX 8000 series, with the company reportedly planning to debut at least two new performance-segment SKUs along the sidelines of the 2025 CES. The two SKUs are rumored to be based on the "Navi 48" silicon, and AMD is gunning for sales volumes and market share by targeting the most bulky market segments, going after the GeForce RTX 5070 series and RTX 5060 series. The RDNA 4 graphics architecture is expected to make big strides in reducing the performance cost of ray tracing, through a more specialized ray tracing hardware setup, besides generational improvements in performance and performance-per-Watt.

In Win Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, had introduced its new AR36 (360 mm) AIO liquid cooler featuring an "infinity Mirror" design, compatible with both AMD and Intel platforms.

Infinity Mirror Block
The ARGB-infused CPU block features an infinity mirror design on the front, showcasing radiant light reflections that create an infinite, vibrant, and colorful glow from every angle. Inside, high-density microchannel fins in the copper baseplate efficiently draw heat away from even the hottest processors, minimizing the temperature delta to unlock maximum headroom for sustained thermal boost clock speeds. The pump is equipped with a three-phase, six-pole motor, ensuring consistently high performance with reduced noise during operation.

Framework, the company known for making consumer-friendly, repairable, upgradeable laptops, has officially announced the first expansion bay for the Framework 16, its AMD-powered gaming laptop. The new storage module, which slots into the Expansion Bay, has dual M.2 slots for up to 16 TB total additional storage for the Framework 16. Part of the idea behind the storage expansion seems to be turning what is essentially a gaming laptop into a capable workstation. Crucially, upgrading the storage with the expansion bay requires removing the discrete Radeon 7700s GPU, although the Framework 16 already has dual M.2 slots on the motherboard, so this expansion isn't really intended for gamers, anyway.

One of the major selling points for the Framework 16 was that it offered PCIe expansion via a modular interface, and this is Framework's first real foray into expanding that ecosystem for its largest laptop. In addition to the storage expansion, Framework also announced a new Mystery Box system for its US and Canada Outlets to offload spare parts, like returned modules and components that it doesn't want to relegate to the e-waste pile but also cannot financially justify sorting through and refurbishing. These Mystery Boxes each contain at least three items and come with a warning that reads "Note that these don't come with a warranty and are non-returnable, so only get it if you want random scrap to play with!"

At this point, it's basically taken for granted that Lenovo will be launching its cut-down Legion Go S gaming handheld at CES 2025, and a fresh leak from Evan Blass via The Verge points to another Legion Go handheld—a direct replacement for the current-generation Go—launching alongside the Go S. While the Go S will supposedly be powered by the less powerful AMD Ryzen Z2G and its Radeon 680M iGPU, the full-fat Legion Go 2 will likely use a more powerful processor and iGPU, suggesting that a Ryzen Z2 Extreme SoC is on the way.

Perhaps the most compelling thing about the new Legion Go handheld, though is that it will reportedly feature an OLED display. Despite the new display tech, though, the Legion Go 2 will supposedly have the same display size, detachable controllers, and FPS mode, although the images shared by Blass show significantly rounder controller edges, which should make the chunky handheld less cumbersome to hold. The leaks make no mention of SteamOS or a Steam button for the Legion Go 2, suggesting that it will still be a Windows-first gaming handheld, and the Legion Space button is still present on the face of the Legion Go 2 featured in the leaks.

According to a new research report from the analyst firm Jon Peddie Research, the growth of the global PC-based graphics add-in board market reached 8.1 million units in Q3'24 and desktop PC CPU shipments increased to 20.1 million units. Overall, AIBs will have a compound annual growth rate of -6.0% from 2024 to 2028 and reach an installed base of 119 million units at the end of the forecast period. Over the next five years, the penetration of AIBs in desktop PCs will be 83%.

As indicated in the following chart, AMD's overall AIB market share decreased -2.0% from last quarter, and NVIDIA's market share increased by 2.0%. These slight flips of market share in a down quarter don't mean much except to the winner. The overall market dynamics haven't changed.

• The AIB overall attach rate in desktop PCs for the quarter decreased to 141%, down -26.9% from last quarter.
• The desktop PC CPU market decreased -3.4% year to year and increased 42.2% quarter to quarter, which influenced the attach rate of AIBs.

Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital to break down the AI bottleneck of data movement with its optical I/O technology. This brings the company's total funding to $370 million and raises the company's valuation to above $1 billion.

The strength of the round and caliber of investors, including participation from AMD Ventures, Intel Capital, and NVIDIA, marks another key milestone as Ayar Labs prepares its optical solution for high volume manufacturing strategically aligned to customer roadmaps. Other new strategic and financial investors participating in the round include 3M Ventures and Autopilot. They join existing investors such as Applied Ventures LLC, Axial Partners, Boardman Bay Capital Management, GlobalFoundries, IAG Capital Partners, Lockheed Martin Ventures, Playground Global, and VentureTech Alliance.

HighPoint Technologies, a leader in advanced PCIe Switch and RAID AIC, Adapter and Storage Enclosure solutions, has announced an extensive line of M.2 and E1.S RAID AICs engineered to accommodate high-performance GPU-centric workloads. Designed for enterprise and datacenter class computing environments, HighPoint NVMe RAID AICs deliver class-leading performance and unmatched scalability, enabling modern x86/AMD and Arm platforms to support 4 to 16 NVMe SSDs via a single PCIe Gen 4 or Gen 5 x16 slot. State-of-the-art PCIe Switching Architecture and flexible RAID technology enable administrators to custom tailor M.2 and E1.S storage configurations for a broad range of data-intensive applications, and seamlessly scale or expand existing storage configurations to meet the needs of evolving workflows.

Unprecedented Storage Density
HighPoint NVMe AICs have established a new milestone for M.2 NVMe storage. HighPoint's revolutionary Dual-Width AIC architecture enables a single PCIe Gen 4 or Gen 5 x16 slot to directly host up to 16 M.2 NVMe SSDs, and 128 TB of storage capacity, at speeds up to 28 GB/s; a truly unprecedented advancement in compact, single-device storage expansion solutions. State-of-the art PCIe switching technology and advanced cooling systems maximize transfer throughput and ensure M.2 configurations operate at peak efficiency by halting the performance sapping threat of thermal throttling in its tracks.

AMD's recently launched Strix Point lineup of high-end APUs boast truly impressive performance, even when configured with lower TDPs. As time goes on, more and more hardware brands are hitting the market with Strix Point-powered devices, and unsurprisingly, Aoostar does not wish to sit on the sidelines either.

The company has teased a yet-to-be announced mini PC, with Strix Point at its heart. Powered by the powerful Ryzen AI 9 HX 370 APU, the system will likely offer excellent performance, considering that Aoostar refuses to skimp on its cooling system. Thankfully, that does seem to be case, since Aoostar claims the upcoming mini PC will boast a vapor chamber cooling setup allowing the HX 370 to run at its maximum of 54 watts. For those out of the loop, here is a rundown of the HX 370's specifications: 12-core setup with 8 Zen 5c cores and 4 Zen 5 cores, Radeon 890M iGPU based on RDNA 3+, and a 50 TOPS XDNA 2 NPU to justify the "AI" branding.