Tesla Reportedly Doubling Dojo D1 Supercomputer Chip Orders
Tesla first revealed plans for its Dojo D1 training chip back in 2021, with hopes of it powering self-driving technology in the near future. The automative division has relied mostly on NVIDIA over the ensuing years, but is seemingly keen to move onto proprietary solutions. Media reports from two years ago suggest that 5760 NVIDIA A100 GPUs were in play to develop Tesla's advanced driver-assistance system (Autopilot ADAS). Tom's Hardware believed that a $300 Million AI supercomputer cluster—comprised of roughly 10,000 NVIDIA H100 GPUs—was powered on last month. Recent reports emerging from Taiwan suggest that Tesla is doubling Dojo D1 supercomputer chip orders with TSMC.
An Economic Daily report posits that 10,000 Dojo D1 are in a production queue for the next year, with insiders believing that Tesla is quietly expressing confidence in its custom application-specific integrated circuit (ASIC). An upcoming order count could increase for the next batch (in 2025). The article hints that TSMC's "HPC-related order momentum has increased thanks to Tesla." Both organizations have not publicly commented on these developments, but insider sources have disclosed some technical details—most notably that the finalized Dojo design: "mainly uses TSMC's 7 nm family process and combines it with InFO-level system-on-wafer (SoW) advanced packaging."
An Economic Daily report posits that 10,000 Dojo D1 are in a production queue for the next year, with insiders believing that Tesla is quietly expressing confidence in its custom application-specific integrated circuit (ASIC). An upcoming order count could increase for the next batch (in 2025). The article hints that TSMC's "HPC-related order momentum has increased thanks to Tesla." Both organizations have not publicly commented on these developments, but insider sources have disclosed some technical details—most notably that the finalized Dojo design: "mainly uses TSMC's 7 nm family process and combines it with InFO-level system-on-wafer (SoW) advanced packaging."