Avicena Works with TSMC to Enable PD Arrays for LightBundle MicroLED-Based Interconnects
Avicena, headquartered in Sunnyvale, CA, announced today that the company will work with TSMC to optimize photodetector (PD) arrays for Avicena's revolutionary LightBundle microLED-based interconnects. LightBundle supports > 1Tbps/mm shoreline density and extends ultra-high density die-to-die (D2D) connections to > 10 meters at class-leading sub-pJ/bit energy efficiency. This will enable AI scale-up networks to support large clusters of GPUs across multiple racks, eliminating reach limitations of current copper interconnects while drastically reducing power consumption.
Increasingly sophisticated AI models are driving an unprecedented surge in demand for compute and memory performance, requiring interconnects with higher density, lower power, and longer reach for both processor-to-processor (P2P) and processor-to-memory (P2M) connectivity.
Increasingly sophisticated AI models are driving an unprecedented surge in demand for compute and memory performance, requiring interconnects with higher density, lower power, and longer reach for both processor-to-processor (P2P) and processor-to-memory (P2M) connectivity.