Sarcina Technology Launches AI Chiplet Platform Enabling Systems Up to 100x100 mm in a Single Package
Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE's FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing for the delivery of cost-effective, customizable, cutting-edge solutions.
Sarcina Technology is on a mission to push the boundaries of AI computing system development by providing a unique platform that enables efficient, scalable, configurable and cost-effective semiconductor packaging solutions for AI applications. As AI workloads continue to evolve, there is a need for increasingly sophisticated packaging solutions capable of supporting higher computational demands. Sarcina's novel interposer packaging technology integrates leading memory solutions with high-efficiency interconnects. Whether prioritizing cost, performance or power-efficiency, Sarcina's new AI platform can deliver.
Sarcina Technology is on a mission to push the boundaries of AI computing system development by providing a unique platform that enables efficient, scalable, configurable and cost-effective semiconductor packaging solutions for AI applications. As AI workloads continue to evolve, there is a need for increasingly sophisticated packaging solutions capable of supporting higher computational demands. Sarcina's novel interposer packaging technology integrates leading memory solutions with high-efficiency interconnects. Whether prioritizing cost, performance or power-efficiency, Sarcina's new AI platform can deliver.