What appears to be the full details of all of Intel's upcoming 800-series chipsets have leaked and although we've already seen what the Z890 chipset will offer, no details of the other SKUs have leaked to date. Maybe the biggest news is that there won't be an H870 chipset this time around, according to the leaker @jaykihn0 over at X/Twitter. The full range appears to be Z890, B860 and H810 for consumers, W880 for workstations and Q870 for corporate desktops. That said, the Z890 and W880 are identical in terms of slots and ports, but whereas the W880 gains full ECC support and Intel vPro and remote management, it loses the CPU and bus overclocking features of the Z890. The Q870 loses four chipset PCIe 4.0 lanes, one 20 Gbps or two 10 Gbps USB 3.2 ports, but is otherwise similar to the Z890, minus all the overclocking features, but with Intel vPro and remote management.

The B860 ends up on the chopping block as always and loses not only 10 chipset PCIe lanes compared to the Z890 chipset, but also four lanes from the CPU and four lanes on the DMI interface to the chipset. On top of that bifurcation goes out the window toigether with PCIe RAID and the chipset is only capable of having two 20 Gbps or four 10 Gbps USB 3.2 ports, but at least memory overclocking is still on the table. Finally, the H810 chipset is as basic as it gets, with no extra CPU PCIe lanes beyond the 16 lanes for a graphics card, but they are at least PCIe 5.0 this time around. The chipset itself is only equipped with a mere eight PCIe 4.0 lanes and it gets zero 20 Gbps and two 10 Gbps USB 3.2 ports. Note that all platforms support one or two Thunderbolt 4 / USB4 ports, but it's unclear if this is native support or via an add-on chip. Also note that the USB ports are shared and the maximum count is that for the 5 Gbps ports in the details below, so the Z890 for example, doesn't have 25 USB 3.2 ports in total, but rather only 10. All in all, we'll see a migration to PCIe 5.0 for the x16 slot across the entire 800-series chipset range and from the B860 and up, all chipsets will have a dedicated PCIe 5.0 x4 interface that will most likely be used for an M.2 slot. Also, the PCIe lane count is the maximum, but due to Intel's HSIO layout, some resources will be shared with SATA and Ethernet, which means not all PCIe lanes will be accessible.

TrendForce has observed that in 2024, major CSPs such as Microsoft, Google, Meta, and AWS will continue to be the primary buyers of high-end AI servers, which are crucial for LLM and AI modeling. Following establishing a significant AI training server infrastructure in 2024, these CSPs are expected to actively expand into edge AI in 2025. This expansion will include the development of smaller LLM models and setting up edge AI servers to facilitate AI applications across various sectors, such as manufacturing, finance, healthcare, and business.

Moreover, AI PCs or notebooks share a similar architecture to AI servers, offering substantial computational power and the ability to run smaller LLM and generative AI applications. These devices are anticipated to serve as the final bridge between cloud AI infrastructure and edge AI for small-scale training or inference applications.

The PC (desktops, notebooks, and workstations) market in Mainland China is forecast to contract by 1% in 2024 according to the latest Canalys data. The first quarter of the year already saw a sharp decline, with shipments down 12%, in contrast to the global market which returned to growth. Desktop shipments are expected to perform well in 2024, growing 10% annually as they benefit from commercial sector refresh demand, especially from large state-held enterprises and local governments. Notebook shipments are set to drop 5%, as demand from consumers and the private sector is anticipated to remain cautious on short-term expenditure such as PCs.

China's PC market trajectory is diverging from global trends in its recovery journey. In Q1 2024, the commercial sector bore the brunt of the market downturn, undergoing a 19% decline due to weak IT spending by large enterprises. The decline in consumer shipments was milder, with shipments dropping 8%. However, despite the muted performance in 2024, significant local developments point to a stronger market in 2025, in which PC shipments are expected to grow 12%.

At COMPUTEX 2024, MediaTek will showcase new products and technology demonstrations, featuring highlights in AI, Smart TVs, Chromebooks, IoT and more, in addition to a keynote by Vice Chairman and CEO Dr. Rick Tsai about how MediaTek can enable ubiquitous AI.

At this year's show, MediaTek will debut two new chipsets with powerful performance and support for the latest AI enhancements across multiple verticals: the Kompanio 838 SoC for premium Chromebooks, and the Pentonic 800 SoC for 4K premium smart TVs and displays.

AMD is debuting its Ryzen 9000 series "Granite Ridge" desktop processors powered by the "Zen 5" microarchitecture later this year. These chips are compatible with existing AMD 600-series chipset motherboards with a simple UEFI firmware update, but the company is also taking the opportunity to launch the AMD 800-series chipset family alongside these chips. The lineup will be led by the AMD X870E, followed by the X870. These two chipsets should launch immediately alongside the new processors, but will later be joined by the AMD B850 and B840. There's no entry-level chipset planned, the AMD A620 will continue to hold the fort for AMD here. There is an interesting new mix of product differentiation, according to a leaked GIGABYTE slide scored by VideoCardz.

If you recall, the X670E and X670 were differentiated by a lack of Gen 5 PCI-Express x16 PEG slots on the X670, which instead was limited to Gen 4 on the PEG slot. The X670 still had Gen 5 NVMe slots attached to the CPU, and had practically the same I/O features as the X670E, including the same counts of downstream PCIe Gen 4 general purpose lanes. Both the X670E and X670 are 2-chip solutions, in that the second chip is a connected to the general purpose PCIe lanes of the first chip, which in turn is connected to the processor. Things are going to change with the 800-series. The top-spec X870E will be a 2-chip solution, with PCIe Gen 4 general purpose lane counts resembling the X670E; but the X870 is a single-chip solution that more closely resembles the B650E in I/O. The X870 (non-E) now gives you Gen 5 PCI-Express x16 PEG, just like the X870E and the B650E, and at least one Gen 5 x4 NVMe slot attached to the CPU, but has fewer downstream Gen 4 general purpose PCIe lanes than the X670. Both the X870E and X870 assure USB4 connectivity, and support CPU overclocking. Things get very interesting in the mid-range.

MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz paired with 4X Arm Cortex-A55 cores. The 4 nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

A couple of weeks ago, we reported on NVIDIA directing users of Intel's 13th Generation Raptor Lake and 14th Generation Raptor Lake Refresh CPUs to consult Intel for any issues with system stability. Motherboard makers, by default, often run the CPU outside of Intel's recommended specifications, overvolting the CPU through modifying voltage curves, automatic overclocks, and removing power limits.

Today, we learned that Igor's Lab has obtained a statement from Intel that the company prepared for motherboard OEMs regarding the issues multiple users report. Intel CPUs come pre-programmed with a stock voltage curve. When motherboard makers remove power limits and automatically adjust voltage curves and frequency targets, the CPU can be pushed outside its safe operating range, possibly causing system instability. Intel has set up a dedicated website for users to report their issues and offer support. Manufacturers like GIGABYTE have already issued new BIOS updates for users to achieve maximum stability, which incidentally has recent user reports of still being outside Intel spec, setting PL2 to 188 W, loadlines to 1.7/1.7 and current limit to 249 A. While MSI provided a blog post tutorial for stability. ASUS has published updated BIOS for its motherboards to reflect on this Intel baseline spec as well. Surprisingly, not all the revised BIOS values match up with the Intel Baseline Profile spec for these various new BIOS updates from different vendors. You can read the statement from Intel in the quote below.

The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world's top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple's latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC's premium 3 nm process notably enhanced its revenue contribution, pushing its global market share past the 60% threshold this quarter.

TrendForce remarks that 2023 was a challenging year for foundries, marked by high inventory levels across the supply chain, a weak global economy, and a slow recovery in the Chinese market. These factors led to a downward cycle in the industry, with the top ten foundries experiencing a 13.6% annual drop as revenue reached just $111.54 billion. Nevertheless, 2024 promises a brighter outlook, with AI-driven demand expected to boost annual revenue by 12% to $125.24 billion. TSMC, benefiting from steady advanced process orders, is poised to far exceed the industry average in growth.

SMIC, China's largest semiconductor manufacturer, is reportedly assembling a dedicated team to develop 3 nm semiconductor node technology, following reports of the company setting up 5 nm chip production for Huawei later this year. This move is part of SMIC's efforts to achieve independence from foreign companies and reduce its reliance on US technology. According to a report from Joongang, SMIC's initial goal is to commence operations of its 5 nm production line, which will mass-produce Huawei chipsets for various products, including AI silicon. However, SMIC is already looking beyond the 5 nm node. The company has assembled an internal research and development team to begin work on the next-generation 3 nm node.

The Chinese manufacturer is expected to accomplish this using existing DUV machinery, as ASML, the sole supplier of advanced EUV technology, is prohibited from providing equipment to Chinese companies due to US restrictions. It is reported that one of the biggest challenges facing SMIC is the potential for low yields and high production costs. The company is seeking substantial subsidies from the Chinese government to overcome these obstacles. Receiving government subsidies will be crucial for SMIC, especially considering that its 5 nm chips are expected to be up to 50 percent more expensive than TSMC's due to the use of older DUV equipment. The first 3 nm wafers from SMIC are not expected to roll out for several years, as the company will prioritize the commercialization of Huawei's 5 nm chips. This ambitious undertaking by SMIC represents a significant challenge for the company as it strives to reduce its dependence on foreign semiconductor technology and establish itself as an essential player in the global manufacturing industry.

Apple CEO, Tim Cook, discussed planned generative AI software features during an early February earnings call: "As we look ahead, we will continue to invest in these and other technologies that will shape the future. That includes artificial intelligence, where we continue to spend a tremendous amount of time and effort, and we're excited to share the details of our ongoing work in that space later this year." His "prepared" statement did not provide any specific insights into involved technologies, but many iPhone experts believe that the upcoming release of iOS 18 could be "the biggest update" in Apple mobile operating system history. The American multinational technology giant is seemingly taking a relaxed approach with internal artificial intelligence developments—rival smartphone maker, Samsung, has already jumped into the on-the-go AI deep end with its recently launched Galaxy S24 series. Qualcomm's Snapdragon 8 Gen 3 (for Galaxy) chipset is ready to take on all sorts of artificial intelligence-augmented tasks, while a next-gen ARM Cortex-X "Blackhawk" unit (leveraging "great" LLM performance) is in the pipeline for a late 2024 rollout.

Taiwan's Economic Daily News has reached out to insider contacts, albeit on the hardware side of things—their sources reckon that Apple is working on next generation processors that sport "significantly upgraded Neural Engine performance with additional cores." Tipsters believe that plans for 2024 include an effort to "significantly strengthen the AI computing power of the (existing) M3 and A17 processors," while the true "new generation" M4 and Bionic A18 chipsets will be augmented with greater AI computing core counts. Taiwan's top foundry is reportedly in the mix: "Apple has strengthened the AI computing performance of mobile devices and greatly increased the computing power of its own processors, which has simultaneously increased its wafer investment in TSMC. According to industry sources, Apple's wafer production volume for TSMC's 3 nm enhanced version process this year is expected to increase by more than 50% compared with last year, making it firmly the largest customer of TSMC."

Cristiano Renno Amon, President and CEO of Qualcomm, discussed the successful launch of his company's Snapdragon 8 Gen 3 mobile platform during a January 31 Earnings Call—expectations have been set high for the flagship smartphone chipset: "(bringing) a new standard for on-device gen AI experiences for premium smartphones and powers all through flagship Android devices launched and launching this fiscal year." Amon highlighted Samsung's recently rolled out Galaxy S24 Ultra range, that makes use of a special "For Galaxy" Snapdragon 8 Gen 3 SoC. Industry watchdogs have continued to question Samsung's reliance on third-party processor solutions (including MediaTek Dimensity parts), despite having access to plenty of "worthy" in-house technology. Their flagship Exynos 2400 chip has been deployed with the Galaxy S24 Plus range, but Qualcomm Snapdragon-equipped devices offer better performance and efficiency.

The picky segment of Samsung's smartphone userbase will be pleased to hear about a renewed agreement between it and Qualcomm, which includes a trickling down to mid-range offerings—Amon made a big announcement during the late January conference call: "We're also announcing that we extended a multi-year agreement with Samsung relating to Snapdragon platforms for flagship Galaxy smartphone launches starting in 2024. The extended agreement demonstrates the value of Snapdragon 8, our technology leadership and our successful long-term strategic partnership with Samsung. In the quarter, we also announced the Snapdragon 7 Gen 3 mobile platform, which brings leading gen AI capabilities to high-tier Android smartphones and is a category leader in both experiences and performance." Going forward, Samsung is likely sticking with its current operating model of peppering a mix of Snapdragon and Exynos chipsets throughout its Galaxy Z, S and A product ranges.

Everyone's favorite PC hardware tipster, momomo_us, has spotted a bunch of interesting SKUs registrations—the Eurasian Economic Commission (EEC) portal is normally a good source of pre-release information. ASUS appears to have submitted (on January 30) a wide range of AMD and Intel chipsetted mainboards with the Customs Union of Belarus, Kazakhstan, and Russia. The presence of Pro WS X690E-SAGE SE and Pro WS X690E-SAGE SE WIFI models attracted the most attention—fellow tipster HXL/@9550pro proposed that AMD's incoming X690 tech could be an X670 offshoot. They made reference to an AORUS BIOS screenshot showing a "common options" setting for AM4 generation X570 and X590 chipsets. The latter was a workstation solution that never reached finalized retail form.

Team Red has not officially announced the X690 chipset, so we know little else beyond this week's SKU filings. ASUS has produced a number of Pro Workstation Series for AMD platforms—the most recent examples being very fancy WRX90 and TRX50 motherboards for the mighty "Storm Peak" Threadripper 7000 processor family. VideoCardz reminds us that ASUS has not updated its Ryzen and Ryzen PRO "consumer and business" mainboard product range since the X570 days, so it is encouraging to see some potential new AM5 options on the horizon. On occasion, EEC SKU registrations do not lead to finalized retail products, so plans are subject to change.

Digital Chat Station has seemingly received insider information regarding the performance of Qualcomm's Snapdragon 8 Gen 4 mobile chipset—their source reports that a probable engineering sample is already exceeding its predecessor's Big core (Cortex-X4) maximum limit of 3.3 GHz. The rumor mill has Nuvia's custom Oryon cores linked to the next generation mobile processor, although some experts think that the Phoenix design was selected for Gen 4. Qualcomm's Snapdragon X Elite notebook SoC was unveiled last October—this ARM-based solution is set to deliver "a dramatic leap in innovation for computing" thanks to Nuvia's custom Oryon technology. Kedar Kondap, Senior Vice President & General Manager of Compute & Gaming stated that the Snapdragon X Elite offers: "super-charged performance that will delight consumers with incredible power efficiency and take their creativity and productivity to the next level."

Digital Chat Station's brief assessment of the prototype Snapdragon 8 Gen 4's Big core prowess is also glowing: "4.0 GHz is no longer a dream" on smartphones. Past reports have Qualcomm signed up with TSMC for an unspecified 3 nm production process—next generation silicon will benefit greatly in terms of power efficiency, with custom Oryon or Phoenix cores (allegedly) achieving greater clock speeds thanks to some extra headroom. As mentioned above, the previous-gen Kryo Prime core—using TSMC's advanced 4 nm node—is factory restricted to 3.3 GHz. Tipsters reckon that efficiency cores are not part of the Snapdragon 8 Gen 4 design, due to the innate benefits of 3 nm—according to Digital Chat Station, MediaTek is taking similar steps with its upcoming Dimensity 9400 SoC.

Courtesy of X/Twitter user @yuuki_ans, we now have what should be very detailed information on Intel's next generation consumer desktop platform, assuming the leaked information is real. The leaker not only provided confirmation on the CPU specs of the Arrow Lake-S desktop CPUs, which will feature up to an 8+16+1 core configuration. However, it appears that it's not all smooth sailing for Intel to get Arrow Lake-S up and running, as a note points out that the pre-alpha hardware has the performance cores disabled due to a hardware bug that is expected to be fixed in a future hardware revision. We can also see that the official memory support is DDR5-6400 from the block diagram, which is quite a jump from DDR5-5600 which is what the current 14th gen CPUs officially support.

That said, the rest of the documentation shared is very detailed and provides us with a ton of details in terms of the various platform interfaces we can expect. For starters, the Arrow Lake-S CPUs will feature native Thunderbolt 4/USB4 support (once again an odd mistake here stating USB4.0), as well as DisplayPort 2.0 (UHBR20 only) and HDMI 2.1 support. The CPU is said to deliver 24 PCIe lanes, of which 16 are PCIe 5.0 lanes for the GPU and the remaining eight are for NVMe SSDs, with half being PCIe 5.0 and half PCIe 4.0.

MediaTek, one of the first adopters of Wi-Fi 7 technology, today announced that it is working closely within Wi-Fi Alliance to launch a complete first wave of Wi-Fi CERTIFIED 7 products, which will be featured as part of MediaTek's global ecosystem showcase at CES 2024. In an era where people rely on artificial intelligence to improve their lives and productivity, a fast and reliable network ensures consumers and professionals have the connectivity needed to utilize the latest AI tools. These devices, powered by MediaTek Filogic Wi-Fi CERTIFIED 7 chipsets, represent fast, reliable and always-on connected experiences for a wide variety of consumer and enterprise products, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.

"As a technology leader, we make significant investments in formulating the standards that drive the industry, in addition to developing products that utilize those standards," said Alan Hsu, corporate vice president at MediaTek. "The recent announcement of our family of Wi-Fi CERTIFIED 7 chipset solutions has enabled us to work with Wi-Fi Alliance to provide testbeds for devices on both the access point and client sides, streamlining the product certification process for manufacturers."

Wi-Fi CERTIFIED 7 is here, introducing powerful new features that boost Wi-Fi performance and improve connectivity across a variety of environments. Cutting-edge capabilities in Wi-Fi CERTIFIED 7 enable innovations that rely on high throughput, deterministic latency, and greater reliability for critical traffic. New use cases - including multi-user AR/VR/XR, immersive 3-D training, electronic gaming, hybrid work, industrial IoT, and automotive - will advance as a result of the latest Wi-Fi generation. Wi-Fi CERTIFIED 7 represents the culmination of extensive collaboration and innovation within Wi-Fi Alliance, facilitating worldwide product interoperability and a robust, sophisticated device ecosystem.

Wi-Fi 7 will see rapid adoption across a broad ecosystem with more than 233 million devices expected to enter the market in 2024, growing to 2.1 billion devices by 2028. Smartphones, PCs, tablets, and access points (APs) will be the earliest adopters of Wi-Fi 7, and customer premises equipment (CPE) and augmented and virtual reality (AR/VR) equipment will continue to gain early market traction. Wi-Fi CERTIFIED 7 pushes the boundaries of today's wireless connectivity, and Wi-Fi CERTIFIED helps ensure advanced features are deployed in a consistent way to deliver high-quality user experiences.

MaxLinear, Inc., a global leader in broadband access and gateway solutions, today announced its Wi-Fi 7 chipsets and Tri-band Access Point were certified by Wi-Fi Alliance and selected as one of the Wi-Fi CERTIFIED 7 test bed devices. Wi-Fi Alliance's Wi-Fi 7 certification helps verify that upcoming Wi-Fi 7 devices can seamlessly interoperate and deliver the high-performance promises of the new standard. The inclusion of MaxLinear's innovative, single-chip Wi-Fi 7 solution in the verification process exemplifies its continuing commitment to pushing the boundaries of in-home communications and reshaping the way service providers build access and connectivity networks.

"At MaxLinear, we're not just leading the pack with Wi-Fi 7 technology; we're redefining it. Our single-chip tri-band device is an industry first, symbolizing a giant leap in wireless communication," said Will Torgerson, VP/GM Broadband Group. "With our focus on power efficiency and peak performance, we're at the forefront of the Wi-Fi 7 revolution, offering blazing-fast speeds, reduced latency, and robust connectivity. As part of the Wi-Fi Alliance, we celebrate 25 years of Wi-Fi innovation and remain committed to advancing a connected world where our groundbreaking solutions enable seamless, multi-gigabit broadband access."

During the recent IEDM conference, TSMC previewed its process roadmap for delivering next-generation chip packages packing over one trillion transistors by 2030. This aligns with similar long-term visions from Intel. Such enormous transistor counts will come through advanced 3D packaging of multiple chipsets. But TSMC also aims to push monolithic chip complexity higher, ultimately enabling 200 billion transistor designs on a single die. This requires steady enhancement of TSMC's planned N2, N2P, N1.4, and N1 nodes, which are slated to arrive between now and the end of the decade. While multi-chipset architectures are currently gaining favor, TSMC asserts both packaging density and raw transistor density must scale up in tandem. Some perspective on the magnitude of TSMC's goals include NVIDIA's 80 billion transistor GH100 GPU—among today's largest chips, excluding wafer-scale designs from Cerebras.

Yet TSMC's roadmap calls for more than doubling that, first with over 100 billion transistor monolithic designs, then eventually 200 billion. Of course, yields become more challenging as die sizes grow, which is where advanced packaging of smaller chiplets becomes crucial. Multi-chip module offerings like AMD's MI300X and Intel's Ponte Vecchio already integrate dozens of tiles, with PVC having 47 tiles. TSMC envisions this expansion to chip packages housing more than a trillion transistors via its CoWoS, InFO, 3D stacking, and many other technologies. While the scaling cadence has recently slowed, TSMC remains confident in achieving both packaging and process breakthroughs to meet future density demands. The foundry's continuous investment ensures progress in unlocking next-generation semiconductor capabilities. But physics ultimately dictates timelines, no matter how aggressive the roadmap.

Market research by Korean publication Danawa DPG provides valuable insights to how desktop AMD Ryzen processor users are charting their upgrade paths given the long upgrade longevity of AMD sockets. The research follows a 10-month date range from December 2022 to October 2023, and tracks the sales of motherboards based on various AMD chipset models. We're shown that toward the turn of the year, AMD B550 chipset motherboards sell the most. This is when AMD Ryzen 5000 Socket AM4 processors top sales for the company, Given that the B550 fully supports CPU overclocking, and that there are plenty of feature-packed B550 motherboard models, it explains why the B550 covers a wide price-band.

AMD launched the Ryzen 7000 series "Zen 4" to lukewarm response in September 2022, mainly because the platform lacked DDR4 memory support that was relevant at the time, and hence wasn't as flexible to consumers as Intel's LGA1700. Its launch caused price-cuts for Ryzen 5000 series processors, clearing out some upgrade headroom for those on the AM4 platform still using Ryzen 3000. Off to a slow start, we see its successor from Socket AM5, the B650 chipset, rise steadily over the time period, and for two reasons—DDR5 memory became affordable over the course of 2023; and AMD breathed life into the Ryzen 7000 series with the introduction of the Ryzen 7000X3D series, which restored gaming performance competitiveness to Intel's 13th Gen Core "Raptor Lake." The B650 has everything you need right now for a Ryzen 7000X3D build, given that both the GeForce RTX 40-series and Radeon RX 7000 series are PCIe Gen 4 graphics cards; and that the B650 has at least a Gen 5 NVMe slot. If you absolutely need a Gen 5 x16 slot, there's the premium B650E chipset to go with.

MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Based on TSMC's 2nd generation 4 nm process, the Dimensity 8300 has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm's latest v9 CPU architecture. With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset. Additionally, the Dimensity 8300's Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. Plus, the chipset's impressive memory and storage speeds ensure users can enjoy smooth and dynamic experiences in gaming, lifestyle applications, photography, and more.

MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3 nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

"We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek. "TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market."

Pixelworks, Inc., a leading provider of innovative visual processing solutions, today announced the official launch of its new IRX gaming experience brand. As a brand targeted at smartphone users, IRX is grounded on Pixelworks' mobile visual processing solutions and coupled with in-depth game tuning services. This combination leverages Pixelworks' expertise to achieve ultra-smooth gaming experience and the highest picture quality for different types of games on mobile devices. In addition, it exercises effective control of power consumption, latency and other performance variables to ensure stable and long-lasting gaming with optimal visual performance, providing end users with unparalleled mobile gaming experiences.

The IRX gaming experience is enabled by a portfolio of technology advantages and product application experiences based on the Company's innovative distributed rendering architecture. More specifically, Pixelworks' ultra-low latency MotionEngine technology, low power super-resolution technology, AI Always-on HDR and other technologies bring optimized rendering capabilities to smartphones that exceed what can be achieved by a traditional chipset. Together with Pixelworks' profound tuning experience for different games on various mobile devices the result is a meaningfully enriched visual experience for smartphone users, which is the core foundation for the IRX gaming experience.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, is pleased to announce its close collaboration with HWiNFO, a comprehensive system information and diagnostic tool. This partnership aims to enhance the accuracy of hardware information and diagnostics, while introducing innovative features to benefit computer enthusiasts and professionals alike.

HWiNFO, known for its detailed system information and diagnostic capabilities, has partnered with GIGABYTE to integrate their technologies and deliver more precise and comprehensive hardware information to users. By combining GIGABYTE's expertise in hardware manufacturing and HWiNFO's advanced diagnostics, users can now access a wealth of information about their computer components with unparalleled accuracy.

Somewhat out of the blue, Silicon Box has announced the opening of its US$2 billion semiconductor assembly plant in Singapore. The "startup" is founded by several of Marvell's founders, suggesting the company has the right pedigree to compete in what is sure to be a very competitive market over the next few years. Silicon Box is not a foundry and will at least at this point in time, not be involved in foundry services, but instead the company will focus on advanced chip packaging technologies, focusing on chiplets.

The company is promising "faster time-to-market, lower new device design cost" on its very rudimentary website, something the company has yet to prove to be capable of. However, its new plant in Singapore covers 73,000 square metres and is said to feature state of the art production equipment for turning chiplets into chips. The factory is said to create some 1,200 jobs in Singapore, suggesting that this is a company that means business. According to a comment by company founder and CEO BJ Han to Reuters, "customers had been lining up" since before the completion of the assembly plant. Silicon Box is expecting to have several AI chipset companies as its customers, including Tenstorrent, which so far is the only officially mentioned client. Time will tell if Silicon Box can compete with established chip packaging businesses and if they can deliver on their promise to be faster and cheaper than the competition.

Global LiFi technology firms pureLiFi and Fraunhofer HHI welcome the release of IEEE 802.11bb as the latest global light communications standard alongside IEEE 802.11 WiFi standards. The bb standard marks a significant milestone for the LiFi market, as it provides a globally recognised framework for deployment of LiFi technology.

LiFi is a wireless technology that uses light rather than radio frequencies to transmit data. By harnessing the light spectrum, LiFi can unleash faster, more reliable wireless communications with unparalleled security compared to conventional technologies such as WiFi and 5G. The Light Communications 802.11bb Task Group was formed in 2018 chaired by pureLiFi and supported by Fraunhofer HHI, two firms which have been at the forefront of LiFi development efforts. Both organisations aim to see accelerated adoption and interoperability not only between LiFi vendors but also with WiFi technologies as a result of these standardisation efforts.