Just before the official launch of Radeon RX 9070 XT graphics cards, members of the Chiphell forum expressed concerns about unnamed evaluation samples exhibiting worrying memory module temperatures. Days later, Western review outlets published similar findings across several board partner specimens. Typically, pre-launch and retail units have utilized SK hynix GDDR6 VRAM modules—TechPowerUp's W1zzard uncovered numerous examples of the manufacturer's "H56G42AS8DX-014" model during teardown sessions. Curiously, Chinese PC hardware enthusiasts have happened upon Radeon RX 9070 XT cards that utilize Samsung GDDR6 memory modules. It is not clear whether Yeston has outfitted its flagship Sakura Atlantis OC SKU with Samsung components from the very beginning, but one owner documented a GPU-Z diagnostics session—late last month—showing "GDDR6 (Samsung)" onboard. Earlier this month, insiders posited that NVIDIA was in the process of changing its main GDDR7 memory vendor—from Samsung to SK hynix—for the GeForce RTX 50-series.

According to a recent Guru3D news piece, additional cases were reported. Online conjecture points to "higher end" custom models being updated with "cooler" modules. Hilbert Hagedoorn—Guru3D's head honcho—has gathered compelling information via community feedback channels: "the transition to Samsung memory has yielded noticeable thermal advantages. Early reviews and comparisons indicate that the new memory modules help lower temperatures significantly. Custom RX 9070 XT models running demanding benchmarks like Furmark have demonstrated memory temperatures of 75°C or lower without necessitating an increase in voltage or a reduction in clock speeds. Notable manufacturers, including Sapphire, XFX, and GIGABYTE, have already integrated Samsung's GDDR6 into their custom variants. However, as of now, AMD has not authorized its partners to explicitly differentiate between models with SK hynix and Samsung memory, likely to avoid confusion among consumers and maintain a consistent product lineup." Additionally, TechPowerUp forum members have found Samsung GDDR6 memory on Radeon RX 9070 XT and RX 9070 custom models. Thanks for the tip, Fluffmeister.

PlayStation 5 Pro console—the most innovative PlayStation console to date—elevates gaming experiences to the next level with features like upgraded GPU, advanced ray tracing, and PlayStation Spectral Super Resolution (PSSR) - an AI-driven upscaling that delivers super sharp image clarity with high framerate gameplay. Today we're providing a closer look at the console's internal architecture, as Sony Interactive Entertainment engineers Shinya Tsuchida, PS5 Pro Mechanical Design Lead and Shinya Hiromitsu, PS5 Pro Electrical Design Lead, provide a deep-dive into the console's innovative technology and design philosophy.

Note: in this article, we refer to the PlayStation 5 model released in 2020 as the "original PS5," the PS5 released in 2023 as the "current PS5," and the PS5 Pro released in 2024 as the "PS5 Pro." Do not try this at home. Risk of fires, and exposure to electric shock or other injuries. Disassembling your console will invalidate your manufacturer's guarantee.

TrendForce's latest research reveals that although the U.S. has granted a 90-day grace period before implementing reciprocal tariffs—offering temporary relief for notebook brands—the broader market remains clouded by policy and economic uncertainty. Brands began frontloading inventory in late 2024, pushing Q4 shipment growth to 5.1%, with 1Q25 seeing a 7.2% YoY increase.

However, given persistent economic weakness and rising tariff risks, TrendForce has revised the full-year 2025 notebook brand shipment growth forecast downward from 3.6% to just 1.4%.

The Taiwan media is reporting that Foxconn has been busy moving more and more of its production from China to India, with the main focus being on Apple's iPhone and iPad products for now. Foxconn has been producing iPhones for the Indian market in India since 2019, but the story here is that China has banned Foxconn from sending Chinese staff to India to train the local staff and oversee the production. This has resulted in Foxconn having to send staff from Taiwan to India instead, but they might not be as familiar with the entire production process as the ones that are based in the factories in China.

This is only part of the issue though, as the news reports are also mentioning that China is preventing Foxconn from sending machines and equipment needed for the production to India. The same issue is said to be affecting other Taiwanese companies that are moving some of their production out of China to India, but they've had no issues when it comes to sending equipment to other nations in South East Asia. The equipment is apparently not possible to produce locally in India either, which means that these companies are more or less being forced to keep their production in China. To work around this issue, Foxconn is said to be sending half-finished phones and components to India, to do the final assembly there, to keep up production in India. So far, this is just rumours out of Taiwan, but it looks like China is intent on keeping the production on its shores for as long as it can.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4. Designed as an evolutionary step beyond the previous HBM3 standard, JESD270-4 HBM4 will further enhance data processing rates while maintaining essential features such as higher bandwidth, power efficiency, and increased capacity per die and/or stack, because the higher bandwidth enables the higher data processing rate.

The advancements introduced by HBM4 are vital for applications that require efficient handling of large datasets and complex calculations, including generative artificial intelligence (AI), high-performance computing, high-end graphics cards, and servers. HBM4 introduces numerous improvements to the prior version of the standard, including:

The DOOM Slayer is back, and as we count down the days until you can explore the medieval world of DOOM: The Dark Ages, you'll need the right tools to get the job done. Introducing the Xbox Wireless Controller - DOOM: The Dark Ages Limited Edition, Xbox Elite Wireless Controller Series 2 - DOOM: The Dark Ages Limited Edition, and the Xbox Series X Wrap - DOOM: The Dark Ages Limited Edition. This collection celebrates DOOM and the latest chapter in the franchise's storied history. From the runes adorning each piece, to specific homages like the matte green armor and the Mark of the Slayer, every detail in this collection has been thoughtfully selected to capture the essence of the DOOM universe.

If you're going to be the Slayer, you better look the part—gear up with the Limited Edition Xbox Wireless Controller in battle-worn green and silver. Crowned with 3D silver helmet spikes at the top and silver-plated sheathing on the two sides, this controller was forged for a demon-slaying super weapon. With additional touches like a rubberized, leather-like grip, a red thumbstick to match the chest port, and blood splatter resulting from your Shield Saw, every detail is crafted with the DOOM fan in mind.

As the US works to bring more semiconductor manufacturing back home, the machines needed to turn silicon into the world's most advanced processors are becoming pricier and harder to get, thanks to tariffs. Foundries building new fabs report that the specialized equipment they rely on, everything from extreme ultraviolet (EUV) lithography steppers to chemical vapor deposition chambers, carries a roughly 15% premium compared with similar gear sold overseas. Several forces are at play. The raw materials, high‑grade quartz for vacuum enclosures, and exotic metal alloys for precision optics have climbed in price. At the same time, key components like ultra‑accurate motion stages and alignment sensors are in short supply, sometimes stretching lead times for critical subsystems well beyond 18 months. For a fab racing to move from a 7 nm to a 5 nm process, those delays can mean missing tight ramp‑up targets and pushing out product launches.

Smaller chipmakers feel the squeeze the hardest. With fewer orders to negotiate volume discounts, second‑tier foundries may see their capital budgets balloon by 20 percent or more. In response, some are taking a mixed approach, sourcing commoditized tools such as oxidation furnaces and rapid thermal processors from multiple suppliers while reserving single‑vendor deals for high‑stakes systems like EUV scanners. Government support through the CHIPS Act offers a partial safety net, helping to subsidize capital expenditures. Yet even with grants and tax credits, the challenges will remain. Success will hinge on tight coordination between fabs, equipment makers, and policymakers to tame rising costs, shorten delivery schedules, and keep America's chip renaissance on track.

HP is expanding into the DIY gaming PC market with a new line of Omen-branded components, moving beyond its traditional prebuilt systems and laptops. The upcoming product lineup includes a single 120 mm RGB fan, a triple-pack of 120 mm modular RGB fans, a 1000 W modular power supply, a 240 mm LCD liquid cooling system, and a 360 mm aRGB liquid cooling system. HP confirms these components will work with non-Omen desktop systems, giving PC builders more flexibility.

The fans feature an annular design to help increase the airflow (up to 74 CFM) while reducing vibration through improved static pressure. Each fan includes aRGB LEDs that are customizable via HP's Omen Gaming Hub (OGH) software. They support HP's daisy chain system (up to 10 fans), or connect up to 16 fans through a single Omen Modular Hub. The AIO liquid cooling uses Asetek's 7th Gen pump with a built-in 2.1-inch IPS LCD (for the 240 mm model) and fans with aRGB Gen 2 lighting effects with OGH. HP is also offering the OMEN 1,000 W ATX 3.1 PSU with Cybernetics Platinum and 80 Plus Gold certification. The power supply is fully modular featuring 12 V-2×6 and 12VHPWR connectors with up to 600 W of power and a Zero RPM fan mode for quiet operation., While specific release dates and pricing haven't been announced, HP's website indicates these products are "coming soon."

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced a new range of products that enhance cooling efficiency, offer streamlined form factors, and deliver reliable power for diverse computing needs. From the space-conscious Ncore 100 Air case to updates in the MasterLiquid and Hyper series, Cooler Master continues its focus on performance-driven, user-friendly designs.

"We're excited to introduce a fully integrated lineup that supports PC builders at every level," said Jimmy Sha, CEO of Cooler Master. "From the compact Ncore 100 Air case to our latest MasterLiquid and Hyper coolers, SickleFlow Edge fans, and the MWE Gold V3 PSU, each product underscores our goal of blending performance, reliability, and style into every build."

ViewSonic Corp., a leading global provider of visual and EdTech solutions, has been honored at the prestigious iF Design Award 2025 for its outstanding design excellence. The company earned accolades for its Mac-compatible 5K monitor, 16-inch 16:10 portable monitors, and ViewShare wireless screen casting kit, showcasing its dedication to innovation, sustainability, and user-centric design.

ViewSonic has been honored at the iF Design Award 2025 for its outstanding design excellence
"We're thrilled to see our focus on user-centric innovation—like the ColorPro monitor's stunning 5K clarity for creative professionals, portable monitors for productivity on the go, and ViewShare for seamless collaboration—recognized for the eighth consecutive year at the iF Design Award," said Bonny Cheng, COO at ViewSonic. "Our goal is to deliver comprehensive solutions across business, education, and entertainment while prioritizing sustainability."

Considering that CPUs like the AMD Ryzen 7 9800X3D are turning heads everywhere for their unstoppable gaming prowess, you might be thinking about building a new PC in 2025. You'll need a potent graphics card to power your gaming ambitions. Today, you have more options on that front than ever. We're expanding our portfolio of AMD-powered graphics cards with Radeon RX 9070 XT and Radeon RX 9070 models from TUF Gaming and Prime.

Next-gen feature set
Armed with the latest RDNA 4 architecture and a supersized 16 GB serving of VRAM, these graphics cards stand poised to give you premium gaming experiences for years to come. Next-gen HYPR-RX tech delivers ultra-fast gaming, and you'll enjoy next-level immersion with the latest AI-powered features from AMD, including an improved experience with ray tracing. New for this generation is a machine-learning based super resolution mode compatible with select FSR 3.1 games that gives you an incredible balance of detailed images and fluid frame rates. DisplayPort 2.1 outputs give you incredible bandwidth for going big on resolution while supporting high-end refresh rates.

The Lords of Gondor have returned! Two new additions to the line of CSTM Kings. A line, a blade, a board - all that were once broken have been remade. Now, they can be custom-made, again and again. Inspired by the greatest kingdom of men; our Gondor CSTM80 and CSTM65 keyboards are kings of customization. Keeping safe all borders of these keebs, our all-new Gondor CSTM Decorative Cases feature exclusive artwork from the South Kingdom—as well as easy magnetic attachment for quick swapping with other cases in our collection.

Crowned with CSTM components fit for a King
Taking up the call of quality and customization alongside our Gondor accessories is a whole tower guard's worth of enthusiast components. Including: Gateron switches, customizable gasket mounting, case foam, case weights, and more...

Framework has finally introduced its next-generation Framework Laptop 13, now powered by the extremely potent Ryzen AI 300 "Strix Point" APUs. The product is already available for pre-order on Framework's website, with prices starting from $899 for the Do-It-Yourself variant, and $1,099 for the fully assembled variant. From the outside, the design of the product has been left mostly unchanged, which may appear somewhat disappointing at first, although an unaltered design likely indicates compatibility of components between the two laptops, which is undoubtedly one of the primary selling points for the Framework Laptop.

As mentioned, the biggest upgrade that the new Framework Laptop brings to the table is the new selection of processors, with the Ryzen AI 9 HX 370 APU sitting at the highest-end. Unsurprisingly, the Strix Point APUs allow for excellent performance improvements to both CPU and GPU side of things. With 12 cores (4 Zen 5 + 8 Zen 5c) and 24 threads, the highest-end Ryzen AI 9 HX 370 APU performs admirably well in benchmarks as well as real-life workloads. The Radeon 890M iGPU is among the fastest available on the market, trading blows with the Arc 140T iGPU in synthetic benchmarks. Of course, the 50 TOPS NPU allows for CoPilot functionality, for those who care. The Windows variant ships with a dedicated CoPilot key as well, while the DIY variant does not.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is excited to introduce the Pacific F-Pro Fitting - Chrome series and the Pacific PCTG Hard Tube series. Combining aesthetics with functionality, the F-Pro Fittings feature a sleek mirror-polished design, while the PCTG Hard Tubes provide high-temperature resistance. These new cooling components enhance durability and precision, making installation effortless and giving PC enthusiasts the freedom to create with confidence.

Pacific F-Pro Fitting - Chrome
The Pacific F-Pro Fitting Series stands out for its mirror-polished design, meticulously crafted to deliver a flawless, mirror-like finish. This treatment elevates the aesthetics of custom liquid cooling setups, offering a refined look. With six different fittings, this series provides a range of options, enabling you to build ideal liquid cooling systems for the ultimate performance and style.

We spotted via IT Home a fresh PC case just released by GALAX under the name "Metal Master Dark Guard", a new case that works with both ATX and microATX (back connectors supported) motherboards. The case keeps the look of the Metal Master series, with clean lines and a nice beveled design. It also has a big tempered glass side panel that gives you a clear view of internal components. The case internal design shows special attention to cooling, as GALAX mentions that they put it through multiple airflow tests. It can fit up to eight 120 or 140 mm fans, and one 240/260/280 mm radiator which makes it great for high-end gaming PCs. The design has a smart air duct system to keep things cool, and there's plenty of room inside to make cable management easy. One cool thing about the design is that the USB 3.0, and Type-C connectors are placed at the front-bottom. This helps keep the overall look clean by hiding cables away from the user's eyes while keeping the airflow clean.

The case can fit the latest hardware components, including the new RTX 50 series graphics cards or any graphic card up to 400 mm long, and standard power supplies. GALAX has priced the Metal Master Dark Guard at 249 yuan about $35, at least that's the price on Asian markets. If it reaches Western markets around $50 it can be considered a viable option for those on a tight budget.

The GameSir X3 Pro integrated cooler mobile controller merges an advanced cooling system with high-quality performance. It is designed to enhance your gaming comfort and elevate your gaming experience with extreme esports sensation. It's compatible with Android devices and iPhone 15 and above, supporting phones with a length of 110-180 mm. Now available in exclusive Deadpool edition.

Officially licensed by Marvel, this edition showcases Deadpool's iconic black and red color scheme, capturing the essence of the beloved anti-hero. Equipped with a 900 mm cooling plate, it delivers an impressive 12 W of cooling power, keeping your phone cool even during long gaming sessions or in high temperatures. The GameSir Hall Effect anti-drift sticks offer 360° precision control, providing seamless and pinpoint accuracy. Combined with their durability, they meet the high standards that gamers demand for a top-tier gaming experience.

Shrinking components was (and still is) the main way to boost the speed of all electronic devices; however, as devices get tinier, making them becomes trickier. A group of scientists from SANKEN (The Institute of Scientific and Industrial Research), at Osaka University has discovered another method to enhance performance: putting a special metal layer known as a metamaterial on top of a silicon base to make electrons move faster. This approach shows promise, but the tricky part is managing the metamaterial's structure so it can adapt to real-world needs.

To address this, the team looked into vanadium dioxide (VO₂). When heated, VO₂ changes from non-conductive to metallic, allowing it to carry electric charge like small adjustable electrodes. The researchers used this effect to create 'living' microelectrodes, which made silicon photodetectors better at spotting terahertz light. "We made a terahertz photodetector with VO₂ as a metamaterial. Using a precise method, we created a high-quality VO₂ layer on silicon. By controlling the temperature, we adjusted the size of the metallic regions—much larger than previously possible—which affected how the silicon detected terahertz light," says lead author Ai I. Osaka.

PNY Technologies today announced the latest additions to their USB Type-C flash drive lineup, headlined by the extreme-performance PRO Elite V3 that delivers read speeds up to 1,000 MB/s and write speeds up to 800 MB/s, and offers storage options ranging from 256 GB - 2 TB. The expanded Type-C portfolio also includes the ultra-compact Elite-X Fit and Elite models, providing a storage solution for all Type-C and high-performance portable needs without requiring a Type-C adapter.

Extreme Storage Solution—PRO Elite V3 Type-C
The PRO Elite V3 leads PNY's latest generation of Type-C USB storage solutions, crafted for professional content creators, designers, and gamers demanding high performance while working with large files and resource-demanding applications. With extreme read speeds up to 1,000 MB/s and write speeds up to 800 MB/s, users can safely transfer their valuable content at blazing fast speeds up to 265 times faster than standard USB 2.0 flash drives. A huge storage size increase of up to 2 TB provides professional users ample space to store large project files, 4K video collections, and extensive gaming libraries on a single storage device.

We build our TUF Gaming components for users who want an emphasis on substance, meaning you're paying for pure performance when you go TUF. That focus on function is where the TUF Gaming GeForce RTX 5090 and TUF Gaming GeForce RTX 5080 graphics cards excel, providing you with next-gen graphics capabilities as well as high-performance thermal solutions that'll hold up under 4K AAA gaming pressure. If you've been waiting to upgrade your rig and want to treat yourself to a premium power bump, now's the time to pull the trigger. You're in for a truly substantial generational leap with these high-end components featuring the power of NVIDIA's latest GPU architecture alongside the sophistication of our latest graphics card designs.

Next-gen tech for tomorrow's heavyweight games
The GeForce RTX 5090 and 5080 comprise the top of the power stack for NVIDIA's 50 Series GPUs, so when you invest in either a TUF Gaming GeForce RTX 5090 or 5080 graphics card, you're setting yourself up for years to come. The 50 Series is powered by NVIDIA's Blackwell architecture, meaning these GPUs feature 4th generation RT cores to give gamers the best ray tracing performance yet. They also pack neural shaders, which compress textures to cut down on memory usage and produce incredible real-time visuals. And NVIDIA has ensured its 50 Series is equipped for neural processing via a built-in AI management processor, so you'll get an optimal experience when harnessing the power of NVIDIA DLSS 4. Powered by 5th generation Tensor Cores, DLSS 4 uses a Multi Frame Generation solution to boost your framerate to new heights.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Intel's Platform Engineering and Client Segments groups are actively looking into ways of reducing computer e-waste, and (in parallel) enhance product repairability. The company's newly proposed "Modular PC Design" is set to take a "sustainable approach" across three key modularity levels: factory, field and user. Team Blue's blog post goes into great detail about revised laptop and mini-PC designs—with the "right-to-repair" movement serving as a major influence. Many "consumer activists and environmental groups" have advocated for improvements in personal computer design—Intel appears to be listening, but a firm release timeline has not been set.

Intel's proposed new standards will revolve around repairability and upgradability—as explained in their blog: "the right-to-repair emphasizes the importance of being able to fix and upgrade PCs on one's own. Improving repairability requires fundamental changes starting from the design methodology." Team Blue's Modular PC program—for laptops—breaks away from the tradition of utilizing an "all-in-one motherboard." A reference diagram shows off three internal modules: a motherboard package and two "universal" left and right I/O units. These separate boards can be: "utilized across various platforms or market segments leads to cost savings by streamlining the duration of the design cycle and minimizing the engineering investment required. The I/O boards for Premium Modular designs are engineered to be common between the fan-less Thin & Light system, which operates within a 10 W power envelope, and the premium fanned designs, which function within a 20 W (single fan) and 30 W (dual fan, Wi-Fi only SKU) power envelope." Framework recently celebrated its fifth year of operation—its modular laptop designs have seemingly "inspired" a few copycats.

In the design of wearable devices, every millimeter matters. As AI technology becomes deeply integrated, wearable devices demand not only enhanced performance but also the ability to deliver more functionalities within highly limited spaces. Recently, Longsys introduced a 7.2 mm × 7.2 mm subsize eMMC, providing a groundbreaking memory solution for optimizing the physical space of AI wearables.

Ultra-Compact: Unlocking New Possibilities for Wearable Design
7.2 mm × 7.2 mm is one of the smallest subsize eMMCs currently available on the market, achieving maximum space efficiency. Its 153 solder balls nearly cover the entire panel, pushing the design to the very edge of physical limits. Compared to the standard 11.5 mm × 13 mm eMMC, its surface area is reduced by approximately 65%, with a thickness of just 0.8 mm. Featuring a lightweight design, it weighs only 0.1 g (approx.), nearly 67% lighter than the standard 0.3 g eMMC. This ultra-compact design frees up additional space for other internal components, enabling wearable devices to maintain a sleek and lightweight form while integrating more functional modules to meet diverse user demands.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, just dropped the curtain on two groundbreaking additions to its APEX line: the all-new APEX FORCE and the upgraded APEX RUSH. These state-of-the-art gaming PCs redefine performance, cooling, and customization for the most discerning gamers.

APEX FORCE: There's No Replacement for Displacement
The APEX FORCE features a full-tower chassis design based on the popular Phanteks NV9, concealed rear external cable management, and panoramic tempered glass panels trimmed with a diffused illuminated edge, that maximizes the premium aesthetics of the FORCE. Inside, it's immediately noticeable that MAINGEAR spent countless hours precisely engineering the APEX hardline cooling system with 10-degree offset tubing to perfectly mate with the chassis' unique design language, making the FORCE a masterpiece of functional design and engineering. Upgradable RGB lighting accentuates the cooling components and premium hardware perfectly.

MSI has unveiled its groundbreaking NVIDIA GeForce RTX 50 Series graphics cards, featuring cutting-edge designs including Suprim Liquid, Suprim, Vanguard, Gaming Trio, Ventus, and Inspire. Engineered with enhanced thermal solutions, the cards are crafted to meet the high-performance demands of next-gen GPUs, delivering advanced cooling and peak performance.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.