Corsair Gaming, Inc. (Nasdaq: CRSR) ("Corsair" or the "Company"), a leading global provider of high-performance gear for gamers, streamers, content creators, PC builders and SIM driving enthusiasts, today announced that the planned CEO transition has taken effect. Andy Paul, Corsair's Founder and Chief Executive Officer, has officially retired from the Company and its Board of Directors, effective today. Thi La, formerly the Company's President and Chief Operating Officer, has assumed the role of Chief Executive Officer.

Originally announced in February 2025, the transition is part of a long-planned succession strategy approved by Corsair's Board of Directors. Ms. La steps into the CEO role after more than 14 years with Corsair, where she has held key executive positions in operations, product leadership, and strategic development.

TrendForce's latest investigations reveal that 1Q25 revenue for the global IC design industry reached US$77.4 billion, marking a 6% QoQ increase and setting a new record high. This growth was fueled by early stocking ahead of new U.S. tariffs on electronics and the ongoing construction of AI data centers around the world, which sustained strong chip demand despite the traditional off-season.

NVIDIA remained the top-ranking IC design company, with Q1 revenue surging to $42.3 billion—up 12% QoQ and 72% YoY—thanks to increasing shipments of its new Blackwell platform. Although its H20 chip is constrained by updated U.S. export controls and is expected to incur losses in Q2, the higher-margin Blackwell is poised to replace the Hopper platform gradually, cushioning the financial impact.

As demand for ever-growing AI compute power continues to rise and manufacturing advanced nodes becomes more difficult, packaging is undergoing its golden era of development. Today's advanced accelerators often rely on TSMC's CoWoS modules, which are built on wafer cuts measuring no more than 120 × 150 mm in size. In response to the need for more space, TSMC has unveiled plans for CoPoS, or "Chips on Panel on Substrate," which could expand substrate dimensions to 310 × 310 mm and beyond. By shifting from round wafers to rectangular panels, CoPoS offers more than five times the usable area. This extra surface makes it possible to integrate additional high-bandwidth memory stacks, multiple I/O chiplets and compute dies in a single package. It also brings panel-level packaging (PLP) to the fore. Unlike wafer-level packaging (WLP), PLP assembles components on large, rectangular panels, delivering higher throughput and lower cost per unit. Systems with PLP will be actually viable for production runs and allow faster iterations over WLP.

TSMC will establish a CoPoS pilot line in 2026 at its Visionchip subsidiary. In 2027, the pilot facility will focus on refining the process, to meet partner requirements by the end of the year. Mass production is projected to begin between the end of 2028 and early 2029 at TSMC's Chiayi AP7 campus. That site, chosen for its modern infrastructure and ample space, is also slated to host production of multi-chip modules and System-on-Wafer technologies. NVIDIA is expected to be the launch partner for CoPoS. The company plans to leverage the larger panel area to accommodate up to 12 HBM4 chips alongside several GPU chiplets, offering significant performance gains for AI workloads. At the same time, AMD and Broadcom will continue using TSMC's CoWoS-L and CoWoS-R variants for their high-end products. Beyond simply increasing size, CoPoS and PLP may work in tandem with other emerging advances, such as glass substrates and silicon photonics. If development proceeds as planned, the first CoPoS-enabled devices could reach the market by late 2029.

ASUS today announced the Prime MR120 series of case fans, designed for quiet and capable cooling performance with a gorgeous design that adds style to any PC. The MR120 series is built to keep a user's hottest components cool and their rig quiet. PWM control and a wide RPM range also mean the MR120 series will stay ultraquiet during lightweight tasks and crank up the cooling when it is time to run demanding apps. With a maximum noise output of 21dB(A), the MR120 Standard fan model will keep unwanted sound to a minimum so users can enjoy aural bliss in their gaming sessions. The MR120 Reverse stays similarly muted with a maximum noise output of 23dB(A). The latter is ideal for users who want an interior-facing fan that emphasizes RGB, presents unobstructed fan blades and keeps things quiet.

The MR120 series achieves a delicate balance of low noise and effective cooling thanks to its thick 28 mm frame. This allows for wider blades and enables high static pressure to push air deep into the nooks and crannies of a system. The Standard model of the MR120 provides up to 58CFM of airflow and 1.7mmH₂O of static pressure for an ample ability to handle airflow resistance, cool components and prevent heat buildup. The Reverse model of the MR120 provides strong cooling performance as well, offering up to 58CFM and 1.38mmH₂O static pressure.

Over a century ago, Henry Ford pioneered the mass production of cars and engines to provide transportation at an affordable price. Today, the technology industry manufactures the engines for a new kind of factory—those that produce intelligence. As companies and countries increasingly focus on AI, and move from experimentation to implementation, the demand for AI technologies continues to grow exponentially. Leading system builders are racing to ramp up production of the servers for AI factories—the engines of AI factories—to meet the world's exploding demand for intelligence and growth. Dell Technologies is a leader in this renaissance. Dell and NVIDIA have partnered for decades and continue to push the pace of innovation. In its last earnings call, Dell projected that its AI server business will grow at least $15 billion this year.

"We're on a mission to bring AI to millions of customers around the world," said Michael Dell, chairman and chief executive officer, Dell Technologies, in a recent announcement at Dell Technologies World. "With the Dell AI Factory with NVIDIA, enterprises can manage the entire AI lifecycle across use cases, from training to deployment, at any scale." The latest Dell AI servers, powered by NVIDIA Blackwell, offer up to 50x more AI reasoning inference output and 5x improvement in throughput compared with the Hopper platform. Customers use them to generate tokens for new AI applications that will help solve some of the world's biggest challenges, from disease prevention to advanced manufacturing.

Browse the list of bestselling PC cases on Amazon, and you'll see a pattern emerge very quickly. Today's PC builders aren't deciding whether they want a tempered glass side panel: they're deciding how many of these panels they want. Panoramic PC cases provide an undeniably gorgeous view of your internal PC hardware, so it's no wonder that they've soared in popularity. But that wide-open panorama does pose a problem for people who prefer a pristine PC. If you have a stray cable or wire in such a build, you'll notice it every time you sit down at your desk.

Already, we offer an ecosystem of BTF motherboards, PC cases, and graphics cards that help you tuck your PC's wires and cables out of sight. But we're interested in doing even more, and we're eager to present solutions that work with traditional PC hardware designs, not just BTF. Behind the scenes, we've been working on modular hardware concepts that cut down on cable clutter for two key components: chassis fans and AIO coolers. Visitors to our Computex 2025 booth will get to see this concept hardware in action, but perhaps a trip to Taipei isn't in the works for you this year. Let's take a closer look.

EK, a leader in high-performance liquid cooling solutions, proudly presents the EK-Quantum Vector³ Suprim RTX 5090 - Plexi. This meticulously engineered water block is tailored for MSI's flagship Suprim RTX 5090 graphics card, delivering unparalleled thermal performance and a striking visual appeal.

Next-Generation Cooling for the RTX 5090
At the heart of the Vector³ Suprim RTX 5090 lies an advanced cooling engine, featuring an expanded fin array and optimized coolant flow paths. This design ensures efficient heat dissipation from critical components, including the GPU core, VRAM, and power stages. Complementing this is a custom CNC-machined backplate that not only reinforces the structural integrity of the card but also passively cools PCB hotspots, maintaining optimal performance under load.

AI is creating value for everyone—from researchers in drug discovery to quantitative analysts navigating financial market changes. The faster an AI system can produce tokens, a unit of data used to string together outputs, the greater its impact. That's why AI factories are key, providing the most efficient path from "time to first token" to "time to first value." AI factories are redefining the economics of modern infrastructure. They produce intelligence by transforming data into valuable outputs—whether tokens, predictions, images, proteins or other forms—at massive scale.

They help enhance three key aspects of the AI journey—data ingestion, model training and high-volume inference. AI factories are being built to generate tokens faster and more accurately, using three critical technology stacks: AI models, accelerated computing infrastructure and enterprise-grade software. Read on to learn how AI factories are helping enterprises and organizations around the world convert the most valuable digital commodity—data—into revenue potential.

Our diverse lineup of GeForce RTX 50 Series graphics cards is getting even larger with the arrival of new White Editions. With these high-performance, cutting-edge cards, you'll be able to keep your frost-hued battlestation color coordinated. Check out the snazzy new White Edition offerings from ROG, TUF Gaming, and Prime.

Max out your snow-white rig with peak power from ROG Astral
If you want the most power possible in a ravishing white graphics card, consider the ROG Astral GeForce RTX 5090 White Edition 32 GB and ROG Astral GeForce RTX 5080 White Edition 16 GB. These VRAM-loaded cards comprise the top of the power stack. They both feature a quad-fan design for more airflow than last-gen's flagship cards, our patented vapor chamber tech, and eight heatpipes for incredible heat dissipation. These cards also swap out thermal paste for a premium phase-change thermal pad, enhancing the longevity of the graphics card's thermal interface material.

They say that the most difficult part of transportation planning is last-mile delivery. A network of warehouses and trucks can bring products within a mile of almost all customers, but logistical challenges and costs add up quickly in the process of delivering those goods to the right doors at the right time. There's a similar pattern in the AI space. Massive data center installations have empowered astonishing cloud-based AI services, but many researchers, developers, and data scientists need the power of an AI supercomputer to travel that last mile. They need machines that offer the convenience and space-saving design of a desktop PC, but go well above and beyond the capabilities of consumer-grade hardware, especially when it comes to available GPU memory.

Enter a new class of AI desktop supercomputers, powered by ASUS and NVIDIA. The upcoming ASUS AI supercomputer lineup, spearheaded by the ASUS ExpertCenter Pro ET900N G3 desktop PC and ASUS Ascent GX10 mini-PC, wield the latest NVIDIA Grace Blackwell superchips to deliver astounding performance in AI workflows. For those who need local, private supercomputing resources, but for whom a data center or rack server installation isn't feasible, these systems provide a transformative opportunity to seize the capabilities of AI.

Taiwan's electronics manufacturing services (EMS) providers are accelerating their North American production plans in response to tariff threats, but component shortages and capacity constraints at US chip plants could hamper the AI server market for years, according to industry sources.

"Since Trump's election, Taiwanese manufacturers have been strategically expanding their US presence," said Yen Chou, an analyst at DIGITIMES Research. "Most server manufacturers are concentrating in Texas, with Foxconn's FII already operating there and planning expansions."

Agentic AI is redefining the cybersecurity landscape—introducing new opportunities that demand rethinking how to secure AI while offering the keys to addressing those challenges. Unlike standard AI systems, AI agents can take autonomous actions—interacting with tools, environments, other agents and sensitive data. This provides new opportunities for defenders but also introduces new classes of risks. Enterprises must now take a dual approach: defend both with and against agentic AI.

Building Cybersecurity Defense With Agentic AI
Cybersecurity teams are increasingly overwhelmed by talent shortages and growing alert volume. Agentic AI offers new ways to bolster threat detection, response and AI security—and requires a fundamental pivot in the foundations of the cybersecurity ecosystem. Agentic AI systems can perceive, reason and act autonomously to solve complex problems. They can also serve as intelligent collaborators for cyber experts to safeguard digital assets, mitigate risks in enterprise environments and boost efficiency in security operations centers. This frees up cybersecurity teams to focus on high-impact decisions, helping them scale their expertise while potentially reducing workforce burnout. For example, AI agents can cut the time needed to respond to software security vulnerabilities by investigating the risk of a new common vulnerability or exposure in just seconds. They can search external resources, evaluate environments and summarize and prioritize findings so human analysts can take swift, informed action.

LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.

In 2022, LG Innotek announced its plans to launch a business producing FC-BGAs, high-value semiconductor substrates. To build the Dream Factory, the company acquired LG Electronics' Gumi 4 Factory and began full-scale mass production in February 2024.

A series of April leaks have suggested that Apple's mixed reality headset engineering team is concocting two distinct next-gen solutions. Mid-month, leakers shared alleged early shots of "Vision Air"-related connectors and external parts—hinting at a potential dark blue colorway. Combined with a selection of fairly legitimate-sounding predictions from a notorious industry watcher, so-called Vision Pro sequels are on the way. Apple's Chinese manufacturing partners are reportedly deep into mass production of crucial "Vision Pro 2" components. Mark Gurman's "Power On" newsletter has provided plenty of inside knowledge stories over the past couple of months—his latest article included a section dedicated to fresh VR/AR insights: "I reported earlier this month that Apple is full steam ahead on two new successors to the Vision Pro (2023): a lighter version at a cheaper price point, and a Mac-tethered model aimed at applications that need maximum responsiveness."

He continued: "all signs point to the lighter model arriving between the end of this year and the first half of 2026. Despite the first version selling poorly, the company isn't abandoning ship here. The main uncertainty is whether the lighter version will be considered a replacement for the Vision Pro or a cheaper alternative." In theory, Apple could test "more mainstream" gaming waters with an initial rollout of the claimed cheaper + lightweight "Vision Air" model—perhaps set to do battle with readily available rival devices; e.g. Meta's dominant Quest 3 range. A full-blown Vision Pro follow-up could launch later on in 2026—likely reserved for upper-crust customers, with an increased focus on productivity applications.

Recent trends in the NAS market and general tech market has shown a propensity to lock down their devices to prevent you from using the device you paid for as you see fit. We at ASUSTOR do not believe in locking down your NAS device. As such, all ASUSTOR NAS devices come in an unlocked state. Today, ASUSTOR is announcing its intention to continue to maintain its devices in an unlocked state for maximum freedom.

Owning Your Products!
In recent years, companies across the tech industry have announced tighter and tighter vendor lock-in requirements that are largely arbitrary in nature. This has been in the form of putting software locks that disallow the use of unauthorized software or peripherals on devices you purchase with your hard earned money. Examples of this include companies forcing use of in-house branded hardware like hard drives in a NAS, locking out third party operating systems and apps not approved by the vendor This is part of a general trend towards disposable technology, vendor lock-in, planned obsolescence, and anti-consumer practices all at an unnecessary expense to you, the consumer. At ASUSTOR, we believe that you own the hardware you purchase, and as such, ASUSTOR NAS devices come in an unlocked state. ASUSTOR NAS devices do not place arbitrary restrictions on your use of the device, while using a non-approved drive on NAS devices with vendor lock-in policies can cause error messages or loss of features like building a RAID pool or knowledge of drive health and more.

Just before the official launch of Radeon RX 9070 XT graphics cards, members of the Chiphell forum expressed concerns about unnamed evaluation samples exhibiting worrying memory module temperatures. Days later, Western review outlets published similar findings across several board partner specimens. Typically, pre-launch and retail units have utilized SK hynix GDDR6 VRAM modules—TechPowerUp's W1zzard uncovered numerous examples of the manufacturer's "H56G42AS8DX-014" model during teardown sessions. Curiously, Chinese PC hardware enthusiasts have happened upon Radeon RX 9070 XT cards that utilize Samsung GDDR6 memory modules. It is not clear whether Yeston has outfitted its flagship Sakura Atlantis OC SKU with Samsung components from the very beginning, but one owner documented a GPU-Z diagnostics session—late last month—showing "GDDR6 (Samsung)" onboard. Earlier this month, insiders posited that NVIDIA was in the process of changing its main GDDR7 memory vendor—from Samsung to SK hynix—for the GeForce RTX 50-series.

According to a recent Guru3D news piece, additional cases were reported. Online conjecture points to "higher end" custom models being updated with "cooler" modules. Hilbert Hagedoorn—Guru3D's head honcho—has gathered compelling information via community feedback channels: "the transition to Samsung memory has yielded noticeable thermal advantages. Early reviews and comparisons indicate that the new memory modules help lower temperatures significantly. Custom RX 9070 XT models running demanding benchmarks like Furmark have demonstrated memory temperatures of 75°C or lower without necessitating an increase in voltage or a reduction in clock speeds. Notable manufacturers, including Sapphire, XFX, and GIGABYTE, have already integrated Samsung's GDDR6 into their custom variants. However, as of now, AMD has not authorized its partners to explicitly differentiate between models with SK hynix and Samsung memory, likely to avoid confusion among consumers and maintain a consistent product lineup." Additionally, TechPowerUp forum members have found Samsung GDDR6 memory on Radeon RX 9070 XT and RX 9070 custom models. Thanks for the tip, Fluffmeister.

PlayStation 5 Pro console—the most innovative PlayStation console to date—elevates gaming experiences to the next level with features like upgraded GPU, advanced ray tracing, and PlayStation Spectral Super Resolution (PSSR) - an AI-driven upscaling that delivers super sharp image clarity with high framerate gameplay. Today we're providing a closer look at the console's internal architecture, as Sony Interactive Entertainment engineers Shinya Tsuchida, PS5 Pro Mechanical Design Lead and Shinya Hiromitsu, PS5 Pro Electrical Design Lead, provide a deep-dive into the console's innovative technology and design philosophy.

Note: in this article, we refer to the PlayStation 5 model released in 2020 as the "original PS5," the PS5 released in 2023 as the "current PS5," and the PS5 Pro released in 2024 as the "PS5 Pro." Do not try this at home. Risk of fires, and exposure to electric shock or other injuries. Disassembling your console will invalidate your manufacturer's guarantee.

TrendForce's latest research reveals that although the U.S. has granted a 90-day grace period before implementing reciprocal tariffs—offering temporary relief for notebook brands—the broader market remains clouded by policy and economic uncertainty. Brands began frontloading inventory in late 2024, pushing Q4 shipment growth to 5.1%, with 1Q25 seeing a 7.2% YoY increase.

However, given persistent economic weakness and rising tariff risks, TrendForce has revised the full-year 2025 notebook brand shipment growth forecast downward from 3.6% to just 1.4%.

The Taiwan media is reporting that Foxconn has been busy moving more and more of its production from China to India, with the main focus being on Apple's iPhone and iPad products for now. Foxconn has been producing iPhones for the Indian market in India since 2019, but the story here is that China has banned Foxconn from sending Chinese staff to India to train the local staff and oversee the production. This has resulted in Foxconn having to send staff from Taiwan to India instead, but they might not be as familiar with the entire production process as the ones that are based in the factories in China.

This is only part of the issue though, as the news reports are also mentioning that China is preventing Foxconn from sending machines and equipment needed for the production to India. The same issue is said to be affecting other Taiwanese companies that are moving some of their production out of China to India, but they've had no issues when it comes to sending equipment to other nations in South East Asia. The equipment is apparently not possible to produce locally in India either, which means that these companies are more or less being forced to keep their production in China. To work around this issue, Foxconn is said to be sending half-finished phones and components to India, to do the final assembly there, to keep up production in India. So far, this is just rumours out of Taiwan, but it looks like China is intent on keeping the production on its shores for as long as it can.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4. Designed as an evolutionary step beyond the previous HBM3 standard, JESD270-4 HBM4 will further enhance data processing rates while maintaining essential features such as higher bandwidth, power efficiency, and increased capacity per die and/or stack, because the higher bandwidth enables the higher data processing rate.

The advancements introduced by HBM4 are vital for applications that require efficient handling of large datasets and complex calculations, including generative artificial intelligence (AI), high-performance computing, high-end graphics cards, and servers. HBM4 introduces numerous improvements to the prior version of the standard, including:

The DOOM Slayer is back, and as we count down the days until you can explore the medieval world of DOOM: The Dark Ages, you'll need the right tools to get the job done. Introducing the Xbox Wireless Controller - DOOM: The Dark Ages Limited Edition, Xbox Elite Wireless Controller Series 2 - DOOM: The Dark Ages Limited Edition, and the Xbox Series X Wrap - DOOM: The Dark Ages Limited Edition. This collection celebrates DOOM and the latest chapter in the franchise's storied history. From the runes adorning each piece, to specific homages like the matte green armor and the Mark of the Slayer, every detail in this collection has been thoughtfully selected to capture the essence of the DOOM universe.

If you're going to be the Slayer, you better look the part—gear up with the Limited Edition Xbox Wireless Controller in battle-worn green and silver. Crowned with 3D silver helmet spikes at the top and silver-plated sheathing on the two sides, this controller was forged for a demon-slaying super weapon. With additional touches like a rubberized, leather-like grip, a red thumbstick to match the chest port, and blood splatter resulting from your Shield Saw, every detail is crafted with the DOOM fan in mind.

As the US works to bring more semiconductor manufacturing back home, the machines needed to turn silicon into the world's most advanced processors are becoming pricier and harder to get, thanks to tariffs. Foundries building new fabs report that the specialized equipment they rely on, everything from extreme ultraviolet (EUV) lithography steppers to chemical vapor deposition chambers, carries a roughly 15% premium compared with similar gear sold overseas. Several forces are at play. The raw materials, high‑grade quartz for vacuum enclosures, and exotic metal alloys for precision optics have climbed in price. At the same time, key components like ultra‑accurate motion stages and alignment sensors are in short supply, sometimes stretching lead times for critical subsystems well beyond 18 months. For a fab racing to move from a 7 nm to a 5 nm process, those delays can mean missing tight ramp‑up targets and pushing out product launches.

Smaller chipmakers feel the squeeze the hardest. With fewer orders to negotiate volume discounts, second‑tier foundries may see their capital budgets balloon by 20 percent or more. In response, some are taking a mixed approach, sourcing commoditized tools such as oxidation furnaces and rapid thermal processors from multiple suppliers while reserving single‑vendor deals for high‑stakes systems like EUV scanners. Government support through the CHIPS Act offers a partial safety net, helping to subsidize capital expenditures. Yet even with grants and tax credits, the challenges will remain. Success will hinge on tight coordination between fabs, equipment makers, and policymakers to tame rising costs, shorten delivery schedules, and keep America's chip renaissance on track.

HP is expanding into the DIY gaming PC market with a new line of Omen-branded components, moving beyond its traditional prebuilt systems and laptops. The upcoming product lineup includes a single 120 mm RGB fan, a triple-pack of 120 mm modular RGB fans, a 1000 W modular power supply, a 240 mm LCD liquid cooling system, and a 360 mm aRGB liquid cooling system. HP confirms these components will work with non-Omen desktop systems, giving PC builders more flexibility.

The fans feature an annular design to help increase the airflow (up to 74 CFM) while reducing vibration through improved static pressure. Each fan includes aRGB LEDs that are customizable via HP's Omen Gaming Hub (OGH) software. They support HP's daisy chain system (up to 10 fans), or connect up to 16 fans through a single Omen Modular Hub. The AIO liquid cooling uses Asetek's 7th Gen pump with a built-in 2.1-inch IPS LCD (for the 240 mm model) and fans with aRGB Gen 2 lighting effects with OGH. HP is also offering the OMEN 1,000 W ATX 3.1 PSU with Cybernetics Platinum and 80 Plus Gold certification. The power supply is fully modular featuring 12 V-2×6 and 12VHPWR connectors with up to 600 W of power and a Zero RPM fan mode for quiet operation., While specific release dates and pricing haven't been announced, HP's website indicates these products are "coming soon."

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced a new range of products that enhance cooling efficiency, offer streamlined form factors, and deliver reliable power for diverse computing needs. From the space-conscious Ncore 100 Air case to updates in the MasterLiquid and Hyper series, Cooler Master continues its focus on performance-driven, user-friendly designs.

"We're excited to introduce a fully integrated lineup that supports PC builders at every level," said Jimmy Sha, CEO of Cooler Master. "From the compact Ncore 100 Air case to our latest MasterLiquid and Hyper coolers, SickleFlow Edge fans, and the MWE Gold V3 PSU, each product underscores our goal of blending performance, reliability, and style into every build."

ViewSonic Corp., a leading global provider of visual and EdTech solutions, has been honored at the prestigious iF Design Award 2025 for its outstanding design excellence. The company earned accolades for its Mac-compatible 5K monitor, 16-inch 16:10 portable monitors, and ViewShare wireless screen casting kit, showcasing its dedication to innovation, sustainability, and user-centric design.

ViewSonic has been honored at the iF Design Award 2025 for its outstanding design excellence
"We're thrilled to see our focus on user-centric innovation—like the ColorPro monitor's stunning 5K clarity for creative professionals, portable monitors for productivity on the go, and ViewShare for seamless collaboration—recognized for the eighth consecutive year at the iF Design Award," said Bonny Cheng, COO at ViewSonic. "Our goal is to deliver comprehensive solutions across business, education, and entertainment while prioritizing sustainability."