iFixit, the company known for publishing tear-down guides and repairability ratings as well as selling official spare parts and components for various electronics brands, has added Microsoft's Xbox consoles to its growing range of official spares. The repair advocacy company today announced in a blog post that Xbox Series X and Series S spares will now be available through iFixit, replete with DIY repair guides for all the spares sold on the online shop. As is typical of iFixit, the goal—aside from the obvious profit motives—is to promote right to repair and DIY repair in order to keep electronics in service for longer, reducing the amount of e-waste that ends up on the trash heap.

The official iFixit Xbox partnership will include both the disc and digital-only versions of the Series consoles, and the parts list is quite extensive, including everything from big-ticket items, like the motherboard assembly and built-in power supply to less obvious things, like the rubber feet and Wi-Fi modules. Xbox controller spares are also available in the Microsoft Repair Hub, and the list of controller spares looks comprehensive, too. Curiously, iFixit will offer both Microsoft's official Series X/S replacement joysticks and Gulikit TMR Electromagnetic joystick modules, which are a drift-resistant upgrade to the stock joysticks.

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced the launch of the MasterFrame Series, an innovative line of PC cases that redefines customization, performance, and artistry in PC design. This adaptable series introduces a bold reimagining of what a PC case can be—blending premium aesthetics with unparalleled functionality.

With its dynamic exo-structure and artist-inspired interchangeable panels, the MasterFrame Series offers a platform for limitless creativity. Whether building high-performance setups, creating content, or showcasing personal style, the MasterFrame empowers users to design PCs as unique as they are.

Leading gaming accessories maker Turtle Beach Corporation (Nasdaq: HEAR), today introduced the ultimate weapon for competitive gamers, the all-new Victrix Pro KO Leverless Fight Stick. Turtle Beach's fully customizable Victrix Pro KO Leverless Fight Stick is officially licensed by Sony Interactive Entertainment and Microsoft to fit any fighting gamer's platform preference and play style and elevate their capabilities in a match. The Victrix Pro KO Leverless Fight Stick is designed and crafted to the highest standard with premium features and components. Hot swappable Cherry MX Speed Silver RGB switches, customizable RGB lighting, a removable aluminium top plate, and up to 16 moveable and mappable buttons give players total control over their gaming experience.

It's time to raise your rank and level up your fighting game gear with the confidence to compete at a professional level. The Victrix Pro KO Leverless Fight Stick for PlayStation is compatible with PS5 and PS4 consoles and Windows 10/11 PCs, while the Designed for Xbox version is compatible with Xbox Series X|S, Xbox One, and Windows 10/11 PCs. The Victrix Pro KO Leverless Fight Stick is available for pre-order for $249.99/£229.99/€249.99 MSRP at www.victrixpro.com and participating retailers and launches December 13, 2024.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced that a select range of thermal solutions will be compatible with Intel's latest Core Ultra 200S Series processors. Cooler Master remains committed to providing high-performance cooling solutions that ensure optimal thermal management for Intel's cutting-edge CPUs, delivering enhanced performance and reliability.

The following Cooler Master advanced cooling technologies have been specifically engineered to complement Intel's latest CPUs, ensuring the best temperature management and sustained performance.

ASUS today announced the TUF Gaming GT502 Horizon, a mid-tower PC case with a seamless panoramic view, exceptional cooling and unbeatable style. The front pillar that separated the front and side tempered glass panels on the original GT502 has been removed to give users a seamless window into a build that stretches nearly halfway around the entire case.

Advanced reinforcement techniques strengthen the TUF Gaming GT502 Horizon to maintain its structural integrity without the support of a front pillar. It can comfortably withstand up to 30 kg of weight from above, and its sturdy fabric handles are perfectly capable of helping users adjust the position of their PC, as they could with the original GT502. The TUF Gaming GT502 Horizon is also available in two colors: Classic Black and Snowy White, with color-matched modular cables.

During its Q2 2024 earnings call, NVIDIA confirmed that its upcoming Blackwell-based products are facing low-yield challenges. However, the company announced that it has implemented design changes to improve the production yields of its B100 and B200 processors. Despite these setbacks, NVIDIA remains optimistic about its production timeline. The tech giant plans to commence the production ramp of Blackwell GPUs in Q4 2024, with expected shipments worth several billion dollars by the end of the year. In an official statement, NVIDIA explained, "We executed a change to the Blackwell GPU mask to improve production yield." The company also reaffirmed that it had successfully sampled Blackwell GPUs with customers in the second quarter.

However, NVIDIA acknowledged that meeting demand required producing "low-yielding Blackwell material," which impacted its gross margins. During an earnings call, NVIDIA's CEO Jensen Huang assured investors that the supply of B100 and B200 GPUs will be there. He expressed confidence in the company's ability to mass-produce these chips starting in the fourth quarter. The Blackwell B100 and B200 GPUs use TSMC's CoWoS-L packaging technology and a complex design, which prompted rumors about the company facing yield issues with its designs. Reports suggest that initial challenges arose from mismatched thermal expansion coefficients among various components, leading to warping and system failures. However, now the company claims that the fix that solved these problems was a new GPU photomask, which bumped yields back to normal levels.

This week at Gamescom 2024, HP Inc. unveiled its latest gaming gear from OMEN and HyperX. The new offerings take customization to the next level, allowing gamers to fine-tune their aesthetics and ensure their desktops are future-ready with OMEN components.

"HP is committed to pushing the boundaries of technology to deliver unparalleled, personalized experiences for every gamer," said Josephine Tan, Senior Vice President & Division President of Personal Systems Gaming Solutions. "With our latest innovations in OMEN and HyperX, being showcased at Gamescom 2024, we are excited to elevate the gaming experience. Our goal is to provide users with the tools they need to perform at their best and ensure their systems are upgradable, allowing them to fully immerse themselves in their gaming worlds for years to come."

Newegg Commerce, Inc., a leading global e-commerce company specializing in computers and consumer electronics, today announced that its CPU Trade-In program is now live on Newegg.com. As the latest addition to the GPU Trade-In program launched last year, Newegg's CPU Trade-In program enables customers to trade their used CPUs in exchange for credit toward an entirely new CPU from Newegg.

About the CPU Trade-In Program
A CPU, often referred to as the brain of a computer, enables PCs to process data and operations. When new units become available, users frequently opt to upgrade their system's CPU with newer, faster models capable of accommodating increasingly sophisticated software and programs. Newegg's trade-in program allows customers to trade in their existing aged CPUs for credit toward a new CPU.

Researchers from the University of California, San Diego, have unveiled a significant security vulnerability affecting Intel Raptor Lake and Alder Lake processors. The newly discovered flaw, dubbed "Indirector," exposes weaknesses in the Indirect Branch Predictor (IBP) and Branch Target Buffer (BTB), potentially allowing attackers to execute precise Branch Target Injection (BTI) attacks. The published study provides a detailed look into the intricate structures of the IBP and BTB within recent Intel processors, showcasing Spectre-style attach. For the first time, researchers have mapped out the size, structure, and precise functions governing index and tag hashing in these critical components. Particularly concerning is the discovery of previously unknown gaps in Intel's hardware defenses, including IBPB, IBRS, and STIBP. These findings suggest that even the latest security measures may be insufficient to protect against sophisticated attacks.

The research team developed a tool called "iBranch Locator," which can efficiently identify and manipulate specific branches within the IBP. This tool enables highly precise BTI attacks, potentially compromising security across various scenarios, including cross-process and cross-privilege environments. One of the most alarming implications of this vulnerability is its ability to bypass Address Space Layout Randomization (ASLR), a crucial security feature in modern operating systems. By exploiting the IBP and BTB, attackers could potentially break ASLR protections, exposing systems to a wide range of security threats. Experts recommend several mitigation strategies, including more aggressive use of Intel's IBPB (Indirect Branch Prediction Barrier) feature. However, the performance impact of this solution—up to 50% in some cases—makes it impractical for frequent domain transitions, such as those in browsers and sandboxes. In a statement for Tom's Hardware, Intel noted the following: "Intel reviewed the report submitted by academic researchers and determined previous mitigation guidance provided for issues such as IBRS, eIBRS and BHI are effective against this new research and no new mitigations or guidance is required."

USound, the leading global provider of MEMS speakers, announced today the availability of a new dual speaker audio module that was created in collaboration with the notable global designer and manufacturer Luxshare-ICT. In 2022, the two companies had announced their collaboration for the development of a new audio solution that would fulfill all criteria for true wireless (TWS) earphones. The development is now concluded and Gemini 2.0 UAM-C1102 dual speaker audio module is available for purchase.

"We proudly announce the availability of the most advanced audio module for TWS and IEMs. Gemini 2.0 exceeds market demands by providing unparalleled audio performance in an ultra-compact form; a development that was made possible thanks to the harmonious and fruitful collaboration with Luxshare-ICT. Here at USound, we look forward to seeing our innovative audio components facilitate the production of state-of-the-art consumer electronics products, such as TWS earphones and advanced IEMs." -Ferruccio Bottoni, USound's CEO

HP has envisioned a new approach to MicroLED monitors that could revolutionize how we design and buikd displays. Dubbed "Composable MicroLED Monitors," this concept proposes a modular system where users can assemble their desired monitor configuration from multiple components. At the core of this concept lies a base unit that serves as the foundation, housing the necessary connections and a stand. Users can then attach flat or curved extension modules to the base, allowing various display sizes and formats. These modules resemble puzzle pieces, seamlessly integrating with the base unit through magnetic holders that ensure precise alignment. The true beauty of this concept lies in its scalability and customization options. By combining multiple base units and extension modules, users can create displays of virtually any size or shape tailored to their specific needs.

Whether it's a compact, single-screen setup or an immersive, curved multi-monitor array, the possibilities are endless. HP's illustrations showcase the potential of this concept, with a proposed base unit size of 12" x 12" and extension modules measuring 12" x 6". With integrated switches or software controls, users can even specify how the operating system treats the connected display tiles - as a unified, large display or as separate, independent screens. While this concept's modular nature promises infinite flexibility, it also presents a challenge: the inevitable gaps between modules. HP's research paper delves into potential solutions to minimize these gaps, ensuring a seamless visual experience for users. Whether HP's "Composable MicroLED Monitors" concept will transition from a study to a tangible product remains to be seen. However, one thing is sure: this pioneering approach could open up a world of possibilities for display technology, enabling users to create truly personalized and tailored visual experiences.

The Taiwanese Ministry of Economic Affairs (MOEA) managed to herd government representatives and leading Information and Communication Technology (ICT) industry figures together for an important meeting, according to DigiTimes Asia. The report suggests that the main topic of discussion focused on an anticipated growth of Taiwan's ICT industry—current market trends were analyzed, revealing that the nation absolutely dominates in the AI server segment. The MOEA has (allegedly) determined that Taiwan has shipped 90% of global AI server equipment—DigiTimes claims (based on insider info) that: "American brand vendors are expected to source their AI servers from Taiwanese partners." North American customers could be (presently) 100% reliant on supplies of Taiwanese-produced equipment—a scenario that potentially complicates ongoing international tensions.

The report posits that involved parties have formed plans to seize opportunities within an evergrowing global demand for AI hardware—a 90% market dominance is clearly not enough for some very ambitious industry bosses—although manufacturers will need to jump over several (rising) cost hurdles. Key components for AI servers are reported to be much higher than vanilla server parts—DigiTimes believes that AI processor/accelerator chips are priced close to ten times higher than general purpose server CPUs. Similar price hikes have reportedly affected AI adjacent component supply chains—notably cooling, power supplies and passive parts. Taiwanese manufacturers have spread operations around the world, but industry watchdogs (largely) believe that the best stuff gets produced on home ground—global expansions are underway, perhaps inching closer to better balanced supply conditions.

In developing the OPX1000, a controller fit for the ever-growing quantum processors counting 1,000 qubits and beyond, we had to think deeply about every detail that impairs scalability. Our recently unveiled OPX1000 module for microwave generation (MW-FEM) generates pulses up to 10.5 GHz directly, without analog oscillators or mixers. The choice of technology to reach microwave frequencies is not trivial. We choose cutting-edge direct digital synthesis (DDS) for very specific reasons, and we believe it will enable scalability and performance to an even greater degree. In this blog, we dive deeper into the considerations for going this route and existing alternatives. So stick around, whether you like mixers or hate them, this will be an interesting ride.

Summary of Technologies for Microwave Operation
The control signals for qubit drive and readout often fall in the microwave range, which is outside the range of baseband controllers. Many qubit labs have solved the issue with solutions based on mixing, including single sideband mixers, IQ-mixers, or more complicated schemes such as double super-heterodyne (DSH) conversion. Mixer-based solutions make use of analog local oscillators (LOs) that are multiplied by the signal of a controller or an AWG. IQ-mixers naturally suffer from two main spurs (affectionate name for unwanted signals), the LO leakage and the mixer image, which require non-trivial calibration to be removed. Other schemes, such as double super-heterodyne, offer a zero-calibration solution but use many more components. Additionally, mixing schemes require having an LO source per mixer if different drive frequencies are used. Having a low phase source per mixer is very expensive, and in order to cut prices, will probably include a phase-lock loops (PLL), leading to phase differences between channels, which is detrimental for multi-qubit systems. In other words, while mixers can be useful, we need to be aware of the pros and cons involved.

In Sept. 2023, Quantum Machines (QM) unveiled OPX1000, our most advanced quantum control system to date - and the industry's leading controller in terms of performance and channel density. OPX1000 is the third generation of QM's processor-based quantum controllers. It enhances its predecessor, OPX+, by expanding analog performance and multiplying channel density to support the control of over 1,000 qubits. However, QM's vision for quantum controllers extends far beyond.

OPX1000 is designed as a platform for orchestrating the control of large-scale QPUs (quantum processing units). It's equipped with 8 frontend modules (FEMs) slots, representing the cutting-edge modular architecture for quantum control. The first low-frequency (LF) module was introduced in September 2023, and today, we're happy to introduce the Microwave (MW) FEM, which delivers additional value to our rapidly expanding customer base.

Samsung, SK hynix, and Micron are considered to be the top manufacturing sources of High Bandwidth Memory (HBM)—the HBM3 and HBM3E standards are becoming increasingly in demand, due to a widespread deployment of GPUs and accelerators by generative AI companies. Taiwan's Commercial Times proposes that there is an ongoing shortage of HBM components—but this presents a growth opportunity for smaller manufacturers in the region. Naturally, the big name producers are expected to dive in head first with the development of next generation models. The aforementioned financial news article cites research conducted by the Gartner group—they predict that the HBM market will hit an all-time high of $4.976 billion (USD) by 2025.

This estimate is almost double that of projected revenues (just over $2 billion) generated by the HBM market in 2023—the explosive growth of generative AI applications has "boosted" demand for the most performant memory standards. The Commercial Times report states that SK Hynix is the current HBM3E leader, with Micron and Samsung trailing behind—industry experts believe that stragglers will need to "expand HBM production capacity" in order to stay competitive. SK Hynix has shacked up with NVIDIA—the GH200 Grace Hopper platform was unveiled last summer; outfitted with the South Korean firm's HBM3e parts. In a similar timeframe, Samsung was named as AMD's preferred supplier of HBM3 packages—as featured within the recently launched Instinct MI300X accelerator. NVIDIA's HBM3E deal with SK Hynix is believed to extend to the internal makeup of Blackwell GB100 data-center GPUs. The HBM4 memory standard is expected to be the next major battleground for the industry's hardest hitters.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.

At the CES 2024 show, Thermaltake announced new additions to its cooling lineup—the TOUGHLIQUID EX Pro all-in-one liquid coolers and TOUGHFAN EX Pro high static pressure fans. The new releases incorporate Thermaltake's latest MagForce 2.0 magnetic quick-connect system for simplified installation and flexible component layouts. Available in a range of sizes spanning 240 mm to 420 mm radiator sizes, the TOUGHLIQUID EX Pro leverages large copper radiators and industrial mirror finish water blocks to tame high-TDP CPUs like Intel's 14th gen Core i9 models. TOUGHFAN EX Pro series fans complement the liquid coolers with detachable blades, allowing flow direction swapping based on mounting orientation.

For example, chassis top-mounted radiator fans can be inverted to intake cool air rather than recirculate hot interior air. The TOUGHFAN EX Pro uses enhanced steel motor hubs and copper motor housing for robust performance under pressure. Models push over 70 CFM airflow at noise levels under 30 dBA. By using evolving magnetic-based modular cooling, Thermaltake aims to simplify complex builds and accommodate flexible orientations that are not feasible with wired connections. Combined with extreme static pressure fans, the new TOUGHLIQUID EX Pro and TOUGHFAN Pro EX enable users to cool today's most powerful components efficiently without compromising system aesthetics. The TOUGHFAN EX12 Pro - Swappable Edition comes with an MSRP of $79.99/$89.99 and TOUGHLIQUID 240/280/360/420 Pro ARGB comes at $119.99/$129.99/$139.99/$169.99 pricing structure. The OLED-enabled TOUGHLIQUID OLED 360 Pro comes with a slight premium and is priced at $299.99.

During the CES 2024, Thermaltake announced the CTE E600 MX series of cases, in addition to the Tower 300 micro-ATX design shown at the company booth. Firstly, The Thermaltake CTE E600 MX mid-tower chassis focuses on exceptional cooling, customization, and tidy cable management. Its dual-chamber layout separates hot components from cables, with 12 potential fan mounts and 420 mm radiator support. Interchangeable front panels allow configuring for either maximum airflow or sleek tempered glass viewing. A bundled 400 mm PCIe 4.0 riser cable uniquely enables three GPU orientation options - standard, vertical, or a "floating" centered mount showcasing your graphics card. Anchor points and included ties facilitate organizing wiring neatly out of sight in the partitioned cable chamber. With outstanding flexibility tailoring both form and function, the CTE E600 MX empowers users to build their perfect customized system matching individual style and cooling demands. The CTE E600 comes with an MSRP of $179.99.

The recent attacks on cargo ships in the Red Sea are affecting not only oil shipments, but also cargo ships from Asia to Europe. All major carriers such as CMA CGM, Cosco, Evergreen, Hapag-Lloyd, Maersk, MSC and so forth are affected and all have delayed their shipments through the area. A coordinated security action called Operations Prosperity Guardian which includes over half a dozen nations so far, is getting ready to guide shipments through the affected area by Yemen, but it'll lead to slower shipments through the area.

TechPowerUp has already received reports from sources in Taiwan that their products are on some of these ships that are now stuck waiting for naval escorts through the area. However, it appears that there might be shortages of some computer components for the foreseeable future, alongside many other products that are being shipped this route and onwards via the Suez Canal. According to the BBC, it takes 25.5 days on average to ship goods from Taiwan to the Netherlands via the Red Sea and Suez Canal whereas the only alternative route via the Cape of Good Hope takes 34 days and adds extra fuel costs. Regardless of the extra shipping times and costs, it appears some shipping companies are willing to take the longer route to avoid being attacked. This is likely to have a knock on effect on prices for a lot of consumer goods in Europe, so if you haven't bought that hardware you've been holding off getting, now might be as good a time as any.

Binarly's research team has discovered a collection of security vulnerabilities known as "LogoFAIL", which affects image parsing components within the UEFI firmware of a wide array of devices. These vulnerabilities are especially concerning because they are embedded within the reference code provided by Independent BIOS Vendors (IBVs), affecting not just a single vendor but a broad spectrum of devices that utilize this code. LogoFAIL is particularly dangerous because it allows attackers to bypass crucial security measures such as Secure Boot and Intel Boot Guard by executing a payload during the device's boot process. This is achieved by storing malicious images on the EFI System Partition or within unsigned sections of firmware updates. This method can compromise system security deeply without altering the runtime integrity of the bootloader or firmware, unlike other threats such as BlackLotus or BootHole.

The potential reach of LogoFAIL vulnerability is rather wide, with millions of consumer and enterprise-grade devices from various vendors, including ones like Intel, Acer, and Lenovo, being vulnerable. The exact list of affected devices is still undetermined, but the prevalence of the IBVs' code across numerous devices suggests that the impact could be widespread, with both Windows and Linux users being affected. Only PCs that don't allow any logotype displayed in the UEFI during the boot process are safe. Apple's Macs are secure as they don't allow any add-on images during boot, and some OEM prebuilt PCs, like the ones from Dell, don't allow images in the UEFI. Some makers like Lenovo, AMI, and Insyde have already published notes about cautiously uploading custom images to the UEFI and providing BIOS updates. Consumers and enterprises must check with their OEMs and IBVs for BIOS microcode updates to patch against this vulnerability.Below, you can see the proof of concept in a YouTube video.

Yangtze Memory Technologies Corp (YMTC), China's biggest NAND flash memory manufacturer, has successfully raised billions of US Dollars in new capital to adapt to challenging US restrictions. According to the report from Financial Times, YMTC, which was added to a trade blacklist in December and barred from procuring US equipment to manufacture chips, exceeded its funding target. However, the exact amount remains undisclosed. The capital increase became necessary due to YMTC's substantial spending on finding alternative equipment and developing new components and core chipmaking tools. This financing round was oversubscribed by domestic investors, reflecting support for YMTC amid tightening US restrictions.

Last year, YMTC managed to raise 50 billion Chinese Yuan or about 7 billion US Dollars for equipment. Spending it all on the supply chain, the company is now looking to bolster its offerings with additional equipment for its memory facilities. One of the investors in the funding rally for YMTC has made a statement for Finanical Times: "If Chinese companies have equipment that can be used, [YMTC] will use it. If not, it will see if countries other than the US can sell to it. If that doesn't work, YMTC will develop it together with the supplier." This statement indicates that the company is looking into several options, where one is simply developing its custom machinery with the suppliers.

Jabil Inc., a global leader in design, manufacturing, and supply chain solutions, today announced it will take over the manufacture and sale of Intel's current Silicon Photonics-based pluggable optical transceiver ("module") product lines and the development of future generations of such modules.

"This deal better positions Jabil to cater to the needs of our valued customers in the data center industry, including hyperscale, next-wave clouds, and AI cloud data centers. These complex environments present unique challenges, and we are committed to tackling them head-on and delivering innovative solutions to support the evolving demands of the data center ecosystem," stated Matt Crowley, Senior Vice President of Cloud and Enterprise Infrastructure at Jabil. "This deal enables Jabil to expand its presence in the data center value chain."

Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.

In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its range-wide compatibility and readiness for Intel's new 14th Generation Intel Core processors. With a enormous range of tested and validated components such as DDR5 memory, all-in-one liquid CPU coolers, innovative and reliable power supplies, and blazing fast M.2 SSDs, you can be confident that CORSAIR components will pair exceptionally with the latest in Intel processors to help your PC reach its full potential.

The latest Core processors utilize Intel's new Performance Hybrid Architecture, featuring more efficiency-cores for the best gaming experience—even while streaming and encoding video. Other features, such as Intel Thread Director to keep background tasks from slowing down games and Smart Cache for smoother gameplay and faster load times, make 14th Gen Core processors a great choice for PC gaming. But it's not enough to just have the CPU; you need to complete your system with components that can keep up and tap into its full potential, and that's where CORSAIR comes in.

According to the editorial blog post published on the Samsung blog by SangJoon Hwang, Executive Vice President and Head of the DRAM Product & Technology Team at Samsung Electronics, we have information that High-Bandwidth Memory 4 (HBM4) is coming in 2025. In the recent timeline of HBM development, we saw the first appearance of HBM memory in 2015 with the AMD Radeon R9 Fury X. The second-generation HBM2 appeared with NVIDIA Tesla P100 in 2016, and the third-generation HBM3 saw the light of the day with NVIDIA Hopper GH100 GPU in 2022. Currently, Samsung has developed 9.8 Gbps HBM3E memory, which will start sampling to customers soon.

However, Samsung is more ambitious with development timelines this time, and the company expects to announce HBM4 in 2025, possibly with commercial products in the same calendar year. Interestingly, the HBM4 memory will have some technology optimized for high thermal properties, such as non-conductive film (NCF) assembly and hybrid copper bonding (HCB). The NCF is a polymer layer that enhances the stability of micro bumps and TSVs in the chip, so memory solder bump dies are protected from shock. Hybrid copper bonding is an advanced semiconductor packaging method that creates direct copper-to-copper connections between semiconductor components, enabling high-density, 3D-like packaging. It offers high I/O density, enhanced bandwidth, and improved power efficiency. It uses a copper layer as a conductor and oxide insulator instead of regular micro bumps to increase the connection density needed for HBM-like structures.