TrendForce reports that NAND Flash suppliers began reducing production in the fourth quarter of 2024, and the effects are now starting to show. In anticipation of potential U.S. tariff increases, consumer electronics brands have accelerated production, further driving up demand. Concurrently, inventory restocking is underway across the PC, smartphone, and data center sectors. As a result, NAND Flash prices are expected to stabilize in the second quarter of 2025, with prices for wafers and client SSDs projected to rise.

Client SSD prices to rise 3-8% while enterprise SSD prices to remain flat
After three consecutive quarters of inventory depletion, client SSD demand is rebounding as OEMs resume production early. The upcoming end of Windows 10 support and the launch of new-generation CPUs are expected to drive replacement demand for PCs. Meanwhile, the DeepSeek effect is accelerating the adoption of edge AI, further fueling client SSD demand. With production cuts and supply adjustments gradually restoring balance, client SSD contract prices are projected to rise 3% to 8% QoQ in Q2.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

TrendForce's latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Most contract prices across applications were seen to have reversed downward. However, increased procurement of high-capacity server DDR5 by major American CSPs helped sustain price momentum for server DRAM.

On Wednesday (February 19), Apple announced the upcoming launch of its "budget-friendly" iPhone 16e smartphone model. The Cupertino, California-based company has refreshed its entry level product tier—starting at $599—with modernized internals. Apple's new design houses an A18 chipset, as well as their much-discussed debut modem design. The C1 is a custom 5G part; fully developed in-house. Previously, modern iPhone product ranges have been fitted with Qualcomm 5G modems. As expected, Apple contracted with TSMC for the production of A18 and C1 silicon—the A-type SoC is based on a 3 nm process node (TSMC N3E). Their proprietary modem baseband design utilizes 4 mm, while the receiver uses a 7 nm process—according to insiders.

Taiwan's Commercial Times reckons that TSMC will be the "biggest beneficiary" from the aforementioned agreement with Apple. Ctee TW's latest report cites industry analysis; soothsayers estimate annual shipments reaching roughly 22 million units annually. Additional whispers suggest that the C1 modem will turn up in non-iPhone devices—namely next-gen Watches and iPads, by next year. The report also mentions that upcoming Mac products are slated for C1 upgrades. Further leaks have linked project "Ganymede" to a "C2" custom 5G modem design—inside sources believe that a 3 nm TSMC process is on the cards. Another codename—"Prometheus"—was leaked by insiders; possibly referencing a future "C3" model.

Vince "Kingpin" Lucido's latest "Let's Talk" video blog has revealed difficult circumstances—affecting the development of a new-generation "KP Card." The extreme overclocker has announced a planned move back to North America (prioritizing his family) around mid-2025—he has lived in Taiwan for fifteen years—along with a sad project cancellation. Kingpin stated that: "there's no 'my card' this generation. It can't come for Gen 5. It's impossible. There are just too many issues over here, and it would create a lot of problems if I jumped on board so quickly." Mid-last year, Kingpin partnered with PNY—this collaboration reached a "wishlist" phase following tests performed in 3D Mark, according to today's VLOG.

Timing is cited as a major factor in his decision-making—he did not want to sign a Taiwanese vendor's contract and commit significant man-hours during a trying life period. He reckons that he has options further down the line—potentially with US-based companies. His next Kingpin card design (skipping a generation) could be something "unbelievable" and he hinted about it being a surprise. On this subject he stated: "I can't really say much about that. Well, because it has to do with my previous contractual stuff. I love graphics cards. I love making graphics cards, and for sure, I don't think that's going to die. But I think we'll have to wait-still have to wait for another generation. And who knows? Maybe it won't be Team Green; maybe it'll be another color."

TrendForce's latest findings reveal that NAND Flash products have been impacted by weaker-than-expected seasonal demand in the second half of 2024, leading to a decline in wafer contract prices in Q3. This downward trend is projected to deepen, with prices expected to drop by more than 10% in Q4.

Enterprise SSDs are the only segment likely to see modest price growth—supported by stable order momentum—with contract prices forecast to rise by 0-5% in Q4. However, PC SSDs and UFS will see more cautious procurement strategies from buyers, as weaker-than-expected sales of end products drive buyers to adopt a conservative approach. As a result, TrendForce projects overall NAND Flash contract prices will decline by 3-8% in Q4.

A Microsoft spokesperson confirmed that the delay of Black Myth Wukong on Xbox is not due to the platform's technological limitations but something else entirely. Black Myth: Wukong is a widely known game, reaching a large amount of sales within few months after launch. This well known Black Myth: Wukong, is available for PC and PlayStation 5 players, however one direct competitor is missing. Microsoft's representatives reiterate that Black Myth: Wukong would launch on Xbox soon, but the delay is not due to technological limitations but a case of timed exclusivity by a direct rival, Sony PlayStation.

This claim by the Microsoft representative may be true, after all, before the current generations, Microsoft boasted that their Xbox Series X would be the most powerful household console till date, that surpasses the performance of direct rivals. So that alone may clear the doubts about delay of the game due to platform limitations. Another reason to believe it is because, this isn't the first time we've heard that Sony signed a timed exclusivity contract with devs of a highly potential game title. To avoid competition with direct competitors and just watch the show from the front seat, it's possible that Sony may have done the same again. But then again, it could also be that the developers found out about the technological gaps between the two platforms and decided to hold back the game for a few optimizations before launch. And what the representatives are saying, is just a way to divert the attention from the platform's limitations.

TrendForce reports that memory module makers have been aggressively increasing their DRAM inventories since 3Q23, with inventory levels rising to 11-17 weeks by 2Q24. However, demand for consumer electronics has not rebounded as expected. For instance, smartphone inventories in China have reached excessive levels, and notebook purchases have been delayed as consumers await new AI-powered PCs, leading to continued market contraction.

This has led to a weakening in spot prices for memory products primarily used in consumer electronics, with Q2 prices dropping over 30% compared to Q1. Although spot prices remained disconnected from contract prices through August, this divergence may signal potential future trends for contract pricing.

According to a recent report from Reuters, tech giant Intel is facing a significant legal challenge as shareholders file a lawsuit following a dramatic plunge in the company's stock price. The legal action comes from Intel's recent announcement of dividend suspensions and plans to lay off over 15,000 employees. The semiconductor behemoth saw its market value plummet by a staggering $32 billion in a single day, leaving investors reeling. The Construction Laborers Pension Trust of Greater St. Louis has initiated a proposed class action suit, naming Intel, CEO Pat Gelsinger, and CFO David Zinsner as defendants. The plaintiffs allege that the company made misleading statements about its business operations and manufacturing capabilities, artificially inflating its stock price between January 25 and August 1.

Intel's financial woes stem from underperforming contract foundry operations and 1% drop in revenue during the second quarter of 2024. While it may seem miniscule, declining revenue is paired with a negative 15.3% operating margin, resulting in a net loss of $1.61 billion. The company's August 1 announcement caught many shareholders off guard, prompting accusations of inadequate disclosure and transparency. This lawsuit is just one of several legal battles Intel is currently strangled in. The company is also locked in a patent dispute with R2 Semiconductor across multiple European countries, centering on voltage regulation technology. While Intel has secured a victory in the UK, it faces ongoing litigation in Germany, France, and Italy. Adding to Intel's troubles, a separate class action lawsuit is being explored on behalf of customers who purchased potentially faulty 13th and 14th-generation processors. The company also canceled its September 2024 Innovation event, citing poor financials, without any words on Arrow Lake or Lunar Lake. While the cancelation of events is sad, it is necessary to get financials back on track, and product launches should continue as usual.

TrendForce reports that a recovery in demand for general servers—coupled with an increased production share of HBM by DRAM suppliers—has led suppliers to maintain their stance on hiking prices. As a result, the ASP of DRAM in the third quarter is expected to continue rising, with an anticipated increase of 8-13%. The price of conventional DRAM is expected to rise by 5-10%, showing a slight contraction compared to the increase in the second quarter.

TrendForce notes that buyers were more conservative about restocking in the second, and inventory levels on both the supplier and buyer sides did not show significant changes. Looking ahead to the third quarter, there is still room for inventory replenishment for smartphones and CSPs, and the peak season for production is soon to commence. Consequently, it is expected that smartphones and servers will drive an increase in memory shipments in the third quarter.

Welcome to the first Patch Notes of 2024 for HITMAN World of Assassination. Alongside the return of the Undying, new challenges, and curated contracts, we bring you more than 200 hundred improvements, fixes, and additions to the different areas of the game. Enjoy and happy hunting! HITMAN World of Assassination is now updated to version 3.180 on all platforms; PS5, PS4, Xbox One, Xbox Series X/S, PC, and Switch.

The Undying mission is available in the Free Starter Pack for new players and as an Elusive Target for HITMAN World of Assassination players, for a limited time only. The DLC Undying Pack is also now available, including a suit, items, Freelancer mode decorations, and access to the Undying indefinitely through the Elusive Target Arcade. Players will be able to unleash their creativity against Mark Faba, with a wide variety of tools at their disposal to accomplish their mission and make sure the Undying does not reappear again. The mission takes place in the Miami map, where Agent 47 will have to stop Mark Faba before he can utilize his expert surveillance, infiltration, and demolition skills to complete a contract at the Global Innovation Race event.

Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.

TSMC is experiencing unprecedented demand from AI chip customers—unnamed parties have (fancifully) requested the construction of entirely new fabrication facilities. Taiwan's leading semiconductor contract manufacturer seems to concentrating on "sensible" expansions, mainly in the area of CoWoS packaging output—according to an Economic Daily report, company leadership and local government were negotiating over the construction of four new advanced packaging plants. Insiders propose that plans have been revised—an investment in excess of 500 billion yuan ($16 billion) will enable the founding of six new CoWoS-focused facilities. TSMC is expected to make an official announcement next month—industry moles reckon that construction work will start in April. Two (of the six total) advanced packaging plants could become fully operational before the conclusion of 2024.

Lately, TSMC has initiated an ambitious recruitment drive—targeting around 6000 new workers. A touring entity is tasked with the attraction of "talents with high enthusiasm for semiconductors." The majority of new recruits are likely heading to new or expanded Taiwan-based facilities. The Economic Daily report proposes that Chiayi City's technological hub will play host to TSMC's new CoWoS packaging plants. A DigiTimes Asia news piece (from January) posited that TSMC leadership anticipates CoWoS output reaching 44,000 units by the end of 2024. This predicted tally could grow, thanks to the (rumored) activation of additional factories. CoWoS packaging is considered to be a vital aspect of AI accelerators—insiders believe that TSMC's latest investment will boost production of NVIDIA H100 GPUs. The combined output of six new CoWoS plants will assist greatly in the creation of next-gen B100 chips.

Rumors from last week pointed to a possible $3.5 billion government defense-related investment—Intel was linked to this very lucrative semiconductor supply contract. Insiders posited that the US Department of Commerce was readying a rough $1 billion investment, while the Pentagon prepared around $2.5 billion. The latter has scrapped those plans, according to anonymous sources—Bloomberg believes that this: "move threatens to limit the total amount that Intel has been expecting to get in federal funding, setting up a contentious situation." The publication's moles have requested complete anonymity, due to the secretive nature of policy negotiations.

The US Department of Commerce deliberates over the nation's CHIPS Act—this fund could be utilized to "make up for the shortfall," following the Pentagon's reported last minute course change. The Department of Commerce could be forced to foot the entire bill—of $3.5 billion—if Intel's services are secured. Negotiations over a so-called "Secure Enclave" project have been ongoing since last year, according to insiders. It is possible that the "fast-moving" military spending bill set off alarms at the Pentagon—the Department of Defense's reasonings were not revealed by Bloomberg's investigation. Several media outlets have requested official comments from the two arms of government. Yesterday, Intel shares fell by 3%—as reported Investopedia—with the market reacting to rumors of cancelled plans.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.

TrendForce investigations reveal a significant leap in the DRAM industry for 3Q23, with total revenues soaring to US$13.48 billion—marking 18% QoQ growth. This surge is attributed to a gradual resurgence in demand, prompting buyers to re-energize their procurement activities. Looking ahead to Q4, while suppliers are firmly set on price hikes, with DRAM contract prices expected to rise by approximately 13-18%, demand recovery will not be as robust as in previous peak seasons. Overall, while there is demand for stockpiling, procurement for the server sector remains tentative due to high inventory levels, suggesting limited growth in DRAM industry shipments for Q4.

Three major manufacturers witnessed Q3 revenue growth. Samsung's revenue increased by about 15.9% to US$5.25 billion thanks to stable demand for high-capacity products fueled by AI advancements and the rollout of its 1alpha nm DDR5. SK hynix showcased the most notable growth among manufacturers with a 34.4% increase, reaching about US$4.626 billion and significantly narrowing its market share gap with Samsung to less than 5%. Micron's revenue rose by approximately 4.2% to US$3.075 billion—despite a slight drop in ASP—supported by an upswing in demand and shipment volumes.

Recently, the spot market for NAND Flash chips has seen a rise in active price inquiries for certain products, a movement driven by successful increases in wafer contract prices. TrendForce reports this uptick primarily stems from negotiations in late August between NAND Flash suppliers and key Chinese module makers. These discussions led to a new wafer contract that successfully boosted the price of 512 Gb wafers by approximately 10%.

Other suppliers have also raised prices for their comparable products, signaling a shift in supplier sentiment: they are now less inclined to finalize deals at lower prices. This change has contributed to a short-term surge in the wafer spot market. Nevertheless, whether this surge in procurement is supported by actual end-user demand remains uncertain, as these orders have arisen in reaction to adjustments in supply-side pricing.

In a surprise move, Maxlinear has cancelled its close to US$4 billion takeover of Silicon Motion, despite having received approval by China to finally acquire Silicon Motion. The two companies started their merger back in May of 2022, but over a year later, Maxlinear has announced that it has "exercised its contractual rights to terminate its May 5, 2022 merger agreement". The announcement saw a drop in Maxlinear's shares of about 12 percent and a 25 percent drop for Silicon Motion.

It's unclear as to why Maxlinear cancelled the deal, but the two companies don't appear to have clear synergies outside some storage products. That said, Maxlinear appears to blame Silicon Motion in a press release that the company issues. Among other things, Maxlinear states that "Silicon Motion has suffered a Material Adverse Effect that is continuing, Silicon Motion is in material breach of representations, warranties, covenants, and agreements in the Merger Agreement that give rise to the right of the Company to terminate". As to what this actually means, we'll most likely never find out, but as Maxlinear also points out, the merger was supposed to have been finished by the 23rd of May 2023, which means Maxlinear had the right to cancel the merger regardless.

Three years ago, Intel announced a goal to increase global annual spending with diverse suppliers to $2 billion by 2030. We are proud to announce we reached $2.2 billion in diverse supplier spending in 2022, eight years ahead of schedule. This $2.2 billion represents nearly 15 times the annual total when our supplier diversity program launched in 2015 and double our 2019 results.

There are strong indications that Oppo is winding down its operations in France according to a report published by Frandroid last weekend, which goes against the company's denial that it was exiting several markets across the European Union, including France. Frandroid's investigative piece states that French retail workers had provided enough evidence, back in late March, for the publication to make the claim that Oppo was withdrawing from that region. The news outlet has gathered more insider information since then and now claims that a promotions company - Atmospheres - has not been contracted to help market Oppo's lastest smartphone models, including the Find N2 Flip. The agreement between the two firms was already set to end on June 30, but the promo team was expecting a renewal or extension - their boss finally admitted that it was all over and done with.

Frandroid has observed that Oppo is not updating its display material at big box stores, in particular Fnac Darty, and a salesperson confirmed that that they were only obligated to clear existing smartphone stock and related accessories. A former Oppo regional sales manager told the publication about a cessation of product training - under normal circumstances the team gets briefed about the latest products in advance, but the insider confides (under an alias): "We understood that they were leaving...We see the Find X coming out in China, oh no, it's not coming out in France. We see the new Reno phones arriving, will they be released in France? Neither. When the Find N2 Flip arrives, we are told of a store release, and then finally no, it is only available on the web store."

Samsung Electronics has announced that its sub-division, Samsung Display, is planning to invest $3.1 billion until 2026 in Asan, South Korea to manufacture advanced organic light-emitting diode (OLED) display panels. The country's ministry stated that Samsung's next generation of OLED display panels will be integrated into tablets and laptops. There are already rumors swirling that Apple has contracted with Samsung Display to produce parts for a refresh of the MacBook Pro range that is set to debut at some point before 2026.

Industry insiders are claiming that the substantial investment into the company's Asan, South Chungcheong factory will help fulfil orders placed by Apple for iPad and MacBook OLED displays - the North American company has not officially confirmed an adoption of that type of screen technology for these product ranges. Samsung is likely trying to secure a long term relationship with the Silicon Valley behemoth, and at the same time outmaneuver its competitors in South Korea as well as those in neighboring nations. It has been reported that domestic rival LG is currently unable to take on new orders, as its display factories are functioning at maximum production capacities.

Intel has awarded TSMC with some big contracts for future manufacturing of next generation GPUs, according to Taiwan's Commercial Times. As previously covered on TPU, the second generation Battlemage graphics processing units will get fabricated via a 4 nm process. According to insider sources at both partnering companies, Intel is eyeing a release date in the second half of 2024 for this Xe2-based architecture. The same sources pointed to the third generation Celestial graphics processing units being ready in time for a second half of 2026 launch window. Arc Celestial, which is based on the Xe3 architecture, is set for manufacture in the coming years courtesy of TSMC's N3X (3 nm) process node.

One of the sources claim that Intel is quietly confident about its future prospects in the GPU sector, despite mixed critical and commercial reactions to the first generation line-up of Arc Alchemist discrete graphics cards. The company is said to be anticipating great demand for more potent versions of its graphics products in the future, and internal restructuring efforts have not dulled the will of a core team of engineers. The restructuring process resulted in the original AXG graphics division being divided into two sub-groups - CCG and DCAI. The pioneer of the entire endeavor, Raja Koduri, departed Intel midway through last month, to pursue new opportunities with an AI-focused startup.

Although NAND suppliers have continued to roll back production, there is still an oversupply of NAND Flash as demand for products such as servers, smartphones, and notebooks is still too weak. Therefore, TrendForce predicts that the ASP of NAND Flash will continue to fall in 2Q23, though that decline may shrink to 5~10%. The key to supply and demand returning to a market equilibrium lies in whether NAND suppliers can cut back on production even more. TrendForce believes if demand remains stable, then the ASP of NAND Flash will have an opportunity to rebound in 4Q23; if demand is weaker than expected, then ASP will take longer to recover.

Client SSD: Currently, PC OEM's have managed to liquidate most of their component inventory, and are now gearing up in preparation for mid-year sales events. Suppliers are cutting prices to clear out their inventories of PCIe Gen 3 SSDs, which are gradually being phased out. Meanwhile, prices of PCIe Gen 4 SSDs continue to face downward pressure due to a slow intake of new customer orders. The continuous decline of QLC products in 1Q23 has also dragged down the prices of TLC products, and there is relatively little room for prices to keep falling in 2Q23. While it still remains unclear whether or not demand will recover, TrendForce projects that the prices of PC client SSDs will drop 5~10% in 2Q23.

Reykjavík, Iceland - 21 March 2023 - CCP Games, creators of sci-fi spacefaring MMO EVE Online, announced today that $40M in financing has been secured from external partners. This financing will allow CCP Games to build upon the discoveries of its research & development team to enable the full-scale development of a new AAA title utilizing blockchain technology, set within the EVE Universe.

"Since its inception, CCP Games' vision has been to create virtual worlds more meaningful than real life. Now, with advancements made within blockchain, we can forge a new universe deeply imbued with our expertise in player agency and autonomy, empowering players to engage in new ways. This financing has marked an exciting frontier in our studio history as we begin our third decade of virtual world operations. We are humbled by the confidence from our partners in the development of this new title," said CCP Games CEO, Hilmar V. Pétursson.

According to TrendForce's latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts takes time as well. Hence, only some tier-2 and -3 foundries were able to immediately respond to the changes in their clients' demand. Also, among them, 8-inch wafer foundries made a more pronounced reduction in their capacity utilization rates. As for the remaining foundries, the downward corrections that they made to their capacity utilization rates did not become noticeable until 4Q22. Hence, in 4Q22, the quarterly total revenue of the global top 10 foundries registered a QoQ decline for the first time after 13 consecutive quarters of positive growth. The quarterly total revenue of the top 10 foundries came to US$33,530 million, reflecting a drop of 4.7% from 3Q22. Moving into 1Q23, TrendForce projects that the quarterly total revenue of the top 10 will show an even steeper drop on account of seasonality and the uncertain macroeconomic situation.