Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.