xMEMS Labs, Inc., inventor of the world's first monolithic silicon MEMS air pump, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into XR smart glasses, providing the industry's first in-frame active cooling solution for AI-powered wearable displays.

As smart glasses rapidly evolve to integrate AI processors, advanced cameras, sensors, and high-resolution AR displays, thermal management has become a major design constraint. Total device power (TDP) is increasing from today's 0.5-1 W levels to 2 W and beyond, driving significant heat into the frame materials that rest directly on the skin. Conventional passive heat sinking struggles to maintain safe and comfortable surface temperatures for devices worn directly on the face for extended periods.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, introduces the UNI FAN CL Wireless. Designed as an affordable solution for PC builders seeking wireless convenience and vibrant lighting effects, the CL Wireless features dual lighting zones with customizable side strips and fan blades. At 28 mm thick, the fan provides enhanced airflow and static pressure, making it ideal for both air- and water-cooling setups. Equipped with a 4-pin receiver for seamless PWM detection in the BIOS and a built-in tail PWM cable for additional power, the UNI FAN CL Wireless delivers optimal performance without cable clutter. Available in black or white, with standard and reverse airflow models, the UNI FAN CL Wireless is priced at $16.99 for a single pack and $54.99 for a 3-pack.

Affordable RGB Cooling with Dual-Zone Customization
The CL Wireless features dual independently customizable lighting zones—illuminated side strips and fan blades. Managed through L-Connect 3 software, users can effortlessly fine-tune lighting effects, synchronize colors, and create unique patterns across each zone, providing greater flexibility for themed builds. The CL Wireless are the same fans featured on the HYDROSHIFT II LCD-C 360CL, allowing users to perfectly complement their cooling setup with a unified aesthetic.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, expands the UNI FAN series with the new UNI FAN SL-INFINITY Wireless. Designed for ultimate customization, the new fans feature three independently controlled lighting zones and two sides of unique styles, thanks to different dual-layered infinity mirror designs on each side. The flexible receiver can connect to either side for easy installation. An upgraded 4-pin cable ensures that the fans are instantly recognized as PWM devices in the BIOS, with a built-in tail PWM cable delivering extra power when needed. Reducing the clutter even further, L-Wireless SYNC 2.4 GHz technology enables full wireless control of ARGB lighting and fan speeds.

Limitless Lighting and Dual-Sided Design
The UNI FAN SL-INFINITY Wireless introduces three independently controlled lighting zones, allowing users to unlock new levels of customization when designing their build. Each side of the fan features a distinct double infinity mirror design, enabling users to showcase two different visual styles based on orientation. Whether facing one side or the other, the SL-INFINITY Wireless ensures stunning visuals from every angle. Lighting effects are fully customizable via the updated L-Connect 3 software.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, announces the launch of the HYDROSHIFT II LCD-C series AIOs. Designed with side-mounted, flexible tubing and a compact radiator, the new AIO provides a clean, nearly tubeless appearance while maximizing compatibility with various case layouts. The HYDROSHIFT II features a sleek, cable-free pump block with a mounting screw cover and a unique latch-in-place design that simplifies installation and enhances maneuverability. It also features a 2.1" round LCD display with full L-Connect 3 integration and offers three versatile control modes: Offline, Wireless, and USB-Streaming.

Minimalist Tubing, Maximum Flexibility
The HYDROSHIFT II LCD-C refines the series' signature clean aesthetic with a more compact radiator and a redesigned side-mounted tube design, achieving a nearly tubeless look and maximizing compatibility. The flexible server-grade corrugated tubing ensures smooth bends around the radiator without compromising flow or internal diameter. A sliding tube clamp allows for precise tube alignment directly over the CPU block and can be secured to 140 mm fan brackets to lock the tubes in place. For builds with limited clearance, the clamp can be removed to optimize space. Paired with a newly redesigned 400×122×24 mm radiator, the HYDROSHIFT II LCD-C offers broad case compatibility while maintaining effective heat dissipation in a wide range of PC setups. The HYDROSHIFT II also features a sleek, cable-free pump block design with a clean mounting screw cover, complemented by an innovative latch-in-place mounting mechanism that holds the block securely while users screw it down—making installation easier and more manageable.

xMEMS Labs, Inc., the pioneer of monolithic MEMS-based solutions, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centers, bringing the industry's first in-module active thermal management solution to high-performance optical transceivers. Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6T optical transceivers—a critical yet underserved category in next-gen AI infrastructure.

Unlike conventional cooling approaches that target high-power (kilowatt) processors and GPUs, µCooling focuses on smaller, thermally stressed components that large-scale cooling systems can't reach, such as optical transceiver DSPs, that operate at 18 W TDP or higher. These components introduce thermal challenges and increasingly limit transceiver performance and reliability as data rates scale.

Deepcool presented a diverse range of cooling solutions at Computex 2025, covering high-end all-in-one liquid coolers, flagship LCD-equipped systems, advanced air coolers, and next-generation chassis fans. The new LQ Ultra models include an ARGB halo ring on the pump housing and a built-in LCD panel that displays live coolant temperature, pump speed, and overall system status. Available in 240 mm and 360 mm radiator options, these AIO units can be fully managed via software for personalized performance profiles. For example, the LQ360 comes with three FD12 ARGB fans and DeepCool's fifth-generation water pump, featuring a three-phase, six-slot, four-pole motor capable of spinning up to 3,400 RPM. This configuration delivers 72.04 CFM of airflow and 3.48 mm of static pressure while keeping noise under 38.71 dB(A). To help ensure long-term durability, the series also incorporates DeepCool's patented Anti-Leak Technology.

Montech is showcasing the yet-to-be-released CyberFlow 360 AIO liquid cooler with an improved and interesting pump design that surely looks impressive. We will see it in stores in Q4 2025 backed by a six-year warranty, however pricing is not yet known. Montech is also preparing a new addition to its HyperFlow AIO liquid coolers with the new HyperFlow Digital 360/240 series that now features a digital display to monitor CPU and GPU temperatures. On the air cooling segment, Montech has on display the NX400 / NX400 ARGB CPU cooler featuring a single tower design with a radiator with 52 fins, a single 120 mm E28 series fan and four heatpipes. The NX400 series will launch this June with an MSRP of $25.90 / $29.90 for the ARGB version. A bigger version named NX600 / NX600 ARGB is due to be launched in Q4 2025, featuring a dual-tower, dual-fan design and six heatpipes.

We stopped by the Raijintek booth at Computex 2025 to see what the brand has prepared for this year. The CYCLOPS EVO Liquid AIO CPU Cooler was at the heart of their presentation. It features a slim 397 × 120 × 27 mm aluminium radiator fitted with three 120 × 120 × 25 mm hydraulic-bearing fans that operate between 800 and 1,800 RPM to deliver up to 67 CFM of airflow. The included ceramic-axis pump moves 750 L/H of coolant through 500 mm of tubing, maintaining an impressively low thermal resistance of 0.08 °C per watt while keeping noise levels below 30 dBA.

XYZ arrives at Computex 2025, showcasing its complete lineup of PC cases and cooling solutions after they made their worldwide debut at CES this January. And things seem pretty clear with how XYZ thinks; it's all either white or black, while letting the ARGB/RGB do the fancy job of spicing things up. Does that work? We think it does as their portfolio pictures a unified vision with products that can suit all users and all budgets.

The Quantum and Quantum Pro are XYZ's flagship PC chassis, sporting a curved glass panel, BTF support, and ARGB Vortex fans. Need a dual-chamber fishtank case? Tesseract and Tesseract X are available, or if you're a bit nostalgic, they have the Airwave, Airone 300X, or the Tesseract Digital (with a digital display for CPU/GPU monitoring) series with a good-old-fashioned front mesh panel. What about liquid cooling? XYZ offers Aquapulse Fusion, Hydrotemp, and Hydroview (fitted with a 3.5-inch fully customizable display via XYZ Nexus software) AIO liquid cooling solutions. However, air cooling "fans" can enjoy the Thermax CPU air-cooler series with six different versions.More pictures follow.

Zalman has showcased their ZET series at Computex 2025; a brand-new family of air CPU tower coolers. This lineup seems to serve as a natural successor to past shell-less CNPS offerings. Circular cooling solutions are an unusual sight in the 2020s, but the South Korean manufacturer is intent on breaking beyond current (boxy) trends. Company representatives and product placards mentioned a main shape inspiration: aircraft engine designs.

The flagship ZET5 model was presented in black and white forms; both augmented with tasteful ARGB lighting rings. The brand's premium option has a 200 W TDP rating. Two modular fans are attached via a magnetic system, and connectivity is granted by a pogo pin system. The ZET5 features copper heatpipes, and a surprisingly non-radial aluminium fin array. A tube of ZM-STC10 thermal compound will be bundled in with these top-end products. Tentative pricing was not available at the time of writing.

be quiet! is extending its liquid cooling portfolio here at Computex 2025, bringing two new mainstream Pure Loop AIO series, namely Pure Loop 3 LX and Pure Loop 3. Starting with Pure Loop 3 LX AIO, we see that it comes in two variants (360 mm and 240 mm radiators) features a 6-pole motor pump with ARGB lighting, and interchangeable foil covers for pump customization. It uses Light Wings LX high-speed fans and supports all current Intel and AMD sockets. The Pure Loop 3 comes in with 240 mm, 280 mm, and 360 mm radiators. It utilizes Pure Wings 3 PWM high-speed fans with low noise operation while maintaining compatibility with current Intel and AMD sockets. Pure Loop 3 LX models launch August 2025 with the 360 mm at $129.90/€119.90 and 240 mm at $109.90/€99.90. Pure Loop 3 variants arrive also in August this year with the 360 mm at $114.90/€104.90, 280 mm at $109.90/€99.90, and 240 mm at $94.90/€84.90.

Cooler Master has revived its gargantuan Cosmos case product line; as demonstrated by the brand dedicating a whole table to two behemoth samples. Massive chassis designs are not particularly "de rigueur" nowadays, but 2025 revivals could be appropriate fits for ever-growing graphics card profiles, and extra elaborate cooling setups. Two different configurations were presented; as denoted by product placards and differentiated by modular panel selections. This year's refresh supports modern hidden and back-connector products.

The Cosmos 2025 "Water Cooling" demo unit's foundation consists of a non-specific Intel Ultra 5 processor, a customized (watercooled) GeForce RTX 5090 card, and an ASRock Z890 LiveMixer WIFI mainboard. Cooler Master has installed their fancy X Pro waterblock system; the visiting TechPowerUp team noticed that these components occupied only a small portion of internal volume. The 180 mm long MWE Gold 1250 V2 PSU looks relatively dinky, in its elevated perch. A radiator setup seems to feature absolutely huge airflow fans (maybe four in total); two of these units are visible in some of our photos.

EK, a leader in high-performance liquid cooling solutions, proudly presents the EK-Quantum Vector³ Suprim RTX 5090 - Plexi. This meticulously engineered water block is tailored for MSI's flagship Suprim RTX 5090 graphics card, delivering unparalleled thermal performance and a striking visual appeal.

Next-Generation Cooling for the RTX 5090
At the heart of the Vector³ Suprim RTX 5090 lies an advanced cooling engine, featuring an expanded fin array and optimized coolant flow paths. This design ensures efficient heat dissipation from critical components, including the GPU core, VRAM, and power stages. Complementing this is a custom CNC-machined backplate that not only reinforces the structural integrity of the card but also passively cools PCB hotspots, maintaining optimal performance under load.

We arrived at GAMEMAX's booth here at Computex 2025, and we're pleasantly surprised by their extended line-up of PC cases, power supply units, and cooling solutions that are oriented for PC gamers. Starting with the PC cases, we discovered the new Blade Concept and N90 models. The Blade Concept is an interesting mix between open-air design, industrial aesthetics, and CNC details. Featuring dynamic claw-style ARGB, support for the latest NVIDIA RTX50 series, swappable I/O, its open-air design clearly targets serious gamers and PC builders. The GAMEMAX N90 case is the next one that catches our attention with its dual-chamber design, panoramic 270° wraparound glass panel, vertical GPU mounting, tool-free customizable top cover, and a large optional LED display. ARGB fans and in-built cable management features are there for those who wish for a vibrant yet clean system.

At Computex 2025 in Taipei, Chieftec unveiled an extensive lineup of power supplies, PC cases, and CPU coolers designed for enthusiasts and professionals alike. The company's new VEGA M series power supplies combine modern efficiency with robust performance. Available in both Black (PPG-1000-C) and White (PPG-1000-CW) finishes, the units deliver configurable output levels of 1,000 W, 850 W, and 750 W (Black) or a fixed 1,000 W (White). Both models employ an LLC Half‑Bridge converter with DC‑to‑DC technology, support ATX 3.1 and PCIe Gen 5, accept 100-240 V AC input at 12 A, and feature a 135 mm fluid-dynamic‑bearing fan alongside 80 Plus Gold certification. Complementing the VEGA M series, the Stealth SPX‑1200‑FC pushes the envelope with 1,200 W capacity, Platinum efficiency, and premium Japanese capacitors. It shares the same advanced cooling design and Gen 5 compatibility, offering a 100-240 V AC input range at 13-6.5 A and ensuring stable power delivery under heavy load.

Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is announcing several improvements to its Direct Liquid Cooling (DLC) solution that incorporate new technologies for cooling various server components, accommodate warmer liquid inflow temperatures, and introduce innovative mechanical designs that enhance AI per watt. The Supermicro DLC-2 solution reduces data center power consumption by up to 40% compared to air-cooled installations. These advanced technologies enable faster deployment and reduced time-to-online for cutting-edge liquid-cooled AI infrastructure. Additionally, the total cost of ownership decreases by up to 20%. The comprehensive cold plate coverage of components allows for lower fan speeds and fewer required fans, significantly reducing data center noise levels to approximately 50dB.

"With the expected demand for liquid-cooled data centers rising to 30% of all installations, we realized that current technologies were insufficient to cool these new AI-optimized systems," said Charles Liang, president and CEO of Supermicro. "Supermicro continues to remain committed to innovation, green computing, and improving the future of AI, by significantly reducing data center power and water consumption, noise, and space. Our latest liquid-cooling innovation, DLC-2, saves data center electricity costs by up to 40%."

In less than a week from now, FSP will present at Computex its complete lineup of ATX 3.1 and PCIe 5.1 power supplies, a new SFF-READY ITX case, and the MP9 Series dual-tower flagship CPU cooler. Despite us not having (yet) any pictures of their upcoming or updated products, we're going to first let you know what FSP will showcase at this year's Computex show. Based on the success of their flagship MEGA TI power supply series, FSP is expanding its range with the new MEGA PM (Platinum efficiency) and MEGA GM (Gold efficiency) series. These additions provide performance-focused users with more options in terms of wattage and efficiency. The VITA PSU series has also received an upgrade with the introduction of VITA PM, now certified for 80 Plus Platinum. Then, for the first time at Computex, FSP will showcase their 1200 W Platinum-certified SFX-L PSU alongside the 1000 W SFX Platinum model.

We're looking forward to seeing FSP's new S550 ITX small form factor case series, which they say is certified as NVIDIA's SFF-READY and fully supports the RTX 5090 Founders Edition graphics card. FSP added that the S550 case is designed for users who want top-tier performance in a compact form factor, combining attractive aesthetics, optimal airflow, and support for high-end GPUs. FSP will also reveal its newest flagship CPU cooler, the MP9 Series, which sports an elegant all-black design. Based on the MP7 CPU cooler series, this dual-tower cooler comes equipped with two 140 mm high-performance silent fans and six 6 mm copper heat pipes with a copper base for effective heat transfer and superior CPU cooling. The MP9 has long-lasting FDB bearing fans and a tool-free magnetic top cover design for quick and easy installation without needing to remove the fans.

GAMEMAX, an emerging brand of PC gaming components including gaming cases and power supply units, is thrilled to join COMPUTEX 2025 with a bold message - Ready to hunt. GAMEMAX's latest innovations and products aims to empower builders of all levels - from first-time builders to seasoned enthusiasts. At this year's COMPUTEX, GAMEMAX will unveil its latest innovations across three key categories: PC Cases, Power Supply Units, and Cooling. Designed to push boundaries in style, power, and performance, every product reflects the brand's mission to fuel the hunt for the ultimate build.

PC Cases: Bold Designs, Next-Level Functionality
GAMEMAX introduces a versatile range of PC cases designed to meet the needs of every type of builder. GAMEMAX will also exhibit its recent releases including the LEADER 2, BLADE CONCEPT, N90, and T20 cases.

Join us at Cooler Master HQ for an exclusive COMPUTEX experience. From cooling the demands of AI and high-performance systems to enabling everyday reliability and modular design, discover how we're shaping the future through smarter, more adaptable solutions. Cooler Master invites you to experience the future of tech—live from our headquarters. As the tech landscape evolves, we're pushing cooling further: powering the rise of AI, delivering smarter performance for everyday systems, and unlocking new possibilities through modular design. This year's showcase brings it all together under one vision.

One Cooler Master—Where Cooling Drives the Future
It's the fusion of our industrial and consumer expertise. For over 30 years, we've built advanced cooling solutions for businesses, including: AI data centers, telecom, and mobile—then brought that same innovation to gamers, creators, and everyday users. One Cooler Master reflects our unified vision: engineering that drives performance at every level.

Levelplay is making a return to Computex this year, unveiling an exciting new lineup of AIO coolers, air coolers, and fans aimed at redefining performance and value in the entry-level PC space. With fresh designs, smart features, and plenty of personality, this year's showcase is all about cooling that doesn't compromise.

AIO Coolers: More Power, More Personality
Levelplay's popular Combat CL240 and CL360 are back with fresh upgrades in the form of the new M2 variants, now featuring enhanced ARGB pump lighting for a more vibrant, customizable look. Also joining the Combat lineup is the Combat M2-LCD, which replaces the infinity mirror with a crisp 2.4-inch high-res display that can show custom GIFs and real-time system stats.

xMEMS Labs, Inc., the pioneer of monolithic MEMS-based solutions, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centers, bringing the industry's first in-module active thermal management solution to high-performance optical transceivers.

Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6T optical transceivers—a critical yet underserved category in next-gen AI infrastructure.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has announced the launch of its latest high-performance PCIe Gen 5 SSD series—the MARS 980. Engineered specifically for professional gamers, tech enthusiasts, and overclocking specialists, the new series meets the soaring demands of artificial intelligence applications and high-performance computing.

Featuring breakthrough performance speeds of up to 14,000 MB/s and utilizing an advanced 6 nm process controller, the MARS 980 significantly enhances both performance and power efficiency. Furthermore, it introduces the industry's first-ever hybrid liquid-and-air cooling solution, effectively addressing the heat challenges posed by high-speed PCIe Gen 5 SSD operations. The MARS 980 SSD lineup comprises three distinctive models—MARS 980 STORM, MARS 980 BLADE, and MARS 980 PRO—each optimized for various user needs and scenarios, fully supporting AI-driven creative workflows, data-intensive tasks, and high-speed operations. Undoubtedly, the MARS 980 series positions itself as the most compelling choice in the Gen 5 SSD market.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is proud to launch the Toughpower GT Series, now available in 1000 W and 1200 W capacities and two colors: Black and Snow. Designed for users building modern high-performance systems, this fully modular PSU series complies with the latest ATX 3.1 standard and is ready to meet the demands of PCIe Gen 5.1 graphics cards with ease.

Featuring native 12V-2x6 (12+4 pin) PCIe Gen 5 connectors, the GT Series supports up to 600 W of power to next-generation GPUs through a single cable, offering future-proof compatibility out of the box. Both models are equipped with high-quality, native 12+4 pin cables and are built to handle up to 200% power excursion, ensuring stability under extreme workloads and transient spikes.

Traditionally, data centers have relied on air cooling—where mechanical chillers circulate chilled air to absorb heat from servers, helping them maintain optimal conditions. But as AI models increase in size, and the use of AI reasoning models rises, maintaining those optimal conditions is not only getting harder and more expensive—but more energy-intensive. While data centers once operated at 20 kW per rack, today's hyperscale facilities can support over 135 kW per rack, making it an order of magnitude harder to dissipate the heat generated by high-density racks. To keep AI servers running at peak performance, a new approach is needed for efficiency and scalability.

One key solution is liquid cooling—by reducing dependence on chillers and enabling more efficient heat rejection, liquid cooling is driving the next generation of high-performance, energy-efficient AI infrastructure. The NVIDIA GB200 NVL72 and the NVIDIA GB300 NVL72 are rack-scale, liquid-cooled systems designed to handle the demanding tasks of trillion-parameter large language model inference. Their architecture is also specifically optimized for test-time scaling accuracy and performance, making it an ideal choice for running AI reasoning models while efficiently managing energy costs and heat.

EK, renowned for its premium liquid cooling solutions and now managed by LM TEK, is set to present its latest innovations at COMPUTEX Taipei 2025. From May 20 to 23, attendees can visit LM TEK at Booth M1419, Hall 1 (4F), TaiNEX 1, to explore cutting-edge cooling technologies designed to meet the demands of next-generation AI computing. As artificial intelligence and high-performance computing continue to evolve, the need for efficient thermal management becomes increasingly critical. EK's newest solutions address these challenges head-on, offering advanced liquid cooling systems that elevate performance, ensure system stability, and meet the rigorous demands of modern AI workloads. This year's COMPUTEX will serve as a platform for EK to showcase how its innovative hardware—engineered for data centers, AI development platforms, and high-performance workstations—can help reshape the future of computing.

Want to know what's coming?
Visit our EK COMPUTEX 2025 page, where we will be revealing newly released products, exclusive launches, and spotlighting key partner projects on display at the show. Under the management of LM TEK, EK continues to push the boundaries of thermal management technology. This transition brings enhanced operational agility and a sharper focus on customer needs, while maintaining the trusted EK quality and design excellence. Visitors to the EK booth will have the opportunity to explore the latest liquid cooling solutions, meet the team, and discuss how EK technology can power next-gen AI innovation. Whether you're an industry professional, system integrator, or tech enthusiast, this is your chance to experience the future of liquid cooling—up close.