Discover the future of CPU cooling technology with Cooler Master's V8 3DVC. Engineered for high-performance, it features advanced superconductive heat pipes and a redesigned vapor chamber, offering unparalleled cooling efficiency. Perfect for demanding CPUs, it promises top-notch performance and sleek aesthetics. Tune in to explore how the V8 3DVC sets new benchmarks in cooling solutions.

Why Choose the V8 3DVC
The V8 3DVC is more than just a cooling solution; it's a testament to Cooler Master's commitment to innovation and quality. Whether you're a gamer, a creative professional, or a tech enthusiast, this cooler is designed to deliver exceptional performance, reliability, and style.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

In the era of high-tech development and the ever-increasing demand for data processing power, data centers are consuming more energy and generating excess heat. As a global leader in thermal solutions, SUNON is at the forefront, offering a diverse range of cutting-edge liquid cooling solutions tailored to advanced data centers equipped with high-capacity CPU and GPU computing for AI, edge, and cloud servers.

SUNON's liquid cooling design services are ideally suited for modern data centers, generative AI computing, and high-performance computing (HPC) applications. These solutions are meticulously customized to fit the cooling space and server density of each data center. With their compact yet comprehensive design, they guarantee exceptional cooling efficiency and reliability, ultimately contributing to a significant reduction in a client's total cost of ownership (TCO) in the long term. In the pursuit of net-zero emissions standards, SUNON's liquid cooling solutions play a pivotal role in enhancing corporate sustainability. They o ff er a win-win scenario for clients seeking to transition toward greener and more digitalized operations.

The SG10 is an ambitious product designed to push the boundaries of fanless technology and create a gaming case capable of cooling high-performance CPUs and GPUs without the use of fans. This project collaboration between Streacom and Calyos is also aimed at showcasing the application of loop heat pipe technology in PC cooling and represents the first step in creating a viable mainstream high-performance solid-state alternative to water cooling solutions.

The spiritual successor to the SG10 began life as a Kickstarter project launched by Calyos as the NSG S0, and whilst having extensive expertise in cooling, the additional challenges of consumer product manufacturing proved to be a stumbling block. A search ensued to find a partner with suitable experience to get the project back on track, and with experience in both case manufacturing and fanless cooling, Streacom was the natural fit. As can be understood just by glancing at the image, the SG10 represents a complete redesign of the NSG S0. Not a single asset or component was carried over from the original case. This includes the Evaporator that pumps the coolant around the loop and the Condenser that radiates the heat, both core components that make this performance possible. Everything has been entirely re-engineered and improved far beyond the original specification and performance.

The Ryzen 7040 Series processor in Framework Laptop 16 is capable of running at a sustained 45 W TDP (Thermal Design Power) and we put together an excellent thermal solution to ensure it can do that while keeping CPU temperature, touch temperatures, and fan noise to a minimum. That 45 watts of CPU power needs to be efficiently conducted into the vapor chamber, heatpipes, and fins to be carried away through airflow from the fans.

Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.

EK, the renowned premium liquid cooling pioneer, proudly announces the debut of its latest masterpiece, the EK-Quantum Momentum² Aorus Z790 Master X D-RGB - Plexi. This monoblock is expertly designed for the Intel LGA 1700 socket and engineered with precision for seamless integration with the GIGABYTE Z790 AORUS MASTER X motherboard. The monoblock's addressable D-RGB LED effortlessly harmonizes with Gigabyte RGB Fusion 2.0 control, providing comprehensive lighting customization for each diode and ensuring a dynamic visual spectacle. This monoblock is also fully compatible with EK-Matrix7, further enhancing its versatility within EK's liquid cooling ecosystem.

EK-Quantum Momentum² Aorus Z790 Master X D-RGB - Plexi
This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Intel's 12th, 13th, and 14th Gen processors. The monoblock seamlessly aligns with the LGA 1700 socket on the Gigabyte Z790 Aorus Master X motherboard. The monoblock's unique design, incorporating a specialized metal cover over the I/O section, is noteworthy. This cover serves a dual purpose: it facilitates the mounting of the stock I/O cover without compromising the factory-intended RGB lighting of the motherboard while also functioning as an elegant stand for the original LCD screen.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

According to @momomo_us, Intel has discontinued its Cryo Cooling Technology as of July 1, 2023, marking the end of one of the tech industry's few sub-ambient cooling options. The technology, which could chill CPUs to 0 degrees Celsius to enhance performance, accompanied Intel's processors from the 10th-generation Comet Lake to the 13th-generation Raptor Lake. Despite its innovative approach to boosting CPU performance, the cooling solution was not widely embraced. The discontinuation comes just before the arrival of the 14th Generation Raptor Lake Refresh, which will not support the Cryo Cooling tech. Intel plans to maintain updates for the existing Cryo Cooling hardware until December 31, 2023.

This specialized cooling method did see some use in products like the Cooler Master MasterLiquid ML360 Sub-Zero and the EKWB EK-QuantumX Delta TEC waterblocks. Interestingly, the technology has managed to work even with non-Intel CPUs, which famous overclocker der8auer managed to get up and running on AMD's Ryzen 9 5950X. Some modifications were in place, but it was possible to do so. The likely reason for shutting down the cryo cooling project is the need for more financial sense to continue to pursue this technology and the effort to keep the cost of R&D down and make funds available for other projects at Intel's laboratories.

NZXT, a leader in PC gaming hardware and services, today announces the H6 Flow and H6 Flow RGB, a compact dual chamber mid-tower ATX case. The H6 Flow offers a harmonious blend of performance and visual appeal for PC enthusiasts. Designed for an expansive and uninterrupted view, the H6 Flow is adorned with consistent tempered glass on the front and sides, granting a panoramic peek into the insides of your build. Leveraging its dual chamber architecture, the new angel front panel directs the airflow from the three pre-included 120 mm fans (or 120 mm RGB fans for the H6 Flow RGB version) and two 140 mm fans at the base of the case allow you to cool your heat generating components. The revamped perforated panels come with a design fine-tuned for optimal airflow and superior performance. While all being easy to build with the H6 Flow facilitates generous cable-routing channels and straps, ensuring organized cable management.

EK, the leading premium liquid cooling gear manufacturer, will soon provide a one-stop-shop purchasing option where System Integrators, Data Centers, AI/ML-focused companies, and similar customers can get full enterprise-grade custom liquid-cooling loops for their systems. The products belong to the EK-Pro line of professional liquid cooling solutions tailor-made for HPC systems and high-compute density applications. This means that System Integrators and Data Centers will be able to purchase full liquid cooling loops for their HPC servers and workstations and enjoy all the benefits that water-cooled HPC systems can provide.

The Advantages of Liquid Cooling for HPC Systems
High Performance Computing facilities use servers and workstations that leverage powerful GPUs, multithreaded CPUs, petabytes of RAM, and extensive storage space. All this computing power, despite modern advancements in manufacturing and power efficiency, generates tremendous amounts of heat. In fact, it is estimated that up to 40% of the total energy requirements of these facilities is spent on keeping the IT equipment within acceptable operating temperatures. Plus, the components that use conventional air cooling tend to underperform and have shorter lifespans.

LITEON Technology, the global leading provider of power and cooling solutions, is set to unveil its groundbreaking liquid cooling solutions featuring immersion technology through its new brand, COOLITE. This will be the very first time that LITEON showcases its COOLITE solutions, along with state-of-the-art power solutions at the OCP Global Summit. These pioneering solutions are poised to transform data centers by significantly enhancing efficiency, performance, and sustainability.

LITEON COOLITE Liquid Cooling Solutions Bring a Paradigm Shift in Data Center Cooling
LITEON's COOLITE Liquid Cooling Solutions, with immersion technology, bring a paradigm shift in data center cooling. By immersing servers and components in a specialized cooling fluid, these solutions eliminate the constraints of traditional air-based cooling. This results in significantly improved thermal efficiency, enabling data centers to handle high-performance workloads with ease. Furthermore, the reduced energy consumption and carbon footprint contribute to the sustainability goals of data centers.

Asetek, innovator of gaming hardware for next-level immersive gaming experiences and the creator of the all-in-one (AIO) liquid cooler, today announced that new OEM Partner LIAN LI makes available its Galahad II LCD CPU Coolers, leveraging the superior thermal and acoustic performance and reliability associated with Asetek's most advanced technology to date. The Galahad II LCD AIOs will enable enthusiasts to boost CPU overclocking capability for extreme performance and gamers to enjoy rock-solid stability for immersive gaming.

Asetek and LIAN LI collaborated to create the Galahad II LCD CPU coolers, which are powered by Asetek's Gen8 technology, and are available in black or white in 280 mm or 360 mm radiator sizes for a variety of form factors and cooling requirements. The coolers include a 2.88" LCD screen with 480x480 resolution to display various system information, such as CPU/GPU temperature and load, pump RPM, and coolant temperature. The updated L-Connect 3 software offers users a host of features to allow them to customize the LCD display. In addition to uploading custom videos, the software has built in functions to allow users to record gameplay videos and images for display on the pump cap, a first-of-a-kind feature for AIOs in this premium category. Trim and upload the video portion you want using the included video editor. The L-Connect 3 software also comes with a variety of included presets and filters that users can apply to any imported images and GIFs.

Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.

In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.

InWin Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, has introduced the first ever fully modular case, the ModFree PC chassis. Fully interchangeable and expandable, it allows PC enthusiasts to freely transform the design, layout, and structure to meet their exact needs and preferences in hardware and cooling. InWin offers a Base Edition preset featuring Mod-I and Mod-II modules along with three InWin Jupiter AJ140 ARGB case fans. The Deluxe Edition preset comes with Mod-I, Mod-II, and two Mod-III modules, and four Jupiter AJ140 fans too.

ModFree: An Easy, Sustainable System
The ModFree ecosystem is designed around toolless interlocking clips that allow users to easily swap modules around. Unlike conventional chassis, ModFree uses an inverted motherboard design that allows users to showcase their hardware from the left side of the desk instead of competing for space with the mouse pad on the right. Investing in this ecosystem ensures an upgrade to add more cooling or more space is just a module away, which also helps to reduce the environmental impact considering you would no longer need to build an entire new system anytime you need to upgrade. ModFree offers a 3D interactive assembly guide with easy-to-follow demonstrations and ideas for how to use each module. Users can also experiment with designs directly in the app.

EK, the renowned manufacturer of premium PC water cooling equipment, introduces yet another addition to its Pro lineup: the EK-Pro Manifold 2CPU 8GPU - Acetal, a specialized coolant delivery system designed for use with a great multitude of water blocks in workstations and servers. Like the previous EK-Pro Manifold 2CPU 6GPU - Acetal, this manifold has all the perks of its smaller brother with compatibility for an extra two GPUs.

Efficient Cooling Distribution
The EK-Pro Manifold 2CPU 8GPU - Acetal redefines cooling precision with its impeccable coolant distribution. Featuring multiple industry-standard G1/4" In and Out ports, it guarantees optimal coolant flow, ensuring flawless cooling for both CPUs and GPUs. With the capacity to accommodate two CPUs and impressive eight-GPU configurations in parallel or semi-parallel, this high-performance manifold opens new horizons for liquid cooling in workstation and server environments.

EK, the renowned manufacturer of premium PC water cooling equipment, introduces the newest addition to its Pro lineup: the EK-Pro Manifold 2CPU 6GPU - Acetal, a specialized coolant delivery system designed for use with multiple water blocks in workstation systems.

Efficient Cooling Distribution
The EK-Pro Manifold 2CPU 6GPU - Acetal redefines cooling precision with its impeccable coolant distribution. Featuring multiple industry-standard G1/4" In and Out ports, it guarantees optimal coolant flow, ensuring flawless cooling for both CPUs and GPUs. With the capacity to accommodate two CPUs and impressive six-GPU configurations in parallel or semi-parallel, this high-performance manifold opens new horizons for liquid cooling in workstation environments.

EK, the industry-leading manufacturer of premium liquid cooling solutions, proudly announces another addition to its Pro line - the EK-Pro CPU WB sTR, an enterprise-grade water block meticulously designed for AMD EPYC and Ryzen Threadripper processors. Engineered with precision and expertise, this liquid cooling solution promises unmatched performance and reliability.

Precision Craftsmanship
EK-Pro CPU WB sTR - Nickel + Acetal water block is custom-designed for AMD processors, making it suitable for desktop PCs, workstations, and taller server racks. With three standard G1/4" threaded ports on the top and an EK G1/4 plug equipped with an O-ring, this water block ensures effortless and secure connections for your liquid cooling system.

TECNO, a global innovative technology brand once again participated in the Berlin International Consumer Electronics Show (IFA), showcasing its innovative prowess from September 1st to 5th, 2023, TECNO unveiled two "world-first" concept devices: the Water-Cooling MEGA MINI Gaming PC and the Phantom Ultimate rollable smartphone.

Throughout the exhibition, TECNO's exhibition design under the theme "Dazzling Youth" stood out, showcasing the brand attitude of "passion, innovation, and modernity" through a comprehensive and stylish visual dialogue with consumers. TECNO's presence was marked by exciting product launches, TECNO highlight products' presentations, and immersive experiences that left a mark on the world of technology. With a focus on addressing evolving consumer needs and trends, TECNO's participation at IFA Berlin 2023 underscored the company's dedication to elevating the smart ecosystem mobile tech landscape.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, is pleased to announce the launch of the TH120/240/280/360/420 V2 ARGB Sync All-In-One Liquid Cooler and the TH240/280/360/420 V2 Ultra ARGB Sync All-In-One Liquid Cooler, 2nd generation of the popular TH Series. To bring the aesthetics to a whole new level, for the first time, Thermaltake uses an Infinity Mirror Lighting Design for the TH V2 ARGB AIOs; as for the TH V2 Ultra ARGB, they come with the iconic LCD Display for the Ultra products on the industrial style top lid. Designed to fulfill the needs of the latest CPUs, this series of AIOs are equipped with powerful CT ARGB Sync fans for enhanced cooling performance. On top of that, the TH V2 ARGB and the TH V2 Ultra ARGB incorporate a variety of 120 mm/140 mm fan models to accommodate diverse chassis sizes.

The TH V2 ARGB Series provides fantastic visual aesthetics to your PC. The TH V2 ARGB incorporates a 360-degree rotational industrial-style top lid, allowing the logo on the water block to be in the proper orientation no matter how you place the cooler. Furthermore, the TH V2 ARGB is the one and only Thermaltake product with an Infinity Mirror Lighting Design, showing unique layered lighting effects. The industrial-look top lid of the TH V2 Ultra is equipped with a 2.1-inch LCD screen, which can present real-time information about CPU, weather, and temperature. To highly customize your AIO liquid cooler, the LCD screen can display any images or GIFs in 16.8M color through the TT RGB PLUS 2.0 software and can support various file types, such as JPG, GIF, MP4, etc. Each TH V2 ARGB Series fan features 9 addressable LEDs, and users can simply customize their dream lighting effects with 5 V motherboard lighting software.

Today, Lenovo announced several new products and solutions at its annual holiday product launch. The new additions to the portfolio - which include AI-tuned innovations in gaming, a groundbreaking 3D monitor, software solutions, versatile accessories, and more - are available to explore here.

Gaming on the Go: Lenovo Legion Gaming Handheld Device and Accessories Untether PC Gaming
The new Lenovo Legion Go is the company's first Windows gaming handheld device that gives gamers more freedom to game however—and wherever—they want. The Lenovo Legion Go is designed for gamers who will settle for nothing less than top-tier specs and visuals on their handheld device. Along with the new micro-OLED-equipped Lenovo Legion Glasses and new Lenovo Legion E510 7.1 RGB Gaming In-Ear Headphones, the debut of the Lenovo Legion Go is a marked expansion of the Lenovo Legion ecosystem of gaming devices, monitors, accessories, software, and services that empower gamers to immerse themselves in their games.

In Win Development Inc. (InWin), a leading innovator in PC enthusiast gaming hardware, has introduced its new AN120/140, DN120/140, and DN120/140 PRO case fans. These silent, high static pressure fans are ideal for air or liquid cooling.

Key Features
Neptune AN, DN, and DN PRO fans feature InWin's signature Turbine Blade design that angles the blades to channel more concentrated airflow. The fan is molded to the frame to prevent air leakage and noise pollution that standard models tend to emit. The results offer an impressive static pressure of up to 2.95 mm/H2O (DN140 PRO), while operating at a mere 20.3 dBA (DN120 PRO). Get great performance without sacrificing your peace. Control with PWM via a dedicated IC chip (for DN PRO), which can produce as little as 17.2 dBA at 900 RPM (AN120).

EK, the leading computer cooling solutions provider, now offers EK-Pro GPU WB RTX 6000 Ada Rack - Nickel + Inox, an enterprise-grade full-cover water block meticulously designed for Nvidia RTX 6000 Ada Generation graphics cards. Crafted to excel in rack mount environments, this cutting-edge water block leverages the power of the Nvidia Ada Lovelace Architecture. Its exceptional construction showcases a CNC-machined nickel-plated copper base, complemented by a laser-cut stainless-steel top, creating a resilient liquid cooling solution that effectively transforms into a space-saving single-slot assembly. It encompasses the entire GPU, VRAM, and VRM components, precisely channeling the cooling liquid over these critical areas to efficiently dissipate heat.

Rack Mount Form Factor
The EK-Pro GPU WB RTX 6000 Ada Rack - Nickel + Inox is a purpose-built water block allowing you to have a professionally liquid-cooled Nvidia RTX 6000 Ada Generation graphics card, perfectly suited for server rack installations. Designed to seamlessly integrate into standard Full Height Full Width (FHFW) server chassis form factors, these EK-Pro Rack GPU water blocks serve as convenient drop-in replacements for both active and passive dual-slot air coolers.

ASRock has added another Arc model to its small selection of Intel graphics cards—this time in low profile form. The entry level A380 GPU is well suited for this narrow (zero dB/silent) dual fan cooling solution due to its diminutive 75 W TDP rating. ASRock has stayed in the safe zone by sticking with the default base clock of 2.0 GHz, as opposed to the sibling Challenger ITX 6 GB OC model's slightly more ambitious 2.25 GHz.

The specifications are typical A380—you get 6 GB of GDDR6 VRAM with a 96-bit memory bus, granting a bandwidth going up to 186 GB/s (memory is clocked at 15.5 Gbps), although the selection of ports has been reduced in number due to the card's small stature. Only single DisplayPort 2.0 and HDMI 2.0b connections here. ASRock's product page for their Arc A380 Low Profile model includes the usual yammering about the GPU's "next-gen gaming" capabilities thanks to Intel's Xe Super Sampling (XeSS) technology, but the card is better suited for compact budget builds and users who require a decent level of AV1 encoding (for the price—not announced at the time of writing).

The U.S. Department of Energy (DOE) has announced its selection of Intel as one of 15 organizations tasked with developing high-performance, energy-efficient cooling solutions for future data centers. The award, announced in May, is part of the COOLERCHIPS program - Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems - supported by DOE's Advanced Research Projects Agency-Energy (ARPA-E). Intel's project, anticipated to be a three-year agreement with $1.71 million in funding, will enable the continuation of Moore's Law by allowing Intel to add more cores and transistors to its highest performance processors, while managing the heat on future devices.

Tejas Shah, principal engineer and lead thermal architect for Intel's Super Compute Platforms Group said: "Immersion cooling is used for its simplicity, sustainability and ease of upgrades. This proposal will enable two-phase immersion cooling to align with the exponential increase in power expected by processors over the next decade."

EK, the leading computer cooling solutions provider, is introducing the EK-Pro GPU WB AMP/Trinity RTX 4090 Ni + Inox, an enterprise-grade full-cover water block designed specifically for the ZOTAC NVIDIA GeForce RTX 4090 AMP Extreme Airo, Trinity, and Trinity OC graphics cards.

The water block is meticulously crafted with a CNC-machined nickel-plated copper base and a laser-cut stainless-steel top, providing a durable and efficient liquid cooling solution. It effectively encompasses and cools the entire GPU, VRAM, and VRM components by channeling the cooling liquid directly over these critical areas to dissipate heat.