Sheetak Announces Product Line Expansion with CENTUM C3 Multi-Stage Cooler Based on Novel Patented Thermoelectric Device Structures
Sheetak is expanding their flagship CENTUM product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant increases to cooling power and COP. These new trailblazing CENTUM C3 chips are now available for sample orders. High-volume manufacturing will start in Q2 2023 at Sheetak's Austin facility.
CENTUM C3 chips have been characterized, using standard thermoelectric testing methods, and demonstrate significant increases in maximum temperature differentials, cooling power, and efficiency (COP). The new chips attain temperature differentials more than 115°C for 2-stage coolers with hot-side at 50°C, and more than 160°C for 4-stage devices. The performance and cost metrics are unchallenged by other commercially available products.
CENTUM C3 chips have been characterized, using standard thermoelectric testing methods, and demonstrate significant increases in maximum temperature differentials, cooling power, and efficiency (COP). The new chips attain temperature differentials more than 115°C for 2-stage coolers with hot-side at 50°C, and more than 160°C for 4-stage devices. The performance and cost metrics are unchallenged by other commercially available products.