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Toshiba Announces the Mini NB510 Netbook, Updates the NB520

Toshiba UK today announces the launch of the Mini NB510, the latest model in the award winning Mini NB500 netbook range. Available in a choice of stylish colours, the Mini NB510 features an all-day battery, high definition connectivity and a compact design - matching convenience with portability.

The latest Intel Atom processor and 1 GB of DDR3 RAM ensure the Mini NB510 is capable of running multiple programs simultaneously. Powerful dual-core performance allows users to enjoy high definition movies, stream TV shows on-demand and use social networks on the move. Up to 10 hours of battery life makes the Mini NB510 an ideal companion for travellers on long-haul journeys, or using away from power sockets for extended periods of time.

Fujitsu Extends Cloud Portfolio With PRIMERGY CX400 Multi-Node Server

Fujitsu today launches the new PRIMERGY CX400 S1 multi-node Cloud eXtension server. This innovative technology requires only half the space of a standard rack server to provide enterprises with cost-effective, energy-efficient access to smart scale-out capabilities for deployments such as private cloud, high-performance computing (HPC) and large-scale virtualization.

Enterprise customers of all sizes are increasingly looking for improved energy efficiency, higher platform density and better management effectiveness when realizing their cloud computing, high performance computing, virtualization, hosting, or virtual-client computing strategies.

Taiwanese Notebook Vendors Offer Ultrabook-like PCs in Q2

With the new Ultrabook specification being governed by Intel, and compatible Ivy Bridge Core processors facing delays, Taiwan-based notebook vendors are finding incentives in launching "Ultrabook-like" PCs, notebooks that are about as compact as Ultrabooks, but with vendors' own hardware specifications. Such PCs are also said to be designed keeping in mind lower price-points, such as $600. These notebooks will do away with expensive metal unibody chassis, hollow hinges, and SSDs, and replace them with more cost-effective ones. For example, 7 mm-thick HDDs are already announced. Those could make viable alternatives for SSDs. Such Ultrabook-alternatives could be launched as early as in Q2-2012, sources note.

Thunderbolt Port Pictured on MSI Z77A-GD80

At last, we're getting to see visuals of MSI's top LGA1155 motherboard based on Intel Z77 chipset, the Z77A-GD80, featuring Intel's Thunderbolt interconnect. Thunderbolt is a unified interconnect that provides 10 Gb/s of raw bus bandwidth to connected devices, and passes through digital display. The connector itself resembles mini-DisplayPort. On the Z77A-GD80, the Thunderbolt port is located below a D-Sub connector. Naturally, is passes both 10 Gb/s Thunderbolt (which can be daisy-chained through multiple bandwidth-hungry devices), and display relayed from Intel processor-integrated graphics. Lucid VirtuMVP lets you harness the pixel-crunching power of your favourite discrete graphics card over this port, as well.

New BOXX Workstation Featuring Intel Xeon Offers 80% Performance Increase

BOXX Technologies, the leading innovator of high-performance workstations and rendering systems, today announced the introduction of the 3DBOXX 8920 workstation which delivers an 80% application performance increase over its predecessor, the 3DBOXX 8520. The latest addition to their heralded 3DBOXX 8500/8900 workstation line, 8920 features dual, eight-core Intel Xeon E5-2600 series processors, along with a host of other technology upgrades that boost overall performance for VFX artists, animators, designers, engineers, and other creative professionals.

"Our BOXX is better than their box," said Shoaib Mohammad, BOXX VP of Marketing and Business Development, in response to being asked what's separates the workstation manufacturer from its competitors. "At BOXX, we understand the applications our customers employ to create, test, and modify their ideas. And we create optimized configurations using the latest Intel Xeon processors in order to provide the best possible user experience when dealing with complex simulations, rendering, and ray tracing applications."
The 3DBOXX 8920 features up to 16 cores (32 threads) of high-powered, multitasking performance for 3D design, animation, rendering, visualization, VFX compositing, and more. Designed to accommodate multi-threading, multiple applications, and complex production pipelines, the new 8920 has also expanded to include additional memory and up to three NVIDIA GPUs. The result is faster performance for both CPU- and GPU-based rendering, simulation, and ray tracing tasks.

Building Intelligent Systems With Windows 8 Embedded

Over the past year, Microsoft has been discussing the vast possibilities offered by the emergence of a new category within the traditional embedded market - intelligent systems.

A critical component of Microsoft's enterprise strategy, intelligent systems enable an unprecedented flow of data with the power to transform industries such as retail, manufacturing and medicine, by connecting devices where data is generated through employees and customers to back-end systems and services where it is translated into strategic insight to inform business decisions.

Shuttle's Z77-based XPC Z77R5 Pictured

Shuttle unveiled the XPC Z77R5 mini-PC barebone at CeBIT. It is built into a familiar-looking XPC chassis, but with a new motherboard based on the Intel Z77 chipset, which lends it support for "Ivy Bridge" Core i7/i5/i3 processors out of the box, apart from support for LGA1155 "Sandy Bridge" processors. Connectors include six USB 2.0, four USB 3.0, HDMI, DVI, RJ-45 (gigabit Ethernet), 2x SATA 6 Gb/s, eSATA, and 8-ch HD audio. There are four expansion slots, one PCI-Express 3.0 x16, one PCI-Express 2.0 x4, and two mini-PCIe.

The chassis includes drive bays for 1 5.25" drive (such as optical drives), two internal+exposed 3.5" bays, for gadgets such as card readers. The power supply is rated at 500W, with 80 Plus Bronze efficiency rating. The XPC Z77R5 chassis measures 32.5 x 21.5 x 19.8 cm (DxWxH). Pricing and availability information was not given out.

ADLINK Launches ATCA Blade with Dual Intel Xeon Processor E5-2648L and AMC Bay

ADLINK Technology, Inc., a leading provider of trusted telecom computing products, today announced availability of the aTCA-6200, a next-generation AdvancedTCA (ATCA) processor blade that demonstrates ADLINK's leadership in the development of high performance compute blades with flexible expansion capabilities.

The aTCA-6200 features two 1.8 GHz eight-core Intel Xeon processors E5-2648L, the Intel C604 chipset, DDR3-1600 memory up to 128 GB, and a PICMG mid-size AMC bay. On-card connectivity includes dual 10GBASE-KX4 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress ports, CFast socket, and quad SAS channels, which provide leading-edge network performance and storage capabilities. The aTCA-6200 is ideal for carrier-grade applications such as media servers in IPTV, IP Multimedia Subsystem (IMS) broadband networks, and wireless infrastructures, providing telecom equipment manufacturers (TEMs) and network equipment providers (NEPs) with a flexible, cost-effective solution for mission-critical applications and a reliable, smooth path for scalability and expansion.

SGI Continues Exascale Move with Integration of Intel Xeon Processor E5-2600 Family

SGI, the trusted leader in technical computing, today announced that it is continuing its march toward exascale computing with the integration of the Intel Xeon processor E5-2600 family into all of its high performance compute (HPC) server and storage platforms and product families. Full support for the Intel Xeon processor E5-2600 family in the SGI Rackable, SGI ICE X HPC and SGI Modular InfiniteStorage (MIS) platforms is also now available.

SGI has been shipping Rackable servers to its public cloud customers since September 2011, and is shipping 26.73 teraflops per rack this month in its ICE X platform. The MIS server platform represents the densest storage server platform in the industry today, and is based solely on the Intel Xeon processor E5-2600 family. As the most flexible, high-performance computing platform in the industry, the SGI Rackable line takes advantage of the new Intel Xeon processor E5-2600 family to drive the most dramatic performance improvements in a typical product generation - in some cases up to 2X¹ and beyond the performance of the previous generation for high-performance computing (HPC) workloads.

Intel Launches the Xeon Processor E5-2600 Product Family

Addressing the incredible growth of data traffic in the cloud, Intel Corporation announced the record-breaking Intel Xeon processor E5-2600 product family. These new processors deliver leadership performance, best data center performance per watt1,4, breakthrough I/O innovation and trusted hardware security features to enable IT to scale. These processors are not only at the heart of servers and workstations, but will also power the next generation of storage and communication systems from leading vendors around the world.

Forecasts call for 15 billion connected devices and over 3 billion connected users by 2015. The amount of global data center IP traffic is forecasted to grow by 33 percent annually through 2015, surpassing 4.8 zetabytes per year, more than 3 times the amount in 2011. At these levels, each connected user will generate more than 4 GB of data traffic every day - the equivalent of a 4-hour HD movie. This will increase the amount of data that needs to be stored by almost 50 percent per year. In order to scale to meet this growth, the worldwide number of cloud servers is expected to more than triple by 2015.

Acer announces its latest F2 generation of server products

In line with a solid strategy for commercial products, Acer has advanced its server line with a whole new line up of refreshed server products. This time around, Acer has not only updated the specifications to support the latest Intel Xeon processors E5 family, but has expanded its business portfolio and management tools to provide greater flexibility in modern datacenters.

Greater performance and expandability

The new product designs feature Intel's latest line up of Intel Xeon processor E5 family of CPUs, which give up to two times the performance for certain benchmarks, and up to 8 cores per CPU. The F2 generation, also provides greater expandability and more robust specifications built into every platform. Hardware-aside, the F2 generation will improve on operating system support to include mainstream and open source platforms, and its management tools are enhanced to improve IT ease of use.

Acer Introduces the V3 Series Notebooks

Acer has unveiled the V3 Series, a range of notebooks optimized for today's digital needs, available in 14-, 15.6- and 17.3-inch models. With excellent performance, entertainment enhancements, communication tools and a classy design, these notebooks are intended for tech-savvy users who want daily high-definition audio and visual experiences.

The latest generation Intel Core family processors, plus NVIDA GeForce GT Series graphics ensure excellent performance for multitasking with lots of apps, music, Internet video, movies, games and more.

HP Unveils Powerful New Line of Workstations

HP today introduced new multicore updates and increased expandability on its powerful line of HP Z Workstations. The new workstations feature the latest eight-core Intel Xeon processor E5-2600 product family, offer up to 512 gigabytes (GB) of DDR3 memory, and support multithreaded workstation applications that professionals rely on.

The latest additions to the industry-leading line of HP Z Workstations also feature third-generation PCI Express technology, providing customers increased performance and seamless integration of new graphics cards.

GIGABYTE Demos 7-Series Ultra Durable 4 Motherboards at CeBIT 2012

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is delighted to showcase its forthcoming 7 series motherboard designs supporting 3rd generation Intel Core processors, showcasing a range of features including the new All Digital Engine, GIGABYTE 3D BIOS and GIGABYTE Ultra Durable 4 technology. Join GIGABYTE at CeBIT 2012 in Hall 15, D19 from March 6th through March 10th 2012.

Visitors to CeBIT 2012 can have an exclusive look at motherboards that feature the latest All Digital Engine design for the PWM. Our new All Digital power design allows users greater control over the power delivered to their 3rd generation Intel Core processors that use the LGA 1155 socket. Using entirely digital controllers for the CPU, processor graphics, VTT and system memory, users can enjoy more precise power delivery to the PC's energy sensitive components than previously possible.

Several Other ASRock Z77 Motherboards Detailed

Apart from two of the most notable products from ASRock's booth, the X79 Extreme11 and Z77E-ITX, ASRock unveiled almost every other 7-series chipset motherboard it has in the works. The lineup is diverse, and based on every chipset model Intel will launch in the 7-series.

The Q77M-vPro is designed for commercial desktops that are part of extremely dense local network (such as corporate networks), with an established network hierarchy, and environments that demand greater manageability and data-security. The B75M is based on the Intel B75 chipset, and designed for more mainstream business desktops for small and medium enterprises.

ASUS To Launch Five New 10" Eee PCs at CeBIT

ASUS is readying five new Eee PC netbooks for launch at CeBIT, these include the Eee PC X101CH, Eee PC 1011CX, two variants of the Eee PC 1015BX, and the Eee PC 1025C. The X101CH and 1011CX are driven by Intel Atom N2600 processor, the 1025C by Atom N2800, while the 1015BX has two variants, driven by AMD Vision C50 or C60 APUs. All of these are 10.1-inchers. Also common between these models are 1 GB RAM, 320 GB storage, and Windows 7 Starter Edition operating system. The five Eee PCs also feature ASUS Express Gate, a lean web-oriented operating system. In related news, ASUS is also working on 11.6-inch Eee PC 1225B/C, which feature larger screens, with 1366x768 pixels resolution.

Gigabyte GA-B75M-D3V Detailed

Here are the first pictures of the GA-B75M-D3V up close. This micro-ATX form-factor board is designed for business desktops (small-businesses, home-offices), and is based on Intel's B75 chipset. The board supports "Ivy Bridge" and "Sandy Bridge" Core processors in the LGA1155 package. Its component loadout doesn't stretch too far beyond what the chipset offers. The LGA1155 CPU is powered by a simple 5-phase VRM, it is wired to just two DDR3 DIMM slots, supporting dual-channel DDR3 memory.

Expansion slots include one PCI-Express 3.0 x16, two PCI-Express 2.0 x1, and one legacy PCI. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s, all internal. The 6 Gb/s ports are angled. Display connectivity includes one each of DVI and D-Sub. There are four USB 3.0 ports, two on the rear-panel, two via front-panel header, all wired to the PCH. 6-channel HD audio, gigabit Ethernet, Parallel/LPT, and PS/2 combo connector top it all off. Expect the GA-B75M-D3V to be hovering around the $100 mark.

Intel Takes Gaming Graphics to Next Level with Developer Tools

Intel Corporation today introduced Intel Graphics Performance Analyzers (Intel GPA) 2012, the latest version of a powerful tool suite to optimize performance of gaming, media and entertainment applications. Expanding upon Intel's mobile momentum, Intel GPA 2012 will support mobile applications for Ultrabook devices and Android-based smartphones and tablets for the first time.

Previously available only on PC platforms, Intel GPA helps developers improve the experience of game and media applications by accessing powerful tools to analyze and optimize performance on Intel Core and Intel Atom processor-based platforms. The tool suite enables developers to enhance application performance on smartphones, tablets, Ultrabooks and PCs. Developers can also optimize Web content for browsers that support hardware-accelerated rich media, including Microsoft Internet Explorer 9, Google Chrome and Mozilla Firefox.

Singapore Retailers Begin Quoting Prices for Ivy Bridge + 7series Motherboard Bundles

A prominent retailer started quoting prices for bundles of next-generation "Ivy Bridge" Core processors and motherboards based on Intel 7-series chipset. The table below reveals prices in Singapore Dollars (SGD) of a large number of board+processor combinations. The table includes current-generation "Sandy Bridge" Core processors and 6-series chipset motherboards, too, as the platforms are inter-compatible (you can run Ivy Bridge processors on 6-series chipset motherboards, and Sandy Bridge processors on 7-series chipset motherboards).

ECS Introduces G24 All-In-One PC Series

Elitegroup Computer Systems (ECS), the world's leading motherboard, graphics card, barebone system, notebook and mobile device manufacturer is honored to launch the brand new G24 All-In-One computer. The smart and stylish G24 enables you connect to the Internet and media directly, making your digital experience extremely versatile.

Equipped with a larger, but thinner, elegant edge-to-edge 23.6' touch panel, Full HD 1080p display. Supporting HDMI-IN compatibility and with a high BTO (Build-To-Order) capability, the Thin Mini-ITX motherboard can be interchanged with Intel H61 Express Chipset and is also compatible to support next generation processors.

novero Unveils the Solana Laptop/Tablet Hybrid

Today novero announced the introduction of Solana, a lightweight, 10-inch laptop/tablet hybrid with a flip-rotating design at the Mobile World Congress in Barcelona. Designed to deliver the best combination of everyday business computing and mobile entertainment, Solana offers optimal flexibility and state-of-the-art features in one unique device.

Whether converting between laptop and tablet mode with just one flip of the screen, or switching between the two operating systems Genuine Windows 7 (Windows 8 ready) and Android within seconds, or staying seamlessly connected through high-speed 3.5G (HSPA+), WiFi or Bluetooth, Solana is the premium lifestyle mobile device built to work, watch, listen, play and connect in multiple ways. Its capacitive sensing multi-touch panel, built-in video camera, stereo loudspeakers and six row full QWERTY keyboard all support the requirements of today's mobile life.

CPU-Z 1.60 Released, Brings Ivy Bridge Support, Knows Some Trinity Too

A fresh (and funky?) new version of CPU-Z has today been released and it brings support for Intel's incoming Ivy Bridge processors, as well as for the Core i5 2550K, 2450P and 2380P, the Xeon E3, the Z77 platform, and for AMD's FX-8140, FX-4150 Bulldozers. Moreover, there's Windows 32/64-bit info in the About tab, and preliminary support for the Piledriver-powered Trinity APUs (from AMD).

To get CPU-Z 1.60 check out this page.

Thanks to stasio for the heads up.

Intel Confirms Ivy Bridge Core Processor Specifications

Intel confirmed specifications of what could be its entire 3rd Generation Core processor family, based on the "Ivy Bridge" silicon, slated for Q1~Q2, 2012. These include details of its desktop Core i7, Core i5 processor models, notebook Core i3, Core i5, Core i7, and their corresponding ULV variants, and so on. Specifications include model numbers, clock speeds, Turbo Boost 2.0 speeds, and basic features such as Built-in Visuals (integrated graphics), caches, HyperThreading, and fab process. These details are meant for retailers and distributors to update them on the upcoming product lineups, so they could fine-tune their inventories.

Notebook lineup details follow.

Eurotech Announces New 6U OpenVPX SBC With Quad-Core Intel Xeon CPU

Eurotech announces the CPU-111-10, a rugged, high-performance 6U VPX (VITA 46) Single Board Computer (SBC) featuring a quad-core Intel L5408 Xeon processor and integrated 10 Gigabit Ethernet switch to support full-mesh backplane data layer interconnectivity for up to eight SBCs integrated into a single chassis.

Available in air cooled or conduction cooled formats, the CPU-111-10 conforms to the OpenVPX (VITA 65) payload module profile MOD6-PAY-4F2T-12.2.2.4 with four fat pipes (10 GBase-BX4) and two thin pipes (1000Base-T).

Intel Capital to Invest in Future of Automotive Technology

Intel Capital today announced a $100 million investment fund to help accelerate innovation and the adoption of new technology and services in the automotive industry. Intel Capital is the first global technology investment organization headquartered in Silicon Valley to announce a dedicated focus on automotive technology innovation.

The Intel Capital Connected Car Fund will be invested globally over the next 4 to 5 years in hardware, software and services companies developing technologies to promote new, compelling in-vehicle applications and enable the seamless connection between vehicles and any connected device, including mobile devices and sensors.
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