Intel started shipping the new Pentium 350, a model designed specifically for low-cost servers, micro-servers, and home servers; a segment Intel originally planned to address with some of its Atom dual-core chips. The Pentium 350 is an offshoot from entry-level desktop and notebook platforms the Pentium brand is currently in charge of, it is designed with durability and energy-efficiency required by servers in mind.

Available in the LGA1155 package, Pentium 350 is a dual-core processor based on the 32 nm Sandy Bridge dual-core silicon. It is clocked at 1.20 GHz, and features 3 MB of shared L3 cache apart from 256 KB L2 cache per core. Thanks to its low clock speed, the chip's TDP is rated at just 15W, making it ideal for home and small business servers. It will naturally benefit from the high IPC of Sandy Bridge architecture. The chip features Intel64 instruction set, its integrated memory controller supports up to 32 GB of dual-channel DDR3-1066/DDR3-1333 MHz memory.

Lenovo, today announced the IdeaCentre Q180 - a consumer desktop PC no larger than a paperback book, yet powerful enough to turn a digital TV into a multimedia hub for enjoying music, videos, games, web browsing and more.

"With the IdeaCentre Q180, we upped our game in the compact PC category," said Nick Reynolds, executive director, Product Group Marketing, Lenovo. "Featuring the latest HD Graphics and Blu-ray 3D playback, the Q180 enables consumers to change the way they enjoy multimedia and the Web in their living room at an affordable price point."

NVIDIA today announced that, for the second year in a row, the world's most energy efficient petaflop-class supercomputer is powered by NVIDIA Tesla GPUs.

The Tsubame 2.0 system at the Tokyo Institute of Technology's Global Scientific Information Center (GSIC) ranks as the greenest petaflop-class supercomputer on the recently released Green500 list. Published twice annually, the Green500 list, rates the 500 most energy efficient supercomputers based on performance achieved relative to power consumed.

Tsubame 2.0 is a heterogeneous supercomputer (combining both CPUs and GPUs) used to accelerate a range of scientific and industrial research in Japan. With sustained performance of 1.19 petaflops per second while consuming 1.2 megawatts, Tsubame 2.0 delivers 958 megaflops of processing power per watt of energy. It is 3.4-times more energy efficient than the next-closest x86 CPU-only petaflop system, the Cielo Cray supercomputer at Los Alamos National Laboratory, which delivers 278 megaflops per watt.

The only way mainstream portable wintels are going the survive the onslaught of smaller, increasingly powerful and energy-efficient computing devices (such as ARM-driven tablets and smartphones), is by slimming down radically, and making themselves available to the mainstream. No, we're not talking about cheapo netbooks, but ultrabooks (ultra-slim notebooks), that provide mainstream notebook-like performance in a much more compact package. Intel will give this form-factor a big push next year with an Ivy Bridge architecture-based processor platform designed keeping it in mind, and technologies centric to it.

To begin with, slimmer form-factors could eat into wired connectivity, hence, Intel will push its Thunderbolt 10 Gb/s interconnect to the fore. But wired connectivity is the least of ultrabook's limitations. Battery life, data storage, and additional computing power will need to be accessible yet optional to it, and hence docking stations will be hot in the market, yet again. Intel will pitch for Thunderbolt to be a standard component of docking port clusters.

Just in time for holiday giving, Samsung is introducing a Piano Black version of its WiFi-only Series 5 Chromebook. At a price of $349, the updated Series 5 is even more giftable than the original.

Chromebook, based on Google's Chrome operating system, is designed to provide people a faster, simpler and more secure computing experience. Due to automatic software updates, Google has continued to release new features and improvements on an ongoing basis. These new features coupled with the Samsung design aesthetic creates a technology device that gets better over time, offering the best possible web experience in one device for the internet-enthusiasts in all our lives.

The TRIM command feature has become an industry standard for internal garbage collection on SSDs. Unlike with magnetic storage devices such as hard drives, in NAND flash storage devices, new data can't simply be overwritten on existing deleted data (like overwriting on cassette tapes), instead NAND flash cells are first put through erase cycles, and then fresh data is written on them. This leads to degradation of performance in SSDs, as all deleted data will be put through erase cycles. The TRIM command allows the drive to tag freshly deleted data for disposal, and then erase flash memory occupied by that data when idling, and dynamically allocating erased cells for fresh data. This dramatically reduces write performance degradation of SSDs. Unfortunately, issuing TRIM commands to SSDs that are part of a RAID volume is so far not possible, because the RAID volume acts as a sort of an abstraction layer between the OS and physical disks. Some low-level data about member disks can still be read by diagnostic tools, but that's about it.

If the Release Notes document of Intel Rapid Storage Technology (RST) driver 11.5.0.1109 Alpha (read here) is to be believed, Intel plans to bring TRIM support to RAID 0 volumes with a future version of RST. Snooping through the document, one can find the following line:

2. This release will not enable the TRIM on RAID0 feature, but it will be added in the next RST 11.5 release. Contact your RST AE representative with questions.

Earlier this week, Intel launched the fastest desktop processors under its Core i7 "Sandy Bridge-E" platform, with is partners, motherboard, memory and cooler vendors. Less than a week into its shelf life, Sandy Bridge-E already has a successor taking shape at Intel, slated for the fourth quarter of 2012, but that's far from being the most interesting part of this news. According to a new internal slide scored by a source at XFastest, Ivy Bridge-E will be compatible with today's Intel X79 platform, and LGA2011 socket.

Suddenly, Sandy Bridge-E makes for a sweeter deal because its platform longevity (for upgrades) is at least two years. Ivy Bridge-E, like Ivy Bridge LGA1155, will be built on the 22 nanometer silicon fabrication process. We don't expect Ivy Bridge-E to be much more than an optical shrink of today's Sandy Bridge-E silicon, but the shrink could leave scope for enabling some of its components otherwise locked out for the Core processor family. Sandy Bridge-E silicon physically holds 8 cores and 20 MB of L3 cache, but the fastest Core processor based on it has just 6 of those cores, and 15 MB of L3 enabled. The source at XFastest says that while Ivy Bridge-E is slated for Q4 2012, the LGA1155 Ivy Bridge will launch across Q1 and Q2 of 2012 (March~April).

Kingston Technology Company, Inc., the independent world leader in memory products, today announced a range of HyperX Genesis memory in 8GB, 16GB and 32GB kits to support the new Intel Sandy Bridge-E X79 quad-channel processors and X79 Express-based motherboards. Kingston HyperX Genesis is the perfect solution for enthusiasts who require 4x raw performance increases afforded by quad channel over single channel solutions.

For extreme users who require both the fastest memory and largest capacity, Kingston's 2400MHz and 2133MHz will soon be available in both 8 GB and 16 GB kits of four modules. Other HyperX Genesis memory for X79 systems include 1866 MHz and 1600 MHz frequencies in kits of four and eight, with capacities ranging from 8GB to 32GB. All of Kingston's HyperX kits have achieved Intel XMP certification and are compatible with the latest X79 motherboards from vendors such as ASUS, GIGABYTE, MSI and ASRock.

NVIDIA today announced that system builders worldwide are now shipping the fastest PC gaming platforms ever built, thanks in part to NVIDIA SLI technology and the just-released Intel Core i7 Extreme Edition processors and X79 chipset-based motherboards.

The combination of NVIDIA SLI technology -- which allows for multiple GPUs to run on a single PC -- and new X79-based motherboards allow gamers to customize their PC experience with up to four NVIDIA GeForce GTX GPUs, including the GeForce GTX 580 and GTX 570, the world's fastest DX11 GPUs. Licensed by the world's leading motherboard manufacturers -- including Intel, ASUS, ASRock, EVGA, Foxconn, Gigabyte and MSI, SLI technology is crucial for playing this year's hottest graphics-intensive games, such as the recently released Battlefield 3 and upcoming Batman: Arkham City with detail, resolution and immersion settings cranked up.

At SC11, Intel Corporation revealed details about the company's next-generation Intel Xeon processor-based and Intel Many Integrated Core (Intel MIC)-based platforms designed for high-performance computing (HPC). The company also outlined new investments in research and development that will lead the industry to Exascale performance by 2018.

During his briefing at the conference, Rajeeb Hazra, general manager of Technical Computing, Intel Datacenter and Connected Systems Group, said that the Intel Xeon processor E5 family is the world's first server processor to support full integration of the PCI Express 3.0 specification**. PCIe 3.0 is estimated** to double the interconnect bandwidth over the PCIe* 2.0 specification** while enabling lower power and higher density server implementations. New fabric controllers taking advantage of the PCI Express 3.0 specification will allow more efficient scaling of performance and data transfer with the growing number of nodes in HPC supercomputers.

The Khronos Group today announced the ratification and public release of the OpenCL 1.2 specification, the latest update to the open, royalty-free standard for cross-platform, parallel programming of modern processors. Released eighteen months after OpenCL 1.1, this new version provides enhanced performance and functionality for parallel programming in a backwards compatible specification that is the result of cooperation by over thirty industry-leading companies. Khronos has updated and expanded its comprehensive OpenCL conformance test suite to ensure that implementations of the new specification provide a complete and reliable platform for cross-platform application development. The OpenCL 1.2 specifications, online reference pages and reference cards are available here.

"The OpenCL working group is listening carefully to feedback from the developer and middleware community to provide significant and timely functionality for heterogeneous computing in this cross vendor open standard," said Neil Trevett, chair of the OpenCL working group, president of the Khronos Group and vice president of mobile content at NVIDIA. "The OpenCL working group is also broadening its membership and has growing representation from the mobile and embedded industries and is enabling innovative devices such as FPGAs to be driven through OpenCL."

On this day 40 years ago, Intel Corporation introduced the world's first commercially available microprocessor - the Intel 4004 - triggering the start of the digital revolution. While most people have never seen a microprocessor, devices that contain them have become so integrated into daily life that they have become virtually indispensible.

Microprocessors are the "brains" inside computers, servers, phones, cars, cameras, refrigerators, radios, TVs and many other everyday devices. The proliferation of microprocessors is due in large part to Intel's relentless pursuit of Moore's Law, a forecast for the pace of silicon technology development that states that roughly every 2 years transistor density of semiconductors will double, while increasing functionality and performance and decreasing costs. It has become the basic business model for the semiconductor industry for more than 40 years.

Elitegroup Computer Systems (ECS), the world's leading motherboard, graphics card, barebone system, notebook and mobile device manufacturer presented white-box All-In-One (AIO) system-G11 not long ago. To surprise the market, ECS provides two more designs for G11-ID2 (North Star) as photo frame style now, and ID4 as L-stand style in Q4, 2011.

Original ID1 as photo-frame style displays an elegant and classical glossy design. ID2 maintains a glossy surface but with a new North Star speaker bezel. North Star represents the leader of stars in Chinese culture and guides the direction in astronomy; G11 new bezel design ID2 leads your new digital life as a North Star. The new ID4 design transfers the photo-frame style to an L-stand style with a brand new stand for users to easily adjust the height and degree of visibility. The new G11 ID4 stand gives you more options for your space arrangement.

ASUS, maker of the world's best-selling and most innovative motherboards, is excited to release a wide range of new X79 motherboards. All feature the new Intel X79 Express Chipset, with support for 2nd generation Core i7 processors in the new LGA 2011 Socket. The complete lineup includes P9X79 Series motherboards with total performance tuning and control, the enthusiast-centric ROG Rampage IV Extreme, the ultra-reliable TUF SABERTOOTH X79, and the professional P9X79 WorkStation Series supporting NVIDIA 4-way SLI and AMD CrossFireX.

All motherboards feature ASUS Dual Intelligent Processor 3 technology with the latest ASUS DIGI+ Power Control design providing three digital voltage controllers onboard, one for the CPU and two for DRAM. ASUS' class-leading Digital Power designs result in better performance, greater stability, and enhanced overclocking for all users. All of the new motherboards ship with multi-GPU support, PCI Express 3.0 capabilities*, exclusive ASUS UEFI and up to 64GB of quad-channel DDR3 support via 8-DIMM slots.

Leading international mainboard and graphics card manufacturer MSI today announces the official release of its X79A-GD65 (8D), X79A-GD65, X79A-GD45, and X79MA-GD45 mainboards. The new mainboards are based on Intel's latest X79 chipset and uses the LGA 2011 socket supporting the 2nd generation Core i7 processors. The X79A-GD65 (8D) features with 8 memory DIMMs, supports 16GB DDR3 memory modules, bringing maximum capacity up to a staggering 128GB! For superior quality and stability, MSI X79 series mainboards adopts Military Class III components. With DrMOS II - the next generation of DrMOS with improved double thermal protection - the lifetime of components is maximized, even in warmer environments or when the machine is heavily overclocked.

MSI X79 series mainboards also feature the latest PCI Express Gen 3 bus and MSI's proprietary Click BIOS II for maximum performance and user convenience. When taking into account all of the other advanced technologies supported such as 3-Way NVIDIA SLI and 4-way AMD CrossFireX multi-GPU processing technology, THX TruStudio PRO sound, Multi-BIOS II, Control Center II, and Super Charger, MSI X79-series mainboards are simply the best choice for enthusiasts!

Razer, maker of high performance gaming gear, has reported that two of their prototype gaming laptops were stolen on the weekend of 4th November from their Bay Area R&D lab. Looking at the basic specs of the laptop, one can see why they were so attractive to thieves: Intel Core i7 2640M Processor (2.80 GHz), 8GB 1333MHz DDR3 Memory, 17.3" LED Backlit Display (1920 x 1080 pixels) & NVIDIA GeForce GT 555M with NVIDIA Optimus Technology and 2 GB Dedicated GDDR5 Video Memory and of course the styling. The outfit is understandably miffed about this and have announced the theft on their Facebook page:

Intel today released its Core i7-3000 series processor family, codenamed "Sandy Bridge-E". These new processors, along with the new Intel X79 chipset, make up for an entirely new platform. The processors are an upscale of the Sandy Bridge architecture found on chips in the LGA1155 package. The Sandy Bridge-E silicon measures 20.8 x 20.9 mm, with a humungous transistor count of 2.27 billion. In its Core i7-3000 configuration, the silicon has up to 6 cores, up to 15 MB of L3 cache, four DDR3 memory channels, and 40 PCI-Express 3.0 lanes ("some" devices "may" support Gen 3.0, Intel's words).

Sandy Bridge-E has the same instruction set as Sandy Bridge, which includes SSE up to version 4.2, AVX, AES, and features Turbo Boost 2.0, HyperThreading. It's the memory controller that's complete upscale. It features four independent 64-bit paths to DDR3 DIMMs, making it a quad-channel DDR3 IMC. DDR3-1600 MHz is natively supported. There are three models, the Core i7-3960X Extreme Edition leads the pack with a clock speed of 3.30 GHz, 3.90 GHz top Turbo Boost speed, and 15 MB of L3 cache. It has 6 cores and 12 threads with HTT enabled. This chip has all its multipliers unlocked and is geared for overclocking. It is priced at US $990 in 1000 unit tray quantities, though retailers might draw a decent margin for the boxed parts.

G.Skill has announced the development of its brand new RipjawsZ series quad-channel memory modules, designed specifically for Intel LGA2011 Sandy Bridge-E processors and X79 systems.

A World First in Super-Sized & Super-Speed, the new RipjawsZ builds on a history of Ripjaws world first performance boundaries and award-winning quality, by including extreme performance kits such as, DDR3 2,500MHz 16GB (4GBx4) 1.65V kit, and super size kits including DDR3 64GB (8GBx8) 2133MHz at only 1.5V, and the fastest ever 8GB DIMMs in the DDR3 2,400MHz 32GB(8GBx4) kit. The following screens show two RipjawsZ 2,400MHz 32GB(8GBx4) kits running together at 2400MHz 64GB and booting at breath-taking 2600MHz 64GB with ASUS Rampage IV Extreme motherboard.

Just a handful of days ahead of Sandy Bridge-E's launch, a Chinese tech website, www.inpai.com.cn (Google translation) has done what Chinese tech websites do best and that's leak benchmarks and slides, Intel's NDA be damned. They pit the current i7-2600K quad core CPU against the upcoming i7-3960X hexa core CPU and compare them in several ways. The take home message appears to be that gaming performance on BF3 & Crysis 2 is identical, while the i7-3960X uses considerably more power, as one might expect from an extra two cores. The only advantage appears to come from the x264 & Cinebench tests. If these benchmarks prove accurate, then gamers might as well stick with the current generation Sandy Bridge CPUs, especially as they will drop in price, before being end of life'd. While this is all rather disappointing, it's best to take leaked benchmarks like this with a (big) grain of salt and wait for the usual gang of reputable websites to publish their reviews on launch day, November 14th. Softpedia reckons that these results are the real deal, however. There's more benchmarks and pictures after the jump.

Chinese company JEHE is launching its latest compact mini-ITX motherboard in Europe under the Giada brand, the MI-Z68. As the name suggests, it is based on Intel Z68 chipset, and supports Core i3/i5/i7 processors in the LGA1155 package. There is no TDP restriction, as the board features a full-fledged CPU VRM that draws power from a 4-pin 12V connector apart from a 20-pin ATX connector (any of today's PSUs with 24-pin connector will support it). The board uses a 4+1 phase CPU VRM, with single phase memory. There are two DDR3 DIMM slots, supporting dual-channel memory. The lone expansion slot is a PCI-Express 2.0 x16.

There's impressive storage connectivity, this includes two mSATA 3 Gb/s (on on either side of the slot), two SATA 6 Gb/s (blue), and two SATA 3 Gb/s (black). There are just two USB 3.0 ports, both on the rear panel, and driven by a Renesas-made controller. 8-channel HD audio with optical SPDIF output, one gigabit Ethernet connection (driven by Realtek-made PHY), display outputs that include DVI and HDMI, a number of USB 2.0 ports and PS/2 keyboard, make for the rest of the rear panel. The Giada MI-Z68 will be priced at €88.

Here are the first slides detailing Haswell, Intel's next generation processor architecture that succeeds Sandy Bridge and Ivy Bridge. Intel follows a "tick-tock" product development model. Every year, Intel's product lineup sees either of the two. A "tock" brings in a new x86 architecture, a "tick" miniaturizes it to a newer silicon fabrication process. For example, Sandy Bridge is Intel's latest architecture, and is based on the 32 nm fab process. Ivy Bridge is a miniaturization of Sandy Bridge to 22 nm. Likewise, Haswell will be a brand new architecture, it will use the 22 nm fab process cemented by Ivy Bridge.

If all goes well with Intel's 22 nm process, Haswell is scheduled for Q2 2013. 2012 (Q2 onwards) will be led by Ivy Bridge. But then here's a "shocker": Haswell's desktop version will use a brand new socket, LGA1150, and will be incompatible with LGA1155. This is because of drastic changes in the pin map of the package. Sandy Bridge and Ivy Bridge share the LGA1155 socket, and will hence, have kept the socket alive for over 2 years. A major change with the component arrangement in the platform that is affecting Haswell's pin map is that Haswell will have a higher bandwidth chipset bus, rearranged PCIe pins (with FDI pins), rearranged power pins, and miscellaneous pins. It does away with a separate power domain for the integrated graphics controller.

Motherboard vendors aren't the only ones getting ready for the big launch of Intel's new high-end desktop (HEDT) platform - Sandy Bridge-E, the ecosystem also consists of memory and cooling products vendors - more importantly, memory. Intel Sandy Bridge-E processors pack an integrated memory controller with a massive 256-bit bus width. To put it into perspective, if a motherboard is populated with four DDR3-1333 MHz modules, the system memory bandwidth would be a staggering 42,600 MB/s. Like everyone, G.Skill is expected to have memory kits with four DDR3 memory modules. It is likely that these kits consisting of four matched modules will be referred to as "quad-channel". Around this time, the company will have a new lineup, RipjawsZ.

RipjawsZ will make use of a new, slightly taller than standard heatspreader design, and will be available in at least two color options - black and red. Some of the kits will consist of just modules, while some will also pack Turbulence II air-coolers that use two fans. In all there are two basic types of modules: ZL, ZH; among these ZH provides the best timings for the frequencies it offers. These modules will be available in a variety of speeds: DDR3-1333, DDR3-1600, DDR3-1866, DDR3-2133, and DDR3-2400. Modules with speeds of up to DDR3-1866 make do with 1.5V DRAM voltage, DDR3-2133 needs 1.60V, while some higher speed modules need up to 1.65V. These kits are available in a variety of capacities - 8 GB (4 x 2 GB), 16 GB (4 x 4 GB), 32 GB (4 x 8 GB), and 64 GB (probably 8 x 8 GB). These modules will be Intel eXtreme Memory Profile (XMP) revision 1.3 compliant.

MSI has announced the launch of a new all-in-one PC model designed specifically for business users: the Wind Top AP2011. The industry-leading adoption of LED panel, integration of the display into the main body of the PC, and brand-new industrial design make for a neat, uncluttered desktop. The Wind Top AP2011 also features unique energy-saving technology, providing power consumption that is approximately 30% lower than conventional CCFL panel. Combined with MSI's other energy-saving technologies, this can help business enterprises to make substantial savings on their electricity bill, making this a truly "green" PC.

As far as performance is concerned, the Wind Top AP2011 uses the second-generation Intel Core processor, whose revolutionary computing capabilities permit more efficient multi-tasking. Besides its energy-saving characteristics and enhanced support for multi-tasking, MSI has also given the Wind Top AP2011 a range of additional features specially designed to meet the needs of business users, including the provision of multiple COM ports, the ability to link the AP2011 up to a barcode reader, credit card reader or credit card terminal. With its energy-saving design and its unique combination of advanced technology and efficient functionality, the Wind Top AP2011 is ideal for both individual users and business enterprises.

The latest data from Jon Peddie Research, which is known for closely tracking the PC graphics hardware industry, claims that the PC graphics industry has stabilized and returned to a more predictable path in Q3 2011. Shipments have increased 16.7% sequentially, and 18.4% compared to Q3 2010 (year over year). Much of this is attributed to the market success of Intel "Sandy Bridge" Core processors, which has also worked to increase Intel's market share. Intel is the market leader in PC graphics, with AMD in the second place, and NVIDIA third.

Intel holds 60.4% of the market, a significant increase from the 54.8% it held in Q2 2011. It grew at the expense of both AMD and NVIDIA. AMD's share slipped a little, despite the introduction of new A-Series "Llano" accelerated processing units. AMD holds 23% of the market, down from the 24.4% it held in Q2. NVIDIA is in a bit of trouble. The green team holds 16.1% of the market, down from 20.1% it held in Q2. This is attributed to its exit from integrated graphics. Its discrete GPU business still sees growth.

Thermaltake, being the industry pioneer brand in thermal solutions with the mission of "delivering the perfect user experience," carrying the corporate vision of "building Thermaltake Technology into a cultural brand for the enjoyment of entertainment, e-Sports, technology, and lifestyle," featured the Contac CPU air cooling Series that aids in fulfilling various needs in the market as well as the corporate mission of "delivering the perfect user experience." This fall adding the shimmering Thermaltake Contac 39 and Contac 30 CPU air cooling to the series, providing a wider range of solution for bargain hunter who desire value and performance equally.