After the heated feedback of the M912 Series with swivel screens that were launched in 2008, GIGABYTE will demonstrate various 10.1-inch mobile PCs at the CeBIT 2009 held in Hannover according to public expectation. These include the Touch Note M1028 also equipped with the swivel screen, the Thin Note M1024 which is only 890 grams and 2cm thick, and the Booktop M1022 equipped with the exclusive docking station for turning the Booktop into a desktop. These models will again display GIGABYTE's excelling R&D power. Also, the new-generation Intel Centrino 2 notebook PCs with different screen sizes will be the focus at the present CeBIT. As one of the leading brands in notebook PCs, GIGABYTE will surely bring refreshing models to the public in 2009.

Touch Note M1028: With a fashionable and elegant appearance, the Touch Note M1028 has a golden coffee top cover of exquisite quality and a 10.1-inch LED backlight swivel screen. It is a combination of notebook and tablet PCs that delivers multiple application modes for convenience use. The two resolution options for this model include 1024x600 and 1366x768, which are the mainstreams of the market. In addition to the mobile features like Wi-Fi, Bluetooth and Express Card slot. What is noteworthy is that the M1028 is equipped with a wide range of crafty designs from GIGABYTE. Besides the 92% full-scale keyboard with premium quality, the M1028 supports the embedded 3.5G (HSDPA) module for users to experience the wonder of mobile life.

Intel researchers have developed the world's first embedded balanced antenna for digital TV. This patent-pending Intel innovation will enable on-the-go users to watch digital television on their laptop without the need for an external antenna. Eliminating the external antenna reduces the number of items to purchase, carry and keep track of. No other details were unveiled.

ECS showcased yet another upcoming motherboard during the ongoing CeBIT event: the LFH-A. Based on Intel's P55 chipset, the motherboard supports LGA-1156 socket. Featuring all the essentials the Ibex Peak platform provides, that includes two support for dual-channel DDR3 memory, six internal SATA ports, two PCI-Express 2.0 x16 slots and one PCI-E x4, the board also extensively supports Intel's Flexible Display Interface that links the IGP on the processor die to the connectors on the board: DVI, D-Sub and HDMI.

The P55 chipset is cooled by a small pre-production heatsink. It should also indicate that the P55 chip indeed runs cool enough to warrant a heatsink of that size, and that since most of the traditional chipset machinery has migrated to the CPU, there's very little the vendors need to do as far as chipset cooling goes. ECS LFH-A might feature in some of the first waves of motherboards to launch along with the launch of the platform itself.

PC component cooling major Arctic Cooling is readying a revision for the Freezer XTREME CPU cooler. The new cooler, simply called Freezer XTREME Rev. 2, retains the basic design, while having a reworked retention module. Due to the size and cooling efficiency of the cooler, it was found of it to be capable of supporting the entire range of desktop processors based on Intel's Nehalem architecture.

The new, reworked retention module provides support for Intel sockets LGA-1366 and LGA-1156. That aside, standard features and design of the cooler remain: copper CPU contact block, four copper heatpipes, large aluminum fin array, and a central 120 mm fan to circulate air. Arctic Cooling is expected to announce this cooler soon. Whether it comes up as a separate SKU or it replaces the existing Freezer Xtreme model from the lineup remains to be seen.

Advancing innovation around the Intel Atom processor with a goal to target additional market segments, Intel Corporation today announced four unique versions of processors and two new system controller hub additions to the company's "embedded" business division product line-up. The new products for the Intel Atom processor Z5xx series include industrial-temperature options, as well as different package-size choices better suited for in-car infotainment devices, media phones, eco-technologies and other industrial-strength applications.

We continue to give you the latest information on the Psion versus Dell and Intel saga. In episode three, Psion counter attacks and surprisingly demands $1.2 Billion from Intel. Psion Teklogix has filled a counterclaim against Intel in response to the chip giant's attempt to get the Netbook trademark freed from legal responsibilities. Part of the complaint, filed with the US District Court for Northern California, says:

Intel has acted willfully and maliciously, has unlawfully attempted to trade on the tremendous commercial value, reputation and goodwill of the Netbook mark, and has deliberately and intentionally confused and deceived the public as to an affiliation, connection or association of Intel with Psion, and/or as to the origin, sponsorship or approval of Intel's goods and/or services,

checkmate

Intel Corporation and TSMC today announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure, and System-on-Chip (SoC) solutions. Under the MOU, Intel would port its Atom processor CPU cores to the TSMC technology platform including processes, IP, libraries, and design flows. The collaboration is intended to expand Intel's Atom SoCs availability for Intel customers for a wider range of applications through integration with TSMC's diverse IP infrastructure.

MSI will be one of the first motherboard manufacturers to design one based on Intel's upcoming P55 chipset, supporting Intel's upcoming Core i5 series processors, using the LGA-1156 socket design. Boy, is this one interesting board. Pictured by Hardware-Aktuell, the MSI G9P55-DC picture shows perhaps the first picture of a fully-assembled LGA-1156 socket, with its complete retention mechanism in place.

The CPU is fuelled by two independent 6-phase power circuits. Four DDR3 DIMM slots support dual-channel memory. Storage comes in the form of six SATA II ports routed to the P55 chip, with four (blue) SATA II ports and an IDE connector courtesy of an additional controller. The board features two PCI slots, a PCI-E x1 slot to hold a "hardware" sound card (part of the package), an open-ended PCI-E x4 slot and three PCI-E 2.0 x16 slots. In case you're wondering how the 16 PCI-E lanes the CPU ends up sparing for graphics ends up into a 3-Way SLI supportive solution, take a look at what would trick you for a southbridge. That, infact is the NVIDIA BR-03 chip. It can provide two PCI-E x16 links, or PCI-E x16, x8, x8 connections to the three slots, much like in the nForce 780a SLI solutions for the AMD platform. Let the puny chipset heatsinks not fool you either. This board is pre-production and its release-grade version will feature an MSI-made cooling solution that cools the chipset and the rather crowded VRM area. We will learn more about this board as CeBIT progresses.

After spinning off its manufacturing division to The Foundry Co., AMD is left with all the engineering resources it needs to make processors. Contradicting older roadmap slides by the company predicting it would start selling 32 nm processors in 2011, Dirk Meyer, CEO of AMD in an interview with Information Week said that the company is on-track to ship smaller, more powerful processors built on the 32 nm manufacturing process by 2010.

The new manufacturing process would allow the chip maker to step up transistor counts to add more features and computational power. Tomorrow, on March 2, the AMD is expected to close the deal with Advanced Technology Investment Company (ATIC) of Abu Dhabi to form The Foundry Company (TFC). This would render AMD fabless. The company will then, like other fabless market heavyweights such as NVIDIA and VIA, will focus on designing processors, while TFC, its largest foundry partner will manufacture the processors. Currently AMD is tied up with foundry companies such as TSMC and UMC for manufacturing products of its Graphics Products Group, products such as GPUs and chipset.

AMD will be an year behind larger market rival Intel in selling processors built on the 32 nm technology. Intel plans to roll out 32 nm processors by Q4 2009. AMD's designs will be ready by mid-2010, following which volume production of its 32 nm chips will commence by Q4 2010.

Here's a quick reminder before going straight to the story. Recently both Intel and Dell filed petitions asking for the cancellation of Psion Teklogix' "Netbook" trademark. Both manufacturers said they need the "Netbook" term liberated from any trademark responsibility, so they can use it as unified term for new class of ultra-portable laptop computers designed for use on the go. Currently makers like Dell, ASUSTeK, Hewlett-Packard, Acer, Lenovo, LG Electronics, Samsung, MSI, GIGABYTE and many others sell products branded as netbooks. Today Psion responded to the legal accusations, by sending an official response to the public. The full statement, because too big, will appear after you click on the read full story marker.

Toldex has unveiled two computer modules with pretty impressive dimensions. The credit card sized Robin Z530 and Z510 are embedded Nano COM Express Type 1 computer modules. They are based on Intel Atom Z530 and Z510 processors and the Intel System Controller Hub US15W, which combines the memory controller, graphic engine and I/O in a single, ultra compact design. The Intel Atom Z530 processor runs at 1.6 GHz and is designed for high performance computing with low power consumption. Robin Z510 features the Intel Atom Z510 processor which runs at 1.1 GHz. Robin Z530 also offers extension for a PCI Express x1 slot, GBit LAN, and up to 7 High Speed USB ports for fast signal connectivity. One USB port can be configured as USB client. The module features in the standard configuration a dual independent graphic output with VGA and LVDS outputs. Robins provide a wide range of interfaces for mass storage devices in Z5xx series. Both micro systems can include up to 2 GB Solid State Flash Disk, a MicroSD slot and a SATA interface on board. For additional information and prices, please click here.

Intel's Pentium Dual-Core E5200 processor is getting on course for a specifications update. The chip will feature in a new, improved Wolfdale-2M core, spec'd out as the R0 stepping, from its current M0 stepping. The new stepping is intended to add new instructions, power-management features, and bring about changes in the chip-package. A short list of known changes is as follows:

• CPUID changed from 10677 to 1067A
• Power State Indicator (PSI) support with Intel 4 series chipsets
• New instructions - XSAVE and XRSTOR
• New S-spec and MM numbers
• New halide-free chip package

Due to the changed CPUID, users may require BIOS updates to detect the CPU. According to the company, E5200 R0 should be out by April 13.

Intel expanded its enterprise-grade Xeon processor lineup with three new models under the Xeon UP series. Built on the 45 nm High-K process, at least two of these new chips boast of high energy efficiency. First up, is the X3380 quad-core chip that has 12 MB of L2 cache, 1333 MHz FSB, and 3.16 GHz of clock speed. Its TDP is rated at 95 W.

The second chip introduced, the L3360 quad-core runs at 2.83 GHz, 1333 MHz FSB, 12 MB of cache, but a reduced TDP rating at 65 W. Lastly, a high-speed yet energy-efficient L3110 dual-core chip runs at 3.00 GHz, comes with 6 MB of cache and a 1333 MHz FSB, with its TDP rated at 45 W. The X3380, L3360 and L3110 are priced at US $530, $369 and $224 respectively, in 1000-unit tray quantities. Intel also introduced the single-core 1.6 GHz Atom Z530 processor that sells for around $70 each, in bulk.

A notable inclusion of perhaps every processor-in-box product, apart from the processor, cooler and documentation, is the case-badge for the processor. The case-badge is a small sticker that shows the company logo for the processor installed in the PC. Intel is reportedly designing new logos (in effect case-badges) for at least 14 of its products. The logos, most of which are rounded-rectangle shaped seem to have been designed to give the processor box a new look, also indicating perhaps that the company is designing new packaging material as well, that use the new logos.

Intel has large volumes of Core 2 Duo, Core 2 Quad and Xeon processors in the making, that Intel feels need new clothing. Core 2 Duo and Core 2 Quad, get the distinct chrome-blue colour that one can find in the Core i7 (non-XE) logo. Core 2 and Core i7 logos look similar at the first glance. Core 2 Extreme gets the chrome-black colour the Core i7 XE logo has. All Centrino series badges stick to the silver-white colour scheme. The logo designs have small inlets on the top-right corner that have small portions of the die-shot. Core 2 and Centrino logos have die-shots of a portion of the Penryn core, while the Core i7 logos use those of the Bloomfield core. Interestingly, Xeon keeps its current logo, as well as a new one with chrome-slate colour, and design of the current Core i7 logo, perhaps making it clear the Xeon processor is based on the Nehalem architecture. The new logos will be effective from Q2 2009.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced immediate availability of DDR3 Registered DIMMs (RDIMMs) and DDR3 ECC Unbuffered DIMMs (ECC UDIMMs).

Super Talent's 1GB and 2GB ECC UDIMMs are immediately available in production volumes and support speeds up to 1333MT/s for single DIMM per channel operation and 1066MT/s for two DIMM per channel operation. Super Talent's 1GB x8 RDIMM is also immediately available in production volumes and supports speeds up to 1333MT/s for single DIMM per channel operation, 1066MT/s for two DIMM per channel operation, and 800MT/s for three DIMM per channel operation. All these products are designed to be compatible with Intel's upcoming Nehalem EP Server Platform.

Kingston Technology Company, the independent world leader in memory products, today announced its 1333 MHz DDR3 server memory modules were validated by Intel for use on its Xeon processor-based motherboards. Kingston's registered ECC server ValueRAM DIMMs are optimized to take advantage of the triple-channel architecture for Intel's newest server platforms using the new Nehalem-based Xeon processors. The 1333 MHz DDR3 server modules will be available in 3 GB and 6 GB triple-channel kits. Kingston server memory is backed by a lifetime warranty and free, 24/7 technical support. For Intel validation information, please click here.

DigiTimes reports of new Intel ultra low-voltage (ULV) processors being prepared for the end of next month.

Intel plans to launch two new ultra low voltage (ULV) CPUs by the end of March this year mainly targeting the company's consumer ultra low voltage (CULV) platform for ultra-thin notebook products, according to sources at notebook makers. The two CPUs are the Core 2 Duo SU9600 with a core frequency of 1.6 GHz and priced at US$289 in thousand-unit tray quantities, and Core 2 Solo SU3500 at 1.4 GHz and US$262. The two CPUs join the previously launched SU9400, SU9300, SU3300 and Celeron 723 under the CULV product line. All can be pared with the GS45 IGP chipset.

Now that Dell started the legal war with PSION, it's time for Intel to go in persuit of the "Netbook" trademark. The latter has filled a petition in the U.S. District Court against PSION TEKLOGIX. This action arises from the allegations recently launched by PSION that it has the exclusive right to use the term "Netbook". Intel claims PSION trademarked the term for its laptop computers, but discontinued its line of laptops in 2003. Effective that date, the term is no longer under PSION's supervision. Now Intel demands cancellation of the "Netbook" trademark for little computers. Intel claims the public already uses the term generically, as "extensions of the notebook category, smaller computers purpose-built for mobile Internet access." Accordingly, the court should cancel PSION's trademark registration and enjoin PSION from asserting rights in the netbook term. A copy of the petition is posted here.

Solid-state drives are relatively new technology for anyone of us, and up until now we've heard only good things about them. They are fast, small, they have no moving parts, but what happens after extensive use of the flash memory that is incorporated in them? Yesterday a review was posted over at PC Perspective, entitled "Long-term performance analysis of Intel Mainstream SSDs". According to the information posted, it appears that Intel's X25-M MLC SSD drives may degrade in performance after a period of time when they are put to extensive use. PC Per claims that once an Intel solid-state drive is used, after a period of time it will no longer be as fast as a new one, neither its rated transfer speeds will be the same.
In response, Intel stated today: "Our labs currently have not been able to duplicate these results," "In our estimation, the synthetic workloads they use to stress the drive are not reflective of real world use. Similarly, the benchmarks they used to evaluate performance do not represent what a PC user experiences." Intel also said: "In general, when a PC's drive (SSD or HDD) is full, there will be some reduction in system performance, however the performance reduction reported by PC Perspective is higher than we generally expect, which is why we are looking into the methodology."
We'll keep you posted if there's new information on the matter.

Intel recently informed its partners that as part of its nonstop update process, some of the giants processors that are not competitive anymore are going to be slowly phased out. Both the 3.0GHz Intel QX9650 and the 3.2GHz QX9770 desktop processors will dissapear from market shelves forever. Both processors are no longer listed in Intel's official processor price list. Final orders will be taken till June 5th of this year and the final tray processors are expected to ship February 2, 2010, while boxed versions will ship until September of next year.

SiS today announced the SiSM671 chipset supporting the Intel dual-core Atom 330 CPU has been adopted by Dell for its Flexible Computing Solution the OptiPlex FX160.

Earlier this week, Intel slapped NVIDIA with a complaint claiming that NVIDIA lacked the privileges derived from earlier agreements between the two companies NVIDIA to make chipsets for Intel's new generation of processors featuring integrated memory controllers. NVIDIA however, dismissed the charges making it clear it didn't have any products in the making that currently violates the agreement, though it feels confident that under the existing agreement it could carry on with development of chipset technologies (more here). Intel pressed fresh charges against NVIDIA which state that the company falsely claimed to have acquired a license to the QuickPath Interconnect technology.

Interestingly, a report by bit-tech.net sheds light on what Intel wants: nothing, while keeping the window open for re-negotiation of agreements between the two companies as an option. Intel does not seek any form of damages from NVIDIA, except merely asking it to pay for its legal fees if Intel wins, a standard practice in court cases. Intel also seems to be using the "re-negotiation" part as a carrot to let NVIDIA concede. "I wouldn't rule out a re-negotiation if we win the suit," said Intel spokesperson Chuck Mulloy, in an interview to bit-tech. "There are options available to us and re-negotiating the license is one of them." he said. The "other options", according to Mulloy, are kept under the wraps, which might as well include termination of the whole agreement, forcing a re-negotiation if NVIDIA needs to continue making core-logic technologies for the Intel platform? Intel has made a redacted version of the complaint public as it may contain some very confidential information that cannot be disclosed. The redacted copy can be read here (PDF). So what is the whole point in this exercise? To make drastic changes in agreements between the two companies by working out a renegotiation? The turn of events in weeks, or even days to come will tell.

In a surprising move by Intel, the silicon giant filed a lawsuit against NVIDIA corporation at the Court of Chancery in the State of Delaware, over the chipset licensing agreement between the two companies, that allows NVIDIA to make core-logic (chipset) for Intel microprocessors. Intel's contention states that the licensing agreement signed between the two companies about four years ago, that allowed NVIDIA to make nForce series chipset supporting Intel processors, does not cover the the privileges required by NVIDIA to prepare chipsets for Intel's new generation of processors that feature integrated memory controllers.

As of now, NVIDIA does not stand at the receiving end of any legal action, since the company has no chipset products either released, or in production, that supports Intel's Core i7 series processors. The legal-spat in the making, between the two companies, may however affect NVIDIA's possible plans to develop chipset products for Intel's new 45 nm and 32 nm processors. NVIDIA on its part, defends its position, dismissing Intel's claims. Jen-Hsun Huang, NVIDIA's president and CEO maintained that the license agreement negotiated earlier would still apply, though he did not miss the opportunity to affirm his beliefs that the focus on CPU being the soul (if not the heart) of the PC, is slowly yet surely shifting towards the GPU. "This is clearly an attempt to stifle innovation to protect a decaying CPU business" he said. According to the NVIDIA CEO, it is obvious that Intel fears the competition NVIDIA poses with its platform core-logic innovations, that it had to file the complaint. This spat between the two major computer hardware companies could get uglier in the days to come. The press-release from NVIDIA in response to Intel's charges follows:

LG Electronics (LG) and Intel Corporation today announced a collaboration around mobile Internet devices (MIDs) based on Intel's next-generation MID hardware platform, codenamed "Moorestown," and Linux-based Moblin v2.0 software platform. The LG device is expected to be one of the first Moorestown designs to market.
LG and Intel's common goal is to unleash rich Internet experiences across a range of mobile devices while delivering the functionality of today's high-end smart phones. The collaboration on the new design extends a close working relationship the two companies have enjoyed across their respective mobile product lines, which now spans the notebook, netbook and MID categories.

Intel will be moving its current high-end X58 chipset to B-3 stepping, the company announced in a recent official notification to motherboard makers. The IOH (I/O Hub) component of the Intel X58 Express chipset is converting from the current B-2 stepping to the new B-3 stepping. This step will require manufacturers to do a re-qualification, although both revisions are pin-to-pin compatible. No modifications or changes in the design of current motherboards will be needed for the new chipset stepping. First batch of B-3 X58 silicon will become available to board manufacturers on April 10th. The B-3 chipset marking will be replaced from SLGBT to SLGMX.