Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, is proud to announce that the TH120/240/280/360/420 V2 ARGB Sync All-In-One Liquid Cooler - Snow Edition, the TH280 V2 ARGB Sync All-In-One Liquid Cooler - Matcha Green Edition, and the TH240/280/360/420 V2 Ultra ARGB Sync All-In-One Liquid Cooler - Snow Edition are ready for purchase.

Besides the previous black color, TH V2 ARGB and TH V2 Ultra ARGB now come in white as well. The TH V2 ARGB/Ultra ARGB Snow is a 2nd generation design of the TH series, upgraded with superior aesthetics and cooling performance. These AIO liquid coolers possess a wide range of 120 mm/140 mm fan models, allowing them to meet various chassis sizes. To mix and match with Thermaltake's matcha green chassis, there is also a TH 280 V2 ARGB Matcha Green AIO for you to choose from.

Lexar, a leading global brand of flash memory solutions, is excited to announce THOR OC DDR5 Desktop Memory. Featuring a complete redesign that pays homage to Thor's hammer, this memory also boasts a durable, solid aluminium heatsink that more than stands up to the challenges of overclocking by providing superior heat dissipation. Lexar THOR OC DDR5 Desktop Memory delivers up to 6000MT/s with timing as low as CL32 for a truly next-gen experience. It features a low-profile form factor that is perfect for compact PC builds. It also supports Intel XMP 3.0 and AMD EXPO overclocking and is compatible with most DDR5 motherboards.

Lexar THOR OC DDR5 Desktop Memory's on-die Error Correction Code (ECC) offers improved stability and reliability while its on-board Power Management IC (PMIC) enhances power efficiency. Another option for PC users is THOR OC DDR4 Desktop Memory. It offers 3200MT/s performance with timing of CL16 and is designed for PC enthusiasts and extreme gamers. It has an aluminium heat spreader with a winged design to keep systems running cool and is compatible with INTEL XMP 2.0 and AMD Ryzen.

Velocity Micro, the premier builder of award-winning enthusiast desktops, laptops, high performance computing solutions, and professional workstations announces the immediate availability of the ProMagix G480a and G480i - two GPU servers optimized for High Performance Computing and Artificial Intelligence. Powered by either dual AMD Epyc 4th Gen or dual 4th Gen Intel Scalable Xeon processors, these 4U form factor servers support up to eight dual slot PCIe Gen 5 GPUs to create incredible compute power designed specifically for the highest demand workflows including simulation, rendering, analytics, deep learning, AI, and more. Shipments begin immediately.

"By putting emphasis on scalability, functionality, and performance, we've created a line of server solutions that tie in the legacy of our high-end brand while also offering businesses alternative options for more specialized solutions for the highest demand workflows," said Randy Copeland, President and CEO of Velocity Micro. "We're excited to introduce a whole new market to what we can do."

Eurocom is launching the highly upgradeable and customizable Nightsky RX415 Superlaptop with 15.6" display, Intel Core i7-13900HX processor, NVIDIA GeForce RTX 4070 or 4060 graphics, up to 64 GB DDR5-5600 memory and up to 16 TB of solid state storage.

"The EUROCOM Nightsky RX415 offers high level of customization and user upgradeability as part of Eurocom's design principles. It is heavy duty, yet lightweight with aluminium alloy chassis." Mark Bialic, Eurocom President said. "The EUROCOM Nightsky RX415 is designed for both professional users as well as gamers. Unlike any other laptop on the market it comes loaded with 10 physical ports providing unprecedented connectivity.M Mark Bialic, Eurocom President said. "With the Eurocom Trade in Program Customers can now get up to 25% off a brand new EUROCOM Nightsky RX415 with an eligible Trade-In."

YEYIAN GAMING, a leader in innovative pre-built gaming PCs, peripherals, and computer components, is thrilled to announce the market launch of eight new gaming desktop PCs powered by the latest INTEL Core i9/i7/i5 14th Gen unlocked CPUs. Four of the eight new models are available exclusively for purchase on Newegg. These newly launched models are meticulously crafted to redefine the gaming experience, catering to both professional gamers and avid enthusiasts alike.

The highlight of this remarkable launch is the fusion of INTEL 14th gen processors with NVIDIA RTX 4000 series graphics cards, culminating in an unparalleled gaming extravaganza that redefines the boundaries of what's possible in the gaming world.

Azza has introduced its new Cube 240 and Cube 360 liquid AIO coolers, compatible with Intel's upcoming LGA1851 socket for Arrow Lake processors. The new LGA1851 socket offers more contact pins than the previous LGA1700 socket, but it maintains the same dimensions and mounting spacing, allowing many existing coolers to remain compatibility. As we see with the latest Reddit post of the Azza Cube 360 installation manual, the LGA1851 socket will retain cooler compatibility with the current LGA1700 socket. For users planning to upgrade to the upcoming Arrow Lake platform, the cooler installation will be the least of their worries if their mounting brackets are compatible.

However, one notable change with LGA1851 is the higher maximum dynamic pressure, signifying increased mounting pressure from CPU coolers. But that only sometimes leads to new mounting mechanisms for coolers. In addition to Azza, Noctua's coolers, like NH-U12, have also confirmed signs of Arrow Lake support, as you can see here.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the new QXG-10G2SF-X710 10GbE network expansion card. Equipped with the advanced Intel Ethernet Controller X710-BM2, this PCIe Gen 3 card (compatible with PCIe Gen 2) can be installed into a QNAP NAS or Windows /Linux PC, instantly augmenting connectivity with two high-speed 10GbE ports.

Featuring a low-noise fanless design, the QXG-10G2SF-X710 comes with two 10GbE SFP+ (10G/1G) network ports. Users can utilize SMB Multichannel or Port Trunking to combine bandwidth, providing up to 20 Gbps of data transfer potential, thereby accelerating large file sharing and intensive data transmission. The QXG-10G2SF-X710 also supports SR-IOV that enhances network resource allocation for VMware virtualization applications, reducing network bandwidth consumption and significantly lowering CPU usage for virtual machine servers (hypervisors).

Intel has released the latest version of Arc GPU Graphics Drivers, version 101.4900 Beta, which brings Game On Driver support on Intel Arc A-series Graphics for Alan Wake 2, Cities: Skylines 2, WRC, and Ghostrunner 2 games. New drivers do not fix any issues or bugs, so it will still have some issues in games like Starfield.

In terms of performance, and compared to the 101.4887 drivers, these will bring up to a 20 percent average performance uplift at 1080p and high settings and up to a 22 percent average performance increase at 1440p and medium settings in the upcoming Alan Wake 2 game which launches on October 27th. It also increases the average FPS by up to 34 percent at 1080p with high settings and up to 26 percent at 1440p with medium settings in Cities Skylines 2 (DX11), which launches today, October 24th.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.4900 Beta

Intel today shared its plans to advance its semiconductor technology development facilities at the Gordon Moore Park at Ronler Acres in Hillsboro, Oregon. The campus is Intel's innovation hub for leading-edge semiconductor research, technology development and manufacturing in the United States. This undertaking is possible with support from the state of Oregon, city of Hillsboro and Washington County, and in anticipation of support from the U.S. CHIPS and Science Act.

"Intel has been dedicated to driving innovation and advancing technology in Oregon for almost five decades, and we are set to lead the charge in restoring America's leadership in semiconductor R&D and manufacturing, backed by Oregon and the U.S. CHIPS Act. This investment further solidifies our commitment to the Silicon Forest and rebalancing the global semiconductor supply chain," said Dr. Ann Kelleher, Intel executive vice president and general manager of the Technology Development Group.

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Intel earlier this week updated its desktop processor product stack with the introduction of the 14th Gen Core "Raptor Lake Refresh" processors. During our coverage of the processor, we erroneously mentioned that the processor supports the upcoming Thunderbolt 5 connectivity standard. Intel reached out to us for a correction, which revealed an interesting detail. Apparently, 14th Gen Core desktop processors do not support Thunderbolt 5, even though Intel has their own TB5 controller design codenamed "Barlow Ridge". However, these won't arrive before Q1 2024, the currently shipping "Maple Ridge" controller has only support for Thunderbolt 4. But even once Barlow Ridge is available, they will not be compatible with "Raptor Lake Refresh" socketed desktop processors.

Intel announced the Thunderbolt 5 standard in September, around the same time, it provided a technical reveal of its upcoming Core "Meteor Lake" mobile processors. The new standard provides a generational doubling in bandwidth to 80 Gbps (per direction), but relies on an exotic new feature called Bandwidth Boost. With this feature enabled, users get 120 Gbps of bandwidth in a particular direction, and 40 Gbps on its opposite direction.

Building on the AI PC use cases shared at Innovation 2023, Intel today launched the AI PC Acceleration Program, a global innovation initiative designed to accelerate the pace of AI development across the PC industry.

The program aims to connect independent hardware vendors (IHVs) and independent software vendors (ISVs) with Intel resources that include AI toolchains, co-engineering, hardware, design resources, technical expertise and co-marketing opportunities. These resources will help the ecosystem take full advantage of Intel Core Ultra processor technologies and corresponding hardware to maximize AI and machine learning (ML) application performance, accelerate new use cases and connect the wider PC industry to the solutions emerging in the AI PC ecosystem. More information is available on the AI PC Acceleration Program website.

Moore Threads Technology (MTT), a Chinese GPU manufacturer, is reportedly testing its next-generation graphics processors for client PCs and data centers. The products under scrutiny are the MTT S90 for client/gaming computers and the MTT S4000 for data centers. Characterized by their Device IDs, 0301 and 0323, this could imply that these GPUs belong to MTT's 3rd generation GPU lineup. While few details about these GPUs are available, the new Device IDs suggest a possible introduction of a novel microarchitecture following the MTT Chunxiao GPU series. The current generation Chunxiao series, featuring the MTT S70, MTT S80, and MTT S3000, failed to compete effectively with AMD, Intel, and NVIDIA GPUs.

Thanks to @Löschzwerg who found the Device Hunt submission, we see hardware identifiers in PCI ID and USB ID repositories earlier than launch, as this often signals the testing of new chips or drivers by various companies. In the case of MTT, the latest developments are complicated by its recent inclusion on the U.S. Entity List, limiting its access to US-made technologies. This introduces a problem for the company, as they can't access TSMC's facilities for chip production, and will have to turn to domestic production in the likely case, with SMIC being the only leading option to consider.

Lenovo today announced the Europe based Innovation Centre specializing in HPC and AI, will now operate with enhanced customer experience from the in-house manufacturing facility in Budapest.

Running the new Innovation Center operations from the Budapest factory with onsite inventory stock, allows Lenovo customers to access the most advanced power and cooling infrastructure solutions and latest generation technology within the supply chain. This access ensures that workloads are tested on accurate representations of end purchased solutions, enabling customers to know with certainty the Lenovo solution installed will perform successfully for the intended workload.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today announced TVS-h674T / TVS-h874T Thunderbolt 4 NAS. By employing a Network Attached Storage (NAS) designed exclusively for creators and video productions on existing file-based workflows, users may enjoy boosted productivity and safeguard precious creative works with amazing efficiency.

• TVS-h674T-i5-32G: 6-bay 3.5" SATA HDD Thunderbolt NAS; 12th Gen Intel Core i5 6-core/12-thread Processor; Intel UHD Graphics 730; 32 GB DDR4 RAM
• TVS-h874T-i7-32G: 8-bay 3.5" SATA HDD Thunderbolt NAS; 12th Gen Intel Core i7 12-core (8P+4E) /20-thread Processor; Intel UHD Graphics 770; 32 GB DDR4 RAM
• TVS-h874T-i9-64G: 8-bay 3.5" SATA HDD Thunderbolt NAS; 12th Gen Intel Core i9 16-core (8P+8E) /24-thread Processor; Intel UHD Graphics 770; 64 GB DDR4 RAM

EK, the premium water cooling gear manufacturer, is proud to announce the availability of high-end, fully liquid-cooled gaming PCs for the European market. These EK-Fluid Gaming PCs are a work of art, hand-made by the master of custom loop liquid cooling. Aside from being visual masterpieces, their integrated custom cooling enables the user to exploit the maximum of what the latest hardware can offer. By liquid cooling both the CPU and GPU, the PC can easily hit and maintain its highest possible boost frequencies without breaking a sweat.

Plug And Play
Fluid Gaming PCs are the ultimate plug-and-play solution for competitive gamers and enthusiasts to whom gaming isn't just a hobby but a lifestyle. But these PCs are not just geared towards gamers, as there are practically no limits to their utilization. They pack the latest and greatest hardware, including the recently launched Intel Core i9 14th generation CPUs. Besides gaming, they can handle streaming, video editing, and 3D modeling, or can just be a visual showpiece in your office or home. With this new availability in Europe, EK's European customers are just a click away from their next-level custom water-cooled gaming experience with ZERO hassle. The starting EK Fluid Gaming PC lineup for Europe consists of three carefully selected PCs inspired by our Shop The Loop series that include: Zen Lotus, Side Task, and Digital Reef.

Intel's 14th Gen Core i9-14900K and i9-14900KF are making their mark around the OC community, with the highest validated clock speed record now at 9048 MHz by elmor, and the highest clock speed reached during a live OC session at 9.10 GHz by SkatterBencher. The records were set on the latest crop of Intel Z790 chipset motherboard models that manufacturers launched over the past few week, which were designed keeping the 14th Gen processors in mind. Both the overclocking pros used a core voltage of 1.360 V, and extreme cooling to boot. SkatterBencher used liquid helium to cool the processor for his OC attempt, in which the glorious 9100 MHz frequency was achieved. This speed couldn't be validated as CPUID is working on improving the validation process of CPU-Z to prevent artificially inflated clock speeds, so hopefully we'll see the 9.10 GHz record being validated soon. Until then, elmor is officially on top of the leaderboard with his 9048 MHz feat!

Supermicro, Inc., a Total IT Solution manufacturer for AI, Cloud, Storage, and 5G/Edge, is announcing one of the industry's broadest portfolios of new GPU systems based on the NVIDIA reference architecture, featuring the latest NVIDIA GH200 Grace Hopper and NVIDIA Grace CPU Superchip. The new modular architecture is designed to standardize AI infrastructure and accelerated computing in compact 1U and 2U form factors while providing ultimate flexibility and expansion ability for current and future GPUs, DPUs, and CPUs. Supermicro's advanced liquid-cooling technology enables very high-density configurations, such as a 1U 2-node configuration with 2 NVIDIA GH200 Grace Hopper Superchips integrated with a high-speed interconnect. Supermicro can deliver thousands of rack-scale AI servers per month from facilities worldwide and ensures Plug-and-Play compatibility.

"Supermicro is a recognized leader in driving today's AI revolution, transforming data centers to deliver the promise of AI to many workloads," said Charles Liang, president and CEO of Supermicro. "It is crucial for us to bring systems that are highly modular, scalable, and universal for rapidly evolving AI technologies. Supermicro's NVIDIA MGX-based solutions show that our building-block strategy enables us to bring the latest systems to market quickly and are the most workload-optimized in the industry. By collaborating with NVIDIA, we are helping accelerate time to market for enterprises to develop new AI-enabled applications, simplifying deployment and reducing environmental impact. The range of new servers incorporates the latest industry technology optimized for AI, including NVIDIA GH200 Grace Hopper Superchips, BlueField, and PCIe 5.0 EDSFF slots."

Marking a milestone in Intel's ongoing manufacturing expansion in Arizona, the company today announced that the initial portion of the cleanroom is "weather tight" and the "blow down" phase has begun at the company's two new leading-edge chip factories on its Ocotillo campus in Chandler, Arizona. This milestone underscores Intel's dedication to advancing its presence in the state and fostering technological innovation.

"Our commitment to Arizona runs deep, and as we expand our operations, we remain dedicated to addressing the growing demand for semiconductors and helping the United States regain its leadership position in this vital industry. This milestone represents the result of great teamwork, proficient teams and exceptional craftsmanship of the tradespeople, and it's thanks to their hard work that we've made such significant progress on our site while keeping our culture of caring and the safety of all as our top priority." -Dan Doron, Intel vice president and general manager of Fab Construction Enterprise

Realizing the full potential of next-generation deep learning requires highly efficient AI infrastructure. For a computing platform to be scalable and cost efficient, optimizing every layer of the AI stack, from algorithms to hardware, is essential. Advances in narrow-precision AI data formats and associated optimized algorithms have been pivotal to this journey, allowing the industry to transition from traditional 32-bit floating point precision to presently only 8 bits of precision (i.e. OCP FP8).

Narrower formats allow silicon to execute more efficient AI calculations per clock cycle, which accelerates model training and inference times. AI models take up less space, which means they require fewer data fetches from memory, and can run with better performance and efficiency. Additionally, fewer bit transfers reduces data movement over the interconnect, which can enhance application performance or cut network costs.

GIGABYTE, a leader in cloud computing and AI server markets, announced a new strategic framework for AI outlining a blueprint for the company's direction in the AI-driven future of the consumer PC market. The framework features three fundamental pillars: offering a comprehensive AI operating platform, implementing AI-based product design, and engaging in the AI ecosystem with the goal of introducing consumers to a new AI-driven experience.

Providing a comprehensive AI operating platform to meet all-end computing applications
GIGABYTE's AI operating platform caters to all-end computing applications, spanning from the cloud to the edge. In the cloud, GIGABYTE's AI servers deliver robust computing power for demanding AI workloads, encompassing generative AI services and machine learning applications like ChatGPT. At the edge, GIGABYTE's consumer products, such as high-performance graphics cards and gaming laptops, furnish users with instant and reliable AI computing power for a diverse array of applications, ranging from real-time video processing to AI-driven gaming. In scenarios involving AI collaboration systems like Microsoft Copilot, GIGABYTE offers a power-saving, secure, and user-friendly AI operating platform explicitly engineered for the next-generation AI processors like NPUs.

ZOTAC TECHNOLOGY, a global manufacturer focused on innovation, launches the world's first Mini PC featuring the AirJet Solid-State Active Cooling system, as well as a lineup of ARM-based, lightweight edge computing platforms based on the NVIDIA Jetson system on module (SoM).

ZBOX PI430AJ WITH AIRJET, THE WORLD'S FIRST SOLID-STATE ACTIVE-COOLED MINI-PC
First debuted at COMPUTEX 2023, the ZBOX PI430AJ with AirJet is the first product of its kind to feature revolutionary Solid-State Active Cooling technology. With each unit featuring two AirJet Mini Modules by Frore Systems, these thin, silent modules are capable of removing significant heat through rapid airflow, raising the ZBOX PI430AJ's thermal ceiling without compromising its form factor. Taking advantage of the newfound possibilities enabled by the AirJet, the ZBOX PI430AJ is equipped with an Intel Core i3 processor, 8 GB LPDDR5 memory, M.2 SSD storage slot, and more - all within a system the size of a deck of cards.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the launch of a new Trident Z5 RGB DDR5 memory kit specification at DDR5-8400 CL40-52-52-134 48 GB (2x24GB), aimed at the latest 14th Gen Intel Core desktop processor & Intel Z790 chipset platform.

Extreme Memory Speed at DDR5-8400 CL40
Developed on the latest 14th Gen Intel Core desktop processor and Intel Z790 chipset platform, G.SKILL is announcing a new DDR5 memory specification at DDR5-8400 CL40-52-52-134 with 48 GB (2x24GB) kit capacity. As shown in the screenshot below, this extreme speed memory kit is validated on the Intel Core i9-14900K desktop processor and ASUS ROG Maximus Z790 Apex Encore motherboard, and demonstrates incredible memory bandwidth speeds at 128.88 GB/s read, 127.03 GB/s write, and 123.83 GB/s copy in the AIDA64 memory bandwidth benchmark.

EK, the leading manufacturer of premium liquid cooling gear, is excited to announce full compatibility of the EK-Nucleus AIOs with the recently unveiled Intel 14th Gen Raptor Lake Refresh CPUs and the upcoming new Z790 motherboards. The Raptor Lake refresh series CPUs feature faster cores that can go up to 6 GHz for improved multi-tasking, gaming, streaming, and more. It is paramount to have a good cooling solution for the CPU to reach these high frequencies through Thermal Velocity Boost. EK's Nucleus AIOs are ready for that task with their ample radiator surface, powerful fans for heat dissipation, and potent pumps to circulate the warmed coolant.

EK-Nucleus AIOs
The coldplate that comes in contact with the CPU IHS is made of copper to enhance the thermal transferring characteristics. It has a dense stack of microfins that boost the thermal transfer area between the copper base and coolant, ensuring unparalleled cooling. These AIOs feature a straightforward installation procedure, powerful and daisy-chainable FPT fans optimized for radiators, strong pumps, diamond-cut fittings, sleeved tubing, and more. The versatile Nucleus All-in-One CPU cooling solutions come in various models - with and without D-RGB when it comes to lighting, in white and black color, and 360 mm and 240 mm variations in terms of size.

Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.

In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.