Bethesda has released its latest Starfield Update 1.8.88 for all platforms, and as a minor update, it only fixes several issues, including a rather annoying bug where space matter is stuck to the player's ship during space travel, also known as the "pet-asteroid" bug. The new update also fixes a bug that prevents random guns spawning in a newly created Weapon Case after loading, and fixes an issue where the game crashes while saving in some scenarios.

As this is a minor patch, it kept everyone wondering when we would see some other promised updates, including city maps, official mod support, a possible new vehicle, and more. Thankfully, Bethesda took to Reddit and clarified that the major update will be coming early next year, bringing support for AMD FSR 3 and Intel XeSS, as well as numerous "in-progress" quest fixes. The post adds that they have been hard at work on fixing many of the issues that were posted, as well as on those new features.

Retailers are beginning to put up placeholder listings for Intel's upcoming 14th Gen Core (65 W), non-K desktop processor models. Based on the "Raptor Lake Refresh" silicon, these chips offer generational uplifts in clock speeds over the 13th Gen Core series, although their feature-set remains nearly identical to the 13th Gen. These chips will run on all Socket LGA1700 motherboards, based on 600-series and 700-series chipset, with a UEFI firmware update. The full lineup already leaked out in marketing material this September (read here), but we're getting confirmation of these chips as retailer listings. The lineup begins with the 4P+0E Core i3-14100F and i3-14100; followed by the Core i5-14400F and i5-14400; the Core i7-14700F, i7-14700; and leading the pack being the i9-14900 and i9-14900F. These chips, particularly the -F extension ones, could provide good value to gamers.

During the 69th annual IEEE International Electron Devices Meeting (IEDM), Intel demonstrated some of its latest transistor design and manufacturing advancements. The first one in line is the 3D integration of transistors. According to Intel, the company has successfully stacked complementary field effect transistors (CFET) at a scaled gate pitch down to 60 nm. With CFETs promising thinner gate channels, the 3D stacked CFET would allow for higher density by going vertically and horizontally. Intel's 7 node has a 54 nm gate pitch, meaning CFETs are already close to matching production-ready nodes. With more time and development, we expect to see 3D stacked CFETs in the production runs in the coming years.

Next, Intel has demonstrated RibbonFET technology, a novel approach that is the first new transistor architecture since the introduction of FinFET in 2012. Using ribbon-shaped channels surrounded by the gate, these transistors allow for better control and higher drive current at all voltage levels. This allows faster transistor switching speeds, which later lead to higher frequency and performance. The width of these nanoribbon channels can be modulated depending on the application, where low-power mobile applications use less current, making the channels thinner, and high-performance applications require more current, making the channels wider. One stack of nanoribbons can achieve the same drive current as multiple fins found in FinFET but at a smaller footprint.

NVIDIA CFO Colette Kress, responding to a question in the Q&A session of the recent UBS Global Technology Conference, hinted at the possibility of NVIDIA onboarding a third semiconductor foundry partner besides its current TSMC and Samsung, with the implication being Intel Foundry Services (IFS). "We would love a third one. And that takes a work of what are they interested in terms of the services. Keep in mind, there is other ones that may come to the U.S. TSMC in the U.S. may be an option for us as well. Not necessarily different, but again in terms of the different region. Nothing that stops us from potentially adding another foundry."

NVIDIA currently sources its chips from TSMC and Samsung. It uses the premier Taiwanese fab for its latest "Ada" GPUs and "Hopper" AI processors, while using Samsung for its older generation "Ampere" GPUs. The addition of IFS as a third foundry partner could improve the company's supply-chain resilience in an uncertain geopolitical environment; given that IFS fabs are predominantly based in the US and the EU.

Intel's upcoming Sierra Forest Xeon server chip has debuted on Geekbench 6, showcasing its potential in multi-core performance. Slated for release in the first half of 2024, Sierra Forest is equipped with up to 288 Efficiency cores, positioning it to compete with AMD's Zen 4c Bergamo server CPUs and other ARM-based server chips like those from Ampere for the favor of cloud service providers (CSP). In the Geekbench 6 benchmark, a dual-socket configuration featuring two 144-core Sierra Forest CPUs was tested. The benchmark revealed a notable multi-core score of 7,770, surpassing most dual-socket systems powered by Intel's high-end Xeon Platinum 8480+, which typically scores between 6,500 and 7,500. However, Sierra Forest's single-core score of 855 points was considerably lower, not even reaching half of that of the 8480+, which manages 1,897 points.

The difference in single-core performance is a matter of choice, as Sierra Forest uses Crestmont-derived Sierra Glen E-cores, which are more power and area-efficient, unlike the Golden Cove P-cores in the Sapphire Rapids-based 8480+. This design choice is particularly advantageous for server environments where high-core counts are crucial, as CSPs usually partition their instances by the number of CPU cores. However, compared to AMD's Bergamo CPUs, which use Zen 4c cores, Sierra Forest lacks pure computing performance, especially in multi-core. The Sierra Forest lacks hyperthreading, while Bergaamo offers SMT with 256 threads on the 128-core SKU. Comparing the Geekbench 6 scores to AMD Bergamo EPYC 9754 and Sierra Forest results look a lot less impressive. Bergamo scored 1,597 points in single-core, almost double that of Sierra Forest, and 16,455 points in the multi-core benchmarks, which is more than double. This is a significant advantage of the Zen 4c core, which cuts down on caches instead of being an entirely different core, as Intel does with its P and E-cores. However, these are just preliminary numbers; we must wait for real-world benchmarks to see the actual performance.

Intel today released the latest version of Arc GPU Graphics Drivers. Version 101.5074 Beta adds optimization for "Avatar: Frontiers of Pandora," with an up to 8% performance uplift seen at 1080p with Ultra settings, as measured with an Arc A770 GPU. The drivers fix a handful of game-specific issues. Total War: Pharaoh exhibits display corruption upon changing game resolution on certain displays; which has been fixed. Application crashes with the original "Alan Wake" (DirectX 9) has been fixed. A colorful pixed corruption with "Cyberpunk 2077" has been fixed. Flickering pixels during gameplay with 4x MSAA enabled for "Counter Strike 2" has been fixed. A sporadic application crash with "Gostrunner 2" has been fixed. An application crash with "Far Cry 3" has been fixed.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5074 Beta

Binarly's research team has discovered a collection of security vulnerabilities known as "LogoFAIL", which affects image parsing components within the UEFI firmware of a wide array of devices. These vulnerabilities are especially concerning because they are embedded within the reference code provided by Independent BIOS Vendors (IBVs), affecting not just a single vendor but a broad spectrum of devices that utilize this code. LogoFAIL is particularly dangerous because it allows attackers to bypass crucial security measures such as Secure Boot and Intel Boot Guard by executing a payload during the device's boot process. This is achieved by storing malicious images on the EFI System Partition or within unsigned sections of firmware updates. This method can compromise system security deeply without altering the runtime integrity of the bootloader or firmware, unlike other threats such as BlackLotus or BootHole.

The potential reach of LogoFAIL vulnerability is rather wide, with millions of consumer and enterprise-grade devices from various vendors, including ones like Intel, Acer, and Lenovo, being vulnerable. The exact list of affected devices is still undetermined, but the prevalence of the IBVs' code across numerous devices suggests that the impact could be widespread, with both Windows and Linux users being affected. Only PCs that don't allow any logotype displayed in the UEFI during the boot process are safe. Apple's Macs are secure as they don't allow any add-on images during boot, and some OEM prebuilt PCs, like the ones from Dell, don't allow images in the UEFI. Some makers like Lenovo, AMI, and Insyde have already published notes about cautiously uploading custom images to the UEFI and providing BIOS updates. Consumers and enterprises must check with their OEMs and IBVs for BIOS microcode updates to patch against this vulnerability.Below, you can see the proof of concept in a YouTube video.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today is excited to introduce the H510MHP-E 3.0 motherboard, designed to run 10th/11th Generation Intel Core Processors. The H510MHP-E 3.0 motherboard excels as the ideal choice for a wide range of users. It offers reliable performance for office tasks, immerses home entertainment enthusiasts with HDMI support, streamlines data management for system integrators, and empowers holiday season HTPC setups with its impressive performance. With its versatile features, this motherboard caters to diverse needs seamlessly.

The H510MHP-E 3.0 motherboard boasts a robust set of specifications to meet the demands of business and casual use. It offers versatility and compatibility, supporting both 10th and 11th-generation Intel Core processors. With its Intel H470 single-chip architecture, this motherboard ensures efficient and seamless operation.

TrendForce's research indicates a dynamic third quarter for the global foundry industry, marked by an uptick in urgent orders for smartphone and notebook components. This surge was fueled by healthy inventory levels and the release of new iPhone and Android devices in 2H23. Despite persisting inflation risks and market uncertainties, these orders were predominantly executed as rush orders. Additionally, TSMC and Samsung's high-cost 3 nm manufacturing process had a positive impact on revenues, driving the 3Q23 value of the top ten global foundries to approximately US$28.29 billion—a 7.9% QoQ increase.

Looking ahead to 4Q23, the anticipation of year-end festive demand is expected to sustain the inflow of urgent orders for smartphones and laptops, particularly for smartphone components. Although the end-user market is yet to fully recover, pre-sales season stockpiling for Chinese Android smartphones appears to be slightly better than expected, with demand for mid-to-low range 5G and 4G phone APs and continued interest in new iPhone models. This scenario suggests a continued upward trend for the top ten global foundries in Q4, potentially exceeding the growth rate seen in Q3.

Acer today shared its commitment to carbon neutrality for its Aspire Vero laptop line, starting from the new Aspire Vero 16 (AV16-51P). Following international standards for carbon footprint calculation and carbon neutrality, actions are taken at each stage of the device lifecycle to minimize its carbon footprint, and then, high-quality carbon credits will be applied to attain carbon neutrality.

"To help tackle the increasing challenges posed by climate change, on the product side, Acer is proposing 'conscious technology' designed and made with consideration for the future," said Jerry Kao, COO, Acer Inc. "On the corporate side, Acer has joined the RE100 initiative and committed to achieving 100% renewable electricity by 2035. We have also pledged to achieve net-zero emissions by 2050."

A U.S. appeals court has overturned a staggering $2.18 billion patent infringement verdict against Intel Corporation, initially won by VLSI Technology, marking a pivotal shift in one of the most prominent patent law cases in U.S. history. The 2021 decision by a Texas jury, which found Intel guilty of infringing on a VLSI patent, was reversed by the U.S. Court of Appeals for the Federal Circuit due to insufficient evidence. Additionally, a new trial in Texas has been ordered to determine the appropriate amount Intel owes for infringing a second patent owned by VLSI. This patent-holding company, affiliated with Fortress Investment Group and recently involved in a majority share acquisition by Abu Dhabi's Mubadala Investment Co from Japan's Softbank, has been in multiple legal confrontations with Intel over semiconductor technology patents, which VLSI acquired from NXP Semiconductors.

The legal disputes have seen varied outcomes; Intel deflected a claim for more than $3 billion in damages in a separate Waco jury trial in 2021. However, the same year, VLSI was awarded nearly $949 million from Intel in another patent case by a jury in Austin, Texas. The companies mutually agreed to dismiss another potential multi-billion-dollar lawsuit in Delaware. With Intel's stock experiencing a downturn (-6.05% in the past five days) following the latest court ruling and the scheduled 2024 trial in Northern California, the ongoing legal battles between the two tech entities continue to influence market dynamics and the semiconductor industry at large. Detaining if the patent infringement happened is still relatively complex, as VLSI needs a team of engineers to determine if Intel used any of its patents.

Thanks to the leaked slides obtained by @InstLatX64, we have more details and some performance estimates about Intel's upcoming 5th Generation Xeon "Emerald Rapids" CPUs, boasting a significant performance leap over its predecessors. Leading the Emerald Rapids family is the top-end SKU, the Xeon 8592+, which features 64 cores and 128 threads, backed by a massive 480 MB L3 cache pool. The upcoming lineup shifts from a 4-tile to a 2-tile design to minimize latency and improve performance. The design utilizes the P-Core architecture under the Raptor Cove ISA and promises up to 40% faster performance than the current 4th Generation "Sapphire Rapids" CPUs in AI applications utilizing Intel AMX engine. Each chiplet has 35 cores, three of which are disabled, and each tile has two DDR5-5600 MT/s memory controllers, which operate two memory channels each and translating that into eight-channel design. There are three PCIe controllers per die, making it six in total.

Newer protocols and AI accelerators also back the upcoming lineup. Now, the Emerald Rapids family supports the Compute Express Link (CXL) Types 1/2/3 in addition to up to 80 PCIe Gen 5 lanes and enhanced Intel Ultra Path Interconnect (UPI). There are four UPI controllers spread over two dies. Moreover, features like the four on-die Intel Accelerator Engines, optimized power mode, and up to 17% improvement in general-purpose workloads make it seem like a big step up from the current generation. Much of this technology is found on the existing Sapphire Rapids SKUs, with the new generation enhancing the AI processing capability further. You can see the die configuration below. The 5th Generation Emerald Rapids designs are supposed to be official on December 14th, just a few days away.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 7.00 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 7.00 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 7.00 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 7.00 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The new AIDA64 update introduces a revamped user interface with a configurable toolbar, as well as AVX-512 accelerated benchmarks for AMD Threadripper 7000 processors, AVX2 optimized benchmarks for Intel Meteor Lake processors, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by AMD, Intel and NVIDIA.

DOWNLOAD: FinalWire AIDA64 Extreme v7.0

Siemens AG, a leading technology company, and Intel Corporation, one of the world's largest semiconductor companies, have signed a memorandum of understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.

"Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we're proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration," said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. "Our joint efforts will contribute to achieving global sustainability goals."

Gearbox Publishing and Blackbird Interactive have officially unveiled the system requirements for Homeworld 3, the highly anticipated next installment in the GOTY-winning sci-fi RTS series, launching in 2024. Blackbird Interactive continues its work to optimize the game to ensure the fidelity, scale and immersiveness of Homeworld 3's gameplay can be experienced across a wide array of PCs.

Players with the latest graphics cards and processors can enjoy the game in 4K with all of the settings turned up while players with older components can still experience Homeworld 3's hallmark 3D strategy experience with dynamic space battles and incredible visuals.

TrendForce's latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung's HBM3 (24 GB) is anticipated to complete verification with NVIDIA by December this year. The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24 GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.

Given the intricacy of the HBM verification process—estimated to take two quarters—TrendForce expects that some manufacturers might learn preliminary HBM3e results by the end of 2023. However, it's generally anticipated that major manufacturers will have definite results by 1Q24. Notably, the outcomes will influence NVIDIA's procurement decisions for 2024, as final evaluations are still underway.

The Geekbench database of benchmark submissions is yielding more leaks about Intel's upcoming 5th generation Xeon Scalable processors codenamed Emerald Rapids. Previously, we have covered the leak of the possibly top-end 64-core Xeon 8592+ Platinum and a 48-core Xeon 8558U processor. However, today, we are seeing information about lower-stack SKUs carrying up to 48 cores each. The first in line is the Xeon Platinum 8558P, a 48-core, 96-threaded CPU that runs at 2.7 GHz base frequency and 4.0 GHz boost frequency. It is equipped with 16 MB of L3 cache in addition to 192 MB of L2, making the total cache memory 260 MB. The integrated memory controller (IMC) of the Xeon Platinum 8558P supports eight-channel DDR5 running at 4800 MT/s, and the CPU has a TDP of 350 Watts.

The other SKU that was also listed was the Xeon Platinum 8551C, also a 48-core, 96-thread model with the same 260 MB cache configuration. However, this SKU has a higher base frequency of 2.9 GHz, with an unknown boost speed and unknown IMC configuration. An interesting thing to note about these 48C/96T SKUs is that they feature less cache compared to the previously leaked 48-core Xeon 8558U processor, which had 96 MB of L2 cache and 260 MB of L3 cache, making for a total of 356 MB of cache (which includes L1D and L1I as well). The segmentation that Intel is doing for its Xeon processors will be based not only on core count, frequency, and TDP but also on CPU cache sizes.

Intel is slowly preparing to launch its next-generation Meteor Lake mobile processor family, dropping the Core i brand name in favor of Core Ultra. Today, we are witnessing some early Geekbench v6 benchmarks with the latest leak of the Core Ultra 7 155H processor, boasting an integrated Arc GPU featuring 8 Xe-Cores—the complete configuration expected in the GPU tile. This tile is also projected to be a part of the more potent Core 9 Ultra 185H CPU. The Intel Core Ultra 7 155H processor has been benchmarked in the new ASUS Zenbook 14, which houses a 16-core and 22-thread hybrid CPU configuration capable of boosting up to 4.8 GHz. Paired with 32 GB of memory, the configuration was well equipped to supply CPU and GPU with sufficient memory space.

Perhaps the most interesting information from the submission was the OpenCL score of the GPU. Clocking in at 33948 points in Geekbench v6, the GPU is running over AMD's Radeon 780M GPU found in APU solutions like AMD Ryzen 9 7940HS and Ryzen 9 7940U, which scored 30585 and 27345 points in the same benchmark, respectively. The GPU tile is millimeters away from closing the gap between itself and the desktop Intel Arc A380 discrete GPU, which scored 37105 points for less than a 10% difference. The Xe-LPG GPU version is bringing some interesting performance points for the integrated GPU platform, which means that Intel's Meteor Lake SKUs will bring more performance/watt than ever.

IBASE Technology Inc. (TPEx: 8050), a pioneering force in embedded computing solutions, proudly presents the IB961 3.5" Single Board Computer (SBC) engineered for peak performance, extensive connectivity, and unmatched versatility. Harnessing the prowess of 13th Gen Intel Core processors, including the i7-1370PE, i5-1340PE, i5-1335UE, and i3-1320PE, the IB961 delivers exceptional computing capabilities across diverse applications. These processors advance performance hybrid architecture with up to 6 Performance-cores (P-core) and up to 8 Efficient-cores (E-core), ensuring unparalleled power for memory-intensive tasks.

This compact SBC offers a rich array of connectivity options, including M.2 (M-Key, E-Key, B-Key) mini type slots, and USB 3.2 ports, enabling 5G communications and ensuring seamless integration with peripherals. Dual Intel LAN support guarantees reliable, high-speed network connectivity. Integrated graphics from 13th Gen Intel Core mobile processors provide stunning visuals through 2x DisplayPort (1.2), eDP, and LVDS outputs. The IB961 signifies a leap forward in embedded computing technology, empowering businesses to enhance efficiency and adaptability across diverse industrial applications.

Intel today released the latest version of Arc GPU Graphics Drivers. Version 101.4972 beta fixes an issue with "Starfield" posting lower than expected performance with game patch version 1.8.86 on Arc GPUs. The drivers don't include any new performance updates or bug fixes, but Intel has taken the opportunity to identify a few new issues to address in its future driver updates, spanning games such as "Ghostrunner 2," "Total War: Pharaoh," "Dead by Daylight," and Topaz Video AI. Grab the driver from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.4972 Beta

V-COLOR Technology Inc. is proud to announce the launch of a new TUF Gaming Alliance Memory, available in both DDR5 XPrism and DDR4 Prism Pro series, showcasing a striking design and exceptional performance. This collaboration with the ASUS TUF Gaming Alliance ensures that components bearing this badge undergo testing that surpasses the industry's standard norms. This rigorous testing is implemented to ensure superior compatibility, stability, and durability, catering to the specific needs of gamers and PC enthusiasts globally.

The new memory kits are offered in configurations of 32 GB (2x 16 GB) with speeds ranging from 5600 MHz to 6400 MHz for DDR5, and 16 GB (2x 8 GB) to 32 GB (2x 16 GB) with speeds ranging from 3200 MHz to 3600 MHz for DDR4 memory. The memory modules are equipped with powerful SK Hynix chips. DDR5 memory is compatible with Intel XMP, and DDR4 is compatible with both INTEL and AMD platforms.

International Data Corporation (IDC) has upgraded its Semiconductor Market Outlook by calling a bottom and return to growth that accelerates next year. IDC raised its September 2023 revenue outlook from $518.8 billion to $526.5 billion in a new forecast. Revenue expectations for 2024 were also raised from $625.9 billion to $632.8 billion as IDC believes the U.S. market will remain resilient from a demand standpoint and China will begin recovering by the second half of 2024 (2H24).

IDC sees better semiconductor growth visibility as the long inventory correction subsides in two of the largest market segments: PCs and smartphones. Automotive and Industrials elevated inventory levels are expected to return to normal levels in 2H24 as electrification continues to drive semiconductor content over the next decade. Technology and large flagship product introductions will drive more semiconductor content and value across market segments in 2024 through 2026, including the introduction of AI PCs and AI Smartphones next year and a much-needed improvement in memory ASPs and DRAM bit volume.

In a major leap forward for high-performance computing, Venom Computers announced the launch of its newest model: the BlackBook Zero 14" Phantom G9. The Phantom G9 is the latest example of Venom's commitment to blending unmatched power with conscientious sustainability and is designed for Venom's exclusive users, who include discerning professionals and informed tech enthusiasts.

"The Zero 14 Phantom isn't just about leading-edge specs, though we're proud of those," said Jaan Turon, Director of Venom. "This new model also embodies our dedication to longevity and service in what we call the Venom Value Cycle: a sustainable ethos that benefits both customers and the environment."

Intel Application Performance Optimization (APO) is a unique feature that sets 14th Gen Core "Raptor Lake Refresh" processors apart from 13th Gen "Raptor Lake," despite the two being practically the same microarchitecture. APO is software-based, application-specific processor optimization that is found to offer an up to 16% performance boost in "Metro Exodus," and an up to 13% boost in "Rainbow Six: Siege." These are the only two games that Intel has released APO optimizations for, and for now, APO is only supported on the Core i9-14900K and i9-14900KF. Hardware Unboxed learned that while the company might bring APO to more 14th Gen Core processor models in the near future; it won't make it to 13th Gen Core "Raptor Lake" and older 12th Gen Core "Alder Lake."

APO is an extension of Intel Dynamic Tuning Technology framework that provides a greater degree of handholding for the OS scheduler, to give a specific application the best possible allocation of hardware system resources. For Intel to release APO profiles to new games, it needs extensive testing and validation specific to processor models and the applications themselves, which is probably why the company is limiting APO to only its current 14th Gen processors, and only specific processor models within the lineup. You can catch the Hardware Unboxed presentation with their testing of APO on the two supported titles, and Intel's statement, in the source link below.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.