IBM Research has unveiled a significant advancement in optical interconnect technology for advanced data center communications. The breakthrough centers on a novel co-packaged optics (CPO) system featuring a sophisticated Polymer Optical Waveguide (PWG) design, marking a potential shift from traditional copper-based interconnects. The innovation introduces a Photonic Integrated Circuit (PIC) measuring 8x10mm, mounted on a 17x17mm substrate, capable of converting electrical signals to optical ones and vice versa. The system's waveguide, spanning 12 mm in width, efficiently channels light waves through precisely engineered pathways, with channels converging from 250 to 50 micrometers.

While current copper-based solutions like NVIDIA's NVLink offer impressive 1.8 TB/s bandwidth rates, and Intel's Optical Compute Interconnect achieves 4 TBit/s bidirectional throughput, IBM's technology focuses on scalability and efficiency. The company plans to implement 12 carrier waves initially, with the potential to accommodate up to 32 waves by reducing spacing to 18 micrometers. Furthermore, the design allows for vertical stacking of up to four PWGs, potentially enabling 128 transmission channels. The technology has undergone rigorous JEDEC-standard testing, including 1,000 cycles of thermal stress between -40°C and 125°C, and extended exposure to extreme conditions including 85% humidity at 85°C. The components have also proven reliable during thousand-hour storage tests at various temperature extremes. The bandwidth of the CPO is currently unknown, but we expect it to surpass current solutions.

Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital to break down the AI bottleneck of data movement with its optical I/O technology. This brings the company's total funding to $370 million and raises the company's valuation to above $1 billion.

The strength of the round and caliber of investors, including participation from AMD Ventures, Intel Capital, and NVIDIA, marks another key milestone as Ayar Labs prepares its optical solution for high volume manufacturing strategically aligned to customer roadmaps. Other new strategic and financial investors participating in the round include 3M Ventures and Autopilot. They join existing investors such as Applied Ventures LLC, Axial Partners, Boardman Bay Capital Management, GlobalFoundries, IAG Capital Partners, Lockheed Martin Ventures, Playground Global, and VentureTech Alliance.

Dai Nippon Printing Co., Ltd. (DNP) has successfully achieved the fine pattern resolution required for photomasks for logic semiconductors of the beyond 2 nm (nm: 10-9 meter) generation that support Extreme Ultra-Violet (EUV) lithography, a cutting-edge process in semiconductor manufacturing.

DNP has also completed the criteria evaluation for photomasks compatible with High-Numerical Aperture, the application being considered for next-generation semiconductors beyond the 2 nm generation, and has commenced the supply of evaluation photomasks. High-NA EUV lithography makes it possible to form fine patterns on silicon wafers with a higher resolution than previously possible, and is expected to lead to the realization of high-performance, low-power semiconductors.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today introduced Marvell Ara, the industry's first 3 nm 1.6 Tbps PAM4 interconnects platform featuring 200 Gbps electrical and optical interfaces. Building on the success of the Nova 2 DSP, the industry's first 5 nm 1.6 Tbps PAM4 DSP with 200 Gbps electrical and optical interfaces, Ara leverages the comprehensive Marvell 3 nm platform with industry-leading 200 Gbps SerDes and integrated optical modulator drivers, to reduce 1.6 Tbps optical module power by over 20%. The energy efficiency improvement reduces operational costs and enables new AI server and networking architectures to address the need for higher bandwidth and performance for AI workloads, within the significant power constraints of the data center.

Ara, the industry's first 3 nm PAM4 optical DSP, builds on six generations of Marvell leadership in PAM4 optical DSP technology. It integrates eight 200 Gbps electrical lanes to the host and eight 200 Gbps optical lanes, enabling 1.6 Tbps in a compact, standardized module form factor. Leveraging 3 nm technology and laser driver integration, Ara reduces module design complexity, power consumption and cost, setting a new benchmark for next-generation AI and cloud infrastructure.

Nikon Corporation (Nikon) is developing a digital lithography system with resolution of one micron (L/S) and high productivity for advanced semiconductor packaging applications. This product is scheduled to be released in Nikon's fiscal year 2026.

The rapid adoption of artificial intelligence (AI) technology is driving demand for integrated circuits (ICs) for data centers. In the field of advanced packaging, including chiplets, the size of packages is increasing with the miniaturization of wiring patterns. This will lead to heightened demand for panel level packages that use glass and other materials suitable for larger packages, requiring exposure equipment that combines high resolution with a large exposure area. To meet these demands, Nikon is developing digital exposure equipment that combines the high-resolution technology of its semiconductor lithography systems, which has been cultivated over many decades, along with the excellent productivity made possible with the multi-lens technology of its FPD lithography systems.

Creative Technology today announced the release of the Sound Blaster GS5, a sleek and compact soundbar designed to elevate the audio experience while taking up minimal space. With versatile connectivity and exceptional audio performance powered by SuperWide technology, the Sound Blaster GS5 creates a wider, more immersive soundstage—perfect for intimate gaming sessions or cozy movie nights with family and friends.

Despite its compact size, this soundbar packs a punch with deep bass and crystal-clear sound. It is powered by advanced full-range racetrack drivers and a built-in port tube with a peak power output of up to 60 W, making every sound—from subtle whispers to dramatic explosions—come alive.

ASUS Republic of Gamers (ROG) today announced the availability of the ROG Harpe Ace Extreme, an ultralight 47-gram gaming mouse featuring an eye-catching carbon fiber shell that offers extreme maneuverability and outstanding durability. The shape of Harpe Ace Extreme was co-developed with esports professionals to ensure exceptional stability and control when flicking and tracking—especially for players accustomed to playing with a claw grip. Built-in cutting-edge technologies such as the ROG AimPoint Pro optical sensor and ROG Optical Micro Switches ensure absolute pinpoint accuracy and reliability. Additionally, the Harpe Ace Extreme is bundled with a host of premium accessories including a set of Corning Gorilla Glass mouse feet, a hard-shell carrying case, and the ROG Polling Rate Booster.

The ROG Polling Rate Booster, when combined with ROG SpeedNova wireless technology, delivers fast and precise data input at a true 8000 Hz polling rate in both wireless and wired modes. Its plug-and-play design allows users to directly attach the receivers or cables of compatible ROG peripherals.

CORSAIR today launched the new M55 series of gaming mice: M55 and M55 WIRELESS. The versatile M55 line suits a wide variety of users, from up-and-coming competitive MVPs to casual gamers who appreciate a wide range of genres. No matter the game, M55 and M55 WIRELESS take every challenge hands-on. The M55 series sports a symmetrical shape that suits any playstyle, alongside a compact size that slots into all hand grips, from claw, fingertip, palm, to anything in between. Textured side grips give users a firm grasp for impressive mouse flicks and pivots.

At 55 grams, the lightweight M55 soars across any mousepad, enabling agile mouse movements like quick-scope shots or rapid 360s. M55 WIRELESS weighs 85 grams with its battery, forgoing wires for an even greater range of motion. Both mice glide on 100% PTFE low-friction skates to smooth mouse strokes on virtually any surface. With their slim and lightweight stature, M55 mice travel effortlessly for seamless on-the-go setups. M55 WIRELESS boasts up to 185 hours on a single AA battery, with a long-lasting, low-latency connectivity via SLIPSTREAM WIRELESS v1.5 that excels in extended gaming sessions and travel.

Sharkoon SHARK Force 3 is the ultimate mouse for both work and gaming thanks to its eight mouse buttons, an optical sensor with up to 12,800 DPI, and an ergonomic shape that is ideal for all types of grip.

High-Resolution Sensor and Optimal Shape for All Types of Grip
The SHARK Force 3 is equipped with a precise A825 sensor that achieves a fantastic mouse sensitivity of up to 12,800 DPI. Six DPI levels are available for selection. The SHARK Force 3 has been specially designed for ergonomic use and is suitable for all hand sizes and grip types.

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

Responding to gamer demands for an enhanced Switch controller experience and inspired by the Gamecube style, NYXI Wizard Series Joy-pad has taken the gaming community by storm. This idea was a brainchild of Michael, CEO of NYXI, who is tech-savvy, as well as being a nostalgia and gaming enthusiast. The success of the Wizard Series exemplifies NYXI unwavering commitment to delivering exceptional performance tailored to the gaming community's preferences.

A Technological Leap Forward for NYXI
Fueled by the cutting-edge technology, NYXI is thrilled to unveil the latest innovation, the NYXI Warrior, which redefines NGC controllers with multi-platform compatibility and ultimate performance.

Corsair proudly announced the launch of two attention-grabbing additions to the M75 gaming mouse lineup: M75 and M75 WIRELESS. Blazing onto the scene with the same award-winning shape and match-winning performance established by the M75 AIR, these new mice deliver utmost comfort and control, while also infusing a streak of RGB into their lightweight designs. For the most competitive matches, M75 and M75 WIRELESS put you in fantastic shape to win, and look great doing it.

The meticulously sculpted M75 mouse design glides into the spotlight once again, with an unwavering focus on precision and ergonomics. M75 series mice are uniquely shaped from the ground up to comprise some of the most thoughtfully crafted gaming mice available. At 74 g and 89 g respectively, M75 and M75 WIRELESS are lightweight and agile enough to make deft flicks and microadjustments.

The University of Shanghai for Science and Technology (USST), Peking University and the Shanghai Institute of Optics and Fine Mechanics (SIOM) are collaborating on new Optical Data Storage (ODS) technologies—a recently published paper reveals that scientists are attempting to create 3D nanoscale optical disk memory that breaks into petabit capacities. Society (as a whole) has an ever-growing data demand—this requires the development of improved high-capacity storage technologies—the R&D teams believe that ODS presents a viable alternative route to traditional present day solutions: "data centers based on major storage technologies such as semiconductor flash devices and hard disk drives have high energy burdens, high operation costs and short lifespans."

The proposed ODS format could be a "promising solution for cost-effective long-term archival data storage." The researchers note that current (e.g Blu-ray) and previous generation ODS technologies have been: "limited by low capacities and the challenge of increasing areal density." In order to get ODS up to petabit capacity levels, several innovations are required—the Nature.com abstract stated: "extending the planar recording architecture to three dimensions with hundreds of layers, meanwhile breaking the optical diffraction limit barrier of the recorded spots. We develop an optical recording medium based on a photoresist film doped with aggregation-induced emission dye, which can be optically stimulated by femtosecond laser beams. This film is highly transparent and uniform, and the aggregation-induced emission phenomenon provides the storage mechanism. It can also be inhibited by another deactivating beam, resulting in a recording spot with a super-resolution scale." The novel optical storage medium relies on dye-doped photoresist (DDPR) with aggregation-induced emission luminogens (AIE-DDPR)—a 515 nm femtosecond Gaussian laser beam takes care of optical writing tasks, while a doughnut-shaped 639 nm continuous wave laser beam is tasked with retrieval. A 480 nm pulsed laser and a 592 nm continuous wave laser work in tandem to read data.

ASUS Republic of Gamers (ROG) today announced an arsenal of gaming peripherals and gear at CES 2024. ROG strives to transcend the limits of what's currently possible and its latest offerings are designed to empower gamers with the tools to dominate gaming worlds. These offerings include the ROG Keris II Ace ultralight gaming mouse, ROG Falchion RX Low Profile 65% gaming keyboard, ROG Cetra True Wireless SpeedNova gaming headphones, ROG Carnyx USB condenser microphone, and the ROG Archer ErgoAir Gaming Backpack.

ROG Keris II Ace
The ROG Keris II Ace is an ultralight gaming mouse made for competitive gamers and esports athletes. Designed with input and feedback from esports professionals, the Keris II Ace's sleek, minimalist aesthetic offers the perfect balance of functionality and form. Its environmentally friendly, bio-based nylon shell is derived from renewable castor oil, giving it an overall weight of just 54 grams to significantly reduce wrist fatigue during marathon gaming sessions. The optical micro switches used in the Keris II Ace offer consistent actuation and are extremely durable with a 100-million-click lifespan.

Ayar Labs, a leader in silicon photonics for chip-to-chip connectivity, will showcase its in-package optical I/O solution integrated with Intel's industry-leading Agilex Field-Programmable Gate Array (FPGA) technology. In demonstrating 5x current industry bandwidth at 5x lower power and 20x lower latency, the optical FPGA - packaged in a common PCIe card form factor - has the potential to transform the high performance computing (HPC) landscape for data-intensive workloads such as generative artificial intelligence (AI), machine learning, and support novel new disaggregated compute and memory architectures and more.

"We're on the cusp of a new era in high performance computing as optical I/O becomes a 'must have' building block for meeting the exponentially growing, data-intensive demands of emerging technologies like generative AI," said Charles Wuischpard, CEO of Ayar Labs. "Showcasing the integration of Ayar Labs' silicon photonics and Intel's cutting-edge FPGA technology at Supercomputing is a concrete demonstration that optical I/O has the maturity and manufacturability needed to meet these critical demands."

CORSAIR, a world leader in high-performance gear for gamers and content creators, announced the launch of their definitive ultra-lightweight wireless mouse for top FPS play, M75 AIR WIRELESS. Sporting a modern and sleek mouse shape for maximum comfort and control, M75 AIR puts players in position for victory, every match.

With its symmetrical shape meticulously crafted from the ground up, M75 AIR ascends to the pinnacle of competitive mouse design. Through a rigorous process, every contour, outline, and button placement was diligently reworked until the optimal shape took form.

Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundle multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2023 in Glasgow, Scotland (https://www.ecocexhibition.com/). Avicena's microLED-based LightBundle architecture breaks new ground by unlocking the performance of processors, memory and sensors, removing key bandwidth and proximity constraints while simultaneously offering class leading energy efficiency.

"As generative AI continues to evolve, the role of high bandwidth-density, low-power and low latency interconnects between xPUs and HBM modules cannot be overstated", says Chris Pfistner, VP Sales & Marketing of Avicena. "Avicena's innovative LightBundle interconnects have the potential to fundamentally change the way processors connect to each other and to memory because their inherent parallelism is well-matched to the internal wide and slow bus architecture within ICs. With a roadmap to multi-terabit per second capacity and sub-pJ/bit efficiency these interconnects are poised to enable the next era of AI innovation, paving the way for even more capable models and a wide range of AI applications that will shape the future."

THX Ltd., a world-class high-fidelity audio and video tuning, certification, and technology company, today announced it is launching THX Interconnect, designed in partnership with Pixelgen. THX Interconnect are a family of Ultra High Speed HDMI 2.1 cables capable of delivering 100% uncompressed 48 Gbps signaling to optimize the fidelity and reliability of nearly any sized or configured home theater system. THX is also relaunching its popular home theater installer THX Certified Training series. Both will be highlighted in early September in Denver, Colorado at the CEDIA Expo.

"The THX mission is to empower high-fidelity entertainment, regardless of where and how consumers want to enjoy movies, music and games," said Jason Fiber, chief executive officer, THX Ltd. "The THX Interconnect cables ensure all home theater components work in harmony at the highest resolutions, regardless of the length. We are pleased to bring home theater enthusiasts around the globe this cost-effective and incredibly reliable new solution. We also look forward to reintroducing the THX Certified Training program which has been dormant for a few years but is back due to overwhelming demand from the home theater installation industry."

Lightelligence, the global leader in photonic computing and connectivity systems, today announced Photowave, the first optical communications hardware designed for PCIe and Compute Express Link (CXL) connectivity, unleashing next-generation workload efficiency.

Photowave, an Optical Networking (oNET) transceiver leveraging the significant latency and energy efficiency of photonics technology, empowers data center managers to scale resources within or across server racks. The first public demonstration of Photowave will be at Flash Memory Summit today through Thursday, August 10, in Santa Clara, Calif.

PCI-SIG today announced the formation of a new workgroup to deliver PCI Express (PCIe) technology over optical connections. The PCI-SIG Optical Workgroup intends to be optical technology-agnostic, supporting a wide range of optical technologies, while potentially developing technology-specific form factors.

"Optical connections will be an important advancement for PCIe architecture as they will allow for higher performance, lower power consumption, extended reach and reduced latency," said Nathan Brookwood, Research Fellow at Insight 64. "Many data-demanding markets and applications such as Cloud and Quantum Computing, Hyperscale Data Centers and High-Performance Computing will benefit from PCIe architecture leveraging optical connections."

Targus, the number one laptop case brand in the US and Canada and a leader in laptop cases and mobile computing accessories, today announced the availability of its patent-pending ErgoFlip EcoSmart Mouse, a sustainable, full-sized, ergonomic mouse that easily converts from right- to left-hand use with a simple twist of the top.

This eco-friendly mouse is made with up to 85 percent post-consumer recycled (PCR) plastic and comes in packaging made from recycled materials. It also uses Bluetooth Low Energy (BLE) technology which is four times more power efficient than competitive BLE chipsets to reduce power consumption and extend battery life.

Announced today, Ultra Ethernet Consortium (UEC) is bringing together leading companies for industry-wide cooperation to build a complete Ethernet-based communication stack architecture for high-performance networking. Artificial Intelligence (AI) and High-Performance Computing (HPC) workloads are rapidly evolving and require best-in-class functionality, performance, interoperability and total cost of ownership, without sacrificing developer and end-user friendliness. The Ultra Ethernet solution stack will capitalize on Ethernet's ubiquity and flexibility for handling a wide variety of workloads while being scalable and cost-effective.

Ultra Ethernet Consortium is founded by companies with long-standing history and experience in high-performance solutions. Each member is contributing significantly to the broader ecosystem of high-performance in an egalitarian manner. The founding members include AMD, Arista, Broadcom, Cisco, Eviden (an Atos Business), HPE, Intel, Meta and Microsoft, who collectively have decades of networking, AI, cloud and high-performance computing-at-scale deployments.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, keep investing a lot of resources in development of gaming peripherals, today launched AORUS M6 lightweight wireless gaming mouse. The AORUS M6 adopts the optimized wireless technology and the enthusiast-grade optical sensor to meet the needs of gamers, allowing gamers to fully express their battle power in the game without worrying about hardware limitations. The symmetrical ergonomic design and classic Omron switches, together with the lightweight and comfortable design, allow gamers not only to use it comfortably, but also to use it for a long time without getting tired.

The AORUS M6 boasts an enthusiast-grade 26,000 DPI optical sensor, capable of 650ips and 50G acceleration, giving gamers the ultimate accuracy for competitive gaming. Adjustability in 50 DPI increments further allows users to make a seamless transition from their old mouse by fine-tuning the level that precisely fits their play style. AORUS M6 is equipped with 1 ms low latency 2.4 GHz wireless technology, which overcomes the interference of environmental noise and transmission delay. It realizes uninterrupted high-speed signal transmission, so that the mouse can operate smoothly. The way of wireless transmission eliminates the cable interference that plagues gamers. The lightweight design of 74 grams, even with a built-in battery module, is lighter than most wired mice, allowing gamers to easily operate for a long time. Due to the lightweight ergonomic design, 50 million Japanese Omron switches, symmetrical design, and a pair of side buttons on the left and right sides, AORUS M6 can be used comfortably by both left and right hands.

Global LiFi technology firms pureLiFi and Fraunhofer HHI welcome the release of IEEE 802.11bb as the latest global light communications standard alongside IEEE 802.11 WiFi standards. The bb standard marks a significant milestone for the LiFi market, as it provides a globally recognised framework for deployment of LiFi technology.

LiFi is a wireless technology that uses light rather than radio frequencies to transmit data. By harnessing the light spectrum, LiFi can unleash faster, more reliable wireless communications with unparalleled security compared to conventional technologies such as WiFi and 5G. The Light Communications 802.11bb Task Group was formed in 2018 chaired by pureLiFi and supported by Fraunhofer HHI, two firms which have been at the forefront of LiFi development efforts. Both organisations aim to see accelerated adoption and interoperability not only between LiFi vendors but also with WiFi technologies as a result of these standardisation efforts.

Metalenz, the world leader in metasurface optics, today announced it has partnered with leading semiconductor foundry United Microelectronics Corporation ("UMC") to release its direct supply chain to mass production and bring the unrivaled scale and precision of semiconductor manufacturing to the optics industry. The announcement marks the launch of metasurface optics on the open market for the first time and follows multiple design wins for Metalenz with leading OEMs in Asia.

"After initially designing meta-optics in partnership with one of the leading suppliers of 3D sensing solutions, we are now engaged with OEMs directly to bring the benefits of metasurface optics to their 3D sensing applications. By partnering with a world-class foundry like UMC, we gain the manufacturing capabilities, expertise, and global reach to serve customers interested in adopting our meta-optics technology," said Rob Devlin, Co-founder and CEO of Metalenz. "This will further accelerate our growth as we are becoming the leading provider of precision optics for 3D sensing solutions."