Lightmatter, the leader in photonic supercomputing, today announced Passage M1000, a groundbreaking 3D Photonic Superchip designed for next-generation XPUs and switches. The Passage M1000 enables a record-breaking 114 Tbps total optical bandwidth for the most demanding AI infrastructure applications. At more than 4,000 square millimeters, the M1000 reference platform is a multi-reticle active photonic interposer that enables the world's largest die complexes in a 3D package, providing connectivity to thousands of GPUs in a single domain.

In existing chip designs, interconnects for processors, memory, and I/O chiplets are bandwidth limited because electrical input/output (I/O) connections are restricted to the edges of these chips. The Passage M1000 overcomes this limitation by unleashing electro-optical I/O virtually anywhere on its surface for the die complex stacked on top. Pervasive interposer connectivity is enabled by an extensive and reconfigurable waveguide network that carries high-bandwidth WDM optical signals throughout the M1000. With fully integrated fiber attachment supporting an unprecedented 256 fibers, the M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to conventional Co-Packaged Optics (CPO) and similar offerings.

Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, today announced the industry's first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet to maximize AI infrastructure performance and efficiency while reducing latency and power consumption. By incorporating a UCIe electrical interface, this solution is designed to eliminate data bottlenecks and integrate easily into customer chip designs.

Capable of achieving 8 Tbps bandwidth, the TeraPHY optical I/O chiplet is powered by Ayar Labs' 16-wavelength SuperNova light source. The integration of a UCIe interface means this solution not only delivers high performance and efficiency but also enables interoperability among chiplets from different vendors. This compatibility with the UCIe standard creates a more accessible, cost-effective ecosystem, which streamlines the adoption of advanced optical technologies necessary for scaling AI workloads and overcoming the limitations of traditional copper interconnects.

Quantum networks—where entanglement is distributed across distant nodes—promise to revolutionize quantum computing, communication, and sensing. However, a major bottleneck has been scalability, as the entanglement rate in most existing systems is limited by a network design of a single qubit per node. A new study, led by Prof. A. Faraon at Caltech and conducted by A. Ruskuc et al., recently published in Nature (ref: 1-2), presents a groundbreaking solution: multiplexed entanglement using multiple emitters in quantum network nodes. By harnessing rare-earth ions coupled to nanophotonic cavities, researchers at Caltech and Stanford have demonstrated a scalable platform that significantly enhances entanglement rates and network efficiency. Let's take a closer look at the two key challenges they tackled—multiplexing to boost entanglement rates and dynamic control strategies to ensure qubit indistinguishability—and how they overcame them.

Breaking the Entanglement Bottleneck via Multiplexing
One of the biggest challenges in scaling quantum networks is the entanglement rate bottleneck, which arises due to the fundamental constraints of long-distance quantum communication. When two distant qubits are entangled via photon interference, the rate of entanglement distribution is typically limited by the speed of light and the node separation distance. In typical systems with a single qubit per node, this rate scales as c/L (where c is the speed of light and L is the distance between nodes), leading to long waiting times between successful entanglement events. This severely limits the scalability of quantum networks.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced in collaboration with TeraHop, a global optical solutions provider for AI driven data centers, the demonstration of the industry's first end-to-end PCIe Gen 6 over optics in the Marvell booth #2129 at OFC 2025. The demonstration will showcase the extension of PCIe reach beyond traditional electrical limits to enable low-latency, standards-based AI scale-up infrastructure.

As AI workloads drive exponential data growth, PCIe connectivity must evolve to support higher bandwidth and longer reach. The Marvell Alaska P PCIe Gen 6 retimer and its PCIe Gen 7 SerDes technology enable low-latency, low bit-error-rate transmission over optical fiber, delivering the scalability, power efficiency, and high performance required for next-generation accelerated infrastructure. With PCIe over optics, system designers will be able to take advantage of longer links between devices that feature the low latency of PCIe technology.

SiCarrier, a Huawei-backed Chinese semiconductor tool manufacturer, has launched a comprehensive suite of semiconductor manufacturing tools at this year's Semicon China. These tools are strategically essential to China's semiconductor self-sufficiency and a major step towards competitive nodes from the mainland. The new lineup spans multiple categories: optical inspection, deposition, etch, metrology, and electrical performance testing. Until now, Chinese chipmakers often depended on older-generation foreign equipment, but SiCarrier's new lineup promises domestic alternatives tailored to modern manufacturing processes. The tools address every stage of semiconductor fabrication, from inspecting microscopic defects to etching intricate circuits.

For quality control, SiCarrier's Color Mountain series functions like a high-powered microscope, using intense lighting and advanced imaging algorithms to examine both sides of silicon wafers for flaws as small as dust particles. Complementing this, the Sky Mountain series ensures the perfect alignment of circuit layers, which need perfect stacking, using diffraction-based measurements (analyzing light patterns) and direct image comparisons. The New Mountain suite combines specialized tools to analyze materials at the atomic level. One standout is the atomic force microscope (AFM), which maps surface topography with a nanoscale "finger," while X-ray techniques (XPS, XRD, XRF) act like forensic tools, revealing the chemical composition, crystal structure, and elemental makeup.

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, has enhanced its 100GbE Lite-L3 managed switch, QSW-M7308R-4X. The 100GbE QSFP28 ports now has backwards compatibility with 40GbE QSFP+, and supports breakout cables to four 25GbE SFP28 ports. IT staff can also monitor multiple switches centrally via the AMIZcloud management platform, enabling efficient and flexible network deployment and device management, reducing initial investment and operational maintenance costs for enterprises deploying 100GbE networks. Users can enjoy these features by upgrading the QSW-M7308R-4X to the latest QSS Pro v4.1 software version.

"QNAP continues to enhance the advanced software features of our 100GbE switches to meet the high performance and flexibility required for enterprises expanding their 100GbE network infrastructure," said Ronald Hsu, Product Manager of QNAP, adding "The QSW-M7308R-4X is one of the few switches that supports 100GbE backward compatibility at an extremely low cost, along with MC-LAG fault tolerance, half-rackmount design, and cloud management capabilities, making it the most cost-optimized choice for small and medium-sized businesses upgrading to 100GbE."

RayNeo, a leading innovator in consumer Augmented Reality (AR) technology, has unveiled its latest XR glasses, the RayNeo Air 3s, at MWC 2025. Alongside this groundbreaking release, the company showcased its other two innovations: the AI-powered, Full-Color AR Glasses RayNeo X3 Pro and the Camera AI Glasses RayNeo V3. Together, these cutting-edge devices underscore RayNeo's unwavering commitment to redefining immersive experiences and enhancing everyday usability through advanced AR solutions.

RayNeo Air 3s: Lightweight XR for Seamless Daily Use
The RayNeo Air 3s redefines the landscape of lightweight XR glasses, seamlessly merging portability with state-of-the-art display technology. Equipped with 3840 Hz high-frequency dimming, a staggering 200,000:1 contrast ratio, and a 154% sRGB color gamut, the Air 3s delivers breathtaking image quality, setting a new benchmark for birdbath display solutions. Its expansive 201-inch virtual screen and TÜV Rheinland-certified eye comfort technology ensure an immersive yet comfortable experience, making it ideal for all-day wear.

GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) today announced a new master research agreement to jointly pursue advancements and innovations for enhancing the performance and efficiency of critical semiconductor technologies. The collaboration will be led by MIT's Microsystems Technology Laboratories (MTL) and GF's research and development team, GF Labs.

With an initial research focus on AI and other applications, the first projects are expected to leverage GF's differentiated silicon photonics technology, which monolithically integrates RF SOI, CMOS and optical features on a single chip to realize power efficiencies for datacenters, and GF's 22FDX platform, which delivers ultra-low power consumption for intelligent devices at the edge.

PowerColor, a trusted name in high-performance gaming hardware, is proud to introduce the ALPHYN AM10 Wireless Gaming Mouse, the latest addition to the ALPHYN series. Designed for gamers and content creators seeking the perfect balance of comfort and high-end specifications, the ALPHYN AM10 delivers cutting-edge technology in an ergonomic, lightweight form. With a powerful 26,000 DPI sensor, an 8,000 Hz polling rate in wired mode, Omron optical switches, and hybrid wireless connectivity, the AM10 is built to provide an exceptional user experience without compromise.

Designed for Performance & Comfort
The ALPHYN AM10 is built to offer precision tracking and responsive control, making every task—from intense gaming sessions to detailed creative work—effortless and fluid. Equipped with a PAW3395 sensor, it provides a DPI range from 100 to 26,000, allowing users to fine-tune sensitivity to their exact needs. With an 8,000 Hz polling rate in wired mode and 1,000 Hz in wireless mode, every movement is accurately registered, ensuring smooth and natural cursor motion. The Omron optical switches (rated for 70 million clicks) provide instant actuation and long-lasting durability, making every click crisp and reliable while reducing fatigue during extended use.

Last month, Sony Japan announced an upcoming retirement of Blu-ray Disc media and other physical media formats. On January 23, the company's Recording Media department addressed its "valued customers" via a short press release. At some point in February (2025), production of "Blu-ray Disc media, MiniDiscs for recording, MD data for recording, and MiniDV cassettes" will cease. Reports from late January suggest that the Recording Media division's last factory will face closure in the coming weeks, signalling the end of commercial supplies. Additionally, Sony disclosed that no "successor models" will be released. Naturally, fans of optical media formats did not welcome Sony's announcement regarding the retirement of these products.

Rival manufacturers have taken the opportunity to offer their fares—fresh news reports have pointed to an interesting Verbatim Japan office-issued press release. The Taiwanese storage specialist and I-O Data pushed out a joint statement, assuring that they: "will live up to the trust of customers through stable supply and continued sales of optical discs in the Japanese market." The two companies appear to be seizing the moment, but their announcement did not name or shame Sony: "the domestic optical disc market is currently at a major turning point, with some manufacturers withdrawing from manufacturing and sales businesses and other trends that are shrinking the supply system. Under these circumstances, Verbatim Japan is working closely with I-O DATA to continue to provide high-quality optical discs to the Japanese market, with stable supply as its top priority."

Pwnage, a leader in premium gaming peripherals, proudly announces the launch of the Trinity CF gaming mouse. This groundbreaking device sets new standards in performance, durability, and versatility, catering to gamers seeking the best lightweight gaming mouse on the market. The Trinity CF is now available for purchase at Pwnage.

Engineered for Precision and Comfort
The Trinity CF features a symmetrical shape that accommodates all grip styles and hand sizes, ensuring ergonomic comfort and precision for every gamer. Weighing just 37-39 grams, it stands as one of the lightest gaming mice available, providing swift and effortless movement during intense gaming sessions.

Pimax, a global leader in high-performance VR technology, debuted its Crystal Super headset on the world stage at CES2025, letting global media get their first taste with the 29 million pixel VR headset.

The world meets the Crystal Super
The Crystal Super is Pimax's latest flagship headset, featuring a resolution of 3840x3840 per eye, meaning it's the first VR headset reaching retina levels of clarity. Glass aspheric lenses provide 57 PPD at over 120° horizontal field of view, with an incredible brightness of 280 nits.

HAVIT's booth at CES 2025 gained attention not only for its minimalist yet futuristic design but also for its product lineup, which ranged from headset series equipped with spatial audio technology and wireless gaming headsets to a variety of mechanical keyboards and gaming mice. The FUXI-H8 Gaming Headset features an open-ear design with dynamic RGB lighting, six-mode connectivity, and spatial audio with head tracking. Next to it, we found the FUXI-H7 over-ear headset offering spatial audio, five-mode connectivity, and a noise-canceling microphone.

The HAVIT KB896L is a 70% (362 mm x 132 mm x 32 mm) compact wired keyboard with a gasket structure and CNC aluminium body. It features RGB backlighting, hot-swappable design, and full N-Key rollover support. HAVIT also displayed the KB904L (348 mm x 140 mm x 45 mm, 85 keys) magnetic switch mechanical keyboard, featuring an 8 kHz polling rate, rapid 0.08 mm trigger, and RGB lighting. The HAVIT MS979WB is a lightweight 59 g tri-mode optical gaming mouse with an RGB charging dock and up to 26,000 DPI.

Brelyon, an MIT spin-off innovating in the computational display space, today announced Ultra Reality Extend, an immersive display line that renders virtual images in multiple depths. As the first commercial multi-focal monitor, the Extend model offers multi-depth programmability for information overlay, allowing users to see images from 0.7 meters to as far as 2.5 meters of depth virtually rendered behind the monitor; organizing various data streams at different depth layers, or triggering focal cues to induce an ultra immersive experience akin to looking out through a window.

"Building on the success of our Ultra Reality product, we're taking advantage of new GPU capabilities to process light and video signals inside our display platforms," said Barmak Heshmat, CEO of Brelyon. "We are thinking beyond headsets and glasses, where we can leverage GPU capabilities to do real-time driving of higher-bandwidth display interfaces. Maturing the industry from the age of photorealism to the age of photon realism, and designed for high-performance applications such as simulation and training, control centers, and teleoperations, Ultra Reality Extend is a new platform for AI and light to impact enterprise visualization, navigation, and computer interaction."

IBM Research has unveiled a significant advancement in optical interconnect technology for advanced data center communications. The breakthrough centers on a novel co-packaged optics (CPO) system featuring a sophisticated Polymer Optical Waveguide (PWG) design, marking a potential shift from traditional copper-based interconnects. The innovation introduces a Photonic Integrated Circuit (PIC) measuring 8x10mm, mounted on a 17x17mm substrate, capable of converting electrical signals to optical ones and vice versa. The system's waveguide, spanning 12 mm in width, efficiently channels light waves through precisely engineered pathways, with channels converging from 250 to 50 micrometers.

While current copper-based solutions like NVIDIA's NVLink offer impressive 1.8 TB/s bandwidth rates, and Intel's Optical Compute Interconnect achieves 4 TBit/s bidirectional throughput, IBM's technology focuses on scalability and efficiency. The company plans to implement 12 carrier waves initially, with the potential to accommodate up to 32 waves by reducing spacing to 18 micrometers. Furthermore, the design allows for vertical stacking of up to four PWGs, potentially enabling 128 transmission channels. The technology has undergone rigorous JEDEC-standard testing, including 1,000 cycles of thermal stress between -40°C and 125°C, and extended exposure to extreme conditions including 85% humidity at 85°C. The components have also proven reliable during thousand-hour storage tests at various temperature extremes. The bandwidth of the CPO is currently unknown, but we expect it to surpass current solutions.

Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital to break down the AI bottleneck of data movement with its optical I/O technology. This brings the company's total funding to $370 million and raises the company's valuation to above $1 billion.

The strength of the round and caliber of investors, including participation from AMD Ventures, Intel Capital, and NVIDIA, marks another key milestone as Ayar Labs prepares its optical solution for high volume manufacturing strategically aligned to customer roadmaps. Other new strategic and financial investors participating in the round include 3M Ventures and Autopilot. They join existing investors such as Applied Ventures LLC, Axial Partners, Boardman Bay Capital Management, GlobalFoundries, IAG Capital Partners, Lockheed Martin Ventures, Playground Global, and VentureTech Alliance.

Dai Nippon Printing Co., Ltd. (DNP) has successfully achieved the fine pattern resolution required for photomasks for logic semiconductors of the beyond 2 nm (nm: 10-9 meter) generation that support Extreme Ultra-Violet (EUV) lithography, a cutting-edge process in semiconductor manufacturing.

DNP has also completed the criteria evaluation for photomasks compatible with High-Numerical Aperture, the application being considered for next-generation semiconductors beyond the 2 nm generation, and has commenced the supply of evaluation photomasks. High-NA EUV lithography makes it possible to form fine patterns on silicon wafers with a higher resolution than previously possible, and is expected to lead to the realization of high-performance, low-power semiconductors.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today introduced Marvell Ara, the industry's first 3 nm 1.6 Tbps PAM4 interconnects platform featuring 200 Gbps electrical and optical interfaces. Building on the success of the Nova 2 DSP, the industry's first 5 nm 1.6 Tbps PAM4 DSP with 200 Gbps electrical and optical interfaces, Ara leverages the comprehensive Marvell 3 nm platform with industry-leading 200 Gbps SerDes and integrated optical modulator drivers, to reduce 1.6 Tbps optical module power by over 20%. The energy efficiency improvement reduces operational costs and enables new AI server and networking architectures to address the need for higher bandwidth and performance for AI workloads, within the significant power constraints of the data center.

Ara, the industry's first 3 nm PAM4 optical DSP, builds on six generations of Marvell leadership in PAM4 optical DSP technology. It integrates eight 200 Gbps electrical lanes to the host and eight 200 Gbps optical lanes, enabling 1.6 Tbps in a compact, standardized module form factor. Leveraging 3 nm technology and laser driver integration, Ara reduces module design complexity, power consumption and cost, setting a new benchmark for next-generation AI and cloud infrastructure.

Nikon Corporation (Nikon) is developing a digital lithography system with resolution of one micron (L/S) and high productivity for advanced semiconductor packaging applications. This product is scheduled to be released in Nikon's fiscal year 2026.

The rapid adoption of artificial intelligence (AI) technology is driving demand for integrated circuits (ICs) for data centers. In the field of advanced packaging, including chiplets, the size of packages is increasing with the miniaturization of wiring patterns. This will lead to heightened demand for panel level packages that use glass and other materials suitable for larger packages, requiring exposure equipment that combines high resolution with a large exposure area. To meet these demands, Nikon is developing digital exposure equipment that combines the high-resolution technology of its semiconductor lithography systems, which has been cultivated over many decades, along with the excellent productivity made possible with the multi-lens technology of its FPD lithography systems.

Creative Technology today announced the release of the Sound Blaster GS5, a sleek and compact soundbar designed to elevate the audio experience while taking up minimal space. With versatile connectivity and exceptional audio performance powered by SuperWide technology, the Sound Blaster GS5 creates a wider, more immersive soundstage—perfect for intimate gaming sessions or cozy movie nights with family and friends.

Despite its compact size, this soundbar packs a punch with deep bass and crystal-clear sound. It is powered by advanced full-range racetrack drivers and a built-in port tube with a peak power output of up to 60 W, making every sound—from subtle whispers to dramatic explosions—come alive.

ASUS Republic of Gamers (ROG) today announced the availability of the ROG Harpe Ace Extreme, an ultralight 47-gram gaming mouse featuring an eye-catching carbon fiber shell that offers extreme maneuverability and outstanding durability. The shape of Harpe Ace Extreme was co-developed with esports professionals to ensure exceptional stability and control when flicking and tracking—especially for players accustomed to playing with a claw grip. Built-in cutting-edge technologies such as the ROG AimPoint Pro optical sensor and ROG Optical Micro Switches ensure absolute pinpoint accuracy and reliability. Additionally, the Harpe Ace Extreme is bundled with a host of premium accessories including a set of Corning Gorilla Glass mouse feet, a hard-shell carrying case, and the ROG Polling Rate Booster.

The ROG Polling Rate Booster, when combined with ROG SpeedNova wireless technology, delivers fast and precise data input at a true 8000 Hz polling rate in both wireless and wired modes. Its plug-and-play design allows users to directly attach the receivers or cables of compatible ROG peripherals.

CORSAIR today launched the new M55 series of gaming mice: M55 and M55 WIRELESS. The versatile M55 line suits a wide variety of users, from up-and-coming competitive MVPs to casual gamers who appreciate a wide range of genres. No matter the game, M55 and M55 WIRELESS take every challenge hands-on. The M55 series sports a symmetrical shape that suits any playstyle, alongside a compact size that slots into all hand grips, from claw, fingertip, palm, to anything in between. Textured side grips give users a firm grasp for impressive mouse flicks and pivots.

At 55 grams, the lightweight M55 soars across any mousepad, enabling agile mouse movements like quick-scope shots or rapid 360s. M55 WIRELESS weighs 85 grams with its battery, forgoing wires for an even greater range of motion. Both mice glide on 100% PTFE low-friction skates to smooth mouse strokes on virtually any surface. With their slim and lightweight stature, M55 mice travel effortlessly for seamless on-the-go setups. M55 WIRELESS boasts up to 185 hours on a single AA battery, with a long-lasting, low-latency connectivity via SLIPSTREAM WIRELESS v1.5 that excels in extended gaming sessions and travel.

Sharkoon SHARK Force 3 is the ultimate mouse for both work and gaming thanks to its eight mouse buttons, an optical sensor with up to 12,800 DPI, and an ergonomic shape that is ideal for all types of grip.

High-Resolution Sensor and Optimal Shape for All Types of Grip
The SHARK Force 3 is equipped with a precise A825 sensor that achieves a fantastic mouse sensitivity of up to 12,800 DPI. Six DPI levels are available for selection. The SHARK Force 3 has been specially designed for ergonomic use and is suitable for all hand sizes and grip types.

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

Responding to gamer demands for an enhanced Switch controller experience and inspired by the Gamecube style, NYXI Wizard Series Joy-pad has taken the gaming community by storm. This idea was a brainchild of Michael, CEO of NYXI, who is tech-savvy, as well as being a nostalgia and gaming enthusiast. The success of the Wizard Series exemplifies NYXI unwavering commitment to delivering exceptional performance tailored to the gaming community's preferences.

A Technological Leap Forward for NYXI
Fueled by the cutting-edge technology, NYXI is thrilled to unveil the latest innovation, the NYXI Warrior, which redefines NGC controllers with multi-platform compatibility and ultimate performance.