Tuesday, January 20th 2015
EKWB Indigo Xtreme ETI and Supremacy EVO Elite Now for LGA-2011-3
EK Water Blocks, Ljubljana based premium computer liquid cooling gear manufacturer, is proud to introduce new Indigo Xtreme Engineered Thermal Interface for the latest 5th generation Intel Socket LGA-2011-3 series CPU as well as Supremacy EVO Elite CPU water block + Indigo Xtreme ETI bundle.
EK-TIM Indigo Xtreme represents the latest generation Engineered Thermal Interface (ETI) and fits neatly between a CPU lid and water block (or heat sink) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink.
Indigo Xtreme achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance.
EK-TIM Indigo Xtreme - Intel 2011-3 is a platform dependant applicator and thus only compatible with Intel Socket LGA-2011-3 series CPU.
This product offers the following characteristics:
EK-Supremacy EVO is an evolution of a EK-Supremacy flagship performance water block, introduced in 2012. More than one year worth of round-clock development, CFD analysis and rigorous testing is now resulting in ultimate performance, unmatched by any other product on the market.
EK-Supremacy EVO is a universal CPU water block that fits all modern CPU sockets with a universal mounting mechanism that offers error-preventing, tool-less installation. The result is a perfect installation which results in optimal performance every time. EK-Supremacy EVO is truly the only product for performance seeking enthusiasts.
EK-TIM Indigo Xtreme represents the latest generation Engineered Thermal Interface (ETI) and fits neatly between a CPU lid and water block (or heat sink) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink.
EK-TIM Indigo Xtreme - Intel 2011-3 is a platform dependant applicator and thus only compatible with Intel Socket LGA-2011-3 series CPU.
This product offers the following characteristics:
- Bulk thermal conductivity >20 W/mK
- Fully sealed structure - no mess or migration
- Most consistent performance - applies the correct amount of alloy every time
- Gallium-free
- Laser-cut precision
- Fully compatible with copper and aluminum surfaces
- Peel-and-stick application
- Easy clean up - just peel to remove
EK-Supremacy EVO is an evolution of a EK-Supremacy flagship performance water block, introduced in 2012. More than one year worth of round-clock development, CFD analysis and rigorous testing is now resulting in ultimate performance, unmatched by any other product on the market.
EK-Supremacy EVO is a universal CPU water block that fits all modern CPU sockets with a universal mounting mechanism that offers error-preventing, tool-less installation. The result is a perfect installation which results in optimal performance every time. EK-Supremacy EVO is truly the only product for performance seeking enthusiasts.
4 Comments on EKWB Indigo Xtreme ETI and Supremacy EVO Elite Now for LGA-2011-3
Also, Is this something that works exclusively with EK blocks or will it fit all the same with a Swiftech CPU block? I'm really thinking about trying these out now.
btw the metal pad is something much like this ( the original one )
www.coollaboratory.com/en/products/liquid-metalpad/
Technically the best heat conduction is with no TIM at all and with perfectly smooth metal-to-metal contact. Since this is impossible even with extremely smooth (not polished) surfaces, a small amount of TIM only to fill the minute pores or unevenness in the two surfaces is the best choice for heat transfer. If you can't see through the TIM after the heatsink has been installed and removed and less than 50-75% of the two metal surfaces are not completely bare of TIM, then you have too much TIM or warped surfaces that need some flattening.
BUT the process of applying it is long and fiddly, if I remember correctly it has about 40 steps. To get the best reflow you are supposed to putt the tower on its side so the motherboard is laying completely flat, using a spirit meter to achieve this.
Also, the price is HIGH, ass you only get two applications in one box, and you are going to use both the first time you do it.
Also, it’s a bich to get off the block, and you cannot keep the application if you remove the block, then you have to redo the whole 40 step process with a new one.
So in short, its really good when you put it on, but getting it on takes time.