Wednesday, February 22nd 2017

Toshiba Now Shipping Samples of 64-Layer, 512-gigabit 3D Flash Memory

Toshiba Corporation has today unveiled the latest addition in its industry-leading line-up of BiCS FLASH three-dimensional flash memory with a stacked cell structure, a 64-layer device that achieves a 512-gigabit (64-gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology. The new device will be used in applications that include enterprise and consumer SSD. Sample shipments of the chip started this month, and mass production is scheduled for the second half of this calendar year.

Toshiba continues to refine BiCS FLASH, and the next milestone on its development roadmap is the industry's largest capacity, a 1-terabyte product with a 16-die stacked architecture in a single package. Plans call for the start of sample shipments in April 2017. For the new 512-gigabit device, Toshiba deployed leading-edge 64-layer stacking process to realize a 65% larger capacity per unit chip size than the 48-layer 256-gigabit (32-gigabytes) device, and has increased memory capacity per silicon wafer, reducing the cost per bit.
Toshiba's Memory business already mass produces 64-layer 256-gigabit (32-gigabytes) devices and will expand BiCS FLASH production. It will advance 3D technology to realize increased densities and finer processes in order to meet diversifying market needs.
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2 Comments on Toshiba Now Shipping Samples of 64-Layer, 512-gigabit 3D Flash Memory

#1
BiggieShady
Oh nice, next is 1 TB flash chip with 16 stacked dies ... I guess world won't miss their microwave ovens after all
Posted on Reply
#2
Rictorhell
I could use a 512gb micro sdxc card right about now. If they want to leapfrog that and release a 1tb version I wouldn't be mad. I would hope the price for those would drop a few months after initial release because I know they would be sky high at first.
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Dec 23rd, 2024 04:22 EST change timezone

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