ATP Electronics, the global leader in specialized storage and memory solutions, proudly unveils the N651Si Series E1.S solid state drives (SSDs), which offer best in class performance, endurance, and data retention capabilities for the most demanding applications.

Supporting industrial temperature operating range (-40°C to 85°C) along with hardware power loss protection (HW PLP), the new SSDs offer the highest levels of reliability and total cost of ownership value in harsh environments, making them especially beneficial for mission-critical applications running under extreme temperatures, such as automotive, data logger, data centers, and defense/aerospace. Engineered for 1U Edge servers, the EDSFF offering with 9.5 mm symmetrical enclosure is available with up to 8 TB capacity and is constructed with 512 Gb prime NAND die 176-layer 3D triple level cell (TLC).

Samsung has introduced its latest BM1743 SSD, boasting an impressive 61.44 TB of storage capacity. The BM1743 utilizes Samsung's seventh-generation 3D NAND (V-NAND) technology, featuring 176 layers of memory cells. This represents a significant leap from its predecessor, the BM1733, which debuted in 2020 with 96-layer technology and a maximum capacity of 32 TB. Performance-wise, the BM1743 doesn't disappoint. It delivers up to 1.6 million random read IOPS and 110,000 random write IOPS, with sequential read and write speeds of 7.2 GB/s and 2.0 GB/s, respectively. These figures position the drive as a highly capable solution for read-intensive workloads. Samsung claims that the new SSD offers double the sequential read and write speeds of its fifth-generation technology, with random reads quadrupling in performance. This advancement suggests that quad-level cell (QLC) SSDs are now approaching the performance levels of their triple-level cell (TLC) counterparts while offering superior storage density.

The BM1743 is available in the traditional U.2 form factor, with an E3.S variant supporting PCIe Gen 5 also in the lineup, thanks to the custom Samsung controller. Samsung has enhanced the durability and data retention capabilities of the BM1743. The new drive boasts an improved endurance rating of 0.26 drive writes per day (DWPD) throughout its warranty period, a notable increase from the BM1733's 0.18 DWPD. Additionally, the BM1743 extends its power-off data retention to three months, tripling the one-month period of its predecessor. In a hint of things to come, Samsung has suggested that a 122.88 TB model may be on the horizon, potentially doubling the capacity of the BM1743. This new offering puts Samsung in direct competition with Solidigm's D5-P5336, which has dominated the high-capacity SSD market for the past year. High-density storage solutions are becoming more important as AI and HPC tasks require and produce massive amounts of data.

TrendForce reports that while the enterprise sector continues to invest in server infrastructure—especially with the rising adoption of AI driving demand for enterprise SSDs—the consumer electronics market remains lackluster. This, combined with NAND suppliers aggressively ramping up production in the second half of the year, is expected to push the NAND Flash sufficiency ratio up to 2.3% in the third quarter, curbing the blended price hike to a modest 5-10%.

This year, NAND Flash prices saw a robust rebound as manufacturers kept production in check during the first half, helping them regain profitability. However, with a noticeable ramp-up in production and sluggish retail demand, wafer spot prices have dropped significantly. Some wafer prices are now over 20% below contract prices, casting doubts on the sustainability of future price hikes.

Kioxia presented a technology roadmap at the IWM 2024 conference in Seoul, projecting the development of 1,000-layer 3D NAND by 2027. This ambitious goal is based on extrapolating past trends, which saw NAND layers increase from 24 in 2014 to 238 in 2022. Kioxia's plan involves not only increasing layer count but also shrinking cell size and increasing bit levels from TLC (3 bits per cell) to QLC (4 bits per cell), and possibly even to PLC (5 bits per cell).

However, these advancements come with significant technical challenges. Etching the vertical connecting holes (through-silicon vias or TSVs) are harder to achieve and can lead to higher channel resistance. Kioxia proposes solutions such as using single-crystalline silicon instead of polysilicon and switching from tungsten to molybdenum to reduce resistance. They also suggest moving to multi-lane wordlines to reduce the die area needed for electrical connectivity.

Western Digital has released a new budget friendly SSD that got a serious jump in model number, since the company decided to call it the SN5000. Its predecessor is the SN580 launched just under a year ago and price wise, it's the better option of the two. The new SN5000 uses the same BiCS 5 TLC NAND as the SN580 on the 500 GB to the 2 TB SKU, but according to Anandtech, the 4 TB uses BiCS 6 QLC NAND. The SN5000 is still a PCIe 4.0 x4 NVMe drive, but the overall performance has been significantly improved. If we use the 1 TB SKU for comparison, then the sequential read speeds have gone up by 1 GB/s from 4150 MB/s to 5150 MB/s. The sequential write speed is up 750 MB/s from 4150 MB/s to 4900 MB/s.

As for random performance, the read IOPS are up from 600K IOPS to 730K IOPS and the write IOPS are up slightly from 750K to 770K. The 4 TB QLC SKU is said to deliver even better performance with the exception of the random read IOPS. The 1 TB SKU is said to have a write endurance of 600 TBW, but the 4 TB SKU only offers 1200 TBW. That's 0.33 drive writes per day (DWPD) for the 1 TB SKU vs. 0.16 DWPD for the 4 TB SKU, showing the weakness of the QLC NAND. A new feature for the SN5000 series compared to previous WD Blue NVMe drives is support for TGC Pyrite 2.01 encryption. The WD SN5000-series starts at US$70 for the 500 GB model, going up to US$80 for 1 TB, US$140 for 2 TB and topping out at US$280 for the 4 TB model. WD only seems to have the 500 GB model in stock, with all the others being available in 3-4 weeks time. All SKUs come with a five year warranty.

GIGABYTE today launched its flagship M.2 NVMe SSD, the AORUS Gen5 14000 series. The drive packs the winning combination of Phison PS5026-E26 Max14um controller, with Micron B58R 232-layer 3D TLC NAND flash memory, along with a fast LPDDR4 DRAM cache. The drive comes in 1 TB, 2 TB, and 4 TB capacity variants. The maximum speeds vary for the three.

The 2 TB model is the fastest of the three, with a sequential read speed of up to 14,500 MB/s, and sequential write speed of up to 12,700 MB/s. The 4 TB model is the second fastest, with up to 14,100 MB/s sequential reads, and up to 12,600 MB/s sequential writes. The 1 TB model is third, with up to 13,600 MB/s sequential reads, and up to 10,200 MB/s sequential writes. All three models come without a heatsink, with just a metal film label on top. GIGABYTE recommends pairing the drive with M.2 SSD cooling solutions included with your motherboard to minimize performance throttling. The company didn't announce pricing.

MSI also brought plenty of SSD products to the Computex 2024 show, including the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD based on the Phison E31T controller and Kioxia's 218-layer BiCS 3D TLC NAND, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution, and a couple of SSD accessories, including the DATAMAG Magnetic Portable SSD and the DATAVAULT SSD Enclosure.

As said, the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD will use the Phison 7 nm E31T controller paired up with Kioxia 8th generation 218-layer BiCS 3D TLC NAND and offer transfer rates of up to 10,000 MB/s. The controller, according to MSI, should bring up to a 15 percent reduction in power consumption as well as "maximize bandwidths and link efficiency". It will be available in 1 TB, and 2 TB capacities, and MSI will probably have a version that will include the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution which has been also showcased at the Computex 2024 show. MSI says that this is yet another world's first, which uses "a two-phase flow transition of gas and liquid with minimal signal interference, ensuring rapid and silent heat exchange." According to MSI, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution should provide up to 11 degrees lower temperature compared to a standard aluminium heatsink.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today launched the SM2322, the industry's fastest single-chip high-performance, low-power, and cost-effective solution for external portable SSDs, supporting up to 8 TB of storage and achieves unparalleled data transfer rates of 20 Gbps for storing and accessing large amounts of content seamlessly from AI smartphones, high-performance multimedia devices, and game consoles.

With the increase of AI-capable devices, high density and high-performance storage solutions are becoming more critical to consumers. Portable SSDs powered by the new SM2322 controller are the only solution that offers low-cost, high-density and high-performance, making it the ideal solution for these applications. Equipped with a USB 3.2 Gen 2x2 interface with 20 Gb/s bandwidth and fully integrated hardware and software solution delivering peak sequential read and write transfer speeds of 2,100 MB/s and 2,000 MB/s, respectively, with up to 8 TB capacity, SM2322 powered high-performance portable SSDs enable an ultra-compact and lightweight form factor. The SM2322 supports the ProRes format and MFi specification for iPhone users while also being compatible with Windows, Android OS, and macOS, making it an ideal high-density, high-performance portable storage solution for AI smartphones, HD content creators, and gaming enthusiasts who require high-density, high-performance portable storage.

During the COMPUTEX 2024 exhibition from June 4th to 7th, Mnemonic Electronic Co., Ltd. (hereinafter referred to as Mnemonic), Longsys's Taiwan subsidiary, will showcase a series of high-capacity SSD products under the theme "Embracing the Era of High-capacity SSDs," providing solutions for global users of high-capacity SSD products.

The lineup of high-capacity products presented by Mnemonic includes the ORCA 4836 series enterprise NVMe SSDs and the UNCIA 3836 series enterprise SATA SSDs. These products are equipped with the latest enterprise-grade 128-layer TLC NAND flash memory, offering high performance, low latency, adjustable power consumption, and high reliability storage solutions for enterprise-grade users such as servers, cloud computing, and edge computing, with a maximum capacity of up to 7.68 TB.

Sabrent introduced the Rocket 2242 M.2 Gen 4 NVMe SSD. The drive is built in the M.2-2242 form-factor (42 mm long), which should make it suitable for certain kinds of handheld game consoles, such as the Legion Go. The Rocket 2242 comes in just one capacity for now, 1 TB. The drive combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash, and takes advantage of the PCI-Express 4.0 x4 host interface to offer sequential transfer speeds of up to 5000 MB/s. The company put out no other performance or endurance related specs. Sabrent is pricing the Rocket 2242 1 TB at USD $99.99, it is available now, and backed by a 5-year warranty.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

"We are excited to deliver the industry's first 9th-gen V-NAND, which will bring future applications leaps forward. In order to address the evolving needs for NAND flash solutions, Samsung has pushed the boundaries in cell architecture and operational scheme for our next-generation product," said SungHoi Hur, Head of Flash Product & Technology at Samsung Electronics. "Through our latest V-NAND, Samsung will continue to set the trend for the high-performance, high-density solid state drive (SSD) market that meets the needs for the coming AI generation."

At Embedded World 2024 in Nuremberg, Germany, industrial grade storage brand KingSpec (also known as YANSEN) presented its 2.5" SSD specialized for in-vehicle storage solutions. Embedded World serves as a global platform gathering industry-leading enterprises, technologies, and experts. At this exhibition, YANSEN showcased a solution specifically designed for in vehicle, rail transit and surveillance industries. With the rapid growth of electric vehicles and intelligent connected cars, the demand for reliable, high-capacity in-vehicle data storage is soaring. Secure storage solutions are becoming more essential. YANSEN's 2.5" in-vehicle SSD is engineered specifically for challenging transportation applications.

Rail transit operations face challenging conditions, requiring storage hardware capable of enduring wide temperature ranges, vibrations, and humidity. The 2.5" in-vehicle SSD has undergone rigorous testing beyond industry standards, with an operating temperature range of 0°C to 70°C and an MTBF exceeding 2 million hours. The product features conformal coating and underfill dispensing design to ensure data integrity even in extreme environments.

Micron Technology, Inc., today announced it is sampling the automotive-grade Micron 4150AT SSD, the world's first quad-port SSD, capable of interfacing with up to four systems on chips (SoCs) to centralize storage for software-defined intelligent vehicles. The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface and ruggedized automotive design. With these features, the automotive-grade SSD provides the ecosystem with data center-level flexibility and power.

"As storage requirements race to keep up with rich in-vehicle experiences featuring AI and advanced algorithms for higher levels of autonomous safety, this era demands a new paradigm for automotive storage to match," said Michael Basca, Micron vice president of embedded products and systems. "Building on our collaboration with the innovators redefining next-generation automotive architectures, Micron has reimagined storage from the ground up to deliver the world's first quad-port SSD - the Micron 4150AT - which provides the industry flexibility and horsepower to roll out the transformative technologies on the horizon."

Sabrent today debuted the Rocket 4 line of DRAMless M.2 NVMe Gen 4 SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, and provide sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.4 GB/s writes. The drives also offer 4K random access performance of up to 1 million IOPS reads, and 0.95 million IOPS writes. For now, Sabrent is launching 1 TB and 2 TB capacity variants of the Rocket 4, but the company is preparing to launch a larger 4 TB variant soon.

The Sabrent Rocket 4 combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash memory (also known as the BiCS 6). There's just a copper foil heat spreader to keep things cool. The 12 nm E27T doesn't run anywhere near as hot as the E18, so you can make do with the heatsink your motherboard includes, or run it the way it is. The 1 TB variant is priced at $99.99, and the 2 TB variant at $199.99. The company didn't reveal pricing of the unreleased 4 TB variant.

TrendForce projects a strong 13-18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative. The slight dip in Q2 NAND Flash purchasing—compared to Q1—does not detract from the overall market's momentum, which continues to be influenced by decreasing supplier inventories and the impact of production cuts.

eMMC demand is predominantly driven by Chinese smartphone brands, leading to a substantial boost in shipments from Chinese module makers as some suppliers have reduced their supply. Buyers are increasingly adopting solutions from module makers to meet production needs, enhancing the technological advancement of Chinese module factories and their outreach to premier clients. This trend is likely to increase the penetration of eMMC products among smartphone customers, with a projected 10-15% rise in eMMC contract prices in Q2 due to a sharp rebound in NAND Flash wafer prices.

Greenliant is now sampling its new NVMe NANDrive ball grid array (BGA) solid state drives (SSDs) to customers requiring reliable, high performance data storage for embedded systems used in high stress, extreme environments. Operating between -40 and +95 degrees Celsius, NVMe NANDrive SSDs support the PCIe Gen3x4 interface and are built in an industry standard M.2 1620 (16 x 20 mm, 291-ball) package. See NVMe NANDrive information at https://bit.ly/NVMe-BGA-SSD.

"Building on our proven track record with PATA, SATA and eMMC NANDrive, Greenliant delivers another outstanding high reliability BGA SSD, now with the high speed PCIe NVMe interface, and features that meet the requirements of the most demanding applications," said Arthur Kroyan, vice president, business development and marketing, Greenliant."

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

As the IT sector continues to seek answers for scaling data processing performance while simultaneously improving efficiency - in terms of performance and density per watt, per system, per rack, and per dollar of CapEx and OpEx - ScaleFlux is answering the call with innovative design choices in its SSD controllers. The SFX 5016 promises to set new standards both for performance and for power efficiency.

In addition to carrying forward the transparent compression feature that ScaleFlux first released in 2020 in upgraded in 2022 with the SFX 3016 computational storage drive controller, the new SFX 5016 SOC processor includes a number of design advances.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage, and gaming peripherals, proudly introduces the Viper PV553 M.2 2280 PCIe Gen 5 x4 SSD. This groundbreaking SSD is designed with the core idea of delivering next-gen performance, featuring an innovative active cooling system.

The PV553 introduces a revolutionary cooling solution as Patriot's first SSD with a blower fan design. Patriot Memory's cutting-edge advancements ensure active thermal dissipation, providing consistent cooling even during extended usage for intense gaming sessions. Crafted with premium materials and a slim 16.5 mm aluminium heat shield, the PV553 incorporates an embedded thermal sensor, guaranteeing unwavering high performance. With a 5-year warranty, this SSD exemplifies quality and reliability.

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.

While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.

SK hynix Inc. showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the industry's first NAND with more than 300 layers. The company gave a presentation on the progress on the development of its 321-layer 1 Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara.

SK hynix is the first in the industry to unveil the progress on the development of a NAND with more than 300 layers in detail. The company plans to raise the level of completion of the 321-layer product and start mass production from the first half of 2025. The company said its technological competitiveness accumulated from the success of the world's highest 238-layer NAND, already in mass production, paved the way for a smooth progress for the development of the 321-layer product. "With another breakthrough to address stacking limitations, SK hynix will open the era of NAND with more than 300 layers and lead the market."

Micron Technology, Inc., today announced the Crucial X9 Pro Portable SSD and Crucial X10 Pro Portable SSD, two new performance offerings in the Crucial Pro Series product portfolio, designed for content creators such as photographers, videographers, designers, or any performance-seeking consumer. Both drives utilize Micron TLC NAND and leverage a revolutionary single-ASIC portable storage architecture to enable a breakthrough, ultra-compact, lightweight form factor and allows Micron to ship the most capacity per square millimeter in the industry. With either the Crucial X9 Pro and X10 Pro, users can safely store, transport and backup important videos, photos, files and more on the go, without cloud or internet access at lightning-fast speeds.

"We recognize that fast, efficient workflow processes are essential to the success of videographers, photographers and other content creators," said Jonathan Weech, senior director of product marketing for Micron's Commercial Products Group. "We designed and built our two new portable SSDs, the Crucial X9 Pro and the Crucial X10 Pro, to specifically address these demanding workloads. With more photos and videos being taken than ever before, consumers are looking for ways to save, preserve and protect their digital lives reliably and quickly. These two new Crucial Pro Portable SSDs are a great choice for anyone who needs dependable, fast, high-capacity storage."

Seagate Technology Holdings today introduced the next generation of SSD technology to its lineup, the FireCuda 540. The PCIe Gen 5 NVMe SSD delivers unparalleled performance to gamers, creators, and tech enthusiasts - adding the fastest speeds and endurance to the company's line of PC storage products.

Seagate's fastest and highest performance M.2 2280 SSD, the FireCuda 540 delivers sequential read speeds of up to 10,000 MB/s and sequential write speeds of up to 10,000 MB/s. Built for sustained, pro-level gaming and accelerated content creation, the new drive performs up to 50% faster than Gen 4 M.2 NVMe drives and 17 times faster than SATA-based SSDs. With the latest 3D TLC NAND technology and built with a Seagate-validated E26 controller, the FireCuda 540 provides the most advanced speed and durability - allowing users to push limits when gaming or creating content. Plug-and-play compatible with all PCIe Gen 5 motherboards and backwards compatible with PCIe Gen 4, the drive is accessible and ready for trailblazing.

A trend we've seen in the 2023 Computex is that SSD manufacturers aren't advertising their feisty Gen 5 NVMe SSDs with the elaborate cooling solutions that they sorely need, but rather as bare drives, with the cooling options marketed separately. In practice, manufacturers could get retailers to bundle Gen 5 SSDs with a selection of their coolers. This lets them trim some of the criticism of just how hot SSDs have gotten over just one generation. Team Group showed off its T-Force Cardea Z5 lines of M.2 Gen 5 NVMe SSDs. There are two distinct lines with the same names. One of these comes with a maximum sequential read speed of 12 GB/s, while the other comes with 14 GB/s. Both have their respective 1 TB, 2 TB, and 4 TB capacity variants. Both use 3D TLC NAND flash. The under-the-hood difference between the 12 GB/s and 14 GB/s versions of the Cardea Z5 is that while the 12 GB/s variant uses a Phison E26-series controller, the 14 GB/s one uses an InnoGrit IG5666 controller. Team Group intends to eventually re-brand the 14 GB/s variant as the Cardea Z54A series.

Team Group also announced a handful cooling solutions to pair with these Gen 5 SSDs. The most striking of these is the T-Force Siren, an all-in-one (AIO) closed loop liquid M.2 NVMe SSD cooler, with as 120 mm radiator. The name is a bit of a misnomer, as SSD coolers with 20 mm fans is what a siren might sound like. Obviously, this cooler is overkill, and helps the SSD deliver its best performance, but there are other options from the company. The T-Force AirFlow I uses two copper heatpipes that run through the base-plate, pulling heat from the controller, NAND flash, and DRAM, and pushing it through an aluminium fin-stack arranged vertically. This is then ventilated by a 30 mm fan. The T-Force Airflow II uses a slightly different approach, with a single thicker heat pipe arranged in a C-shape, with radially-projecting finnage that have the appearance of a cylinder. At the other end of this is a 30 mm fan.