Monday, April 10th 2017
SK Hynix Introduces Industry's Highest 72-Layer 3D NAND Flash
SK Hynix Inc. today introduced the industry's first 72-Layer 256 Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32 GB (Gigabytes) storage. SK Hynix launched 36-Layer 128 Gb 3D NAND chips in April 2016, and has been mass producing 48-Layer 256 Gb 3D NAND chips since November 2016. In just 5 months, the company has developed the 72-Layer 256 Gb 3D NAND chips, securing the industry's finest product portfolio.
The technological achievement of this 72-Layer 256 Gb 3D NAND compares figuratively to the difficulty of approximately 4 billion 72-storied skyscrapers on a dime. The chip also achieves approximately 30 percent more manufacturing productivity over its predecessor 48-Layer by stacking 1.5 times more cells and utilizing existing mass production facilities. Also by bringing high-speed circuit design into the new chip, its internal operation speed is two times faster and read/write performance is 20 percent higher than a 48-Layer 3D NAND chip.
With this new 72-Layer 3D NAND chips having 30% more efficiency in productivity and 20% higher performance, SK Hynix has been currently developing NAND Flash solutions such as SSD(Solid State Drive) and storage for mobile devices such as smart phones. With the improved performance, high reliability and low power consumption, the company looks forward to solidifying its business competence in the 3D NAND memory solutions.
"With the introduction of this industry's highest productivity 3D NAND, SK Hynix will mass produce the 256Gb 3D NAND in the second half of this year to provide this to worldwide business clients for optimum use in storage solutions" said vice president Jong Ho Kim, the Head of Marketing Division. "The company plans to expand the usage of the product to SSDs and mobile gadgets such as smart phones to further improve its business structure weighted towards DRAM" he added.
3D NAND demand will rapidly increase across AI(Artificial Intelligence), big data and cloud storage in the 4th industrial revolution. According to Gartner, NAND Flash market revenue is expected to total USD 46.5 billion in this year and post continuous growth to amount to USD 56.5 billion in 2021.
The technological achievement of this 72-Layer 256 Gb 3D NAND compares figuratively to the difficulty of approximately 4 billion 72-storied skyscrapers on a dime. The chip also achieves approximately 30 percent more manufacturing productivity over its predecessor 48-Layer by stacking 1.5 times more cells and utilizing existing mass production facilities. Also by bringing high-speed circuit design into the new chip, its internal operation speed is two times faster and read/write performance is 20 percent higher than a 48-Layer 3D NAND chip.
"With the introduction of this industry's highest productivity 3D NAND, SK Hynix will mass produce the 256Gb 3D NAND in the second half of this year to provide this to worldwide business clients for optimum use in storage solutions" said vice president Jong Ho Kim, the Head of Marketing Division. "The company plans to expand the usage of the product to SSDs and mobile gadgets such as smart phones to further improve its business structure weighted towards DRAM" he added.
3D NAND demand will rapidly increase across AI(Artificial Intelligence), big data and cloud storage in the 4th industrial revolution. According to Gartner, NAND Flash market revenue is expected to total USD 46.5 billion in this year and post continuous growth to amount to USD 56.5 billion in 2021.
9 Comments on SK Hynix Introduces Industry's Highest 72-Layer 3D NAND Flash
I like it, but we need to go HIGHER! :clap:
(I wonder if there is no limit to how hight they could stack them, I mean, if they're already making these kinds of leaps within months)
I mean there's marketing BS, and then there's that. I'm pretty speechless at the arrogance of claiming a 4th industrial revolution when it's questionable if even the tech generation qualifies as a "second," let alone whatever they consider number three. I really doubt 3D nand factors into any of this at all, to be frank.
I'm wondering if it's already built on 10nm process?
and a bit more creative, this: en.wikipedia.org/wiki/The_Third_Industrial_Revolution
You can apply it to other services as well, like finance. Small financal auditing firms will soon be a thing of the past, because there exists simpler tools now so people can do it themselves faster, plus the large auditing companies have developed systems so they can do it even faster and cheaper. Work that two years ago took an afternoon now takes 30 minutes, or even shorter.
And all of this depends on shuffling lots of data about as fast as possible. It's marketing speak, but it's not as dumb as it sounds.