Wednesday, April 4th 2018
The Ncore V1 is the World's First Naked Die Cooling Waterblock for LGA1151 CPUs
The world's first waterblock designed for naked die cooling throws years of conventional wisdom out of the window. It features six unique patentable features including its "in-frame" mounting mechanism. The man behind NUDEcnc, Arek Tobiszewski has started this Kickstarter campaign in order to get a professional CNC machine, which will enable this inventor to deliver Ncore and other cool projects to the audience. He has been brave enough to send the Ncore for a review to Kyle Bennett from HardOcp; Linus tech tips; buildzoid, and Techlipton. Some of the reviews are already up, and are very promising.Ncore is still a prototype but Arek is promising unique features like
- Designed for naked die cooling (No HIS in the way)
- Water 20x closer to the CPU
- True adjustable waterflow
- 3d watercooling
- Money saving thermals
- Noise reduction
- Independent floating fixture
- Single part 12sec installation, no tools required
- Deigned as a delidding tool V1D
30 Comments on The Ncore V1 is the World's First Naked Die Cooling Waterblock for LGA1151 CPUs
It would be nice if AMD/Intel can do limited production runs with something like this, soldered coldplate attached to the CPU/GPU. This is not just about getting rid off thermal paste/compound altogether, but long term stable temperature performance. ie, it will be more or less have the same temperature many years down the road, virtually no degradation.
I think a hotplate is needed to solder the CPU to this product. I have a full infrared workstation (Aoyue BGA9000) & I just got a great idea how to solder a CPU to coldplate. It's just hit me how to solve this problem. This is experimental as I have never used a workstation to solder a coldplate to a CPU.
EDIT: I have just order some Indium, thermal paste/compound could become obsolete for me in the next few days. Watch this space, it's going to be interesting, because if successful it will appear also on a R9 Nano.
This should be easy for me to solder & desolder CPUs as I have already done BGA CPU soldering/reballing, so I should get the job done first time with no errors.
Anyone that does BGA soldering/desoldering should be able to do this without errors first time & every time without errors, & I know there are a few of you out there.
Hotplate does seem to be the perfect tool for this, but I will be using a workstation. So all those CPUs/APUs out there that are not soldered, can be soldered. I have two methods how to solder CPUs, I will test both, then practice removing IHS, then I will move to coldplate/CPU soldering.
Still awaiting Indium to arrive.
EDIT: The reason I say this should be easy for users that do BGA soldering is because, you are already dealing with temperatures around 175c-220c when you are soldering-in BGA CPUs or BGA components. So I expect perfection "first time".
I should also make you aware the soldered route also has a higher conductivity of heat, better than Liquid Metal Compound. This has already shown-up when I did the IHS to Heatsink direct soldering & I expect further improvements when die is also soldered.