Wednesday, April 1st 2020
Intel Planning 14nm "Ozark Lake" 16-core Processor for Spring 2021
TechPowerUp has learned that Intel is planning to bring 16 cores onto the mainstream desktop platform by Spring 2021 by implementing a similar chip-design philosophy as AMD: MCMs. The new "Ozark Lake" processor will pack up to 16 cores and 32 threads by decoupling the "core" and "uncore" components of a typical Intel mainstream processor.
Intel will leverage the additional fiberglass substrate floor-space yielded from the new LGA1700 package to create a multi-chip module that has two [kinds of] dies, the "core complex" and the "uncore complex." The core complex is a 14 nm die purely composed of CPU cores and an EMIB interconnect. There will be as many as 16 "Skylake" cores in a conventional ringbus layout, and conventional cache hierarchy (256 KB L2$ and up to 2 MB/core L3$). The lack of uncore components and exclusive clock and voltage domains will allow the CPU cores to attain Thermal Velocity Boost Pro speeds of up to 6.00 GHz, if not more.
The core complex connects to another, smaller die on the package called the "uncore complex," using EMIB. This die packs all of the chip's I/O. Among its key components include a dual-channel DDR4 memory controller, a PCI-Express gen 4.0 root complex with 28 lanes (16 toward PEG, 8 toward the DMI 4.0 chipset bus, and 4 toward an "accelerated M.2 slot" (working title), or perhaps even an Optane persistent memory slot). Also featured will be an Intel Xe-architecture based iGPU with roughly 1 TFLOP/s raw compute power. The modularity of the MCM will allow Intel to build lower-core count SKUs by simply placing smaller 10-core, 8-core, or 6-core dies next to the uncore complex.
Intel has, in the past, built an MCM with the exact same floor-plan and division of labor, "Clarkdale," circa 2010. Our well placed sources in the motherboard industry pin a soft-launch date on April 1, 2021, unless delayed by COVID-19.
Update 07:07 UTC: We reached out to Intel for comments and received an unexpected response: "We do not comment on unreleased products, but we're committed to saving the world by keeping college kids away from irresponsible spring break parties during a pandemic."
Intel will leverage the additional fiberglass substrate floor-space yielded from the new LGA1700 package to create a multi-chip module that has two [kinds of] dies, the "core complex" and the "uncore complex." The core complex is a 14 nm die purely composed of CPU cores and an EMIB interconnect. There will be as many as 16 "Skylake" cores in a conventional ringbus layout, and conventional cache hierarchy (256 KB L2$ and up to 2 MB/core L3$). The lack of uncore components and exclusive clock and voltage domains will allow the CPU cores to attain Thermal Velocity Boost Pro speeds of up to 6.00 GHz, if not more.
Intel has, in the past, built an MCM with the exact same floor-plan and division of labor, "Clarkdale," circa 2010. Our well placed sources in the motherboard industry pin a soft-launch date on April 1, 2021, unless delayed by COVID-19.
Update 07:07 UTC: We reached out to Intel for comments and received an unexpected response: "We do not comment on unreleased products, but we're committed to saving the world by keeping college kids away from irresponsible spring break parties during a pandemic."
60 Comments on Intel Planning 14nm "Ozark Lake" 16-core Processor for Spring 2021
I have to wonder how much heat and power a 14nm cpu core.....
Wait, this is an April's Fool joke isn't it?
XMG APEX 15 is a Laptop with AMD Ryzen 3950X CPU Inside
Zen 4 2021 or 2022 on next-gen node.
We don't know the codenames after Vermeer and Renoir.
Just Genoa after Naples, Milan and Rome.
new young boi's rockin tha scene on low node
And I know it is not fake new as this laptop whas already posted on March 31st.
I see it will be BIG.small hybrid. And may be not end of legacy x86 instructions, just adding new.
As a foundry business, EMIB is the killer tech, yet they have absolutely 0 products.
Same for ESRAM, what it could be, what it were...
I think, Intel works best when it follows a standard some other company made. It is the perfect engineering company with zero resourcefulness.
So, when they say 6.0GHz, I absolutely believe them to deliver. They made great rounds with powergated frontend in the sandybridge era. They just need to work like that.
I only say this as a design perspective - they needed that Jim Keller sorely.
EMIB and all, so very good. They don't shuffle their core market, that is what I'm saying.
That fountry executive which I watched his 2012 lecture told it straight away, the 14nm process had all the bells and whistles and implied how else to improve upon in 10 nm - we are only beginning to see it now. It was just an emphasis on 14nm's readiness. Intel only lacked design, they really have the best tech, see my note on their EMIB which could dominate 2.5D domain if they wanted to.