NaitoI understand that. However, 4K TVs have become very prevalent (I've seen as low as $300 where I am) and for a console which will probably be in the market for 7 to 8 years, it should still be able to drive 4K at least as well as the Scorpio (One X) currently does. Scaling back performance to only support 1080/1440p seems short sighted. Though, as others have pointed out, 4TF of RDNA2 may perform as well or better than the 6TF on hand in the Scorpio.

demian_viSwitch Lite showed that there's a market for cheaper versions of consoles. not everyone has a 4k tv and someone who can't afford a 4k tv, would likely prefer a cheaper console.
Microsoft has definitely done some market research before deciding this


Cpu will be the same.

danbert2000CPU portion will be the same, but it's all the same chip. GPU portion of the overall APU will either be smaller (cost savings from smaller dies, which means more per wafer) or harvested (meaning that they are the same physical chip as the Series X, but defective in several regions which are then deactivated physically with laser cuts). The latter has cost savings from reusing chips that would have been thrown away, so as long as the defective chips meet demand they are essentially free. If not, they would likely have to start cutting perfectly good Series X chips to meet the lower price point.

My bet is in the beginning it will be harvested defective Series X dies, and once the 7 nm fab defect rate drops, they'll have a custom chip to go along with a fab shrink. Best of both worlds and in the beginning you're just managing one chip run.

ValantarCPU being the same does not mean the SoC is the same, and it's highly unlikely that there will be enough defective XSX dice to support this being based on cut down chips. If this is real it's likely a second die design with the same CPU but less GPU CUs and RAM channels.

demian_viCpu is the same and gpu is different. I never said anything about the Soc, we already know it's different.

ValantarGiven that TSMC 7nm is now a mature node and the XSX die has four CUs spare and is a relatively reasonable die size (bigger, but still comparable to a Navi 10), I see no reason to expect there to be any noticeable defect rate for those chips - at least not ones that can be harvested. Given what consumes the most die area it's reasonable to expect most errors to happen in the GPU, where there can then be up to four errors per die, all in different CUs (highly unlikely) before the chip fails to pass muster. If there's a flaw in the CPU or something else that's shared, they can't harvest it anyhow.

danbert2000Just because it's a mature node doesn't mean there isn't defect rates. It means that the defect rates are acceptable and making the chips is reliably profitable. That could mean that the wafer cost goes down or the defect rate goes down, but it can never be zero defects, especially at the edge of the wafer. Nvidia and AMD harvest defective dies for their lower end GPUs all the time, and Nvidia especially is on a very mature node at this point and still has the cost structure set up to make few different chips with cut resources. Intel has defective chips on 14 nm after all this time on it. Still, we don't have any information at this point about whether the Series S chips will be new or harvested, but my bet is in the beginning they will be harvested so Microsoft can reuse some of those very large APUs that have just a few defects in the GPU portion.