Intel Developer Forum (IDF) in Shanghai, China, officially opens its doors from April 2nd to April 3rd. Topics set to be covered at IDF Shanghai include Netbook, Nettop, Bloomfield (Nehalem), solid-state drives, QuickAssist (accelerators), system-on-chip (Tolapai), and USB 3.0. The pictures below are from one of these topics, the new quad-core Nehalem CPU, or more specificly its core. Intel's future Nehalem will bring a totally new system architecture and a next-gen platform architecture. It will come in new socket, and will be the first processor to have up to 8 cores and integrated DDR3 memory controller. Expect more details tomorrow.