MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, announced today that its AM5 series motherboards are fully compatible with the AMD Ryzen 7 9800X3D processor, maximizing its impressive gaming performance. This allows PC enthusiasts worldwide to be among the first to experience the exceptional capabilities brought by the AMD Ryzen 7 9800X3D processor. The AMD Ryzen 7 9800X3D is the first model released in the 9000X3D processor series. ASRock AM5 motherboards will continue to receive updates to ensure seamless compatibility with upcoming Ryzen 9000 Series X3D processors, delivering outstanding performance for gaming enthusiasts.

Users can download and install the latest AGESA 1.2.0.2a BIOS from the ASRock website or use the BIOS Flashback and Instant Flash features for an easy upgrade. ASRock recommends updating to the latest BIOS version promptly to ensure optimal system compatibility and performance.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, is proud to announce the launch of X3D Turbo Mode, a revolutionary BIOS feature designed to maximize gaming performance on X870E, X870, and 600 series motherboards with AMD Ryzen 7000 X3D and Ryzen 9000 series processors.⁠

GIGABYTE X3D Turbo Mode is a cutting-edge BIOS feature that pushes the boundaries of gaming performance. Empirical testing demonstrates that this innovative BIOS feature delivers tangible benefits to gamers, with performance increases of up to 35% for incoming Ryzen 9000 X3D processors and an astounding 20% for Ryzen 9000 non-X3D processors. Moreover, X3D Turbo Mode's unique optimization parameters allow even Ryzen 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency by GIGABYTE's BIOS wizardry-X3D Turbo Mode.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

According to new latest testing, the latest AGESA (AMD Generic Encapsulated Software Architecture) update, version 1.2.0.2, promises a significant boost in performance for AMD Ryzen 9000 "Zen 5" processors. This update is targeting one of the most crucial aspects of multi-core processing: inter-core latency. The AGESA 1.2.0.2 update addresses challenges initially reported in AMD's Zen 5 architecture, particularly in scenarios demanding rapid communication between multiple cores. Early reports suggest a remarkable reduction in inter-core latency by up to 58%. According to Overclock.net testing, older AGESA 1.2.0.1A showed the cross-CCD latency at around 180 ns. However, with the new AGESA 1.2.0.2 BIOS, the latency is seemingly around 75 ns.

Interestingly, the update has arrived on the ASUS ROG Crosshair X670E motherboard, with BIOS version 2401. BIOS updates with the latest AGESA 1.2.0.2 are still rolling out, so it will be interesting to see further testing and possible improvements. It could be that the cross-CCD latency has just been reported badly, so final testing will conclude the latency increase from Zen 4 to Zen 5 debate.

OpenSIL is an open-source CPU initialization framework project that seeks to replace on-chip initialization microcode, such as AGESA, across both client- and server processors. AMD looks to implement OpenSIL as it makes its AMD EPYC processors more friendly to large customers that want to take control of this aspect of the processor. Since its open-sourcing in June 2023, AMD has come up with reference motherboards implementing OpenSIL, as well as modifying a Supermicro server motherboard to the architecture, to demo at conferences. AMD firmware engineer Paul Grimes presented the company's progress with implementing OpenSIL, at the OSFC conference, in Germany. It's been known that AMD is targeting a 2025-26 timeline for OpenSIL to hit product, but AMD put out specifics, such as its next-generation "Venice" server processor supporting OpenSIL.

"Venice" is codename for an AMD EPYC server processor generation succeeding "Turin." It is built on the future "Zen 6" microarchitecture, and AMD could at least unveil the processor some time in 2025, if not mass-produce it. late-2024 thru 2025 could see the company ramp up "Turin" and other server processors implementing "Zen 5." That's not all, AMD plans to being OpenSIL even to client processors, with the generation of Ryzen processors based on "Zen 6." This will see the AGESA microcode replaced by a first-party firmware from AMD based on OpenSIL, which PC OEMs will be able to customize. The biggest impact of this change will be felt in the commercial notebook and commercial desktop segments, where large organizations can take greater control over the chip initialization firmware.

Motherboard manufacturers are beginning to roll out UEFI firmware updates that not just patch the Sinkclose critical vulnerability, but enable an experimental "105 W TDP mode" option as part of the processor's custom BIOS settings (CBS). The mode elevates the power limits of the Ryzen 5 9600X and Ryzen 7 9700X "Zen 5" desktop processors, with up to 13%" performance gains being reported by the motherboard vendors themselves. By default, your motherboard will run these processors at their original 65 W TDP, and you're supposed to manually enable the setting in the UEFI firmware setup program. It could either be found in the overclocking/tuning page, or the AMD CBS section.

To remove the last bit of hesitation among users go turn this setting on, AMD is working to extend its processor warranty to cover the 105 W TDP mode, reports Wccftech editor Hassan Mujtaba. Currently, the setting is being shipped with AM5 AGESA version 1.2.0.1, which includes the Sinkclose vulnerability patch, but will "officially" release it with AM5 AGESA 1.2.0.2, along with warranty coverage. Mujtaba reports that firmware updated with AGESA 1.2.0.2 are expected to begin rolling out in late-September.

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the BIOS update that fixes a recently identified security vulnerability "Sinkclose" of AMD desktop processors.

This security flaw was reported to impact all AMD processors since 2006 and millions of devices globally. GIGABYTE remains working closely with AMD and demonstrates our commitment to swiftly addressing any issues that may affect our customers' experience. The latest AGESA BIOS which can fix the security vulnerability will be released to the website in succession starting by end of August.⁠

User are encouraged to install the updated BIOS at their earliest convenience. The BIOS can be easily updated using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology. Please refer to the following table for the AGESA BIOS version and applicable models.

Recent reports suggest that AMD's Zen 5 desktop processors may soon receive a significant power upgrade. The upcoming AGESA 1.2.0.1A Patch A is rumored to increase the default power limits (TDP) from 65 W to 105 W for certain models, specifically the 8-core Ryzen 7 9700X and the 6-core Ryzen 5 9600X. This development comes as a surprise given that the first reviews of the Ryzen 9000 series were published just last week, with lower power consumption praised as a major advantage over previous generations. The potential TDP increase, while not as high as the 120 W initially rumored for the 9700X, still represents a substantial boost in power allocation.

The rationale behind this significant TDP increase appears to be addressing the lower than expected performance of the Ryzen 7 9700X and Ryzen 5 9600X compared to their predecessors. Initial testing showed that both CPUs performed similarly to earlier models, especially in gaming scenarios, with notable improvements only visible when using Precision Boost Overdrive (PBO). Even at 65 W, the Ryzen 7 9700X struggled to outpace the 7800X3D in gaming performance, highlighting the need for improved power delivery.

ASRock has released the AGESA 1.2.0.0a patch A BIOS update for its AM5 motherboards, enhancing compatibility and performance for AMD Ryzen 9000 series processors. The update is available for ASRock's AM5 motherboard lineup, including models with X670E, B650E, B650, and A620 chipsets. This new BIOS version allows users to fully leverage the capabilities of the Ryzen 9000 series processors, providing improved system performance and stability.

Users can easily download and install the update from the ASRock official website or use features like BIOS Flashback and Instant Flash. ASRock recommends updating to the latest BIOS version to ensure optimal system compatibility and performance for AMD Ryzen 9000 series processors.

MSI is excited to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the AM5 platform. Powered by advanced 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unmatched performance, efficiency, and versatility for gamers and content creators. At launch, August 8th, AMD Ryzen 7 9700X, and Ryzen 5 9600X are available while the Ryzen 9 9950X and 9900X will launch on August 15th. These processors will feature up to 16 cores and 32 threads, with a theoretical maximum boost clock speed of 5.7 GHz, 64 MB of L3 cache, and a maximum TDP of 170 W.

AMD Ryzen 9000 Series will also support PCIe 5.0 for the GPU and M.2 while enhancing DDR5 memory speed. Notably, the AMD Ryzen 7 9700X offers approximately 12% better overall performance than the first-gen AMD 3D V-cache CPU. All these processors are compatible with the AM5 socket, and existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate by updating to the latest BIOS, available on MSI's product support page.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to announce a brand-new BIOS update for its AMD AM5 motherboards, designed to support AMD's latest Ryzen 9000 series processors, including Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. Incorporating the latest AMD AGESA 1.2.0.0.a Patch A BIOS update on BIOSTAR official website, BIOSTAR AM5 series motherboards consisting of X870E, X670E, B650E, B650, A620, and A620A are now primed and ready to unleash the full potential of AMD's ZEN 5 processors with superior stability.

AMD's latest Ryzen 9000 series processors, built on the groundbreaking Zen 5 architecture, represent a significant leap forward in computing performance and efficiency. These processors offer up to 16 cores and 32 threads, with clock speeds reaching up to 5.7 GHz. Featuring enhanced IPC (Instructions Per Cycle) performance and advanced Ryzen AI capabilities, the Ryzen 9000 series is engineered to handle intensive gaming, content creation, and professional workloads with ease. The new architecture also introduces improved power efficiency, ensuring cooler operation and lower energy consumption. With these cutting-edge processors, users can experience unprecedented levels of speed, responsiveness, and overall computing power.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.

GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology.

MSI released a new AMD AGESA Combo PI-1.2.0.0 BIOS update today for all AMD X670E, X670, B650, and A620 motherboards. This update aims to enhance the overall user experience by addressing several key issues and new improvements. Users simply need to update the BIOS to the latest version to benefit from these enhancements.

Firstly, we have made a few enhancements to the upcoming AMD Ryzen 9000 series CPU, focusing on stability and performance bug fixes. These fixes are to ensure that users will have a smooth and reliable performance with the new CPUs. Additionally, the update includes several compatibility improvements and workaround with NVIDIA's RTX 40 Series graphics cards, especially the 4070 and 4060 GPUs, which were previously causing some instability issues.

EVGA designed an enthusiast segment AMD X670E chipset motherboard for the Socket AM5 platform, which never made it to the mass market. It had even planned to give the board its coveted Classified brand, and sell as the X670E Classified. Prototypes of this board fetched over $1,300 in auction. The board is built in the E-ATX form-factor like most of the EVGA Classified series motherboards; and packs a powerful CPU VRM, besides several overclocker-friendly features, such as top-oriented DDR5 memory slots, side-facing I/O (including power inputs), and in general, a decluttered layout that won't get in the way of extreme cooling solutions.

There were four such prototypes with Jiacheng Liu, a hardware enthusiast, each of which went under the hammer. The only trouble with these prototypes is that they're bare—they don't include heatsinks for the CPU VRM or the chipset, let alone heatsinks for the two M.2 Gen 5 NVMe slots that don't eat into the Gen 5 x16 PEG. Another problem with these boards is that they're not supported by EVGA, and only come with their initial BIOS that supports Ryzen 7000 "Zen 4" processors, but not the upcoming Ryzen 9000 "Zen 5." We doubt if these even support the Ryzen 7000X3D series, which is probably the main reason the boards didn't fetch way more than $1,300 a piece at the auctions. Enthusiasts might still figure out a way to BIOS-mod and encapsulate the latest AGESA.

AMD classified the Zenbleed vulnerability, CVE-2023-20593, as a medium-level threat about a year ago. AMD has acknowledged that it could potentially allow an attacker to access sensitive information under certain microarchitectural circumstances. Today, MSI has released new BIOS updates featuring AMD's AM4 AGESA 1.2.0.Ca firmware update. This update addresses the Zenbleed vulnerability affecting AMD's Ryzen 4000 series Zen 2 APUs. MSI is proactively rolling out the new BIOS updates across its range of compatible motherboards. The updates are currently available for almost all X570 motherboards, with support for other chipsets and 400 series motherboards expected to follow soon.

The AGESA 1.2.0.Ca firmware update specifically targets the Zenbleed vulnerability in the Zen 2 microarchitecture. Although the vulnerability primarily affects Ryzen 4000 "Renoir" APUs, it also exists in other Zen 2 processors, including the Ryzen 3000 series and certain EPYC and Threadripper CPUs. AMD has already addressed the Zenbleed vulnerability in previous AGESA microcode updates for Ryzen 3000 processors and other platforms, such as EPYC server CPUs and Ryzen mobile CPUs. However, the Ryzen Embedded V2000 CPUs are still awaiting the EmbeddedPi-FP6 1.0.0.9 AGESA firmware update, which is expected to be released by April. While AMD has not explicitly stated whether the security update will impact performance, previous testing of Zenbleed fixes has shown potential performance drops of up to 15% in certain workloads, although gaming performance remained relatively unaffected. Users with AM4 chips based on architectures other than Zen 2, such as Zen+ or Zen 3, do not need to update their BIOS as they are not affected by this specific vulnerability.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today is excited to announce a brand-new BIOS update designed for its AMD AM5 series motherboards, incorporating the latest AGESA PI 1.1.7.0 Patch A architecture. This update is aimed at the imminent release of AMD's next-generation CPUs, ensuring that BIOSTAR motherboards are primed to unleash the full potential of these cutting-edge processors. With a strong focus on future-ready performance, this BIOS update will be available to download soon and is ready to redefine computing power and performance with the latest AMD processors. BIOSTAR invites users to stay tuned to its official website for the BIOS release and future updates.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, released the latest AGESA 1.1.7.0 beta bios for the coming AMD Ryzen 9000 series processors boot-up support on GIGABYTE AM5 X670, B650, A620 motherboards, and for present Ryzen 7000 and 8000 series processors as well.⁠ The AGESA 1.1.7.0 beta BIOS is now ready on the GIGABYTE official website, and the formal release will be in mid-May. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology. For more update, please pay close attention to the official GIGABYTE website.

In yet another clear sign that we could see some action from AMD on the next-gen desktop processor front this Computex, motherboard maker MSI released its first beta UEFI firmware update that packs an AGESA microcode that reportedly supports the upcoming AMD Ryzen 9000 "Granite Ridge" processors. The "7D74v1D2 beta" firmware update for the MSI MPG B650 Carbon Wi-Fi motherboard encapsulates AGESA ComboPI 1.1.7.0 patch-A, with the description that it supports a "next-gen CPU," a reference to the Ryzen 9000 "Granite Ridge."

A successor to the Ryzen 7000 Raphael, the Ryzen 9000 Granite Ridge introduces the new "Zen 5" microarchitecture to the desktop platform, with CPU core counts remaining up to 16-core/32-thread. The new microarchitecture is expected to introduce generational increase in IPC, as well as improve performance of certain exotic workloads such as AVX-512. The processors are said to be launching alongside the new AMD 800-series motherboard chipset. If AMD is using Computex as a platform to showcase these processors, it's likely we might see the first of these motherboards as well.

The AMD Ryzen 8000 and 5000 series desktop processors have been released, broadening system build options. Notably, they are respectively compatible with MSI AM5 and AM4 motherboards, offering enthusiasts expanded possibilities for powerful and customizable setups. The latest AMD Ryzen 8000 series desktop lineup includes the powerful Ryzen 7 8700G, Ryzen 5 8600G, and Ryzen 5 8500G processors. These processors come equipped with built-in AMD Radeon graphics solution, ensuring an exceptional gaming experience for all gamers. Compatible with MSI AM5 platform, including X670E, X670, B650, and A620 series motherboards.

MSI is diligently working to release the official BIOS version for gamers. The first wave of supported beta BIOS is already available on the MSI official website. More choices for system builds on the AM4 platform as AMD introduces the Ryzen 7 5700X3D, Ryzen 7 5700, Ryzen 5 5600GT, and Ryzen 5 5500GT processors, extending the portfolio for system builds. The MSI AM4 motherboards are fully compatible with the latest AMD Ryzen 5000 series processors. With the current AGESA ComboAm4v2PI 1.2.0.B official BIOS, users can seamlessly upgrade their processors hassle-free.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly unveils the world's first motherboard designed to seamlessly support the native USB-C 40 Gbps signal when paired with the cutting-edge AMD Ryzen 8000 series processors.

"We are thrilled to introduce a motherboard that not only supports the cutting-edge AMD Ryzen 8000 series processors but also incorporates advanced features that cater to the evolving needs of our users. This marks a significant leap forward in terms of performance, user-friendliness, and design aesthetics." Said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

ASUS began rolling out beta UEFI firmware updates for its Socket AM5 motherboards that contain the latest AMD AGESA 1.1.0.1 microcode. If you recall, ASRock had recently released its own firmware updates last month that feature AGESA 1.1.0.0. This would be the first widely released firmware from ASUS to support the upcoming Ryzen 8000G "Phoenix" and "Phoenix 2" desktop APUs; and the 4th AGESA release to do so. Version ComboAM5PI 1.1.0.1 contains a newer version of the system management unit (SMU) for "Phoenix" and "Phoenix 2," with SMU version 76.75.0, compared to version 76.72.0 with the older ComboAM5PI 1.1.0.0 that ASRock released in November.

The UEFI firmware updates by ASUS containing AGESA ComboAM5PI 1.1.0.1 are only being released for AMD B650/E and X670/E chipset motherboards, and only spanning the company's ROG, ROG Strix, TUF Gaming, and ProArt product lines, we haven't come across one for the Prime series, yet. It's important to reiterate here, that these are beta updates, and those with Ryzen 7000 "Raphael" processors don't stand to benefit from them, as the SMU for "Raphael" hasn't changed since ComboAM5PI 1.0.8.0. Check for the firmware updates in the Support section of the product pages of your motherboard on the ASUS website.

AMD Socket AM4 users are in for a treat, as the company plans two more processor models in the Ryzen 5000X3D series, according to chi11eddog, a reliable source with AMD leaks. Although based on the older "Zen 3" microarchitecture, these chips feature 3D Vertical Cache technology, which helps shore up their gaming performance to levels comparable at least to 12th Gen Intel Core "Alder Lake," giving Socket AM4 platform users a cost-effective upgrade path to prolong their gaming PC builds that could be as old as 5 years now. If you recall, AMD has formally extended "Zen 3" and 3D V-cache support to all Socket AM4 chipset generations, including AMD 300-series.

Among the two new processor models are the Ryzen 7 5700X3D, and the Ryzen 5 5500X3D. The 5700X3D is an 8-core/16-thread processor with 100 MB of total cache (that's 512 KB of L2 cache per core, plus 96 MB of L3 cache); while the Ryzen 5 5500X3D is a 6-core/12-thread chip with 99 MB of total cache. What sets the 5700X3D and 5500X3D apart from the 5800X3D and 5600X3D are lower clock speeds, and possibly, lower TDP. Both chips come with a base frequency of 3.00 GHz, compared to the 3.30 GHz of the 5600X3D and 3.40 GHz of the 5800X3D. The 5700X3D boosts up to 4.10 GHz compared to the 4.50 GHz of the 5800X3D; while the 5500X3D boosts up to 4.00 GHz when compared to 4.40 GHz of the 5600X3D. Both the 5800X3D and 5600X3D have their TDP rated at 105 W, so it's possible that AMD is using lower TDP and PPT values for the 5700X3D and 5500X3D. There's no word on when the two new chips are coming out, although AMD continues to release updates to the Socket AM4 AGESA microcode, with the latest version ComboAM4v2 1.2.0.B being released as recently as September 2023.

ASRock began rolling out UEFI firmware updates for its Socket AM5 motherboards that encapsulate AMD AGESA 1.1.0.0 ComboAM5PI microcode. This would be the second release of AGESA to support AMD's upcoming Ryzen 7000G "Phoenix" and "Phoenix 2" desktop APUs that the company reportedly plans to launch later this year. The AGESA 1.1.0.0 microcode comes with the SMU version 76.72.0 for "Phoenix" and "Phoenix 2," and continues with version 84.79.223 for "Raphael" and "Raphael-X" processors.

Unlike several past generations of Ryzen branded desktop APUs that only had 2-3 processor models in the retail channel, AMD is reportedly planning a slightly bigger lineup of APUs for the Socket AM5 platform, consisting of Ryzen 3, Ryzen 5, and possibly Ryzen 7 processor models, and their Ryzen PRO variants. The Ryzen 3 and Ryzen 5 models are expected to be based on the "Phoenix 2" silicon that has a combination of two "Zen 4" and four "Zen 4c" CPU cores and an iGPU with 4 compute units; while it is rumored that at least one Ryzen 5 and Ryzen 7 processor model will be built on "Phoenix," which has up to eight "Zen 4" cores, and a large iGPU with up to 12 compute units. So far we haven't seen reports of AMD bringing Ryzen AI to the desktop platform.