It will be an unexpectedly busy March for AMD, with the company launching three distinct products across its processor lines. The first one, which we reported earlier this morning, speaks of a late-March availability of the Ryzen 7 5800X3D 8-core/16-thread Socket AM4 processor, which AMD claims offers gaming performance on par with the Core i9-12900K "Alder Lake." It turns out, there are two more surprises.

Apparently the company is ready with Ryzen Threadripper PRO 5000 series workstation processors. Designed for Socket sWRX8 motherboards based on the only chipset option available—the AMD WRX80, these are the first Threadripper products based on the "Zen 3" microarchitecture, and feature 8-channel DDR4 memory, and up to 128 PCI-Express Gen4 lanes for workstation connectivity. Unfortunately, you can't buy one of these in the retail channel, as AMD is making them OEM-only. The first pre-built workstations will arrive as early as next week (March 8). At this point we still don't know if these chips use the newer "Zen 3" CCD with 3D Vertical Cache, or the conventional "Zen 3" CCD with 32 MB planar L3 cache.

Jonsbo today unveiled the HX4170D, a low-profile, top-flow CPU cooler with a Z-height (including fan) of 45.3 mm. Four 6 mm-thick copper heat pipes pass through an indirect-copper base, conveying heat through an aluminium fin-stack that's ventilated by a compact 12.5 mm-thick 92 mm fan. The fan spins between 600 to 3,300 RPM, pushing up to 38.85 CFM of air-flow, at up to 28.4 dBA noise level. The fan features a hydraulic bearing.

There are two variants of the HX4170D. The standard White variant has an all-white heatsink, and its fan features addressable-RGB illumination. The All-Black variant has an opaque fan impeller, and lacks illumination. The cooler measures 95 mm x 95 mm x 45.3 mm (WxDxH), weighing 290 g. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

GIGABYTE over the last week posted UEFI firmware updates for its Socket AM4 motherboards that add support for the upcoming AMD Ryzen 5800X3D processor. Released for motherboards across its AMD 400-series and 500-series lineups; the updates pack AGESA ComboPI V2 1.2.0.6 Patch-b microcode. Another key feature of these updates are that they re-introduce the "Max CPU Boost Clock Override" toggle, which appears when a Ryzen 5000 "Vermeer" processor is installed.

The Ryzen 7 5800X3D is an 8-core/16-thread processor based on the "Zen 3" microarchitecture, and packs the AMD 3D Vertical Cache (3DV Cache) technology, featuring 100 MB of Total Cache (AMD jargon for the sum of all L2 + L3 cache). The company claims gaming performance on par with the Core i9-12900K "Alder Lake" processor. The re-introduction of the Boost Frequency overrides signal that the company wants enthusiasts to go to town with overclocking, making this a possible response to the i9-12900KS gaming performance, at a lower price-point.

Thermaltake, the leading PC DIY premium brand for Case, Cooling, Gaming peripherals, and enthusiast memory solutions, expands both all-in-one liquid coolers and air coolers by introducing new-colored products: TOUGHLIQUID 240 ARGB Sync Turquoise/ Racing Green All-In-One Liquid Cooler and TOUGHAIR 510 Turquoise /Racing Green CPU Cooler.

Adding more colorful models to the AIO liquid cooler series, the TOUGHLIQUID 240 ARGB Sync Turquoise/Racing Green All-In-One Liquid Cooler is a TOUGHFAN 12 equipped all-in-one liquid cooler with a built-in controller and rotational cap with 6 LEDs, which can be controlled by 5V RGB compatible motherboards. Notably, the TOUGHFAN 12 is a superior fan with speeds of up to 2000RPM and only 22.3dba of noise signature, offering excellent silent cooling performance. The TOUGHLIQUID 240 ARGB Sync Turquoise/Racing Green All-In-One Liquid Cooler is the best selection for users who are looking for a functional and good-looking All-In-One Liquid Cooler.

JONSBO today unveiled the HP400S, an ultra-low-profile, top-flow CPU cooler. With its fan in place, the cooler has a height of just 36 mm. Despite its compact dimensions, its designers claim that it is capable of handling thermal loads of up to 140 W. Its design involves four 6 mm-thick copper heat pipes making direct contact with the CPU at the base, twisting into a dense aluminium fin-stack with 40 fins, which are ventilated by a 90 mm fan. This 15 mm-tall 90 mm fan can turn at speeds of up to 3,000 RPM, pushing up to 48.3 CFM of airflow, and 3.24 mm H₂O static pressure, with a maximum noise output of 33 dBA. The cooler measures 103 mm x 92 mm x 36 mm, with a weight of 380 g. Among the CPU socket types supported are LGA1700, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

The new Jonsbo HX6240 joins a breed of thick aluminium fin-stack tower-type coolers, which rely on a thicker aluminium fin-stack, over a split dual fin-stack design. With its single 120 mm fan in place, the cooler measures 105 mm x 120 mm x 162 mm (DxWxH), weighing 1.035 kg. Its design involves a nickel-plated copper base that has a mirror-finish, from which six 6 mm-thick copper heat pipes emerge, transferring heat to the aluminium fin-stack, which is ventilated by a 120 mm fan.

The surface-area for heat-dissipation mentioned by Jonsbo, is 8,900 cm². The fan included with the Jonsbo HX6240 turns at speeds of up to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 45.56 dBA noise output. It features a fluid-dynamic bearing. An interesting design element of this cooler is its detachable top-plate, which uses magnets to stay in place, and is hence tool-free. Removing the top-plate, and slighly pushing down the fan, lets you reduce the height of the cooler by 5 mm. The HX6240 comes in two trims—black and white. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Thermalright today introduced the AXP120-X67, a premium low-profile, top-flow CPU cooler, with a height of 67 mm with the fan in place. The cooler features a "C-type" aluminium fin-stack heatsink, in which heat is drawn from the C1100-grade nickel-plated copper base, and conveyed to the fin-stack via six 6 mm-thick heat-pipes of the same material. The fin-stack is arranged along the plane of the motherboard, and is ventilated by a 15 mm-thick 120 mm fan in a top-flow fashion.

The included 120 mm Thermalright TL-C12015 fan comes with 15 mm thickness, features a fluid-dynamic bearing, turns at speeds of up to 1,800 RPM, pushing up to 59 CFM of airflow, at a static pressure of 1.36 mm H₂O, and 26.1 dBA maximum noise output. The cooler measures 120 mm x 123.5 mm x 67 mm (WxDxH), weighing 490 g. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Cougar today introduced the Forza 50, a slim yet premium tower-type CPU cooler. Designed with a height of 155 mm, the cooler features a dense aluminium fin-stack to which heat is fed by four 6 mm-thick copper heat pipes that make direct contact with the CPU at the base. This is ventilated by a high-speed Cougar MHP-120 fan which features hydro-dynamic bearing, turns at speeds of up to 2,000 RPM, pushing up to 82.48 CFM of air-flow, at up to 31.68 dBA of noise output, and 4.24 mm H₂O static pressure. With its fan in place, the Cougar Forza 50 measures about 135 mm x 155 mm x 75 mm (WxHxD), weighing 792 g. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Thermalright today introduced the Macho MAXX, its latest single-tower type CPU coolers. The Macho line of tower-type coolers see Thermalright's designers choose a single large aluminium fin-stack over a "D-type" dual fin-stack approach. With its fan in place, the cooler measures 140 mm x 124 mm x 158 mm (WxDxH), weighing 780 g.

The design of the Macho MAXX involves a nickel-plated C1100-grade copper base, from which six 6 mm-thick copper heat pipes emerge, conveying heat across the large stack of 31 fins, which is ventilated by a 140 mm TL-D14 fan. This fan turns at speeds of up to 1,500 RPM, pushing up to 77.8 CFM of airflow, at up to 2.09 mm H₂O static pressure, and up to 25.6 dBA noise output. It features a fluid-dynamic bearing. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

ZALMAN today launched the Alpha line of all-in-one liquid CPU coolers. Available in three variants based on radiator size—Alpha 36 (360 mm x 120 mm), Alpha 28 (280 mm x 140 mm), and Alpha 24 (240 mm x 120 mm), each with sub-variants based on color—white and black; the main sell with the Alpha series is an innovation with the pump-block design.

ZALMAN designed the pump to feature three independent coolant flow paths for the inflow and outflow, which works to prevent pump overload. Its designers claim this also improves cooling performance by reducing residual fluid in the pump-chamber. The heat-dissipation base is made of copper, with a large micro-fin lattice, with 0.15 mm fins. The pump-block features an in-built fan-controller that manages the radiator fans based on cooling needs. The pump-block also features a dome-shaped ARGB-illuminated top that freely moves around, so you can orient the ZALMAN logo whichever way you want.

Thermalright today introduced the TA120 EX Mini White, one of the company's more compact tower-type CPU coolers. The cooler is designed with a height of 135 mm, even though it uses a 120 mm fan for ventilation. It features a conventional tower type design, in which five 6 mm-thick copper heat pipes make indirect contact with the CPU at the base (nickel-plated C1100-grade copper with mirror finish), pushing heat through the fin-stack, which is ventilated by a TL-D12 PRO-W fan. It features a fluid-dynamic bearing, and turns at speeds of up to 1,850 RPM, pushing up to 82 CFM of airflow, with 2.1 mm H₂O static pressure, and 29.6 dBA noise output. Among the CPU socket types supported include LGA1700, AM4, and LGA1200. The company didn't reveal pricing.

Today, ARCTIC, one of the leading manufacturers of low-noise PC coolers and components, presents the complete Freezer 35 air cooler family. In total, the series includes four versions of the single-tower CPU cooler for different requirements and areas of application, whose heatsinks are identical in construction. The compact dimensions ensure optimal RAM compatibility. Four offset direct-touch heatpipes ensure fast heat transfer into the heat sink, where the powerful 120 mm P-fan with dynamic PWM control efficiently dissipates the heat.

The improved mounting system of the Freezer 35 series with spring-loaded screws is noteworthy, achieving optimum contact pressure and even distribution of the thermal paste. The socket-specific Intel/AMD variants offer a reduction in superfluous mounting material and simplify the installation of the coolers. In addition to the standard Freezer i35/ Freezer A35 and the previously introduced A-RGB models Freezer i35 A-RGB and Freezer A35 A-RGB, RGB coolers for Intel (LGA 1700, 1200 and 115x) and AMD (AM4) are joining the market. The Freezer i35 RGB and Freezer A35 RGB feature 12 analog RGB LEDs in the fan hub. These can be controlled uniformly and are compatible with the common RGB standards of leading motherboard manufacturers, making a direct connection via a 12 V 4-pin RGB motherboard header possible.

Thermalright today rolled out the Peerless Assassin 120 SE White ARGB, a variant of the Peerless Assassin 120 cooler that the company originally launched in April 2021. For the most part, the new aluminium dual fin-stack cooler is identical to the original, spare for a few changes. As a "white" trim, the cooler is completely whitewashed in a matte white coating that covers the aluminium fins, the nickel-plated and copper heat pipes. The included TL-C12CW-S ARGB fans are a white variant of the TL-C12C-S, come with white frames, frosty impellers, and ARGB illumination. The original's fans were either all-black or all-white. Thermalright also did away with the decorative top-plate for the two fin-stacks, lowering the Z-height of the cooler to 155 mm, compared to 157 mm on the original. Lastly, the new cooler comes with out-of-the-box support for Intel Socket LGA1700, besides AM4 and LGA1200. The company didn't reveal pricing.

One of the most debated questions surrounding AMD's AM4 platform has been the lack of support for AMD's Ryzen 5000-series CPUs on the company's 300-series chipsets. Now, in an interview with Tom's Hardware, AMD's Corporate VP and GM of the Client Channel business, David McAfee, has thrown some cautious words into the hellish debate on platform fragmentation (some even say artificial segmentation). "It's definitely something we're working through," David said. "And it's not lost on us at all that this would be a good thing to do for the community, and we're trying to figure out how to make it happen." It's not a promise, but it seems that AMD is indeed contemplating solutions that would enable first-generation AM4 chipsets to support AMD's latest Ryzen 5000 series CPUs.

The problem has mostly to do with storage space: there are only so much available bits to be used in AM4 motherboards' 16 MB SPI ROM, the read-only memory bank that stores BIOS configurations and the necessary instructions for processor support. As AM4 is one of the longest-lived consumer platforms ever, the number of CPUs has ballooned, which has led to difficult decisions as to which CPUs to support. However, some more creative board partners have resorted to interesting techniques that allowed them to free up space in the SPI ROM that could be used to add support for otherwise incompatible CPUs, such as simplifying the BIOS GUI and falling back on more traditional text-based UIs. That and other practices resulted in a number of vendors adding support for AMD's Ryzen 5000 chips on the most entry-level A320 motherboards, which left consumers that had opted for the more technically accomplished X370 motherboards high and dry - barring a few lucky, ASRock-toting exceptions.

AMD is designing its upcoming Socket AM5 platform to be a "long-lived platform," not unlike AM4. CEO Dr Lisa Su, responding to a question on the longevity of AM5, by Paul Alcorn from Tom's Hardware, said that she's very happy with AM4 being the company's long-lived desktop socket; and while she doesn't have an exact number of years to share, one could expect AM5 to be a "long-lived platform" of a similar kind.

AMD Socket AM4 was debuted alongside the company's very first Ryzen processors, in March 2017. It has remained AMD's mainstream desktop socket for close to five years; and AMD continues to launch new products for the socket. Even in 2022, the company is expected to give the socket its swansong, with the Ryzen 5000X3D processors. AM4 was designed keeping in mind dual-channel DDR4 and up to 28 lanes of PCIe Gen 3 (later Gen 4) in mind. The change to Socket AM5 is driven by next-generation I/O, namely DDR5 memory (four 40-bit channels), and PCIe Gen 5.

The Ryzen 3000XT line of processors were the kind of stop-gap products that make people wary of stop-gap products, and AMD plans to remedy this. The new Ryzen 7 5800X3D is an upcoming Socket AM4 processor designed with the singular purpose of matching the Intel Core i9-12900K "Alder Lake" processor at gaming performance, so Intel doesn't have free reign until much later in the year, when AMD debuts "Zen 4" and AM5. It's also a means for AMD to signal consumers as well as investors to the sheer engineering depth the company enjoys these days.

The Ryzen 7 5800X3D isn't a a 5800X with an insane CPU overclock that throws efficiency out of the window. In fact, it has lower clocks! Instead, it leverages a new feature addition AMD did to its existing "Zen 3" microarchitecture, called 3D Vertical Cache. This is basically 64 MB of fast SRAM physically stacked on top of the CPU core die (CCD), giving it 96 MB of last-level cache. The company has already debuted this with its EPYC "Milan-X" enterprise processors, and the Ryzen 7 5800X3D would be the first client-segment product with this CCD.

AMD's next-generation Ryzen "Raphael" processor could launch only in the second half of 2022, confirms a leaked company slide scored by VideoCardz. The slide points to a Ryzen 5000X3D series product-stack update within the 1H-2022. These are Socket AM4 processors that leverage the company's updated "Zen 3(+)" CPU core die (CCD), which features 64 MB of 3D Vertical cache memory in addition to 32 MB of L3. AMD claims that 3DV Cache technology significantly improves performance akin to a generational update (anywhere between 5% to 25% depending on the application). The company is targeting "Spring" 2022 for launch, which would put this around early-Q2.

The "Raphael" Socket AM5 processor is sure to catch much of the attention, as it's the company's true next-gen desktop product. It heralds Socket AM5, a new LGA-based socket; and next-generation connectivity that includes DDR5 memory and PCI-Express Gen 5. The CCDs of these processors are built on the TSMC N5 (5 nm) silicon fabrication node, and are based on the "Zen 4" microarchitecture. The leaked slide shows the first grainy picture of Socket AM5, with a retention mechanism not unlike what we're used to, on the Intel platform. We're hearing rumors that AM5 will somehow manage cooler-compatibility with AM4 despite the radical redesign to the socket. An H2-2022 launch would put "Raphael" close to Intel's 13th Gen Core "Raptor Lake" launch, as team blue hopes to return to an annual IPC-uplift cadence, with up to 8 "Raptor Cove" P-cores, and 16 "Gracemont" E-cores.

Cougar today rolled out the Forza 85, a premium tower-type CPU cooler. The cooler features a conventional aluminium fin-stack tower-type design; but with a 85 mm-thick fin-stack, and high fin-density (50 fins). The heatsink is capped off with a brushed-aluminium top-plate. The design involves six 6 mm-thick nickel-plated copper heat pipes making indirect contact with the CPU at the mirror-finish nickel-plated copper base, conveying heat through the fin-stack, which is ventilated by a single 120 mm fan. The heatsink is capable of holding two fans (push-pull). It is offset slightly to one side, to create clearance for the memory slots.

The included Cougar Vortex MHP120 fan with this cooler turns at speeds ranging between 600 to 2,000 RPM, pushing up to 82.48 CFM of air-flow, at 4.24 mm H₂O air-pressure, and 31.68 dBA maximum noise output. The fan features hydro-dynamic bearing. Among the CPU socket types supported by the Cougar Forza 85, are LGA1700, AM4, and LGA1200. With the fan in place, the cooler measures 135 mm x 110 mm x 160 mm (WxDxH), and weighs 1.16 kg. The company didn't reveal pricing information.

EK, the premium liquid cooling gear manufacturer, is releasing a new AMD AM4 socket-based monoblock belonging to the Quantum Line of products, the EK-Quantum Momentum² ROG Strix X570-I Gaming D-RGB. This monoblock is engineered specifically for the ROG Strix X570-I Gaming ITX motherboard from ASUS. The addressable D-RGB LED in the monoblock is compatible with ASUS Aura Sync RGB control and offers a full lighting customization experience for every single diode at any given time. This monoblock is EK-Matrix7 compatible.

This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Ryzen AMD processors and the monoblock is compatible with the AM4 socketed ROG Strix X570-I Gaming motherboard. This monoblock uses the latest generation of EK Velocity² cooling engine to ensure the best possible CPU cooling while not reducing flow to other components. This water block directly cools the AM4 Ryzen CPU, VRM section, and importantly the X570 Chipset which tends to run quite hot. This eliminates the need for any fans on the motherboard.

Sapphire today entered the CPU cooling components market with the NITRO+ line of all-in-one, closed-loop, liquid CPU coolers. The series debuts with two variants based on radiator size, S360-A and S240-A (360 mm x 120 mm and 240 mm x 120 mm, respectively). The cooler uses 7th Gen Asetek pump-block technology, which integrates a thermal sensor within the pump-block, and onboard logic that accordingly adjusts pump speed. The block is studded with addressable RGB lighting, a 3D structure resembling a roll-cage, and a brushed aluminium accent.

The second Sapphire innovation with these coolers is the included set of fans for the aluminium radiator. Inspired from the fans found in Sapphire's NITRO+ series graphics cards, these double ball-bearing fans feature impellers with 13 densely packed blades that are webbed off at the edges, to guide all their airflow axially. ARGB LEDs are studded in the impeller hubs. The pump turns at speeds ranging between 800 to 2,800 RPM, while the fans turn between 450 to 2,500 RPM. Among the CPU socket types supported are LGA1700, AM4, and LGA1200. The company didn't reveal pricing.

After a very long reign of the most popular water block on the market, the EK-Quantum Velocity, it's time to make the Quantum leap yet again. The next generation EK Quantum Line water block - the EK-Quantum Velocity² enters the stage in full D-RGB glory. The water block features EK-Matrix7 compatibility, a standard where increments of 7 mm manage the height of products and the distance between ports. This product uses a socket-specific cooling engine to ensure the best performance and optimal flow with low restrictions on every platform. Three years after the original Velocity water block launch, EK is officially launching the Velocity² AM4, which is engineered for the popular AMD AM4 socket and Ryzen series desktop processors. Other Velocity² CPU water blocks will also follow shortly, tuned specifically for each CPU socket and IHS geometry on the market.

This new water block kept the name "Velocity" because it retained the ability to be responsive and agile in the world of liquid cooling. Embedded in the Velocity² is a next-generation EK CPU water block cooling engine that is socket-specific. A combination of mounting pressure and cold plate geometry, tailored for the IHS and die layout of AMD AM4 socket processors, is used to achieve low hydraulic flow restriction and high performance. Thе lathe-turned cold plate is made with precision to cover the IHS effectively and put optimal pressure on the die area. Flow is also being directed into areas that need it most.

Raijintek today introduced the Eleos 12 RBW, a tower-type CPU cooler designed with a large base that's optimized for Intel Socket LGA1700. Measuring 127 mm x 75 mm x 164 mm (WxDxH), and weighing 610 g, the cooler features a conventional tower-type design. Six 6 mm-thick nickel-plated copper heat-pipes make direct contact with the processor at the base, conveying heat through an aluminium fin-stack that's ventilated by a single 120 mm fan.

The included 120 mm fan takes in 4-pin PWM for its main function, and 3-pin addressable RGB for lighting. It features a hydraulic bearing that's rated for 40,000 hours. The fan spins at speeds between 800 to 1,800 RPM, pushing up to 75 CFM of airflow, and 2.3 mm H₂O static pressure, and up to 28 dBA maximum noise. Lighting elements include ARGB LED studded in the fan-hub, as well as the top-plate of the heatsink. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

AeroCool today introduced the Raven 4 ARGB, a tower-type CPU cooler that relies on a custom design 120 mm fan. The cooler uses a typical aluminium fin-stack heatsink design. Four 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. This is ventilated by the 120 mm fan, with a unique frame design that guides airflow such that it envelopes the fin-stack along all sides.

The fan takes in a 4-pin PWM connection for its main function, and 3-pin ARGB for its lighting. The fan turns at speeds ranging between 900 to 1,800 RPM, pushing 24.1 to 58 CFM of airflow, with a noise output ranging between 18 to 27 dBA. The fan uses a hydraulic bearing rated for 60,000 hours. The cooler measures 125 mm x 80 mm x 135 mm (WxDxH). Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

EVGA today rolled out the X570 FTW WiFi, its second AMD Socket AM4 motherboard. While the X570 DARK is aimed at professional overclockers looking to squeeze the most out of Ryzen 5000 series processors, the X570 FTW is aimed at a slightly broader audience—enthusiasts. The board comes with four DDR4 DIMM slots to illustrate this, compared to two slots (1 DIMM per channel) on the X570 DARK. The board pulls power from a combination of 24-pin ATX, and 8+4 pin EPS. It features a 15-phase CPU VRM that's cooled by aluminium fin-stack heatsinks. The Socket AM4 processor is wired to four DDR4 DIMM slots, two PCI-Express 4.0 x16 (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring.

Besides this CPU-attached M.2 NVMe Gen 4 slot, two additional Gen 4 slots are put out by the X570 chipset, cooled by a large aluminium monoblock heatsink. The X570 chipset itself is cooled fanless, which means it's likely the X570S variant. Eight SATA 6 Gbps ports make for the rest of the storage connectivity. USB connectivity includes three 10 Gbps USB 3.1 Gen2 ports at the rear panel, two 5 Gbps Gen1 ports, and two additional Gen1 ports through internal headers. The onboard audio solution uses a Realtek ALC1220 CODEC with SV3H615 headphones amp. Networking connectivity includes Intel-sourced WiFi 6 and 1 GbE. Available to EVGA Elite members, the EVGA X570 FTW WiFi is priced at USD $499, about $200 cheaper than the X570 DARK.