Thermalright today introduced the TA120 EX Mini White, one of the company's more compact tower-type CPU coolers. The cooler is designed with a height of 135 mm, even though it uses a 120 mm fan for ventilation. It features a conventional tower type design, in which five 6 mm-thick copper heat pipes make indirect contact with the CPU at the base (nickel-plated C1100-grade copper with mirror finish), pushing heat through the fin-stack, which is ventilated by a TL-D12 PRO-W fan. It features a fluid-dynamic bearing, and turns at speeds of up to 1,850 RPM, pushing up to 82 CFM of airflow, with 2.1 mm H₂O static pressure, and 29.6 dBA noise output. Among the CPU socket types supported include LGA1700, AM4, and LGA1200. The company didn't reveal pricing.

Today, ARCTIC, one of the leading manufacturers of low-noise PC coolers and components, presents the complete Freezer 35 air cooler family. In total, the series includes four versions of the single-tower CPU cooler for different requirements and areas of application, whose heatsinks are identical in construction. The compact dimensions ensure optimal RAM compatibility. Four offset direct-touch heatpipes ensure fast heat transfer into the heat sink, where the powerful 120 mm P-fan with dynamic PWM control efficiently dissipates the heat.

The improved mounting system of the Freezer 35 series with spring-loaded screws is noteworthy, achieving optimum contact pressure and even distribution of the thermal paste. The socket-specific Intel/AMD variants offer a reduction in superfluous mounting material and simplify the installation of the coolers. In addition to the standard Freezer i35/ Freezer A35 and the previously introduced A-RGB models Freezer i35 A-RGB and Freezer A35 A-RGB, RGB coolers for Intel (LGA 1700, 1200 and 115x) and AMD (AM4) are joining the market. The Freezer i35 RGB and Freezer A35 RGB feature 12 analog RGB LEDs in the fan hub. These can be controlled uniformly and are compatible with the common RGB standards of leading motherboard manufacturers, making a direct connection via a 12 V 4-pin RGB motherboard header possible.

Thermalright today rolled out the Peerless Assassin 120 SE White ARGB, a variant of the Peerless Assassin 120 cooler that the company originally launched in April 2021. For the most part, the new aluminium dual fin-stack cooler is identical to the original, spare for a few changes. As a "white" trim, the cooler is completely whitewashed in a matte white coating that covers the aluminium fins, the nickel-plated and copper heat pipes. The included TL-C12CW-S ARGB fans are a white variant of the TL-C12C-S, come with white frames, frosty impellers, and ARGB illumination. The original's fans were either all-black or all-white. Thermalright also did away with the decorative top-plate for the two fin-stacks, lowering the Z-height of the cooler to 155 mm, compared to 157 mm on the original. Lastly, the new cooler comes with out-of-the-box support for Intel Socket LGA1700, besides AM4 and LGA1200. The company didn't reveal pricing.

One of the most debated questions surrounding AMD's AM4 platform has been the lack of support for AMD's Ryzen 5000-series CPUs on the company's 300-series chipsets. Now, in an interview with Tom's Hardware, AMD's Corporate VP and GM of the Client Channel business, David McAfee, has thrown some cautious words into the hellish debate on platform fragmentation (some even say artificial segmentation). "It's definitely something we're working through," David said. "And it's not lost on us at all that this would be a good thing to do for the community, and we're trying to figure out how to make it happen." It's not a promise, but it seems that AMD is indeed contemplating solutions that would enable first-generation AM4 chipsets to support AMD's latest Ryzen 5000 series CPUs.

The problem has mostly to do with storage space: there are only so much available bits to be used in AM4 motherboards' 16 MB SPI ROM, the read-only memory bank that stores BIOS configurations and the necessary instructions for processor support. As AM4 is one of the longest-lived consumer platforms ever, the number of CPUs has ballooned, which has led to difficult decisions as to which CPUs to support. However, some more creative board partners have resorted to interesting techniques that allowed them to free up space in the SPI ROM that could be used to add support for otherwise incompatible CPUs, such as simplifying the BIOS GUI and falling back on more traditional text-based UIs. That and other practices resulted in a number of vendors adding support for AMD's Ryzen 5000 chips on the most entry-level A320 motherboards, which left consumers that had opted for the more technically accomplished X370 motherboards high and dry - barring a few lucky, ASRock-toting exceptions.

AMD is designing its upcoming Socket AM5 platform to be a "long-lived platform," not unlike AM4. CEO Dr Lisa Su, responding to a question on the longevity of AM5, by Paul Alcorn from Tom's Hardware, said that she's very happy with AM4 being the company's long-lived desktop socket; and while she doesn't have an exact number of years to share, one could expect AM5 to be a "long-lived platform" of a similar kind.

AMD Socket AM4 was debuted alongside the company's very first Ryzen processors, in March 2017. It has remained AMD's mainstream desktop socket for close to five years; and AMD continues to launch new products for the socket. Even in 2022, the company is expected to give the socket its swansong, with the Ryzen 5000X3D processors. AM4 was designed keeping in mind dual-channel DDR4 and up to 28 lanes of PCIe Gen 3 (later Gen 4) in mind. The change to Socket AM5 is driven by next-generation I/O, namely DDR5 memory (four 40-bit channels), and PCIe Gen 5.

The Ryzen 3000XT line of processors were the kind of stop-gap products that make people wary of stop-gap products, and AMD plans to remedy this. The new Ryzen 7 5800X3D is an upcoming Socket AM4 processor designed with the singular purpose of matching the Intel Core i9-12900K "Alder Lake" processor at gaming performance, so Intel doesn't have free reign until much later in the year, when AMD debuts "Zen 4" and AM5. It's also a means for AMD to signal consumers as well as investors to the sheer engineering depth the company enjoys these days.

The Ryzen 7 5800X3D isn't a a 5800X with an insane CPU overclock that throws efficiency out of the window. In fact, it has lower clocks! Instead, it leverages a new feature addition AMD did to its existing "Zen 3" microarchitecture, called 3D Vertical Cache. This is basically 64 MB of fast SRAM physically stacked on top of the CPU core die (CCD), giving it 96 MB of last-level cache. The company has already debuted this with its EPYC "Milan-X" enterprise processors, and the Ryzen 7 5800X3D would be the first client-segment product with this CCD.

AMD's next-generation Ryzen "Raphael" processor could launch only in the second half of 2022, confirms a leaked company slide scored by VideoCardz. The slide points to a Ryzen 5000X3D series product-stack update within the 1H-2022. These are Socket AM4 processors that leverage the company's updated "Zen 3(+)" CPU core die (CCD), which features 64 MB of 3D Vertical cache memory in addition to 32 MB of L3. AMD claims that 3DV Cache technology significantly improves performance akin to a generational update (anywhere between 5% to 25% depending on the application). The company is targeting "Spring" 2022 for launch, which would put this around early-Q2.

The "Raphael" Socket AM5 processor is sure to catch much of the attention, as it's the company's true next-gen desktop product. It heralds Socket AM5, a new LGA-based socket; and next-generation connectivity that includes DDR5 memory and PCI-Express Gen 5. The CCDs of these processors are built on the TSMC N5 (5 nm) silicon fabrication node, and are based on the "Zen 4" microarchitecture. The leaked slide shows the first grainy picture of Socket AM5, with a retention mechanism not unlike what we're used to, on the Intel platform. We're hearing rumors that AM5 will somehow manage cooler-compatibility with AM4 despite the radical redesign to the socket. An H2-2022 launch would put "Raphael" close to Intel's 13th Gen Core "Raptor Lake" launch, as team blue hopes to return to an annual IPC-uplift cadence, with up to 8 "Raptor Cove" P-cores, and 16 "Gracemont" E-cores.

Cougar today rolled out the Forza 85, a premium tower-type CPU cooler. The cooler features a conventional aluminium fin-stack tower-type design; but with a 85 mm-thick fin-stack, and high fin-density (50 fins). The heatsink is capped off with a brushed-aluminium top-plate. The design involves six 6 mm-thick nickel-plated copper heat pipes making indirect contact with the CPU at the mirror-finish nickel-plated copper base, conveying heat through the fin-stack, which is ventilated by a single 120 mm fan. The heatsink is capable of holding two fans (push-pull). It is offset slightly to one side, to create clearance for the memory slots.

The included Cougar Vortex MHP120 fan with this cooler turns at speeds ranging between 600 to 2,000 RPM, pushing up to 82.48 CFM of air-flow, at 4.24 mm H₂O air-pressure, and 31.68 dBA maximum noise output. The fan features hydro-dynamic bearing. Among the CPU socket types supported by the Cougar Forza 85, are LGA1700, AM4, and LGA1200. With the fan in place, the cooler measures 135 mm x 110 mm x 160 mm (WxDxH), and weighs 1.16 kg. The company didn't reveal pricing information.

EK, the premium liquid cooling gear manufacturer, is releasing a new AMD AM4 socket-based monoblock belonging to the Quantum Line of products, the EK-Quantum Momentum² ROG Strix X570-I Gaming D-RGB. This monoblock is engineered specifically for the ROG Strix X570-I Gaming ITX motherboard from ASUS. The addressable D-RGB LED in the monoblock is compatible with ASUS Aura Sync RGB control and offers a full lighting customization experience for every single diode at any given time. This monoblock is EK-Matrix7 compatible.

This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Ryzen AMD processors and the monoblock is compatible with the AM4 socketed ROG Strix X570-I Gaming motherboard. This monoblock uses the latest generation of EK Velocity² cooling engine to ensure the best possible CPU cooling while not reducing flow to other components. This water block directly cools the AM4 Ryzen CPU, VRM section, and importantly the X570 Chipset which tends to run quite hot. This eliminates the need for any fans on the motherboard.

Sapphire today entered the CPU cooling components market with the NITRO+ line of all-in-one, closed-loop, liquid CPU coolers. The series debuts with two variants based on radiator size, S360-A and S240-A (360 mm x 120 mm and 240 mm x 120 mm, respectively). The cooler uses 7th Gen Asetek pump-block technology, which integrates a thermal sensor within the pump-block, and onboard logic that accordingly adjusts pump speed. The block is studded with addressable RGB lighting, a 3D structure resembling a roll-cage, and a brushed aluminium accent.

The second Sapphire innovation with these coolers is the included set of fans for the aluminium radiator. Inspired from the fans found in Sapphire's NITRO+ series graphics cards, these double ball-bearing fans feature impellers with 13 densely packed blades that are webbed off at the edges, to guide all their airflow axially. ARGB LEDs are studded in the impeller hubs. The pump turns at speeds ranging between 800 to 2,800 RPM, while the fans turn between 450 to 2,500 RPM. Among the CPU socket types supported are LGA1700, AM4, and LGA1200. The company didn't reveal pricing.

After a very long reign of the most popular water block on the market, the EK-Quantum Velocity, it's time to make the Quantum leap yet again. The next generation EK Quantum Line water block - the EK-Quantum Velocity² enters the stage in full D-RGB glory. The water block features EK-Matrix7 compatibility, a standard where increments of 7 mm manage the height of products and the distance between ports. This product uses a socket-specific cooling engine to ensure the best performance and optimal flow with low restrictions on every platform. Three years after the original Velocity water block launch, EK is officially launching the Velocity² AM4, which is engineered for the popular AMD AM4 socket and Ryzen series desktop processors. Other Velocity² CPU water blocks will also follow shortly, tuned specifically for each CPU socket and IHS geometry on the market.

This new water block kept the name "Velocity" because it retained the ability to be responsive and agile in the world of liquid cooling. Embedded in the Velocity² is a next-generation EK CPU water block cooling engine that is socket-specific. A combination of mounting pressure and cold plate geometry, tailored for the IHS and die layout of AMD AM4 socket processors, is used to achieve low hydraulic flow restriction and high performance. Thе lathe-turned cold plate is made with precision to cover the IHS effectively and put optimal pressure on the die area. Flow is also being directed into areas that need it most.

Raijintek today introduced the Eleos 12 RBW, a tower-type CPU cooler designed with a large base that's optimized for Intel Socket LGA1700. Measuring 127 mm x 75 mm x 164 mm (WxDxH), and weighing 610 g, the cooler features a conventional tower-type design. Six 6 mm-thick nickel-plated copper heat-pipes make direct contact with the processor at the base, conveying heat through an aluminium fin-stack that's ventilated by a single 120 mm fan.

The included 120 mm fan takes in 4-pin PWM for its main function, and 3-pin addressable RGB for lighting. It features a hydraulic bearing that's rated for 40,000 hours. The fan spins at speeds between 800 to 1,800 RPM, pushing up to 75 CFM of airflow, and 2.3 mm H₂O static pressure, and up to 28 dBA maximum noise. Lighting elements include ARGB LED studded in the fan-hub, as well as the top-plate of the heatsink. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

AeroCool today introduced the Raven 4 ARGB, a tower-type CPU cooler that relies on a custom design 120 mm fan. The cooler uses a typical aluminium fin-stack heatsink design. Four 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. This is ventilated by the 120 mm fan, with a unique frame design that guides airflow such that it envelopes the fin-stack along all sides.

The fan takes in a 4-pin PWM connection for its main function, and 3-pin ARGB for its lighting. The fan turns at speeds ranging between 900 to 1,800 RPM, pushing 24.1 to 58 CFM of airflow, with a noise output ranging between 18 to 27 dBA. The fan uses a hydraulic bearing rated for 60,000 hours. The cooler measures 125 mm x 80 mm x 135 mm (WxDxH). Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

EVGA today rolled out the X570 FTW WiFi, its second AMD Socket AM4 motherboard. While the X570 DARK is aimed at professional overclockers looking to squeeze the most out of Ryzen 5000 series processors, the X570 FTW is aimed at a slightly broader audience—enthusiasts. The board comes with four DDR4 DIMM slots to illustrate this, compared to two slots (1 DIMM per channel) on the X570 DARK. The board pulls power from a combination of 24-pin ATX, and 8+4 pin EPS. It features a 15-phase CPU VRM that's cooled by aluminium fin-stack heatsinks. The Socket AM4 processor is wired to four DDR4 DIMM slots, two PCI-Express 4.0 x16 (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring.

Besides this CPU-attached M.2 NVMe Gen 4 slot, two additional Gen 4 slots are put out by the X570 chipset, cooled by a large aluminium monoblock heatsink. The X570 chipset itself is cooled fanless, which means it's likely the X570S variant. Eight SATA 6 Gbps ports make for the rest of the storage connectivity. USB connectivity includes three 10 Gbps USB 3.1 Gen2 ports at the rear panel, two 5 Gbps Gen1 ports, and two additional Gen1 ports through internal headers. The onboard audio solution uses a Realtek ALC1220 CODEC with SV3H615 headphones amp. Networking connectivity includes Intel-sourced WiFi 6 and 1 GbE. Available to EVGA Elite members, the EVGA X570 FTW WiFi is priced at USD $499, about $200 cheaper than the X570 DARK.

GIGABYTE Technology,an industry leader in high-performance servers and workstations, today announced two new W-series workstations, W771-Z00 for AMD Ryzen Threadripper PRO processors and W331-Z00 for AMD Ryzen processors, as well as a WRX80 chipset motherboard, MC62-G40, and a TRX40 chipset rack server, G182-C20. Remote work and a high level of compute for 3D design or engineering are driving factors for these new professional products.

Today's engineers and power users are focused on high demanding workloads and require a powerful workstation to enable them to work effectively and efficiently. The W771-Z00 coupled with a top-tier processor from the AMD Ryzen Threadripper PRO family, such as the 3995WX with 64 cores 128 threads, make this the most powerful workstation to date. The motherboard for this workstation is the MC62-G40. Based around the AMD WRX80 chipset, the W771-Z00 shares high-end features that are typically only found in servers.

Tech innovator GELID Solutions unveils the latest high-performance CPU Cooler for AMD and Intel CPU. The BlackFrore is a product of GELID Solutions GAMER product line. The BlackFrore comes with the advanced heatsink that carries 2 power heat pipes and features the Heatpipe Direct Contact (HDC) Technology to provide perfect thermal contact and facilitate heat transfer between CPU and the heat pipes. Additionally, the BlackFrore introduces the High-Class Black Electrophoretic Coating to guarantee top-grade surface finishing of the heatsink, create an exceptional look and feel and improve durability.

An improved 92 mm fan with the Smart PWM (Pulse Width Module) Control and airflow-optimized impeller compliments the heatsink. The newly designed impeller provides efficient airflow distribution over the heatsink and the intelligent PWM Curve technique constantly keeps the fans silent but accelerates speed whenever additional cooling is needed. The high-performance GC-Pro thermal compound and the all-in-one mounting kit for multiple AMD CPU sockets AM2, AM2+, AM3, AM3+, AM4, FM1, FM2 and for Intel CPU LGA 775, 1366, 011, 1155, 1156, 1150, 1151, 1200 sockets are all included too.

DeepCool introduced the AK620, a premium dual fin-stack tower-type CPU cooler. The cooler scrapes your side-panel at 160 mm height, and tips the scales at 1.45 kg. A nickel-plated copper base pulls heat from your processor, which is passed on to two aluminium fin-stacks at the ends of six 6 mm-thick heat-pipes. Two 120 mm fluid-dynamic bearing fans come included with the cooler, they each turn at speeds of 500 to 1,850 RPM, pushing 68.99 CFM of airflow, with a static pressure of 2.19 mm H₂O. The fin-stacks are recessed at the bottom to make space for your memory modules or VRM heatsinks. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The upcoming LGA1700 doesn't find mention in DeepCool's specs. The company didn't reveal pricing.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announced product support for the latest AMD Ryzen 5000G series Cezanne processors. AMD's next-generation Ryzen 5000G series desktop processors codenamed "Cezanne" are ready to invade the global market. The new 5000G series processors are based on Zen 3 architecture, AMD's Ryzen 5000 series of desktop APUs based on the Zen 3 CPU and Vega GPU microarchitectures succeeding the Ryzen 4000 "Renoir" series.

Extreme performance enabled for personal computing with up to 8 cores fueled by the world's most advanced 7 nm processor core technology, the AMD Ryzen 5000 G-series desktop processors with Radeon graphics deliver ultra-fast responsiveness and multi-threaded performance for any use case.

ID-COOLING today announced SE-226-XT ARGB and SE-226-XT BLACK CPU air coolers. Both coolers include the same black heatsink with 6 heatpipes and copper base. 120 mm ARGB fan and Black fan are used on ARGB / BLACK version respectively. SE-226-XT Series is designed to cool those processors with a TDP up to 250 W. Both models are built with a solid heatsink which is specially design with 100% RAM compatibility. Black coating is applied for a stealthy looking.

For SE-226-XT ARGB, the included 120x120x25mm fan is built with 2Ball bearing and has 8pcs rubber dampeners on all corners of both sides, running at 800 to 2000rpm with PWM support while pushing 56.6CFM air at maximum speed, noise level measured 16.2 to 31.5dB (A). For SE-226-XT BLACK, the included standard 120x120x25mm fan has 8pcs rubber dampeners on all corners of both sides, running at 700 to 1800rpm with PWM support while pushing 76.16CFM air at maximum speed, noise level measured 15.2 to 35.2dB (A).

EK, the European manufacturer of premium liquid cooling gear, and MSI, a world-leading gaming brand, have partnered up yet again, to launch an X570S-based motherboard that comes with a pre-installed Quantum design monoblock that offers unparalleled cooling for the VRM section and AMD Ryzen series CPUs. MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to apply EK's technology and know-how to bring you the coolest AMD gaming motherboard. The EK-Quantum MSI MPG X570S CARBON EK X is a response to the market's desire for an out-of-the-box water-cooled motherboard for Ryzen CPUs. It allows maximum performance without the noisy environment that air coolers offer, providing countless hours of uninterrupted gameplay. As an added benefit, it looks as great as it performs.

The EK-Quantum monoblock design aesthetically blends in with the motherboard, giving it a unique look that sets it apart from the rest. The sleek, stealthy look accompanied by the carbon fiber pattern is there to remind all hard-core gamers that pushing the limit is what gaming is all about. A powerful 14+2 Duet Rail Power System with 75 A power stages provides stable power to the Ryzen CPU. The massive power delivery system allows for high overclocks and, by proxy, a great boost in performance. The only downside is increased heat generation. This is where the EK monoblock with an integrated flow indicator kicks in - to cool down not just the CPU, but the power delivery system as well.

AMD's upcoming desktop processor Socket AM5 could retain cooler compatibility with the outgoing Socket AM4, according to a leaked technical document related to the socket. If true, this would be the first time that two fundamentally different sockets—one a PGA, and the other an LGA—are designed for cooler cross-compatibility. The document reveals that with a processor installed, Socket AM5 would align with the retention clip and mount-hole spacing identical to that of Socket AM4. This could mean you can carry over your expensive liquid-cooling setup or pricey AIO CLC over from your current Ryzen desktop build.

New renders of Socket AM5 also reveal that the socket locking mechanism is mostly similar to that of Intel sockets, such as the LGA1200, and isn't a downscale of TR4/sTRX4 as was feared in social media. The top retention brace swings along a hinge, and held in place by pressure from a lever that locks into a hook. Depending on the model, AMD Socket AM5 processors could come in TDP values of 45 W, 65 W, 95 W, 105 W, 125 W, and 170 W.

ASUS today introduced a trio of new motherboards based on AMD's X570 chipset, which join the latest ROG Crosshair VIII Extreme as the latest offerings from ASUS on the X570 platform.

The ROG Strix X570-E Gaming WiFi II pairs the latest tech with essential ROG DNA
Elite gamers and enthusiasts who prefer the finer things in life will want to take a look at the new ROG Strix X570-E Gaming WiFi II. Building on the legacy of the ROG Strix X570-E Gaming WiFi before it, this fresh new board distills high-end components, smart software, and passive chipset cooling into one luxurious board. This revision of the X570-E makes a splash with revised ROG graphics running across the I/O shroud and the chipset heatsink. The CPU VRM also gets a boost to a 12+4-phase design, fueled by ProCool II auxiliary connectors. No matter your choice of Ryzen CPU, the new Strix-E will handle it with aplomb.

Senior Technology Fellow Yuzo Fukuzaki shed light on the elusive new CPU technology AMD unveiled at its Computex 2021 keynote, 3D Vertical Cache (3DV Cache). The company had then detailed it as an additional 64 MB last-level cache stacked on top of a CCD (CPU core complex die), which significantly improves performance, including a claimed 15% average gain in gaming performance, which accounts for a generational performance gain over "Zen 3." The prototype AMD unveiled in its keynote was based on a Socket AM4 processor with "Zen 3" CCDs that have the 3DV Cache components in place. With two such CCDs, a 16-core processor would end up with 192 MB of L3 cache.

Yuzo Fukuzaki's theory sheds light on the most plausible position of 3DV Cache in the processor's cache hierarchy. Apparently, it expands the CCD's L3 cache, and doesn't serve as an "L4" victim cache to the L3. This way, the cache setup remains transparent to the OS, which sees it as a contiguous 96 MB block of L3 cache (per CCD). The 3DV Cache die is an SRAM chip fabricated on the same 7 nm process as the "Zen 3" CCD. It measures 6 mm x 6 mm (36 mm²), and is located above the region of the CCD that typically has the 32 MB L3 SRAM. Fukuzaki estimates that roughly 23,000 TSVs (through-silicon vias), each about 17 µm in size, connect the 3DV Cache die to the main CCD.

The leading global motherboard, graphics card, and small form factor PC manufacturer, ASRock, has released the latest BIOS that support AMD Ryzen 5000 G-Series Desktop Processors with Radeon Graphics and AMD Ryzen 5000 Series Desktop Processors with PRO Technologies.

AMD Ryzen 5000 G-Series Desktop Processors with Radeon Graphics are the newest generation processors come with industry-leading 7nm technology, elevating processing performance to the next level. And now, ASRock 500-Series, B450 AMD Ryzen motherboards and X300 Mini PC are able to support both of them by updating the latest BIOS.