GIGABYTE Technology,an industry leader in high-performance servers and workstations, today announced two new W-series workstations, W771-Z00 for AMD Ryzen Threadripper PRO processors and W331-Z00 for AMD Ryzen processors, as well as a WRX80 chipset motherboard, MC62-G40, and a TRX40 chipset rack server, G182-C20. Remote work and a high level of compute for 3D design or engineering are driving factors for these new professional products.

Today's engineers and power users are focused on high demanding workloads and require a powerful workstation to enable them to work effectively and efficiently. The W771-Z00 coupled with a top-tier processor from the AMD Ryzen Threadripper PRO family, such as the 3995WX with 64 cores 128 threads, make this the most powerful workstation to date. The motherboard for this workstation is the MC62-G40. Based around the AMD WRX80 chipset, the W771-Z00 shares high-end features that are typically only found in servers.

Tech innovator GELID Solutions unveils the latest high-performance CPU Cooler for AMD and Intel CPU. The BlackFrore is a product of GELID Solutions GAMER product line. The BlackFrore comes with the advanced heatsink that carries 2 power heat pipes and features the Heatpipe Direct Contact (HDC) Technology to provide perfect thermal contact and facilitate heat transfer between CPU and the heat pipes. Additionally, the BlackFrore introduces the High-Class Black Electrophoretic Coating to guarantee top-grade surface finishing of the heatsink, create an exceptional look and feel and improve durability.

An improved 92 mm fan with the Smart PWM (Pulse Width Module) Control and airflow-optimized impeller compliments the heatsink. The newly designed impeller provides efficient airflow distribution over the heatsink and the intelligent PWM Curve technique constantly keeps the fans silent but accelerates speed whenever additional cooling is needed. The high-performance GC-Pro thermal compound and the all-in-one mounting kit for multiple AMD CPU sockets AM2, AM2+, AM3, AM3+, AM4, FM1, FM2 and for Intel CPU LGA 775, 1366, 011, 1155, 1156, 1150, 1151, 1200 sockets are all included too.

DeepCool introduced the AK620, a premium dual fin-stack tower-type CPU cooler. The cooler scrapes your side-panel at 160 mm height, and tips the scales at 1.45 kg. A nickel-plated copper base pulls heat from your processor, which is passed on to two aluminium fin-stacks at the ends of six 6 mm-thick heat-pipes. Two 120 mm fluid-dynamic bearing fans come included with the cooler, they each turn at speeds of 500 to 1,850 RPM, pushing 68.99 CFM of airflow, with a static pressure of 2.19 mm H₂O. The fin-stacks are recessed at the bottom to make space for your memory modules or VRM heatsinks. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The upcoming LGA1700 doesn't find mention in DeepCool's specs. The company didn't reveal pricing.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announced product support for the latest AMD Ryzen 5000G series Cezanne processors. AMD's next-generation Ryzen 5000G series desktop processors codenamed "Cezanne" are ready to invade the global market. The new 5000G series processors are based on Zen 3 architecture, AMD's Ryzen 5000 series of desktop APUs based on the Zen 3 CPU and Vega GPU microarchitectures succeeding the Ryzen 4000 "Renoir" series.

Extreme performance enabled for personal computing with up to 8 cores fueled by the world's most advanced 7 nm processor core technology, the AMD Ryzen 5000 G-series desktop processors with Radeon graphics deliver ultra-fast responsiveness and multi-threaded performance for any use case.

ID-COOLING today announced SE-226-XT ARGB and SE-226-XT BLACK CPU air coolers. Both coolers include the same black heatsink with 6 heatpipes and copper base. 120 mm ARGB fan and Black fan are used on ARGB / BLACK version respectively. SE-226-XT Series is designed to cool those processors with a TDP up to 250 W. Both models are built with a solid heatsink which is specially design with 100% RAM compatibility. Black coating is applied for a stealthy looking.

For SE-226-XT ARGB, the included 120x120x25mm fan is built with 2Ball bearing and has 8pcs rubber dampeners on all corners of both sides, running at 800 to 2000rpm with PWM support while pushing 56.6CFM air at maximum speed, noise level measured 16.2 to 31.5dB (A). For SE-226-XT BLACK, the included standard 120x120x25mm fan has 8pcs rubber dampeners on all corners of both sides, running at 700 to 1800rpm with PWM support while pushing 76.16CFM air at maximum speed, noise level measured 15.2 to 35.2dB (A).

EK, the European manufacturer of premium liquid cooling gear, and MSI, a world-leading gaming brand, have partnered up yet again, to launch an X570S-based motherboard that comes with a pre-installed Quantum design monoblock that offers unparalleled cooling for the VRM section and AMD Ryzen series CPUs. MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to apply EK's technology and know-how to bring you the coolest AMD gaming motherboard. The EK-Quantum MSI MPG X570S CARBON EK X is a response to the market's desire for an out-of-the-box water-cooled motherboard for Ryzen CPUs. It allows maximum performance without the noisy environment that air coolers offer, providing countless hours of uninterrupted gameplay. As an added benefit, it looks as great as it performs.

The EK-Quantum monoblock design aesthetically blends in with the motherboard, giving it a unique look that sets it apart from the rest. The sleek, stealthy look accompanied by the carbon fiber pattern is there to remind all hard-core gamers that pushing the limit is what gaming is all about. A powerful 14+2 Duet Rail Power System with 75 A power stages provides stable power to the Ryzen CPU. The massive power delivery system allows for high overclocks and, by proxy, a great boost in performance. The only downside is increased heat generation. This is where the EK monoblock with an integrated flow indicator kicks in - to cool down not just the CPU, but the power delivery system as well.

AMD's upcoming desktop processor Socket AM5 could retain cooler compatibility with the outgoing Socket AM4, according to a leaked technical document related to the socket. If true, this would be the first time that two fundamentally different sockets—one a PGA, and the other an LGA—are designed for cooler cross-compatibility. The document reveals that with a processor installed, Socket AM5 would align with the retention clip and mount-hole spacing identical to that of Socket AM4. This could mean you can carry over your expensive liquid-cooling setup or pricey AIO CLC over from your current Ryzen desktop build.

New renders of Socket AM5 also reveal that the socket locking mechanism is mostly similar to that of Intel sockets, such as the LGA1200, and isn't a downscale of TR4/sTRX4 as was feared in social media. The top retention brace swings along a hinge, and held in place by pressure from a lever that locks into a hook. Depending on the model, AMD Socket AM5 processors could come in TDP values of 45 W, 65 W, 95 W, 105 W, 125 W, and 170 W.

ASUS today introduced a trio of new motherboards based on AMD's X570 chipset, which join the latest ROG Crosshair VIII Extreme as the latest offerings from ASUS on the X570 platform.

The ROG Strix X570-E Gaming WiFi II pairs the latest tech with essential ROG DNA
Elite gamers and enthusiasts who prefer the finer things in life will want to take a look at the new ROG Strix X570-E Gaming WiFi II. Building on the legacy of the ROG Strix X570-E Gaming WiFi before it, this fresh new board distills high-end components, smart software, and passive chipset cooling into one luxurious board. This revision of the X570-E makes a splash with revised ROG graphics running across the I/O shroud and the chipset heatsink. The CPU VRM also gets a boost to a 12+4-phase design, fueled by ProCool II auxiliary connectors. No matter your choice of Ryzen CPU, the new Strix-E will handle it with aplomb.

Senior Technology Fellow Yuzo Fukuzaki shed light on the elusive new CPU technology AMD unveiled at its Computex 2021 keynote, 3D Vertical Cache (3DV Cache). The company had then detailed it as an additional 64 MB last-level cache stacked on top of a CCD (CPU core complex die), which significantly improves performance, including a claimed 15% average gain in gaming performance, which accounts for a generational performance gain over "Zen 3." The prototype AMD unveiled in its keynote was based on a Socket AM4 processor with "Zen 3" CCDs that have the 3DV Cache components in place. With two such CCDs, a 16-core processor would end up with 192 MB of L3 cache.

Yuzo Fukuzaki's theory sheds light on the most plausible position of 3DV Cache in the processor's cache hierarchy. Apparently, it expands the CCD's L3 cache, and doesn't serve as an "L4" victim cache to the L3. This way, the cache setup remains transparent to the OS, which sees it as a contiguous 96 MB block of L3 cache (per CCD). The 3DV Cache die is an SRAM chip fabricated on the same 7 nm process as the "Zen 3" CCD. It measures 6 mm x 6 mm (36 mm²), and is located above the region of the CCD that typically has the 32 MB L3 SRAM. Fukuzaki estimates that roughly 23,000 TSVs (through-silicon vias), each about 17 µm in size, connect the 3DV Cache die to the main CCD.

The leading global motherboard, graphics card, and small form factor PC manufacturer, ASRock, has released the latest BIOS that support AMD Ryzen 5000 G-Series Desktop Processors with Radeon Graphics and AMD Ryzen 5000 Series Desktop Processors with PRO Technologies.

AMD Ryzen 5000 G-Series Desktop Processors with Radeon Graphics are the newest generation processors come with industry-leading 7nm technology, elevating processing performance to the next level. And now, ASRock 500-Series, B450 AMD Ryzen motherboards and X300 Mini PC are able to support both of them by updating the latest BIOS.

Thermalright today introduced the Assassin King 120 Mini WHITE ARGB, an interesting option from the company's fast-growing collection of air-type CPU coolers. The cooler is completely whitewashed—the aluminium fin-stack, the heat-pipes, even most of the base. The included TL-D12W-S 120 mm fan comes with a white frame and impeller, too, although the impeller is frost silicone, and diffuses ARGB illumination from the hub. Five 6 mm-thick copper heat pipes pull heat from a C1100 nickel-plated copper base, conveying heat to an aluminium fin-stack, which is ventilated by a 120 mm fan.

The TL-D12W-S fan features a fluid-dynamic bearing, turns at speeds of up to 1,500 RPM, pushing up to 64.87 CFM of airflow, at 1.53 mm H₂O static pressure, and 25.6 dBA noise output. It takes in 4-pin PWM for its main function, and 3-pin ARGB for the lighting. The Assassin King 120 Mini WHITE ARGB measures 120 mm x 96 mm x 135 mm (WxDxH), weighing 980 g. CPU socket types supported include LGA1200, LGA115x, AM4, and LGA2066. The company didn't reveal pricing.

AMD is slowly preparing to launch its next-generation processors based on the new AM5 socket. The new lineup of processors will be based on the upgraded Zen 4 architecture that is said to bring multiple microarchitecture improvements and enhancements, equaling to a possible high-performance increase. Today, according to ExecutableFix, the person who provided us with renders of AMD's upcoming AM5 socket designed for next-generation Raphael processors. As we previously reported, AM5 is doing away from PGA and switching to LGA type instead, where pins are delivered on the socket, not the CPU like we used to see with AMD processors.

The LGA-1718 socket, pictured in the renders below, looks like a simple retention mechanism, where there is one metal arm to hold the lid down under pressure. If it turns out to be true, this implementation will be a very positive upgrade over the past PGA socket found on AM4 and before. We can look forward to seeing what AMD will deliver once the launch of Raphael processors gets closer.

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

GIGABYTE rolled out the X570S Gaming X motherboard, expanding its line of AMD X570S motherboards that debuted in June with a trio of AORUS Gaming and AERO series products. The Gaming X sticks to GIGABYTE's main brand, and is usually priced below its AORUS Gaming models. Built in the ATX form-factor, the board draws power from a combination of 24-pin ATX and single 8-pin EPS connectors. It uses a 6-layer PCB for better memory and PCIe signalling. A 14-phase (12+2 phase) VRM powers the CPU, with an enlarged MOSFET heatsink. The AMD X570S chipset is cooled by a fanless heatsink.

The AM4 socket is wired to a PCI-Express 4.0 x16 slot, and M.2 NVMe slot with PCI-Express 4.0 x4 wiring. There are two additional M.2 NVMe slots wired to the X570S chipset, both capable of PCI-Express 4.0 x4. Other expansion slots include a PCI-Express x16 (Gen 4 x2 electrical), and two Gen 4 x1 slots. USB connectivity includes two 10 Gbps USB 3.2 ports on the rear panel, one of which is type-C; and seven 5 Gbps USB 3.2 ports, from which four are on the rear panel, one is an internal type-C port, and two ports via headers. The sole network interface is a 2.5 GbE, driven by a Realtek 8125B controller. The 8-channel onboard audio is basic Realtek ALC892 fare. The board comes with out-of-the-box support for Ryzen 5000 "Vermeer," and Ryzen 5000G "Cezanne" processors, besides Ryzen 3000 series. The company didn't reveal pricing, but we expect this to go for well under $180.

Thermaltake today introduced the ToughLiquid Ultra line of all-in-one, closed-loop liquid CPU coolers, featuring ToughFan Turbo fans. Available in two variants based on radiator size—240 mm x 120 mm and 360 mm x 120 mm, these coolers are characterized by a high-speed 3,200 RPM pump-block that has a color LCD screen that displays cooling performance monitoring, or pretty much anything you want it to display; and the ToughFan Turbo fans that turn at speeds of up to 2,500 RPM, each pushing up to 72.69 CFM of airflow with 3.78 mm H₂O static pressure, and 28.1 dBA noise output. Among the CPU socket types supported are LGA2066, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

Thermalright is on a roll with top-flow CPU cooler launches lately, and just added its latest creation, the AXP90-X47 Full Copper. Fit for low-profile builds, this 47 mm-tall top-flow cooler, as its name suggests, uses a heatsink that's made almost entirely of copper, complete from the base-plate to the heat-pipes, to the dissipation-fins, with the only non-copper bits being the retention module.

Four 6 mm-thick copper heat-pipes make indirect contact with the CPU through a C1100-grade copper base, conveying heat to a stack of 54 copper fins. This 32 mm-tall heatsink is ventilated by a 15 mm-tall TL-9015R 90 mm fan. Featuring a hydraulic bearing, the fan spins at 2,700 RPM, pushing up to 42.58 CFM of airflow at 1.33 mm H₂O static pressure, and 22.4 dBA minimum noise. Measuring 95 mm x 94.5 mm x 47 mm (WxDxH, including fan), the AXP90-X47 Full Copper weighs 520 g. CPU socket types supported are AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Thermalright today introduced the Frost Spirit 140 BLACK V3, a variant of the Frost Spirit 140 that the company introduced in 2019. The dual fin-stack cooler has been redone with black anodized aluminium fins, heat-pipes, and a nickel-plated C1100-grade copper base.

The original's design remains largely intact—four 8 mm-thick heat-pipes make indirect contact with the processor over the base, conveying heat to two aluminium fin-stacks, which are ventilated by a combination of a 120 mm "push" fan, and a 140 mm conveyor between the two fin-stacks. Both fans feature fluid-dynamic bearings. The 120 mm TL-C12B turns at 1,500 RPM, pushing up to 66.17 CFM at up to 25.6 dBA noise output. The 140 mm TL-D14B can do 1,500 RPM, handling up to 77.8 CFM of air-flow, at the same 25.6 dBA noise. CPU socket types supported include LGA1200, LGA115x, LGA2066, and AM4. Measuring 140 mm x 146 mm x 158 mm (WxDxH, including fans), the fully assembled cooler can weigh up to 1.28 kg. The company didn't reveal pricing.

Thermalright today rolled out the AXP90-X36 Black, a low-profile, top-flow CPU cooler. If you're having a sense of deja vu right now, it's probably because of the recent launch of the AXP90-X53 Black, a slightly taller cooler from the brand that looks similar. The numerals in the model names are key here. The "90" denotes fan diameter in mm, while the "36" denotes the cooler's height of just 36 mm. The older AXP90-X53 Black is 53 mm-tall.

The new AXP90-X36 Black uses essentially the same design, and an identical TL-9015B fan, but a slimmer heatsink. It still uses four 6 mm-thick nickel-plated copper heat pipes that make indirect contact through a copper base-plate; which twist into the fin-stack, and are ventilated by the 90 mm spinner, which turns at speeds of up to 2,700 RPM pushing up to 42.58 CFM of airflow, at noise levels as low as 22.4 dBA. The cooler measures 95 mm x 94.5 mm x 36 mm, weighing 230 g. CPU socket types supported are LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

GIGABYTE is giving finishing touches to its new motherboard targeted at creators who like to game, and premium desktop builders, the X570S AERO G. This marks the debut of the company's AERO brand, associated with notebooks, over to the desktop PC components segment. The board's aesthetics appear more in line with the company's VISION line of products. The Socket AM4 motherboard is based on the new AMD X570S chipset, a low-power version of the X570 that can make do with fanless cooling.

What sets the X570S AERO G apart is its five M.2 NVMe Gen 4 slots, leveraging the PCIe Gen 4 downstream connectivity of the X570S. You also get two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and creator-relevant connectivity that includes 2.5 GbE wired LAN, Wi-Fi 6E, and GIGABYTE's highest onboard audio grade. Thunderbolt connectivity is unlikely to be found. The board will come with out-of-the-box support not just for Ryzen 5000 "Vermeer" processors, but also Ryzen 5000G "Cezanne" APUs, which it wires out through DisplayPort and HDMI ports.

Update Jul 5th: GIGABYTE formally launched the X570S AERO G. It lacks 10 GbE, unlike previously reported, offers 2.5 GbE, and comes with USB 3.2x2 (20 Gbps) ports.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced that the BIOS of their series motherboards, including Intel X299, C621, C232, C236, C246, 200, 300, 400, 500 lineups, as well as AMD TRX40, 300, 400, 500 motherboards are TPM 2.0 function ready, which can pass the upgraded Windows 11 OS. verification.

Windows 11 is the latest operating system from Microsoft, and features dozens of exciting new functions and Android APP support to effectively improve productivity, system security, and gaming performance. However, most of the users might be confusing that Windows 11 requires TPM 2.0 support means they need a TPM module on board for Windows 11 upgrade.

ID-Cooling today introduced the PinkFlow Diamond Edition, an all-in-one liquid CPU cooler that has a pink+white aesthetic. The star attraction here is the RGB-illuminated ornament on top of the pump-block, which shimmers like a diamond with the LEDs underneath. White Nylon-sleeved tubing connects this to a 240 mm x 120 mm radiator that's completely white, including the fins.

Each of the two included 120 mm fans features a white frame with pink impeller, with addressable RGB LED diffusers along the bore of the frame. The fans turn at speeds ranging between 900 to 2,000 RPM, pushing up to 55.2 CFM of airflow, with up to 2.13 mm H₂O static pressure. Among the CPU socket types supported include AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000 MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets.

The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.

AMD Socket AM5 motherboards are set to arrive in Q2-2022, according to PJ, the editor of Uniko's Hardware. This would mean that the Zen 3 + 3D Vertical Cache chiplet AMD CEO Dr Lisa Su showed off in her Computex keynote, could very well be built in the Socket AM4 package, compatible with existing motherboards. The prototype Dr Su showed off appeared Socket AM4, too. AMD claims that the 3D Vertical Cache feature, when paired with a "Zen 3" chiplet, improves gaming performance by a significant 15 percent, helping AMD catch up with Intel's "Rocket Lake-S" processor at gaming. Elsewhere across the landscape, PJ predicts that the Z690 chipset, which goes with "Alder Lake-S" processors in the LGA1700 package, will arrive by Q4 2021, with cost-effective chipsets such as the B660 and H610 in Q1-2022.

Thermalright today updated its CPU cooler lineup with the new TA140 EX, a tower-type air CPU cooler. The cooler looks slender, but that's only because it's ventilated by a large 140 mm fan. Five 6 mm-thick nickel-plated copper heat pipes make contact with the processor through a mirror-finish base of nickel-plated C1100 copper, conveying heat through an aluminium fin-stack of 53 fins.

The included TL-D14X fan features a fluid-dynamic bearing, turns at speeds of up to 1,800 RPM, pushing up to 95.5 CFM of airflow, at 2.25 mm H₂O static pressure, and 30.2 dBA maximum noise output. Among the CPU socket types supported by the Thermalright TA140 EX, are the LGA1200, LGA115x, LGA2066, and AM4. Measuring 145 mm x 72 mm x 158 mm (LxWxH, including fan); the cooler weighs 840 g. The company didn't reveal pricing.

Noctua's ambitious 100% fanless CPU heatsink, the NH-P1, was briefly listed on Newegg for $100. The heatsink offers clearance for standard-height memory and VRM heatsinks of most motherboards; and completely fanless cooling due to the sheer amount of surface area on offer to dissipate heat without the need for an active airflow. The design of the NH-P1 involves a nickel-plated copper base, from which six heat-pipes emerge passing through a gargantuan aluminium fin-stack.

Noctua claims that the cooler can handle mainstream desktop CPUs without the need for fans. These include the Core i9-9900K, Ryzen 7 2700X, etc., which should mean that most non-K 10th Gen and 11th Gen Intel processors; as well as Ryzen 3000 and Ryzen 5000 chips up to 8 cores should run perfectly fine with this heatsink. Among the CPU socket types supported are LGA1200, LGA115x, LGA2066, and AM4. For higher TDP chips, particularly HEDT chips in the LGA2066 package, the heatsink supports the mounting of a pair of 120 mm fans.