ASUS today announced that a selection of its all-in-one (AIO) liquid coolers will be fully compatible with the AM5 (LGA 1718) socket designed for next-gen AMD CPUs. ROG Ryujin, Ryuo and Strix LC coolers will fit via an AM5 mounting kit, while TUF Gaming LC coolers will fit using the existing kits. A list of compatible ASUS coolers is provided in the table below.

DDR5 memory pricing has been declining faster than expected, with average pricing for modules based on the latest standard dropping by as much as 20% in a month's time. As reported by ComputerBase, pricing for 1 GB of DDR5 has fallen from around €15 by the end of 2021 down to around €5/GB at time of writing. At current pricing, an entry-level, 32 GB DDR5 kit DDR5-4800 memory (JEDEC standard) has fallen from a high of €430 down to a much more palatable €154.

The price decline comes as good news for anyone aiming to upgrade their PC in wake of AMD's Socket AM5 launch for its Zen 4 architecture, which the company has already confirmed will only support the latest RAM standard. AMD itself must be riding the sea of relief, as high DDR5 pricing could significantly shape the company's next-gen platform's value compared to arch-rival Intel, which already offers DDR4 and DDR5 support with its Alder Lake chips. Expectations place the same memory support for the next-gen Raptor Lake platform. Prices for DDR4 memory seem to have hit a bottom, however, as pricing hasn't significantly moved in around six months. Like with all new technologies, expect the price difference to eventually change in favor of DDR5 memory, as manufacturers adjust their outputs towards adoption.

The mention of "170 W" in one of the slides of AMD's Computex 2022 reveal of the upcoming Ryzen 7000 "Zen 4" desktop processors, caused quite some confusion as to what that figure meant. AMD issued a structured clarification on the matter, laying to rest the terminology associated with it. Apparently, there will be certain SKUs of Socket AM5 processors with TDP of 170 W. This would be the same classical definition of TDP that AMD has been consistently using. The package-power tracking (PPT), a figure that translates as power limit for the socket, is 230 W.

This does not necessarily mean that there will be a Ryzen 7000-series SKU with 170 W TDP. AMD plans to give AM5 a similar life-cycle to AM4, which is now spanning five generations of Ryzen processors, and the 170 W TDP and 230 W PPT figures only denote design goals for the socket. AMD, in a statement, explained why it needed to make AM5 capable of delivering much higher power than AM4 could—to enable higher CPU core-counts in the future, more on-package hardware, and for new capabilities like power-hungry instruction-sets (think AVX-512). AMD has been calculating PPT as 1.35 times TDP, since the very first generation of Ryzen chips. For a 105 W TDP processor, this means 140 W PPT, and the same formula continues with Ryzen 7000 series (230 W is 1.35x 170 W).The AMD statement follows.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced all AIO liquid coolers lineup and tower fans for multi-platform are attached with brackets for Socket AM5 to support the new coming AMD motherboards, which provides users the optimal CPU heat dissipation and hands-down system upgrade without changing coolers.

Considering the inconvenience of upgrade CPU fans along with platforms, GIGABYTE always takes into account of the platform variation in the initial design stage of Cooler and tower fan. After confirmed the continuity of AM4 brackets on the Socket AM5 platform, GIGABTYE proved that all AIO liquid coolers lineup and tower fans can provide the optimal thermal performance to the new platform through rigorous tests. For users who has bought GIGABYTE coolers or tower fans designed for multi platforms, no change or adjustment will be needed to suffice the new platform.

Phanteks introduces 3 new chassis; the new Eclipse P500A matte white, Eclipse G360A, Eclipse G500A, a new LCD screen module for the Evolv Shift XT and LGA1700/AM5 support for the Glacier One MP AIO coolers. The Eclipse P500A is a premium mid-tower case that combines high airflow performance with style. It features the Ultra-fine Performance mesh front panel for optimal airflow with dust filtration. The P500A will now be available in Matte White and replaces the original white color option.

Launching on June 8th, the G360A will feature a new design front mesh panel with increased air intake thanks to the enlarged mesh surface area. The case will also support up to 400 mm long GPUs, a new removable fan bracket, and pre-equipped 3x PWM DRGB fans. The G360A will be available in Satin Black and Matte White color options. Following the G360A, the G500A will have new features that include a better innovative design to the front and top for easy fan/radiator installation with a new look for the front mesh panel. The G500A will be available at the end of the summer and have the option of Satin Black or Matte White colors.

Computex 2022 is what's being referred to as a hybrid show and although most of the motherboard manufacturers chose not to exhibit this year, Gigabyte was at the show and we got to take a closer look at its new AM5 motherboards. Gigabyte was only showing four models, but on the plus side, the staff at the booth was more than happy to share details about the boards with us. The four boards on display were the X670E Aorus Xtreme, the X670E Aorus Master, the X670E Aero D and the X670 Aorus Pro AX. Note that these were early board revision and the E is missing in the model name from three of the models, which suggests that AMD hadn't informed the board makers about this distinction between its chipsets until earlier this month when rumours about it started to appear online.

Gigabyte will have a full lineup of boards coming later this year when AMD launches its AM5 platform, although based on the information we were given, the majority of its boards will be based on the B650 chipset. We should point out that there will be high-end B650 motherboards that will be priced similar to lower-end X670 models, which means that buying AM5 motherboards will be highly dependent on what features you favour. Unfortunately no B650 motherboards were on display and we won't be sharing any details of these models at this time. As for the X670E versus X670 chipsets, as there are of course two per board, it seems like the difference comes down to PCIe 5.0 or PCIe 4.0 for the x16 PCIe slot as the major differentiator between Gigabyte's different SKUs.

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

As Computex 2022 is largely an online event, MSI announced its upcoming AMD X670 and X670E boards shortly after AMD's keynote earlier today. Although the official press release didn't go into too many details, VideoCardz got their hands on more detailed information from MSI, which also brings some additional clarity to the platform as a whole. The most interesting slide is the one that lists the AM5 CPU's as having 28 PCIe 5.0 lanes, rather than the 24 PCIe lanes AMD mentioned in its presentation. This makes sense based on the fact that some X670/E boards have multiple PCIe 5.0 M.2 slots for NVMe drives. MSI's X670E Godlike and X670E Ace even feature three PCIe 5.0 x16 slots, although it's likely that this is in a x8/x8/x4 configuration, as these boards only have a single PCIe 5.0 M.2 slot. The same slide also mentions that all Raphael based CPUs will have support for HDMI 2.1 as well as DisplayPort 2.0, which will also work over USB Type-C Alt Mode. Interestingly it seems like not all AM5 CPUs will support DisplayPort 2.0, based on a footnote from MSI.

Other interesting titbits include a minimum CMOS chip size of 32 MB, which hopefully means we won't be seeing a repeat of the issue that the AM4 platform had, where AMD ran out of space for the AGESA, which led to multiple UEFI versions depending on the CPU used with the board. As far as MSI specific features goes, at least the high-end models will be getting eight to 10 layer PCBs and MSI will offer up to 24+2 power phases with improved heatsinks. MSI is also promising 60 W USB PD support for the front USB-C header. Just like ASUS, MSI will also offer an add-in card for more M.2 NVMe drives and MSI calls it the Xpander-Z Gen5 Dual. A common feature among all four boards is that they'll feature AMD's RZ616 WiFi 6E module, which is technically a MediaTek solution.

Although AMD didn't provide too many details during its Computex 2022 keynote speech about the upcoming AM5 platform, the company did announce that there will be at least three chipsets for the platform and showed pictures of some upcoming motherboards. ASUS has kindly filled in some more details about its upcoming ROG Crosshair X670E Extreme, which will be one of its higher-end models. Sadly the pictures posted are kind of tiny and the company didn't provide a shot of the rear I/O. That said, ASUS did point out some of its new features that we can expect to find on the ROG Crosshair X670E Extreme.

For starters, the board will have a pair of PCIe 5.0 x16 slots, although each slot is likely to only have eight lanes each, when both slots are in use, but ASUS doesn't mention any details here. The board has support for up to five M.2 NVMe SSDs, four of which support PCIe 5.0. Only two are onboard, with the other three being via ASUS' proprietary ROG PCIe 5.0 M.2 card and ROG GEN-Z.2 card. ASUS also promises USB4 support, as well as a USB 3.2 Gen 2x2 header with Quick Charge 4+ as well as up to 60 W charging support, for cases with a front USB-C port. On top of the rear I/O is an AniMe Matrix LED display that can be user customised.

Phison Electronics Corp., a leading provider of NAND controller and flash storage solutions, announced today a strategic collaboration with AMD and Micron to build a cooperative PCIe Gen5 ecosystem of compatible products that elevate the gaming and creator experience. Phison's role includes delivering a class-leading PCie Gen5 SSD controller - PS5026-E26 - that features nearly a 2x performance increase over the previous generation flagship while adhering to the same power limitations of the M.2 form factor.

"We are pleased to announce our cooperative effort with Micron and AMD to advance the technological development of PCIe Gen5 storage offerings, as this validates Phison's commitment to upholding customer-centric values," said Leo Huang, Sr. Director, Product Marketing, Phison. "The E26 controller enables gamers to compete at the highest level and helps content creators to maximize the overall system performance to increase productivity." The need for high-speed storage has increased with the popularity of 5G Wireless availability worldwide. Global markets including desktop PC, notebooks, gaming consoles, cloud servers and even mobile devices will benefit from increased data transfer rates and the bandwidth available for multitask purposes. The ecosystem consisting of AMD's AM5 platform, Phison's PS5026-E26 controller, Micron's DDR5 DRAM and Replacement Gate 3D NAND allow for platform acceleration across the entire system to meet the requirements for today's always-connected lifestyle.

We're expecting to see a wide range of AM5 motherboards next week during Computex, but we're already being treated to some early leaks ahead of the show. The most recent leak was picked up by @9550pro on Twitter, but was originally posted on Baidu. What we're looking at here though, isn't actually a picture of a motherboard, but rather the placement map for the SMD components used during motherboard assembly. These pictures are often used to make sure things like the solder mask and components were applied properly during production. However, it does give us a good look at the overall layout of the ASUS X670 Prime-P WiFi and the fact that the X670 chipset does indeed consist of two parts. What is also clear is that we're looking at a PCIe 5.0 x16 slot here, as these slots are SMD components rather than through hole.

Other things that are clearly visible, includes support for three M.2 slots, of which the one closest to the CPU might be PCIe 5.0, but there's really no way of telling by just looking at the connector placement. There's also a space for a WiFi module at the bottom of the rear I/O, but beyond that, it's hard to make out the proper port layout. However, there appears to be at least one USB-C port at the rear, as well as a header for another one at the front of the motherboard, next to a USB 3.0 header. The board also appears to feature 14 power phases and obviously four DDR5 DIMM slots. The chip between the two chipsets are either a Super I/O chip or possibly a PCIe redriver. In addition to the x16 PCIe 5.0 slot, the X670 Prime-P appears to be getting a single PCIe x1 slot and two PCIe x4 slots, both which appear to get physical x16 slots. Finally the board should have two SATA ports mounted at a 90-degree angle, as well as four ports at the bottom edge of the PCB. ASUS seems to have gone for a solar system pattern on the PCB itself, so it'll be interesting to see what the actual boards will look like.

It appears that ASRock got a little bit too excited and posted a Computex video earlier today that contained a brief glimpse of its upcoming X670E Taichi motherboard. The screenshot that was captured by Wccftech doesn't give away too much details, but the board appears to have at least three M.2 slots and a pair of PCIe x16 slots, of which at least one is meant to be of the PCIe 5.0 variety. The rest of the board is covered in heatsinks and various shrouds. The board will feature Realtek's ALC4082 USB attached audio codec, as well as a ESS ES9218 DAC. It is also said to sport a 26-phase VRM setup. The board is also expected to have Thunderbolt 4 support. The video has unfortunately been taken down, so we'll have to wait until next week to find out more details.

In related news, @momomo_us has leaked details of several upcoming AM5 motherboards, of which four models are from ASRock and two from ASUS. The ASRock models are the X670E Taichi mentioned above, the X670 PG Riptide, X670 Phantom Gaming 4 and the X670 Steel Legend. The two ASUS models are the ProArt X670E-Creator WiFi and the ProArt B650-Creator. Finally Gigabyte has revealed that the company will be displaying its X670 Aorus Xtreme, X670 Master, X670 Pro AX and X670 AERO D at Computex next week. The company mentions PCIe 5.0 for both graphics and the M.2 interface, which pretty much cements the earlier rumors about AMD offering PCIe 5.0 support for the M.2 interface on the AM5 platform.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced a new line of all-in-one RGB CPU coolers for performance-minded DIY enthusiasts: H100i RGB ELITE, H115i RGB ELITE, and H150i RGB ELITE Liquid CPU Coolers. Featuring wide compatibility with the latest Intel and AMD sockets - including LGA 1700 and AM5 - and first-class airflow thanks to their new CORSAIR AF ELITE Series cooling fans, RGB ELITE coolers deliver high-caliber cooling to keep your CPU temperatures down, even when the action is heating up.

AF ELITE Series fans also launch today as standalone offerings. Available in either black or white and in 120 mm or 140 mm sizes, AF ELITE fans take advantage of powerful CORSAIR AirGuide technology and ultra-quiet fluid dynamic bearings to deliver robust, concentrated airflow. For cooling that keeps your system performing at its best, take AF ELITE fans for a spin.

AMD's upcoming Socket AM5 Ryzen 7000-series "Raphael" desktop processors will ship with native support for DDR5-5200 memory speed, according to a marketing slide by memory maker Apacer (which also owns the overclocking memory brand ZADAK). The "Zen 4" based desktop processors will feature a dual-channel DDR5 (4 sub-channel) interface, just like the 12th Gen Core "Alder Lake," but with no backwards compatibility with DDR4.

AMD already stated that Ryzen 7000 processors have a design focus on memory overclocking capabilities, including AMD EXPO, a custom memory module SPD extension standard rivaling Intel XMP 3.0, which will come with fine-grained settings specific to the AMD memory controller architecture. Until now, AMD relied on A-XMP, a motherboard vendor-enabled feature based in the UEFI firmware setup program, which translates Intel XMP SPD profiles of memory modules into AMD-approximate settings.

AMD is preparing to launch its highly-anticipated AM5 socket for the next generation of motherboards. And today, thanks to the sources over at Tom's Hardware, we have information regarding memory support for B650 and X670 motherboards. According to the report, both B650 and X670 chipsets will limit the user's memory option to the latest DDR5 memory standard, making it impossible for users with already existing DDR4 memory to perform a seamless upgrade to a new platform. So far, we don't have a lot of details about Zen4's integrated memory controller, and we can't be certain if it supports DDR5 only or carries legacy DDR4 support. However, it seems like B650 and X670 motherboards will have no plans to enable the DDR4 standard memory usage.

Additionally, the report confirms that the B650 chipset is connected to the AM5 socket via PCIe 4.0 x4 connection and has eight lanes of PCIe 4.0 (four of which are for M.2 SSD), four SATA, and lots of USB ports. Documents suggest that the chipset-socket connection is available using PCIe 5.0 for some AM5 processors, so we have to wait and see how it works. As far as high-end X670 is concerned, this chipset is a combination of two chipset dies, presumably a combination of two B650 modules. This doesn't work as the older north/southbridge type of a solution but rather doubled connectivity of a single B650 chipset. We have to wait for the official launch to confirm this information.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, is pleased to announce that all AM4-compatible ARCTIC coolers will also be compatible with AMD's new AM5 socket. AMD is expected to release the next-generation AMD Ryzen 7000 desktop processors (Zen 4) at the end of 2022. Since all mechanical dimensions remain identical, ARCTIC is able to guarantee compatibility with our coolers on AMD's new processors. Among the compatible ARCTIC coolers are its award-winning Liquid Freezer II series, the fan-favorite Freezer 34 eSports air cooler, and many more.

AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

AMD Socket AM5 (LGA1718) is the next-generation socket designed to support next-generation AMD Ryzen 7000 desktop processors (Zen 4). AMD Socket AM5 uses the same liquid cooler bracket as Socket AM4. This allows you to upgrade to and enjoy AM5 without buying a new liquid cooler. MSI liquid coolers all support AMD Socket AM5, for specifics please refer to the chart below:

Noctua today presented the all-new NH-D12L low-height dual tower CPU cooler and the corresponding NF-A12x25r round-frame 120 mm fan. At a height of only 145 mm (13 mm lower than Noctua's regular 120 mm models), it fits many 4U enclosures as well as narrower tower cases that have been previously limited to solutions with 92 mm fans. At the same time, its five heatpipe dual-tower design and state-of-the-art NF-A12x25r 120 mm fan allow it to achieve a level of efficiency that surpasses many full-height 120 mm models.

"So far, all our 120 mm class coolers were 158 mm high, but as of recent, more and more PC cases only support up to 150 or even 145 mm - this is where the NH-D12L steps in", explains Roland Mossig (Noctua CEO). "Simply lowering one of our existing models wasn't an option because a standard square 120 mm fan would cause lots of issues with motherboard heatsinks or shrouds. That's why we came up with this novel dual tower design and a round-frame version of the NF-A12x25 fan that can be installed at a very low position between the two towers - a winning combination that provides impressive results for this height class."

The next-generation AMD Ryzen 7000 "Raphael" desktop processors in the Socket AM5 package are rumored to enter mass-production soon, according to Greymon55 on Twitter, a reliable source with AMD leaks. Silicon fabrication of the chips may already be underway, as the source claims that packaging (placing the dies on the fiberglass substrate or package), will commence by late-April or early-May. "Raphael" is a multi-chip module of "Zen 4" CCDs fabricated on the TSMC N5 (5 nm) node, combined with a cIOD built on a yet-unknown node. A plant in China performs packaging.

It's hard to predict retail availability, but for the Ryzen 5000 "Vermeer" processors, this development milestone was reached in June 2020, with the first products hitting shelves 4 months later, in November. This was, however, in the thick of the pre-vaccine COVID-19 pandemic. The "Zen 4" CPU cores are expected to introduce an IPC increase, as well as higher clock speeds. Also on offer will be next-gen connectivity, including PCI-Express Gen 5 (including CPU-attached Gen 5 NVMe), and DDR5 memory. These processors will launch alongside Socket AM5 motherboards based on the new AMD 600 series chipsets.

AMD is slowly preparing to transition its consumer base into a new platform and processor architecture with the launch of Ryzen 7000 series processors codenamed Raphael. Based on the new AM5 LGA socket, these processors will come with up to 16 cores and 32 threads at the top-end configurations. Thanks to the latest round of rumors, we managed to find out just what TDP rating two SKUs will carry. According to a well-known leaker @graymon55, AMD is rating the 12-core SKU with a TDP of 105 Watts. On the other hand, the top-end 16-core 7000 series SKU replacing the current Ryzen 9 5950X will carry a large TDP of 170 Watts.

The 170 Watt TDP configuration will likely require better cooling efforts. AMD will probably advise users to invest in better cooling solutions, such as AIO liquid coolers or giant air coolers.

Leading memory provider TEAMGROUP not only brings complete storage solutions to consumers worldwide but also strives to provide the best cooling options. In response to greater demands in the next generation of PC hardware for faster and more efficient cooling, its gaming sub-brand T-FORCE has announced the world's first ARGB All-In-One liquid cooling system that dissipates heat from two main heat sources, the CPU and SSD, at the same time.

The dual-cooling system of the T-FORCE SIREN Series All-in-One ARGB Liquid Cooler supports a wide range of Intel and AMD sockets, including the latest LGA1700 and AM5 sockets, and its meticulously-designed water blocks are made for mainstream M.2 2280 SSDs, making the cooler perfect for a large variety of gaming PC setups. The T-FORCE SIREN Series All-in-One liquid cooling system allows gamers to solve both CPU and SSD heating issues with an easy installation and helps provide stable operation when both components are under heavy loads, contributing to longer hardware lifespans. Its ARGB dual water block design can also display a wide array of dazzling lights, giving players the freedom to create their own unique, eye-catching PC rig.

Based on details from multiple sources, least not the release notes for HWiNFO 7.17 beta, we now know that AMD is working on an answer to Intel's XMP memory profiles that should be called RAMP, or Ryzen Accelerated Memory Profile. Not much is known about RAMP at this point in time, but hopefully it'll be as straightforward to use as Intel's XMP when it comes to configuring overclocked DIMMs.

Intel has of course updated XMP to version 3.0 which includes support for DDR5 memory, although it was reported that Intel was late when it came to finalising the specifics of XMP 3.0, which meant some early DDR5 modules intended for overclocking didn't end up getting any XMP profiles. Hopefully AMD will get its RAMP spec finished well ahead of time, so the memory makers that want to offer support for RAMP can do so well ahead of the launch of AMD's upcoming AM5 platform.

It would seem that AMD is concerned about DDR5 memory availability in the market, at least based on an interview that Tom's Hardware had with David McAfee, the Corporate VP and GM of the Client Channel business at AMD. It's not just about availability it seems, but also pricing, as McAfee is quoted saying "One of the dynamics that we do think about a great deal is how and when to introduce that AM5 ecosystem and ensure that the DDR5 supply, as well as pricing of DDR5 memory, is mature and something that's easily attainable for an end-user".

With the current issues that the DRAM module makers are experiencing, with both staff issues related to the pandemic and the PMIC shortage some are having, the question is how long it'll take until there's a steady supply of DDR5 modules in the market, at a reasonable price point. We obviously don't know what kind of DRAM speeds AMD is aiming for either, although it's unlikely that the company is looking at something faster than JEDEC spec at this point in time, even though we expect faster speeds will also be supported. Outside of the US, it seems like a cheap stick of 8 GB of DDR5 memory is going for around the US$100 mark (€89) or roughly four times that of a similar DDR4 stick. Crucial in the US is offering a single 8 GB stick for US$68, with a 16 GB stick costing the same as a pair of 8 GB sticks, US$137. This is unlikely to be the kind of price point AMD is hoping for and most DDR5 memory modules are a lot more expensive.