Sources tell Bits'n'Chips that AMD could use a common 8-core CPU die based on its upcoming "Zen" architecture over multiple CPU SKUs, at least initially. AMD will have two distinct kinds of processors, those with integrated graphics (APUs) based on the "Bristol Ridge" silicon, and those without integrated graphics (CPUs), based on the "Summit Ridge" silicon. Since products based on both the dies will use a common socket on the desktop (socket AM4), consumers looking for 2-4 CPU cores will be presented with APU options, while those looking for more powerful CPU solutions will be made to choose 8-core CPUs based on the "Summit Ridge" silicon.

AMD released the Radeon Software Crimson Edition 16.5.1 Beta, the unified suite of drivers and system software AMD Radeon GPUs. Version 16.5.1 adds optimization for "Forza Motorsport 6: Apex," with the company noting up to 27 percent increase in performance compared to the older drivers (16.4.2), when tested on a Radeon R9 Fury X. Grab the drivers from the links below.DOWNLOAD: AMD Radeon Software Crimson Edition 16.5.1 Beta for Windows 10/8.1/7 64-bit | Windows 10/8.1/7 32-bit

AMD made additions to its Radeon-branded SSD lineup, with the new R3 Series. Targeted at the entry-level segment, these drives come in capacities of 120 GB, 240 GB, 480 GB, and 960 GB; and combine TLC NAND flash memory with Silicon Motion SM2256KX controllers. The 120 GB, 240 GB, and 480 GB variants offer read speeds of up to 520 MB/s, the 960 GB variant up to 510 MB/s. The 120 GB variant writes at up to 360 MB/s, the 240 GB and 480 GB variants at 470 MB/s, and the 960 GB variant at up to 450 MB/s. The drives are built in the 7 mm-thick 2.5-inch form-factor, and feature the SATA 6 Gb/s interface. The 120 GB, 240 GB, and 480 GB variants are priced at US $40.99, $69.99, and $136.99, respectively. Prices of the 960 GB variant are not known.

Today HP Inc. unveiled a new Pavilion PC portfolio in a bold color palette featuring new convertibles, notebooks and desktops with sleek designs and more power ideal for students, millennials and families. The new portfolio lets customers reflect their sense of style and delivers the power they need to be productive and entertained at a price that delivers value.

"Some customers want thin and light PCs for on the go while other customers want power and performance to create and store," said Kevin Frost, vice president and general manager, consumer personal systems, HP Inc. "HP's redesigned Pavilion PCs offer affordability and a variety of options for customers to get the functionality they need in a PC packed with style and personality."

In all the 16 nm NVIDIA "Pascal" GPU fervor, it would be foolish to ignore AMD's first "Polaris" GPUs, built on the more advanced 14 nm process. Hot on the heels of reports that a fully-equipped "Ellesmere" GPU based Radeon R9 490 performs close to NVIDIA's GeForce GTX 980 Ti (and AMD's own R9 Fury X), with nearly half its power-draw, new numbers from an early GFXBench run suggests that its cut-down R9 480 (non-X) sibling performs close to the Radeon R9 390X. The R9 480 succeeds the currently-$200 R9 380, and its prospect of offering performance rivaling the $400 R9 390X at half its power-draw appears to meet AMD's "generational leap" claims for the "Polaris" architecture. Similarly, the R9 490, based on a better-endowed "Ellesmere" chip, offering performance rivaling current $600 GPUs at a $350-ish price-point (succeeding the R9 390), appears to meet expectations of a generation leap.

AMD posted a new webpage for its upcoming "Polaris" GPU architecture, outlining its various innovations - 4th gen. Graphics CoreNext, 4K H.265 60 Hz game-streaming, next-generation display engine with support for DisplayPort 1.3 and HDMI 2.0, XConnect Technology, and the foundation of GPUOpen. In this page, the company inadvertently leaked pictures of its upcoming Polaris 10 "Ellesmere" and Polaris 11 "Baffin" ASICs.

The mast image of the page has a faded 3-quarter shot of a "small" GPU with a die that's almost 30% of the package area. This hints at Polaris 11 "Baffin." This chip is rumored to feature a 128-bit GDDR5/GDDR5X memory interface, and so its pin-count, and conversely, package-size is less. Then in its "4th gen GCN" heading image, AMD showed a picture of a bigger GPU. At first glance, you could assume that it's either "Tonga XT" or "Tahiti" looking at its support brace, but VideoCardz observed that the on-package electrical components in this image are arranged nothing like on the "Tonga" or "Tahiti." This could very well be Polaris 10 "Ellesmere."

AMD and Nantong Fujitsu Microelectronics Co., Ltd. today announced that they have closed the transaction to create a joint venture offering differentiated assembly, test, mark, and pack (ATMP) capabilities to both AMD and a broader range of customers.

"Combining AMD's world-class teams and facilities in Penang and Suzhou with NFME's expertise in the growing assembly and test market will create a new outsource assembly and test leader with the scale and capabilities to help us deliver our upcoming high-performance technologies and products that can re-shape the industry," said AMD President and CEO Dr. Lisa Su. "The creation of this joint venture marks another step in building a more focused AMD as we complete our transition to a fabless business model, enhance our supply chain operations, and further strengthen our financial position."

"AMD is a world class semiconductor provider with advanced flip chip packaging and test technologies. These capabilities are complementary with NFME's advanced packaging and test technologies, such as its flip chip and bump technology for the computing, communication and consumer market. The establishment of this joint venture will elevate the competitiveness of NFME's flip chip packaging and test technologies to a world-class level. With this joint venture, NFME's advanced packaging and test capabilities will account for 70 percent of its total revenue, leading the entire industry and ranking among the top packaging and test companies in the world," said Chairman of Nantong Fujitsu Mr. Shi Mingda.

Slovenian liquid-cooling giant EK Water Blocks is ready with a full-coverage water block for AMD Radeon Pro Duo. The company teased its block in its clear-acrylic top with nickel-plated copper base variant, fitted to a card, with the tagline "There has never been so much GPU raw power stuffed on a single PCB," on the company's Facebook page. The block appears to feature a common coolant channel that passes through both VRM areas, the PCIe bridge chip, and large micro-fin lattices over the two GPUs. The block could be offered in other variants as well - with opaque acetal tops, exposed copper base, and combinations with clear-acrylic and nickel-plated copper bases.

Ahead of its launch, performance numbers of AMD Radeon Pro Duo were leaked to the web by Expreview. Pitted against the $620 GeForce GTX 980 Ti, the $1,499 dual-GPU monstrosity is about 32 percent faster at 1080p (which sees CPU saturation), and on average 59.4 percent faster at 4K Ultra HD. The card is noted to conjure up more than playable frame-rates for all the games Expreview tested at 4K. Frame-rates were as low as 46 fps, and as high as 61 fps, indicating that the Pro Duo is the go-to single-card solution for Ultra HD. Find the review in the link below.

At a presser in Taiwan for its Radeon Pro Duo launch, AMD talked extensively about its upcoming "Polaris" and "Vega" family of GPUs. The company appears to be betting heavily on two SKUs it plans to launch this June, Polaris 10 and Polaris 11. Polaris 10 is an internal designation to Radeon R9 490(X), based on the 14 nm "Ellesmere" silicon. It may be the biggest chip AMD builds on the "Polaris" architecture, but it won't exactly be a "big chip," in that it doesn't succeed "Fiji." That honor is reserved for "Vega," which debuts in early-2017.

The "Ellesmere" silicon is more of AMD's competitor to NVIDIA's GP104. It is rumored that the R9 490(X), based on this silicon, will offer consumers performance rivaling the GeForce GTX 980 Ti (ergo faster than the Radeon R9 Fury X), at a USD $300-ish price point. "Ellesmere" will be a lean-machine, physically featuring up to 2,560 4th generation GCN stream processors (2,304 enabled on Polaris 10), a possible 256-bit GDDR5X memory interface, and a deep sub-200W typical board power rating.

AMD released its latest Radeon Software Crimson Edition drivers. Version 16.4.2 adds or updates CrossFire profiles for "Elite Dangerous" and "Need for Speed" (2016). It introduces full support for the XConnect Technology, an external graphics dock standard promoted by AMD. The drivers also fix crucial game-specific bugs related to "The Division," "SteamVR performance assessment," "Hitman (2016)" with CrossFire, and "Fallout 4" with CrossFire. Grab the drivers from the links below.DOWNLOAD: AMD Radeon Software Crimson Edition 16.4.2 for Windows 10/8.1/7 64-bit | Windows 10/8.1/7 32-bit

The days are numbered for AMD's iconic Sunnyvale, California headquarters at One AMD Place (or 1090 E. Duane). The company is moving out of this property to another, smaller place elsewhere in Silicon Valley. AMD sold and leased-back this building to New York-based W.P. Carey in 1995 for $95 million, and has since been a tenant at the 319,000 square-foot campus, spread across a sprawling 32.5-acre site.

New Port Beach CA-based Irvine Company is set to acquire the site, and redevelop it into hundreds of apartments, according to multiple real-estate sources. With a shrinking payroll that's down to 9,100 today, following over 2,000 job-cuts since 2011, AMD is said to be moving to another location, and is in the market for a 175,000-225,000 square feet property to lease, elsewhere in Silicon Valley. This marks a 30-45% reduction in the company's office-space.

AMD today announced revenue for the first quarter of 2016 of $832 million, operating loss of $68 million, and net loss of $109 million, or $0.14 per share. Non-GAAP operating loss was $55 million and non-GAAP net loss was $96 million, or $0.12 per share.

"Our strategy to build a strong business foundation and improve financial performance through delivering great products is beginning to show benefits," said Lisa Su, AMD president and CEO. "We continued to strengthen the performance of our Computing and Graphics business as our customers and partners show a growing preference for AMD. We are optimistic about our growth prospects in the second half of the year across our businesses based on new product introductions and design wins."

AMD finalized the GPU architecture roadmap running between 2016 and 2018. The company first detailed this at its Capsaicin Event in mid-March 2016. It sees the company's upcoming "Polaris" architecture, while making major architectural leaps over the current-generation, such as a 2.5-times performance/Watt uplift and driving the company's first 14 nanometer GPUs; being limited in its high-end graphics space presence. Polaris is rumored to drive graphics for Sony's upcoming 4K Ultra HD PlayStation, and as discrete GPUs, it will feature in only two chips - Polaris 10 "Ellesmere" and Polaris 11 "Baffin."

"Polaris" introduces several new features, such as HVEC (h.265) decode and encode hardware-acceleration, new display output standards such as DisplayPort 1.3 and HDMI 2.0; however, since neither Polaris 10 nor Polaris 11 are really "big" enthusiast chips that succeed the current "Fiji" silicon, will likely make do with current GDDR5/GDDR5X memory standards. That's not to say that Polaris 10 won't disrupt current performance-thru-enthusiast lineups, or even have the chops to take on NVIDIA's GP104. First-generation HBM limits the total memory amount to 4 GB over a 4096-bit path. Enthusiasts will have to wait until early-2017 for the introduction of the big-chip that succeeds "Fiji," which will not only leverage HBM2 to serve up vast amounts of super-fast memory; but also feature a slight architectural uplift. 2018 will see the introduction of its successor, codenamed "Navi," which features an even faster memory interface.

CodeXL is now part of the GPUOpen initiative. You can find all of CodeXL's source code (barring a few parts that are IP-confidential) on the CodeXL GitHub project. Version 2.0 is also available in pre-built binary form, like previous versions. We believe that by adopting the open-source model and sharing the CodeXL source base with the world we can help developers make better use of CodeXL and make CodeXL a better tool.

To encourage 3rd party contribution and adoption, CodeXL is no longer branded as an AMD product. AMD will still continue development of this tool and upload new CodeXL versions and features to GPUOpen.

Sony's upcoming 4K Ultra HD game console, which its fans are referring to as the "PlayStation 4K," while being internally referred to by Sony as "NEO," could feature a very powerful GPU. AMD could custom-design the SoC that drives the console, to feature an 8-core 64-bit x86 CPU based on the "Jaguar" micro-architecture, running at 2.10 GHz; and a GPU component featuring 36 compute units based on "next-generation Graphics CoreNext" architecture.

36 next-gen GCN compute units sounds an awful lot like the specs of the Polaris10 "Ellesmere" chip in its Radeon R9 480 configuration, working out to a stream processor count of 2,304 - double that of the 1,152 on the current-gen PlayStation 4. The SoC is also rumored to feature a 256-bit GDDR5 memory interface holding 8 GB of memory. This memory will be used as both system and video memory, just like on the current-gen PlayStation 4. The memory bandwidth will be increased to 218 GB/s from the current 176 GB/s. Besides 4K Ultra HD gaming, this chip could also prepare Sony for VR headsets, leveraging AMD's LiquidVR tech.

AMD released an official video-card BIOS update for the Radeon R9 Fury X and Radeon R9 Nano graphics cards, which improve UEFI BIOS support. End users on our forums are also reporting improved overclocking stability. UEFI support at the video-BIOS level is required for the card to run without CSM at the system-BIOS end, in turn enabling useful OS features such as Secure Boot. Several of AMD's add-in board (AIB) partners already ship their cards with UEFI-ready BIOS. AMD is distributing the BIOS as ROM images, and it takes thorough knowledge of how to flash your graphics card's BIOS, to make use of these ROM images.DOWNLOAD: AMD Video BIOS Update for Radeon R9 Nano | Radeon R9 Fury X | From AMD Website

AMD is reportedly bundling its Wraith stock CPU cooling solution with even more of its desktop CPUs. Some of the newer batches of two of the most selling socket AM3+ chips, the eight-core FX-8350 and the six-core FX-6350, could sell in special packages that include Wraith, likely at a tiny premium over packages with the older cooling solution that are already in circulation.

With a clock-speed ranging between 4.00 GHz to 4.20 GHz, the FX-8350 is one of the most popular FX-series chips. Along with the FX-6350, its TDP is rated at a scorching 125W. The Wraith cooler, which was extensively reviewed with the FX-8370, was generally appreciated by tech-reviewers for being as quiet as some of the more expensive third-party air coolers, and performing better than the older cooler.

European tech-site El Chapuzas Informatico got its hands on the price-tag of an XFX-branded Radeon Pro Duo graphics card, and predictably, it's priced way beyond the USD $1,499 at-launch AMD blared at its unveil. The card is expected to cost 1,695€ (incl. taxes). Retail availability is expected to go live on the 26th of April, 2016. On that day, the card will be launched by AMD's various add-in board (AIB) partners. As the picture reveals, AIB-branded cards won't be much more than a brand sticker placed on the cooler, leaving you to choose between them only on the basis of minor price differences, after-sales support, and erm...box art?

Computex 2016 could see some major consumer graphics action, with AMD reportedly planning to launch two mid-thru-performance segment products on the sidelines of the event - the Radeon R7 470, based on the 14 nm "Baffin" (Polaris 11) silicon, and the Radeon R9 480, based on the 14 nm "Ellesmere" (Polaris 10) silicon. The R7 470 could succeed the R7 370 series in not just performance, but also offer a leap in energy efficiency, with a TDP of less than 50W. The R9 480, on the other hand, could feature a TDP of just 110-135W (R9 380 is rated at 190W).

The R9 480, based on the "Ellesmere" (Polaris 10) is shaping up to be a particularly interesting silicon. It's rumored to feature 2,304 stream processors based on the 4th generation Graphics CoreNext architecture, with 2,560 stream processors being physically present on the chip; and a 256-bit wide GDDR5 (GDDR5X-ready) memory controller. 8 GB could be the standard memory amount. AMD could keep the clock speeds relatively low, with 800-1050 MHz GPU clocks. Imagine R9 390-like performance at half its power-draw.

At the 2016 National Association of Broadcasters (NAB) Show, AMD announced the new AMD FirePro W9100 32 GB -- the world's first workstation graphics card with industry leading 32 GB memory support for large asset workflows with creative applications planned for availability in Q2 2016. AMD also introduced the AMD FireRender plug-in for Autodesk 3ds Max, which enables VR storytellers to bring ideas to life through enhanced 4K workflows, photorealistic rendering functionality, and powerful creation support.

"The imagination of the creator is limitless so much so that the professional creator consumes all available resources to produce new and never before seen designs and experiences. Some professional creative workflows demand very high bandwidth memory subsystems while others demand high memory size. AMD pioneered the era of High Bandwidth and Ultra Efficient Memory through the introduction of HBM technology in 2015 and will bring it to content creators with the introduction of Radeon Pro Duo graphics. With the new AMD FirePro W9100 32 GB, AMD is unleashing the world's largest memory size professional workstation graphics card," said Raja Koduri, senior vice-president and chief architect, Radeon Technologies Group (RTG), AMD. "Along with exceptional hardware, AMD is also delivering software tools to leverage our high bandwidth and large memory GPU configurations effectively."

AMD's upcoming GPUs based on the "Polaris" and "Vega" architectures appear to be taking advantage of performance/Watt gains to keep stream processor counts low, and chips small, according to a VideoCardz analysis of curious-looking CompuBench entries. Assuming that a Graphics CoreNext (GCN) compute unit (CU) of the "Polaris" architecture, like the three versions of GCN before it, consists of 64 stream processors, AMD's Polaris 11 silicon, codenamed "Baffin," could feature over 1,024 stream processors, across 16 CUs; Polaris 10, codenamed "Ellesmere," could feature over 2,304 stream processors spread across over 36 CUs; and Vega 10 featuring 4,096 stream processors, spread across 64 CUs.

The "Baffin" silicon succeeds current generation "Curacao" silicon, driving mid-range graphics cards. It is expected to feature a 128-bit wide GDDR5 memory interface, holding 4 GB of memory. The "Ellesmere" silicon succeeds current-generation "Tonga" silicon, driving performance-segment SKUs. It could feature up to 8 GB of GDDR5(X) memory. These two chips could see the light of the day by mid-2016. The third chip out of AMD's stable, Vega 10, could succeed "Fiji," overcoming its biggest marketing shortcoming - 4 GB memory. Taking advantage of HBM2 interface, it could feature 16 GB of memory. It could launch some time in early-2017. AMD is claiming a massive 2.5X performance-per-Watt increase for "Polaris" over the current GCN 1.2 architecture, which drives the "Tonga" and "Fiji" chips, and so these stream processor counts could look deceptively insufficient.

AMD's flagship dual-GPU graphics card, the Radeon Pro Duo, is slated for retail availability from April 26, 2016, according to HardwareBattle. The card was announced at the company's Capsaicin, in mid-March. Reviews of this card could be posted much earlier. Based on a pair of 28 nm "Fiji" GPUs, with two sets of 4,096 stream processors, 256 TMUs, 64 ROPs, and 4 GB of 4096-bit HBM memory, each, the Radeon Pro Duo will be launched at the same price as the company's previous flagship product, the Radeon R9 295X2, at US $1,499. The card could feature on a variety of high-end gaming PCs, and VR content creation workstations. In the retail channel, AMD's traditional add-in board (AIB) partners could launch the reference-design card.

Although AMD's upcoming socket AM4 heralds new lines of processors and APUs based on the company's next-generation "Zen" CPU micro-architecture, some of the first APUs will continue to be based the current "Excavator" architecture. The "Bristol Ridge" is one such chip. It made its mobile debut as the 7th generation A-Series and FX-Series mobile APUs, and is en route to the desktop platform, in the AM4 package. What sets the AM4 package apart from the FM2+ package, and in turn "Bristol Ridge" from "Carrizo" is that the platform integrates even the southbridge (FCH) into the APU die. This could explain the 1,331-pin count of the AM4 socket.

The "Bristol Ridge" silicon is likely built on the existing 28 nm process. That's not the only thing "current-gen" about this chip. Its CPU component consists of two "Excavator" modules that make up four CPU cores, with 4 MB total cache; and its integrated GPU will likely be based on the Graphics CoreNext 1.2 "Volcanic Islands" architecture, the same one which drives the "Tonga" and "Fiji" discrete GPUs. The integrated memory controller supports dual-channel DDR4 memory. In its performance benchmarks, an AM4 APU based on the "Bristol Ridge" silicon was pitted against older 6th generation APUs, in which it was found to be as much as 23 percent faster.

AMD today announced early availability of its new mobile 7th Generation AMD A-Series Processors, timed to support an exciting new notebook design by HP Inc. Equipped with advanced video, graphics, performance, and security features designed to boost productivity and enhance the entertainment experience, 7th Generation AMD A-Series Processors (codenamed "Bristol Ridge") also provide outstanding energy efficiency.

New OEM PC designs powered by mobile 7th Generation AMD A-Series Processors -- from ultrathin notebooks and convertibles to sleek All-in-Ones -- will come to market first with HP in the new HP ENVY x360, and with other OEM announcements expected later in the year. AMD will officially introduce 7th Gen A-Series APUs and showcase a wide range of OEM designs at Computex 2016, May 31-June 4, 2016, in Taipei, Taiwan.