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AMD Readying Feature-enriched ROCm 6.1

The latest version of AMD's open-source GPU compute stack, ROCm, is due for launch soon according to a Phoronix article—chief author, Michael Larabel, has been poring over Team Red's public GitHub repositories over the past couple of days. AMD ROCm version 6.0 was released last December—bringing official support for the AMD Instinct MI300A/MI300X, alongside PyTorch improvements, expanded AI libraries, and many other upgrades and optimizations. The v6.0 milestone placed Team Red in a more competitive position next to NVIDIA's very mature CUDA software layer. A mid-February 2024 update added support for Radeon PRO W7800 and RX 7900 GRE GPUs, as well as ONNX Runtime.

Larabel believes that "ROCm 6.1" is in for an imminent release, given his tracking of increased activity on publicly visible developer platforms: "For MIPOpen 3.1 with ROCm 6.1 there's been many additions including new solvers, an AI-based parameter prediction model for the conv_hip_igemm_group_fwd_xdlops solver, numerous fixes, and other updates. AMD MIGraphX will see an important update with ROCm 6.1. For the next ROCm release, MIGraphX 2.9 brings FP8 support, support for more operators, documentation examples for Whisper / Llama-2 / Stable Diffusion 2.1, new ONNX examples, BLAS auto-tuning for GEMMs, and initial code for MIGraphX running on Microsoft Windows." The change-logs/documentation updates also point to several HIPIFY for ROCm 6.1 improvements—including the addition of CUDA 12.3.2 support.

NVIDIA Accused of Acting as "GPU Cartel" and Controlling Supply

World's most important fuel of the AI frenzy, NVIDIA, is facing accusations of acting as a "GPU cartel" and controlling supply in the data center market, according to statements made by executives at rival chipmaker Groq and former AMD executive Scott Herkelman. In an interview with the Wall Street Journal, Groq CEO Jonathan Ross alleged that some of NVIDIA's data center customers are afraid to even meet with rival AI chipmakers out of fear that NVIDIA will retaliate by delaying shipments of already ordered GPUs. This is despite NVIDIA's claims that it is trying to allocate supply fairly during global shortages. "This happens more than you expect, NVIDIA does this with DC customers, OEMs, AIBs, press, and resellers. They learned from GPP to not put it into writing. They just don't ship after a customer has ordered. They are the GPU cartel, and they control all supply," said former Senior Vice President and General Manager at AMD Radeon, Scott Herkelman, in response to the accusations on X/Twitter.

Gigabyte Provides Specs of its Upcoming 360 Hz QD-OLED Display, the AORUS FO27Q3

Back in January, Gigabyte announced a wide range of new displays at CES and one of the new models that the company didn't have on display at the show was the AORUS FO27Q3. The company has now shared more details on its website of the new display and it gives us a lot more details than what had previously been released. As the model name suggests, the AORUS FO27Q3 is a 27-inch display and the resolution is 2560 x 1440 pixels and the refresh rate will top out at 360 Hz and has a response time of 0.03 ms. The FO27Q3 is built around a QD-OLED panel with an anti-reflective coating. The panel is said to be a 10-bit panel capable of 10.7 billion colours and it's certified for DisplayHDR True Black 400, has a typical brightness of 250 cd/m² and a contrast ratio of 15 million to one.

Other features include support for AMD FreeSync Premium Pro and VESA ClearMR 13000, but there's no mention of G-Sync support. Other features include a range of gaming related features such as crosshairs, night vision, black equalizer etc. as well as picture by picture and picture in picture support. Inputs consist of two HDMI 2.1 ports, one DP 1.4, one USB Type-C with DP Alt mode support as well as a very disappointing 18 W of USB Power Delivery. Furthermore there's a USB 3.0 upstreams port and two downstreams ports, a headphone and a microphone jack. Gigabyte has also added KVM support and a stand that offers tilt, swivels, pivot and height adjustment. The display is said to have a peak power draw of 53 Watts and relies on an external power brick. No word on pricing or availability.

XFX Announces Radeon RX 7900 GRE Graphics Card

XFX today launched its Radeon RX 7900 GRE graphics card. Although the custom-design card sticks with the company's RX 7000 series Speedster MERC board design, XFX did not assign a brand extension to this card. The card's styling appears identical to the RX 7800 XT Speedster QICK 319 Core Edition, a card it very likely shares most of its board design with. The RX 7900 GRE is based on a compact "Navi 31" package that's rumored to be pin-compatible with the "Navi 32," which is why most custom RX 7900 GRE cards appear to have board designs closer to their RX 7800 XT counterparts, than to custom RX 7900 XT cards.

The XFX RX 7900 GRE is 33.5 cm long, 13 cm tall, and is 3 slots thick. It features an aluminium fin-stack heatsink that appears identical to that of the RX 7800 XT QICK 319, ventilated by a trio of fans. XFX has given the RX 7900 GRE factory overclocked speeds of 2052 MHz Game clocks, compared to 1880 MHz reference Game clocks; while leaving the memory untouched at 18 Gbps. The card draws power from a pair of 8-pin PCIe power connectors. Display outputs include three DisplayPort 2.1 and one HDMI 2.1. The company didn't reveal pricing.

ASRock Announces Radeon RX 7900 GRE Series Graphics Cards

ASRock, the leading global motherboard, graphics card and mini PC manufacturer, today launched the new Steel Legend and Challenger series graphics cards based on the AMD Radeon RX 7900 GRE GPU. The new ASRock AMD Radeon RX 7900 GRE Series graphics cards are built on the groundbreaking AMD RDNA 3 architecture, featuring redesigned compute units, second-generation AMD Infinity Cache and ray tracing technologies, and increased AI throughput. They also feature the AMD Radiance Display Engine with support for DisplayPort 2.1, full AV1 encoding and are optimized for high-performance, high-resolution 4K/1440p gaming, streaming and content creation applications.

The new ASRock AMD Radeon RX 7900 GRE Series graphics cards are equipped with high-speed 16 GB GDDR6 memory at 18 Gbps, and are pre-overclocked to deliver higher levels of performance. In addition, the AMD Radiance Display Engine provides 12 bit-per-channel color for up to 68 billion colors for incredible color accuracy. ASRock AMD Radeon RX 7900 GRE Series graphics cards also support various ASRock exclusive features, including the Striped Ring/Axial Fan, Air Deflecting Fin, Ultra-fit Heatpipe, Metal Backplate, and Polychrome SYNC technology to provide great cooling efficiency, solid construction and fancy ARGB lighting effects. With these exclusive features, ASRock AMD Radeon RX 7900 GRE Series graphics cards are premium choices for 4K/2K gamers and creators.

SolidRun Unveils Ryzen V3000 CX7 Com Module

SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor. Boasting AMD's state-of-the-art 6 nm "Zen 3" architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.

"Our new Ryzen V3000 CX7 Com module is an exciting addition to our CX7 product line as it represents a significant leap forward in embedded computing and offers unmatched performance and scalability for networking and edge applications," said Dr. Atai Ziv, CEO at SolidRun. "By leveraging the power of AMD's Ryzen Embedded V3000 processor, we are empowering developers to create innovative solutions that meet the evolving demands of modern embedded computing."

COLORFIRE Launches the MEOW Series Gaming Laptops

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, proudly announces the COLORFIRE MEOW R15 and MEOW R16 gaming laptops. Coming from the success and rising popularity of the COLORFIRE MEOW Series gaming desktop, the MEOW R15 and R16 gaming laptops are adorned with designs inspired by our beloved cat—Bobi. The laptop is littered with cat-inspired aesthetics from cat pawprints to the chic orange tabby cat color. The new MEOW Series gaming laptops are equipped with the latest AMD Ryzen 8000 Series processor designed for gaming, content creation, and entertainment. It also features the AMD Ryzen AI technology unlocking magical AI experiences.

Like a feline, the COLORFIRE MEOW R15 and R16 gaming laptops are fast and agile - swift in attacking enemies. Both laptops comes equipped with that new AMD Ryzen 7 8845HS processor with 8 cores and 16 threads, with a maximum boost clock of 5.1 GHz in a very efficient 45 W TDP power design. Designed for AI engine capabilities, its AMD Ryzen AI processor performance delivers up to 39 TOPS. For graphics, the MEOW R15 and MEOW R16 comes equipped with up to an NVIDIA GeForce RTX 4070 laptop GPU with up to 140 W maximum performance power.

ASUS Intros Radeon RX 7900 GRE DUAL OC and TUF Gaming Graphics Cards

ASUS today introduced its custom design Radeon RX 7900 GRE graphics cards for a wider product launch outside China. These include the RX 7900 GRE DUAL OC, and the TUF Gaming RX 7900 GRE OC. Given the nearly identical 260 W total board power (TBP) and ASIC pin-map of the RX 7900 GRE to the RX 7800 XT, ASUS appears to be reusing its RX 7800 XT custom-design board designs for these cards. The RX 7900 GRE DUAL OC features a 27.9 cm length, triple-slot thickness, and 13.39 cm height, and uses an aluminium fin-stack heatsink with two 100 mm Axial Tech fans—hence the name. There is no RGB lighting or other such frills to speak of, but you get dual-BIOS. The default P-BIOS runs the card at factory-overclocked 1927 MHz Game clock (vs. 1880 MHz reference); while the quieter Q-BIOS runs it at reference speeds, with a more tame fan profile.

The TUF Gaming RX 7900 GRE features the same version of the company's DirectCU III TUF Gaming cooling solution that the company uses with its RX 7800 XT TUF Gaming product, it's 31.9 cm in length, 3-slot thick, and 15 cm tall (about a 1 cm added due to the stub toward the tail-end). The cooler features a trio of 100 mm Axial Tech fans, and as is characteristic of TUF Gaming cooler designs, is well ventilated, exposing more of the heatsink underneath; than competing cooling solutions. You get a minimal amount of RGB lighting, in the form of a diffuser near the tail-end. You also get dual-BIOS, and a more pronounced factory OC than the DUAL OC card, with the P-BIOS enabling 1972 MHz Game clocks. The Q-BIOS again sticks to reference clocks for quieter fan settings. ASUS didn't release pricing, but given that both are factory-overclocked cards, we expect the RX 7900 GRE DUAL OC to be priced around the $570-mark; and the TUF Gaming OC at $600, if not more.

AMD Software Adrenalin 24.2.1 WHQL Released

AMD today released the latest version of AMD Software Adrenalin. Version 24.2.1 WHQL comes with optimization for "Skull and Bones," and "Nightingale." In case you're wondering where Radeon RX 7900 GRE support is; it's been around since July 2023 when the GPU was launched as a China-exclusive. With this release, AMD is also expanding the Vulkan API feature-set with new extensions as listed below. A large number of issues have been fixed with this release. To begin with; an intermittent driver-timeout issue seen with "Helldivers 2" on RX 7000 series GPUs has been addressed. Excessive stutter when playing several games, such as "Battlefield 2042," "Destiny 2," "Overwatch 2," "Monster Hunter: World," "PUBG: BATTLEGROUNDS," and "STAR WARS Battlefront II," has been fixed. Excessive game loading times with "Deathloop" on cards such as RX 6900 XT, has been fixed.

"Deadspace" crashing on some RX 6000 series cards with RTAO enabled, has been fixed. First launching "Enshrouded" or changing AA settings, causes an intermittent application crash, which has been fixed. Visual artifacts with the game have been also fixed. HDR settings failing to take effect with "Like A Dragon: Infinite Wealth" has been fixed. An intermittent driver-timeout with "Counterstrike 2" with FSR enabled on RX 7900 XTX, has been fixed. Incorrect reporting of graphics API as DirectX 12 in some Vulkan games has been fixed. Parsec host application experiencing a crash after reboot, has been fixed. Microsoft Teams displaying looped webcam footage on Ryzen 7 7840U has been fixed. Also fixed is a green tint noticed in Oculus Rift S with some RX 7000 series products. AFMF incorrectly displaying in hybrid GPU setups has been fixed—AFMF only works with a supported GPU is the display GPU.

DOWNLOAD: AMD Software Adrenalin 24.2.1 WHQL

GIGABYTE Announces Radeon RX 7900 GRE Gaming OC Graphics Card

GIGABYTE, a leading manufacturer of premium gaming hardware, today announced the new GIGABYTE AMD Radeon RX 7900 GRE graphics cards powered by AMD RDNA 3 architecture - the GIGABYTE Radeon RX 7900 GRE GAMING OC 16G graphics cards available for purchase on February 27, 2024. The GAMING OC graphics card, a classic and popular GIGABYTE graphics card, focuses on exceptional performance and stability. With the AMD Radeon RX 7900 GRE GPU and 16 GB of GDDR6 memory, it brings next-gen, immersive and high-refresh 1440p gaming and streaming experiences, with additional video memory to enable gamers to step into 4K.

The GIGABYTE Radeon RX 7900 GRE GAMING OC 16G graphics cards come with the WINDFORCE cooling system. The system includes three unique blade fans with alternate spinning, a copper plate that directly contacts the GPU, composite copper heat pipes, 3D active fans and screen cooling to maximize heat dissipation, ensuring the graphics cards operate at low temperatures while delivering outstanding performance. The alternate spinning technology rotates the central fan in the opposite direction of the other two fans, effectively dissipating heat from both the top and the bottom of the graphics card for more efficient cooling. The large copper plate makes direct contact with the GPU and VRAM. Coupled with the composite copper heat pipes, it provides excellent heat dissipation. Moreover, the handy onboard dual BIOS switch allows users to choose between OC and SILENT modes, offering the optimal settings tuned by GIGABYTE.

NVIDIA GH200 72-core Grace CPU Benched Against AMD Threadripper 7000 Series

GPTshop.ai is building prototypes of their "ultimate high-end desktop supercomputer," running the NVIDIA GH200 "Grace" CPU for AI and HPC workloads. Michael Larabel—founder and principal author of Phoronix—was first allowed to "remote access" a GPTshop.ai GH200 576 GB workstation converted model in early February—for the purpose of benchmarking it against systems based on AMD EPYC Zen 4 and Intel Xeon Emerald Rapids processors. Larabel noted: "it was a very interesting battle" that demonstrated the capabilities of 72 Arm Neoverse-V2 cores (in Grace). With this GPTshop.ai GH200 system actually being in workstation form, I also ran some additional benchmarks looking at the CPU capabilities of the GH200 compared to AMD Ryzen Threadripper 7000 series workstations."

Larabel had on-site access to two different Threadripper systems—a Hewlett-Packard (HP) Z6 G5 A workstation and a System76 Thelio Major semi-custom build. No comparable Intel "Xeon W hardware" was within reach, so the Team Green desktop supercomputer was only pitched against AMD HEDT processors. The HP review sample was configured with an AMD Ryzen Threadripper PRO 7995WX 96-core / 192-thread Zen 4 processor, 8 x 16 GB DDR5-5200 memory, and NVIDIA RTX A4000 GPU. Larabel said that it was an "all around nice high-end AMD workstation." The System76 Thelio Major was specced with an AMD Ryzen Threadripper 7980X processor "as the top-end non-PRO SKU." It is a 64-core / 128-thread part, working alongside 4 x 32 GB DDR5-4800 memory and a Radeon PRO W7900 graphics card.

Microsoft DirectX Team to Introduce "DirectSR" at GDC 2024

According to a Game Developers Conference (GDC) 2024 schedule page, Microsoft is planning to present next-gen technologies with their upcoming "DirectX State of the Union Ft. Work Graphs and Introducing DirectSR" presentation. Shawn Hargreaves, Direct3D's Development Manager and Austin Kinross (PIX Developer Lead, Microsoft) are scheduled to discuss matters with representatives from NVIDIA and AMD. Wessam Bahnassi, a "20-year veteran in 3D engine design and optimization," is Team Green's Principal Engineer of Developer Technology. Rob Martin, a Fellow Software Engineer, will be representing all things Team Red—where he leads development on implementations for GPU Work Graphs. According to GDC, the intended audience will be: "graphics developers or technical directors from game studios or engine companies."

Earlier this month, an "Automatic super resolution" feature was discovered in Windows 11 Insider Preview build (24H2)—the captioned part stated: "use AI to make supported games play more smoothly with enhanced details," although further interface options granted usage in desktop applications as well. Initial analysis and user impressions indicated that Microsoft engineers had created a proprietary model, separate from familiar technologies: NVIDIA DLSS, AMD FSR and Intel XeSS. It is interesting to note that Team Blue is not participating in the upcoming March 21 "DirectX State of the Union" panel discussion (a sponsored session). GDC's event description states (in full): "The DirectX team will showcase the latest updates, demos, and best practices for game development with key partners from AMD and NVIDIA. Work graphs are the newest way to take full advantage of GPU hardware and parallelize workloads. Microsoft will provide a preview into DirectSR, making it easier than ever for game devs to scale super resolution support across Windows devices. Finally, dive into the latest tooling updates for PIX."

Sapphire Announces Radeon RX 7900 GRE NITRO+, Pulse, and Pure

SAPPHIRE Technology announces the latest SAPPHIRE NITRO+ AMD Radeon RX 7900 GRE graphics card, crafted on the groundbreaking AMD RDNA 3 architecture designed to provide incredible performance to gamers and creators alike. Premium components and complex cooling designs enveloped in a Cold Rolled Steel Frame ensure a smooth, cool, and quiet gaming experience.

Experience strong and steady 4K gaming with the SAPPHIRE NITRO+ AMD Radeon RX 7900 GRE graphics card, engineered with expert cooling systems, top-notch components and a strong sleek design including SAPPHIRE PANTHEON features found on every NITRO+ product. The SAPPHIRE NITRO+ AMD Radeon RX 7900 GRE graphics card features 80 Compute Units and 5120 stream processors, a Boost Clock of up to 2391 MHz and a Game Clock of up to 2052 MHz. Enjoy breakthrough performance on the SAPPHIRE NITRO+ AMD Radeon RX 7900 GRE with 16 GB of GDDR6 high-speed memory clocked at up to 18 Gbps with 64 MB of AMD Infinity Cache technology. The graphics card is built with 2x HDMI 2.1 and 2x DisplayPort 2.1 ports to provide support for up to 4 output ports for a wide variety of monitors on the market.

[Editor's note: We've reviewed all three new cards today: Pulse, Pure, Nitro+]

PowerColor Launches Radeon RX 7900 GRE Series

TUL Corporation, a pioneering force in the manufacture of AMD graphics cards since 1997, proudly announces the launch of its groundbreaking AMD Radeon RX 7900 GRE series graphics cards. This new lineup, consisting of the Red Devil, Hellhound, and Fighter models, is engineered to redefine gaming excellence, delivering unmatched performance, cooling efficiency, and reliability for gamers and enthusiasts worldwide.

The PowerColor Red Devil AMD Radeon RX 7900 GRE graphics card, designed for the elite gamer, stands at the pinnacle of performance and aesthetics. Its advanced cooling system and robust design support significant overclocking, ensuring that gamers can push the limits of 1440p and beyond. The Red Devil is more than a graphics card, it's an emblem of power, crafted to help gamers capture every victory with style and performance.

AMD Announces Wider Launch of Radeon RX 7900 GRE, Adjusts Pricing of RX 7700 XT

AMD today announced wider availability of the Radeon RX 7900 GRE (Golden Rabbit Edition) graphics card. The card is now available in certain western markets including in Europe and North America; although AMD wouldn't call this a global launch. The card was originally designed as a limited edition product meant for the Chinese market, and has been available there since July 2023. The decision to launch the card in other markets may have been driven by NVIDIA's January launch of the GeForce RTX 4070 SUPER and RTX 4070 Ti SUPER, which have caused cascading price cuts among the older RTX 4070, RTX 4070 Ti; and AMD's RX 7800 XT, creating a rather big gap between this card and the RX 7900 XT, which is probably why AMD decided to launch the RX 7900 GRE at $550.

AMD carved the RX 7900 GRE from the "Navi 31" silicon powering the RX 7900 series, by disabling two MCDs (instead of disabling just one on the RX 7900 XT); which results in a 256-bit memory bus, which drives 16 GB of 18 Gbps GDDR6 memory, for 576 GB/s of memory bandwidth. The GCD sees 80 out of 96 compute units (CU) being enabled, for 5,120 stream processors, 320 TMUs, 160 AI accelerators, and 80 Ray accelerators. The card is configured with 160 out of 192 ROPs present on the silicon. The total board power (TBP) is set to 260 W, which is about the same as the RX 7800 XT; but there are 33% more shaders to go around. Several AMD board partners are expected to announce their custom RX 7900 GRE cards today, with market availability slated for tomorrow, February 27, 2024. Although AMD is known to have a reference design card, it is expected to be confined to the OEM/SI channel. In addition, AMD also cut the official MSRP of the RX 7700 XT to $419.

Our "launch" day reviews of the Radeon RX 7900 GRE include: Sapphire RX 7900 GRE NITRO+ | ASRock RX 7900 GRE Steel Legend | Sapphire RX 7900 GRE Pure | Sapphire RX 7900 GRE Pulse

AMD Radeon RX 7900 GRE To Launch Globally on February 27

AMD's Radeon RX 7900 GRE, or Golden Rabbit Edition, which was previously available only to the Chinese market, will launch globally on February 27. According to the leaked slides, the Radeon RX 7900 GRE will launch at $549, and AMD is comparing it to the NVIDIA GeForce RTX 4070 non-SUPER graphics card. In case you missed it, the AMD Radeon RX 7900 GRE is based on the Navi 31 XL GPU with 80 Compute Units (CUs), which leaves it with 5120 Stream Processors, and comes with 16 GB of 18 Gbps GDDR6 memory on a 256-bit memory interface, which adds up to a maximum bandwidth of 576 GB/s. The Radeon RX 7900 GRE should fit nicely between the Radeon RX 7900 XT and the Radeon RX 7800 XT.

According to the leaked slides, AMD is comparing the Radeon RX 7900 GRE against the NVIDIA GeForce RTX 4070 non-SUPER, which now shares the same price after the recent $50 price cut. According to AMD's own slides, the Radeon RX 7900 GRE should provide around 14 percent more performance per buck on average, and is between 1 and 32 percent faster, at least in games tested by AMD.

Supermicro Accelerates Performance of 5G and Telco Cloud Workloads with New and Expanded Portfolio of Infrastructure Solutions

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

Apple M2 Posts Single-Thread CPU-Z Bench Score Comparable to Intel Alder Lake

Apple's M-series chips frighten Intel, AMD, and Microsoft like nothing else can, as they have the potential to power MacBooks to grab a sizable share of the notebook market share. This is based squarely on the phenomenal performance/Watt on offer with Apple's chips. A user installed Windows 11 Arm on a virtual machine running on an M2-powered MacBook, opened up CPU-Z (which of course doesn't detect the chip since it's on a VM). They then ran a CPU-Z Bench session for a surprising result—a single-threaded score of 749.5 points, with a multithreaded score of 3822.3 points.

The single-thread score in particular is comparable to Intel's 12th Gen Core "Alder Lake" chips (their "Golden Cove" P-cores); maybe not on the fastest Core i9-12900K, but of the mid-range Core i5 chips, such as the i5-12600. It's able to do this at a fraction of the power and heat output. It is on the backs of this kind of IPC that Apple is building bigger chips such as the M3 Pro and M3 Max, which are able to provide HEDT or workstation-class performance, again, at a fraction of the power.

Qualcomm Snapdragon 8cx Gen 3 Put Through CPU-Z Bench

Qualcomm Snapdragon 8cx Gen 3 is a high performance Arm SoC designed to compete with Apple M3, with Windows 11 thin and light notebooks and Chromebooks being its main target devices. Microsoft pins a lot of hope in chips such as the Snapdragon 8cx series as they offer comparable performance and battery life to the current crop of M3 MacBooks. A lot of water has flown under the bridge since Windows RT, and the latest crop of Windows 11 for Arm has a much wider PC application support base thanks to official translation layers by Microsoft. CPUID has an Arm64 version of the popular CPU-Z utility, which correctly detects all the specs of the Snapdragon 8cx, but more importantly, has a Bench tab that can test the single- and multithreaded performance of the CPU.

A Chinese tech enthusiast wasted no time in putting the Snapdragon 8cx through this CPU-Z internal benchmark, and found surprisingly good performance numbers. The single-threaded bench, which loads one of chip's four Arm Cortex-X1C P-cores, registers a score of 543.7 points. This is roughly comparable to that of the AMD "Zen 2" or Intel "Comet Lake" x86-64 core. The multithreaded test, which saturates all four P-cores, and all four Cortex-A78C E-cores, springs up 3479.7 points, which again compares to entry/mainstream x86-64 processors from AMD or Intel. Not impressed? How about the fact that the Snapdragon 8cx Gen 3 is a 7 W chip that idles under 2 W for the most part, and can make do with passive cooling, posting scores comparable to 35 W x86 chips that need active cooling?

MSI Intel and AMD Motherboards Now Fully Support Up to 256GB of Memory Capacity

By the end of 2023, MSI unveiled its groundbreaking support for memory capacities of up to 256 GB. Now, both MSI Intel and AMD motherboards official support these capacities, with 4 DIMMs enabling 256 GB and 2 DIMMs supporting 128 GB. This advancement enhances multitasking capabilities and ensures seamless computing operations.

Intel Motherboard - 700 & 600 Series Platform, BIOS Rolling Out
The supported platforms for this memory capacity enhancement include Intel 700 and 600 series DDR5 motherboards. Gamers looking to benefit from these enhancements will need to upgrade to the own dedicated BIOS. MSI is currently diligently working on releasing the BIOS, with the first batch already available below. The rest of the models will be released in late February and March.

NVIDIA Expects Upcoming Blackwell GPU Generation to be Capacity-Constrained

NVIDIA is anticipating supply issues for its upcoming Blackwell GPUs, which are expected to significantly improve artificial intelligence compute performance. "We expect our next-generation products to be supply constrained as demand far exceeds supply," said Colette Kress, NVIDIA's chief financial officer, during a recent earnings call. This prediction of scarcity comes just days after an analyst noted much shorter lead times for NVIDIA's current flagship Hopper-based H100 GPUs tailored to AI and high-performance computing. The eagerly anticipated Blackwell architecture and B100 GPUs built on it promise major leaps in capability—likely spurring NVIDIA's existing customers to place pre-orders already. With skyrocketing demand in the red-hot AI compute market, NVIDIA appears poised to capitalize on the insatiable appetite for ever-greater processing power.

However, the scarcity of NVIDIA's products may present an excellent opportunity for significant rivals like AMD and Intel. If both companies can offer a product that could beat NVIDIA's current H100 and provide a suitable software stack, customers would be willing to jump to their offerings and not wait many months for the anticipated high lead times. Intel is preparing the next-generation Gaudi 3 and working on the Falcon Shores accelerator for AI and HPC. AMD is shipping its Instinct MI300 accelerator, a highly competitive product, while already working on the MI400 generation. It remains to be seen if AI companies will begin the adoption of non-NVIDIA hardware or if they will remain a loyal customer and agree to the higher lead times of the new Blackwell generation. However, capacity constrain should only be a problem at launch, where the availability should improve from quarter to quarter. As TSMC improves CoWoS packaging capacity and 3 nm production, NVIDIA's allocation of the 3 nm wafers will likely improve over time as the company moves its priority from H100 to B100.

Sons of the Forest Implements FSR 3, Growing Support to 15 Titles

"Sons of the Forest" is an open-world survival horror game, in which you are cast away on a remote island with a dangerous forest and cave network, and have to find the means to survive and thrive. This isn't Far Cry, there are no missions as such, you craft your own journey of survival against hostile weather, wildlife, cannibalistic tribes, hunger, and disease. The overarching story is that you're sent on a remote island to find a missing billionaire. The game just released yesterday, and is a sequel to the 2014 title "The Forest." This is one of the first titles to support AMD FSR 3 at launch, including frame generation.

Consequently, FSR 3 Support has grown to 15 titles. AMD's answer to NVIDIA DLSS 3 Frame Generation, FSR 3 nearly doubles performance in games using a proprietary interpolation technology. The list of titles featuring FSR 3 include Forspoken, Immortals of Aveum, Avatar: Frontiers of Pandora, Like a Dragon Gaiden: The Man Who Erased His Name, MotorCubs RC, Call of Duty Modern Warfare III & Warzone, Farming Simulator 22, The Talos Principle 2, Estencel, Mortal Online 2, Like a Dragon: Infinite Wealth, Starship Troopers: Extermination, The Thaumaturge, Starfield, and now Sons of the Forest. The list is expected to grow as AMD works to bring back Anti-Lag+, a whole-system latency reduction technology, which was also a vital component of FSR 3.

AMD's Dr. Lisa Su to Deliver Opening Keynote at Computex 2024

COMPUTEX 2024, a global leading technology exhibition, featuring AIoT applications, generative AI & and startup ecosystems, will take place from June 4th to 7th at the Taipei Nangang Exhibition Center Halls 1 and 2. Themed "Connecting AI," this year's exhibition focuses on the latest global AI technologies and industry trends. The show will attract 1,500 international and local exhibitors using 4,500 booths. The Opening Keynote will be delivered by Dr. Lisa Su, Chair and CEO of AMD, on the morning of June 3rd to set the stage for the event.

COMPUTEX 2024: Global Tech Giants Unite, Paving the Way for the Era of the AI Ecosystem
2024 is acclaimed as the AI PC era, with the development of artificial intelligence propelling products like AI PCs, AI servers, and AI smartphones to thrive in the market. This year's COMPUTEX covers six major themes: AI computing, Advanced Connectivity, Future Mobility, Immersive Reality, Sustainability, and Innovations. Collaborating with international technology powerhouses, including Acer, ASRock, ASUS, Delta, Gigabyte, G.Skill, Intel, MSI, Pro Gamersware, and more, shapes the AI ecosystem. Moreover, the InnoVEX exhibit for startups will connect innovative teams from around the globe, sparking cross-industry collaboration and revitalizing AI technology with fresh energy.

Intel to Make its Most Advanced Foundry Nodes Available even to AMD, NVIDIA, and Qualcomm

Intel CEO Pat Gelsinger, speaking at the Intel Foundry Services (IFS) Direct Connect event, confirmed to Tom's Hardware that he hopes to turn IFS into the West's premier foundry company, and a direct technological and volume rival to TSMC. He said that there is a clear line of distinction between Intel Products and Intel Foundry, and that later this year, IFS will be more legally distinct from Intel, becoming its own entity. The only way Gelsinger sees IFS being competitive to TSMC, is by making its most advanced semiconductor manufacturing nodes and 3D chip packaging innovations available to foundry customers other than itself (Intel Products), even if it means providing them to companies that directly compete with Intel products, such as AMD and Qualcomm.

Paul Alcorn of Tom's Hardware asked CEO Gelsinger "Intel will now offer its process nodes to some of its competitors, and there may be situations wherein your product teams are competing directly with competitors that are enabled by your crown jewels. How do you plan to navigate those types of situations and maybe soothe ruffled feathers on your product teams?" To this, Gelsinger responded "Well, if you go back to the picture I showed today, Paul, there are Intel products and Intel foundry, There's a clean line between those, and as I said on the last earnings call, we'll have a setup separate legal entity for Intel foundry this year," Gelsinger responded. "We'll start posting separate financials associated with that going forward. And the foundry team's objective is simple: Fill. The. Fabs. Deliver to the broadest set of customers on the planet."

Bethesda Celebrates Starfield FSR 3.0 Update with Graphics Card + Processor Collector's Edition Giveaway

Bethesda on February 20 released the 1.9.67 path update for Starfield, which adds support for AMD FSR 3.0 performance enhancement, including frame generation. To celebrate this update, the game's developers are giving away an ultra-rare Collector's Edition bundle of Starfield-themed flagship AMD hardware. The bundle includes an AMD Radeon RX 7900 XTX with a special paint-job; and an AMD Ryzen 7 7800X3D, which remains the fastest desktop processor for gaming. The RX 7900 XTX Starfield Collector's Edition card features a special cooler shroud and backplate design with design elements from the game; including some anodized aluminium fins in its heatsink in the game's colors. The Giveaway is open to residents of the US, Canada (excluding Quebec), Mexico, the UK, the Netherlands, Belgium, and Luxembourg. You don't need to purchase the game or any AMD hardware to be eligible. Simply follow the Starfield Twitter account, and reply to the Giveaway announcement tweet. One winner will be randomly chosen. Find all Giveaway rules here.
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