During the recent IEDM conference, TSMC previewed its process roadmap for delivering next-generation chip packages packing over one trillion transistors by 2030. This aligns with similar long-term visions from Intel. Such enormous transistor counts will come through advanced 3D packaging of multiple chipsets. But TSMC also aims to push monolithic chip complexity higher, ultimately enabling 200 billion transistor designs on a single die. This requires steady enhancement of TSMC's planned N2, N2P, N1.4, and N1 nodes, which are slated to arrive between now and the end of the decade. While multi-chipset architectures are currently gaining favor, TSMC asserts both packaging density and raw transistor density must scale up in tandem. Some perspective on the magnitude of TSMC's goals include NVIDIA's 80 billion transistor GH100 GPU—among today's largest chips, excluding wafer-scale designs from Cerebras.

Yet TSMC's roadmap calls for more than doubling that, first with over 100 billion transistor monolithic designs, then eventually 200 billion. Of course, yields become more challenging as die sizes grow, which is where advanced packaging of smaller chiplets becomes crucial. Multi-chip module offerings like AMD's MI300X and Intel's Ponte Vecchio already integrate dozens of tiles, with PVC having 47 tiles. TSMC envisions this expansion to chip packages housing more than a trillion transistors via its CoWoS, InFO, 3D stacking, and many other technologies. While the scaling cadence has recently slowed, TSMC remains confident in achieving both packaging and process breakthroughs to meet future density demands. The foundry's continuous investment ensures progress in unlocking next-generation semiconductor capabilities. But physics ultimately dictates timelines, no matter how aggressive the roadmap.

Even as NVIDIA inches close to the launch of its RTX 40-series SUPER graphics cards in January, AMD could be preparing a product stack update of its own. While NVIDIA's refresh focuses on the higher end of its lineup, AMD looks to spread out more into the mainstream-performance segments. A regulatory filing with the Eurasian Economic Commission mentions the terms "RX 7600 XT," "RX 7700," and "RX 7800," which fill gaps between the RX 7600, RX 7700 XT, and RX 7800 XT.

There exists a rather big gap between the $230 Radeon RX 7600 and the $450 RX 7700 XT, which AMD is looking to fill with the RX 7600 XT and RX 7700 (non-XT). How AMD goes about carving out these two will be interesting to see. The RX 7600 already maxes out the 6 nm "Navi 33" silicon that it's based on, which means to create the RX 7600 XT, AMD might have to tap into the larger (and much more expensive) "Navi 32" MCM. There is a vast gap between the 32 CU (compute units) available to the RX 7600, and the 54 CU that the RX 7700 XT has (while the silicon itself has 60). Besides CU count, AMD has other levers, such as the MCD (memory cache die) count, which could be down to just 2 for the RX 7600 XT, or 3 for the RX 7700. The Radeon RX 7800 is a different beast. AMD faced quite some flack for positioning the RX 7700 XT within $50 of the RX 7800 XT, and now the former can be had for a street price of roughly $430. To be able to squeeze the RX 7800 between the two, AMD might need to widen the gap by pushing the RX 7700 XT down.

Bluesky Frame Rate Converter is a nifty little free utility that lets you change the frame-rate of video files. At an operational level, this is a DirectShow filter with its own little control panel. Its author clearly knows his way around GPU acceleration for video encode and decode, and regularly updates it with new features. Version 4.6.0, released on December 23, introduces support for AMD Fluid Motion Video technology, making it one of the first applications to do so. With this, you can double the frame-rates of your videos, taking advantage of AMD's new feature that can extend frame rate doubling via interpolation to video playback or transcoding. To use it, you'll need a Radeon RX 6000 or RX 7000 series GPU, Windows 11 or Windows 10, and Adrenalin 23.12.1 (or later) graphics drivers. You can find Bluesky Frame Rate Converter in the source link below.

ASUS updated its AMD Radeon graphics card lineup with the introduction of the Radeon RX 7800 XT Dual OC and RX 7700 XT Dual OC. This is an interesting development, given that the company only had TUF Gaming series custom-designs of the two GPUs at their early September 2023 launch. The company continues to lack any ROG Strix series products based on the RX 7800 XT, RX 7700 XT, and the RX 7900 series. The two new Dual OC series cards are positioned below the TUF Gaming products, and predictably, share a common board design for the RX 7800 XT Dual OC and the RX 7700 XT Dual OC.

The new Dual OC common board for the RX 7800 XT and RX 7700 XT is just about 2 slots thick (or 2.2 slots to be specific). It is 27.9 cm long, and 13.39 cm tall, or about an inch taller than what constitutes "full height." Its cooler features an aluminium fin-stack heatsink that's ventilated by two 100 mm Axial Tech fans backed by dual ball bearings, webbed impellers, and idle fan-stop. The card draws power from two 8-pin PCIe power connectors. With its OC Mode enabled (via software), the RX 7800 XT Dual OC offers a Game clock of 2254 MHz and 2565 MHz Boost clock (vs. 2124/2430 MHz reference). The RX 7700 XT Dual OC, on the other hand, offers 2239 MHz Game clock and 2599 MHz Boost clock with its OC Mode enabled (vs. 2171/2544 MHz reference). The company didn't reveal pricing.

AMD FidelityFX Super Resolution (FSR) is easy to integrate with games, which also makes the tech a hot commodity within the modding community. LukeFZ figured out a way to get any game with a working FSR 2 implementation to be modified to support FSR 3, which should bring features such as improved image quality among the quality presets; and frame generation. LukeFZ has been behind several such game mods, some free and some paid, one of his community members leaked a bundle of all his paid mods, including one that modifies any game to take advantage of FSR 3. Called simply the FSR2FSR3 mod by LukeFZ, this mod is tested to work correctly on the following games: The Last of Us Part I, Dead Space (2023), Hogwarts Legacy, MS-Man Remastered, UNCHARTED: Legacy of Thieves, HITMAN World of Assassination, Ratchet & Clank: Rift Apart, Remnant II, Cyberpunk 2077, Alan Wake 2, Dying Light 2, Watch Dogs: Legion, Metro Exodus Enhanced, STAR WARS Jedi: Survivor, Ready Or Not, and Assassin's Creed Mirage. You can find the mod in the source link below.

ASUS over the weekend introduced the China-exclusive Radeon RX 7900 GRE TUF Gaming White graphics card. The card shares a lot in common with the other RX 7900 series TUF Gaming custom-design cards, but swaps out the gunmetal-gray cooler shroud and backplate combo for one that's matte white. The whitewash even extends to the impellers of the three Axial Tech fans. The PCB remains black, but due to the 3-D design of the shroud and backplate, is largely concealed. The card draws power from a pair of 8-pin PCIe power connectors, and uses a 14-phase VRM to condition it for the "Navi 31 XL" ASIC.

The Radeon RX 7900 GRE (golden rabbit edition) is based on a "Navi 31 XL," a unique package that combines the 5 nm graphics compute die (GCD) of "Navi 31," with the 4-MCD (memory cache die) setup of the smaller "Navi 32" package. AMD designed this primarily to drive the mobile RX 7900 series SKUs, but it found its way to the desktop platform to fill the gap between the RX 7800 XT and RX 7900 XT, and possibly undercut the GeForce RTX 4070 Ti. It is configured with 80 out of 96 available compute units on the GCD, giving it 5,120 stream processors, 160 AI accelerators, and 80 Ray accelerators, the Infinity Cache size is reduced to 64 MB, since there are only 4 MCDs, driving its 256-bit memory bus that handles 16 GB of 18 Gbps GDDR6 memory (576 GB/s bandwidth).

Hot on the heels of LG's UltraGear 4K OLED monitor with Dual-Hz feature, specifications and pictures of the upcoming HP OMEN Transcend 4K OLED monitor have leaked online. It will come with 32-inch 4K OLED panel with 240 Hz refresh rate and peak brightness of 1000 nits in HDR mode. The monitor will feature HP's Omen Tempest Cooling Tech to mitigate the risk of burn-in problems, as well as support for AMD FreeSync and Dolby Vision.

The rest of the known specifications, reported by Windows Report, include KVM switch, a feature that is quite popular in monitors these days, as well as HDMI 2.1 and DisplayPort 2.1 support. It also includes several other USB Type-C and Type-A ports. The monitor is expected to be the star of HP's OMEN CES 2024 lineup.

AMD is preparing to update its desktop processor lineup not just with new Ryzen 8000G series APUs for the Socket AM5 platform, but also a handful new SKUs for AM4. Possible pricing of many of these chips is detailed in our recent report. Among the chips listed is a mysterious new Ryzen 7 5700 Socket AM4 processor. Although we don't have its pricing, AMD sneakily put up its product information on its website. On the product page, the company says that the product came out in April 2022, but it never did, at least not in the retail channel.

The Ryzen 7 5700 is an 8-core/16-thread processor that lacks integrated graphics, and yet is based on the 7 nm "Cezanne" monolithic silicon, with similar clock speeds to the Ryzen 7 5700G APU. Think of this as the 5700G with its iGPU disabled. The chip comes with a CPU base frequency of 3.70 GHz compared to the 3.80 GHz of the 5700G, although the two have an identical maximum boost frequency of 4.60 GHz. Each of the eight "Zen 3" CPU cores has 512 KB of dedicated L2 cache, and share a 16 MB L3 cache. The processor's TDP is set to 65 W, and the retail package includes a Wraith Stealth cooling solution. One pitfall of choosing the 5700 over something like the 5700X would be its lack of a PCIe Gen 4 interface (it's limited to the older Gen 3), which would mean a slower NVMe storage sub-system.

Courtesy of serial leaker @momomo_us we now have an indication on potential pricing for AMD's upcoming 8000G-series of APUs for the AM5 socket. The Ryzen 8000G-series APUs are expected to use the same CPU cores as AMD's Zen 4 based Ryzen 7000-series CPUs, but paired with a new I/O design in a monolithic die. The leaker has provided pricing from what is said to be three different shops and for three different SKUs, with the Ryzen 5 7600 as the reference point in all three cases. All three shops list the Ryzen 5 7600 at a higher price than Amazon, so it's unlikely that we're looking at MSRP pricing here.

The Ryzen 5 8500G has a price range of US$190-240, followed by the Ryzen 5 8600G which comes in at US$240-310 and finally the Ryzen 7 8700G which is listed at US$340-440. The price span is rather large, which makes it impossible to draw any conclusions of what the MSRP will be. Tom's hardware managed to dig up a pair of retailers, including what appears to be the one with the lowest pricing in the leak, which is DirectDial. The other retailer that Tom's Hardware located was Zones, but that pricing doesn't match any of the initial leaks, but are somewhat towards the higher numbers. AMD is expected to announce the new series of APUs at CES early next year.

AMD continues to release new Ryzen 5000 series processor models for the Socket AM4 platform to this day, with new processors expected to launch next month. That's over 6 years of longevity for the platform, considering that AMD has extended official Ryzen 5000 series support all the way back to its first line of AM4 motherboards based on the 300-series chipset. The company plans a similar longevity for Socket AM5. In an interview with Overclockers UK, AMD's client channel business head David McAfee said "I think that we certainly recognized that the longevity of the AM4 platforms was one of the biggest reasons that led to the success of Ryzen and as we think and as we think about the future, 2025 and beyond, that decision to move to a next-generation of socket is one that's going to be really thought through really really carefully. We know the impact that moving to a new socket brings and we want to stay on AM5 for as long as we possibly can. We are firmly committed to 2025 and beyond and we will see how long that promise lasts beyond 2025."

AMD Socket AM5 is designed to deliver up to 230 W of package power, and has a contemporary I/O that includes a dual-channel DDR5 memory interface (4x 40-bit sub-channels); and 28 PCIe Gen 5 lanes (x16 PEG, two x4 NVMe, and x4 chipset bus), besides the usual SoC connectivity. With the upcoming Ryzen 8000G "Phoenix" APUs, we could expect to see that the socket even wires out modern display I/O such as DisplayPort 2.1 with USB type-C, and the bandwidth for 12-bit HDR up to 68 billion colors. AMD debuted Socket AM5 with the "Zen 4" microarchitecture, with "Zen 5" expected to launch in 2024. It's conceivable that the company's 2025 client architecture, "Zen 6," could also see its desktop presence on AM5, given that DDR5 memory and PCIe Gen 5 will remain relevant till at least that time.

Mini PC designer Geekom is bring three innovative desktops to the 2024 International CES, based on the very latest mobile processors by Intel and AMD. These boxes are hinged on MoDT (mobile on desktop) hardware, meaning that energy efficient mobile processors are crammed into compact desktop cases, and wired out with all the connectivity they can put out. The three mini PC models Geekom is launching includes the IT14 Pro, the A8 Max, and the APro8 Max. The Geekcom IT14 Pro comes in a 0.7-liter chassis (about the size of a NUC), and is powered by an Intel Core Ultra 7 155H "Meteor Lake" processor configured with 6P+8E+2LP cores, or 16-core/22-thread. The desktop relies entirely on the maxed out Arc iGPU with all its 8 Xe cores enabled (128 EU). The NPU is also enabled. The company didn't reveal the memory, storage, or WLAN configuration of this desktop, yet.

The A8 Max is based on a similar 1-liter class chassis, but uses an AMD Ryzen 7 8840HS or Ryzen 9 8940HS "Hawk Point" processor, both of which are 8-core/16-thread "Zen 4," and configured with the full Radeon 780M iGPU available (12 CU or 768 stream processors). The star attraction here is the updated Ryzen AI NPU, which drives up the AI inference performance of these chips to 39 TOPS, compared to 34 TOPS of the Intel "Meteor Lake" chips. The APro8 Max is a based on a physically larger chassis that looks a bit like a game console. It's based on mostly the same hardware as the A8 Max, but with an added Radeon RX 7600M XT discrete GPU, which should give it the ability to offer maxed out AAA gaming at 1080p, or power productivity workloads at 4K UHD. We shoud know more about these three in Vegas next month.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly announces that GIGABYTE DDR5 motherboards deliver breakthrough support for a memory capacity of single DIMM 64 GB with the latest Kingston FURY Renegade DDR5 memory. The 4DIMM model boosts the memory capacity up to 256 GB, while the 2DIMM model has a maximum capacity of up to 128 GB.⁠

With innovative layout design and top-notch components, GIGABYTE motherboards have played a leading role in memory performance. From the Intel 700 and 600 series to the AMD 600 series, GIGABYTE DDR5 motherboards will support a memory capacity of single DIMM 64 GB through BIOS update. The updated BIOS and memory support list will be available on the GIGABYTE official website, coinciding with the launch of the latest Kingston FURY Renegade DDR5 memory. Please stay tuned to the GIGABYTE official website for further information.

An interesting development in the performance segment of graphics cards is price adjustments among SKUs such as the AMD Radeon RX 7700 XT and NVIDIA GeForce RTX 4060 Ti. The RX 7700 XT was spotted at a new low price of $399 by VideoCardz. At this price, the card ends up at least $40 below the lowest price we could find on Newegg for the RTX 4060 Ti 16 GB, and about the same price as its 8 GB variant. This is an interesting development, as the RX 7700 XT is a significantly faster GPU than the RTX 4060 Ti in our testing, posting 14% higher performance on average than the RTX 4060 Ti 8 GB, and 13% higher than the RTX 4060 Ti 16 GB at 1080p, with the NVIDIA cards only beating it by 1-2% in ray tracing workloads, in our testing. The specific custom RX 7700 XT selling for $399 is an ASRock RX 7700 XT Challenger OC, which is listed on Newegg for $449, but with a coupon code that shaves $50 off.

AMD (NASDAQ: AMD) has been notified of a "mini-tender" offer by TRC Capital Investment Corporation ("TRC Capital"). Pursuant to the offer, which is dated Dec. 11, 2023, TRC Capital is offering to purchase up to 1 million shares of AMD common stock, which represents approximately 0.06% of its outstanding shares. AMD cautions its stockholders that TRC Capital's unsolicited "mini-tender" offer of $123.45 per share is approximately 4.24% below the $128.92 per share closing price of AMD stock on Dec. 8, 2023, the day before the "mini-tender" offer was commenced and approximately 11.12% below the $138.90 per share closing price of AMD stock on Dec. 18, 2023.

AMD recommends against tendering shares in response to this unsolicited below-market offer. AMD does not in any way recommend or endorse the TRC Capital "mini-tender" offer, and AMD is in no way associated with TRC Capital, the "mini-tender" offer or the offer documentation. "Mini-tender" offers seek less than 5% of a company's outstanding shares thereby avoiding many procedural and disclosure requirements of the Securities and Exchange Commission (SEC) because they are below the SEC's threshold to provide such disclosure and procedural protections for investors.

Microsoft Xbox Series X/S, their hardware refreshes, and variants, will reportedly be the company's mainstay all the way up until 2028, the company disclosed in its documents filed as part of its anti-trust lawsuit with the FTC. In a presentation slide titled "From "Zero Microsoft" to "Full Microsoft," the company explains how its next gen Xbox, scheduled for calendar year (CY) 2028, will see a full convergence of Microsoft co-developed hardware, software, and cloud compute services, into a powerful entertainment system. It elaborates on this in another slide, titled "Cohesive Hybrid Compute," where it states the company's vision to be the development of "a next generation hybrid game platform capable of leveraging the combined power of the client and cloud to deliver deeper immersion and entirely new classes of game experiences."

From the looks of it, Microsoft fully understands the creator economy that has been built over the gaming industry, and wants to develop its next-gen console to target exactly this—a single device from which people can play, stream, and create content from—something that's traditionally reserved for gaming desktop PCs. Game streamers playing on consoles usually have an entire creator PC setup handling the production and streaming side of things. Keeping this exact use-case in mind, Microsoft plans to "enable new levels of performance beyond the capabilities of the client hardware alone," by which it means that not only will the console rely on its own hardware—which could be jaw-dropping powerful as you'll see—but also leverage cloud compute services from Microsoft.

Market research by Korean publication Danawa DPG provides valuable insights to how desktop AMD Ryzen processor users are charting their upgrade paths given the long upgrade longevity of AMD sockets. The research follows a 10-month date range from December 2022 to October 2023, and tracks the sales of motherboards based on various AMD chipset models. We're shown that toward the turn of the year, AMD B550 chipset motherboards sell the most. This is when AMD Ryzen 5000 Socket AM4 processors top sales for the company, Given that the B550 fully supports CPU overclocking, and that there are plenty of feature-packed B550 motherboard models, it explains why the B550 covers a wide price-band.

AMD launched the Ryzen 7000 series "Zen 4" to lukewarm response in September 2022, mainly because the platform lacked DDR4 memory support that was relevant at the time, and hence wasn't as flexible to consumers as Intel's LGA1700. Its launch caused price-cuts for Ryzen 5000 series processors, clearing out some upgrade headroom for those on the AM4 platform still using Ryzen 3000. Off to a slow start, we see its successor from Socket AM5, the B650 chipset, rise steadily over the time period, and for two reasons—DDR5 memory became affordable over the course of 2023; and AMD breathed life into the Ryzen 7000 series with the introduction of the Ryzen 7000X3D series, which restored gaming performance competitiveness to Intel's 13th Gen Core "Raptor Lake." The B650 has everything you need right now for a Ryzen 7000X3D build, given that both the GeForce RTX 40-series and Radeon RX 7000 series are PCIe Gen 4 graphics cards; and that the B650 has at least a Gen 5 NVMe slot. If you absolutely need a Gen 5 x16 slot, there's the premium B650E chipset to go with.

The Ryzen 7040 Series processor in Framework Laptop 16 is capable of running at a sustained 45 W TDP (Thermal Design Power) and we put together an excellent thermal solution to ensure it can do that while keeping CPU temperature, touch temperatures, and fan noise to a minimum. That 45 watts of CPU power needs to be efficiently conducted into the vapor chamber, heatpipes, and fins to be carried away through airflow from the fans.

Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.

AMD last week released the FSR 3 source code to public through its GPUOpen initiative, and the modding community wasted no time in bringing the feature to popular games such as "The Last of Us: Part 1," and now, "Cyberpunk 2077." CD Projekt Red will probably bring official FSR 3 support to the game at some point, but for those who can't wait, there's DLSS3-to-FSR3 by Nukem9. Put simply, this is a DLSS 3 DLL that you replace your game's DLSS 3 library file with; which gets the game to use FSR 3 instead of DLSS 3 Frame Generation.

The latest version of DLSS3-to-FSR3 adds "Cyberpunk 2077" support, and there's an extensive guide written by AndreasLyUs on Reddit, on how to integrate it with your "Cyberpunk 2077" installation, so you can enable FSR 3. Neegzm on YouTube, published a video review on how FSR 3 mods for "Cyberpunk 2077" look and perform compared to DLSS 2. You can expect a frame-rate jump from 25 FPS with DLSS 2 Quality to 47 FPS with FSR 3 enabled. The FSR 3 mod should be particularly useful for those on older NVIDIA RTX 30-series "Ampere" GPUs, or all Radeon RX 6000 and RX 7000 GPUs. Those on RTX 40-series can just take advantage of the official DLSS 3 Frame Generation support to see comparable frame-rates.

AMD's upcoming server processor, the 5th Gen EPYC "Turin," has been pictured as an engineering sample is probably being evaluated by the company's data-center or cloud customers. The processor has a mammoth core-count of 192-core/384-thread in its high-density cloud-focused variant that uses "Zen 5c" CPU cores. Its regular version that uses larger "Zen 5" cores that can sustain higher clock speeds, also comes with a fairly high core-count of 128-core/256-thread, up from the 96-core/192-thread of the "Zen 4" based EPYC "Genoa."

The EPYC "Turin" server processor based on "Zen 5" comes with an updated sIOD (server I/O die), surrounded by as many as 16 CCDs (CPU complex dies). AMD is expected to build these CCDs on the TSMC N4P foundry node, which is a more advanced version of the TSMC N4 node the company currently uses for its "Phoenix" client processors, and the TSMC N5 node it uses for its "Zen 4" CCD. TSMC claims that the N4P node offers an up to 22% improvement in power efficiency over N5, as well as a 6% increase in transistor density. Each of the "Zen 5" CCDs is confirmed to have 8 CPU cores sharing 32 MB L3 cache memory. A total of 16 such CCDs add up to the processor's 128-core/256-thread number. The high-density "Turin" meant for cloud data-centers, is a whole different beast.

ASRock is announcing the support of 64 GB DDR5 memory module across Intel 700 Series and AMD AM5 Series motherboards. This enhancement boosts the maximum memory capacity to 256 GB with 4 DIMMs, offering increased performance and compatibility for enthusiasts. Additionally, we are committed to expanding support for the 64 GB DDR5 memory module across more motherboards with various chipsets, enhancing productivity for memory-intensive multitasking applications.

Here is our first look at the higher end of AMD's Ryzen 8000G series Socket AM5 desktop APU lineup. The company is planning to bring its 4 nm "Phoenix" and "Phoenix 2" monolithic silicon to the socketed desktop platform, to cover two distinct markets. Models based on the larger "Phoenix" silicon cater to the market that wants a sufficiently powerful CPU, but with a powerful iGPU that's fit for entry-level gaming, or graphics-intensive productivity tasks; whereas the smaller "Phoenix 2" silicon ties up the lower end of AMD's AM5 desktop processor stack, as it probably has a lower bill of materials than a "Raphael" multi-chip module.

The lineup is led by the Ryzen 7 8700G, a direct successor to the Ryzen 7 5700G "Cezanne." This chip gets the full 8-core/16-thread "Zen 4" CPU, along with its 16 MB shared L3 cache; and the full featured Radeon 780M iGPU with its 12 compute units worth 768 stream processors. The CPU features a maximum boost frequency of 4.20 GHz. This is followed by the Ryzen 5 8600G, which is based on the same "Phoenix" silicon as the 8700G, but with 6 out of 8 "Zen 4" cores enabled, and a maximum CPU boost frequency of 4.35 GHz, and the 16 MB L3 cache left untouched. It's likely that the Radeon 780M is unchanged from the 8700G.Update 13:59 UTC: A CPU-Z screenshot of the Ryzen 7 8700G surfaced, which confirms that it features the maxed out Radeon 780M iGPU

Yesterday, Intel unveiled its latest Xeon data center processors, codenamed Emerald Rapids, delivering the new Xeon Platinum 8592+ flagship SKU with 64 cores and 128 threads. Packed into its fresh silicon, Intel promises boosted performance and reduced power hunger. The comprehensive tech benchmarking website Phoronix essentially confirms Intel's pitch. Testing production servers running the new 8592+ showed solid gains over prior Intel models, let alone older generations still commonplace in data centers. On average, upgrading to the 8592+ increased single-socket server performance by around 23.5% compared to the previous generation configs of Sapphire Rapid, Xeon Platinum 8490H. The dual-socket configuration records a 17% boost in performance.

However, Intel is not in the data center market by itself. AMD's 64-core offering that Xeon Platinum 8592+ is competing with is AMD EPYC 9554. The Emerald Rapids chip is faster by about 2.3%. However, AMD's lineup doesn't stop at only 64 cores. AMD's Genoa and Genoa-X with 3D V-cache top out at 96 cores, while Bergamo goes up to 128 cores. On the power consumption front, the Xeon Platinum 8592+ was pulling about 289 Watts compared to the Xeon Platinum 8490H average of 306 Watts. At peak, the Xeon Platinum 8592+ CPU managed to hit 434 Watts compared to the Xeon Platinum 8490H peak of 469 Watts. This aligns with Intel's claims of enhanced efficiency. However, compared to the 64-core counterpart from AMD, the EPYC 9554 had an average power consumption of 227 Watts and a recorded peak of 369 Watts.

AMD on Thursday announced the first release of FidelityFX Super Resolution 3 (FSR 3) source code through the company's GPUOpen initiative. The company just set up an FSR 3 source code repo on GitHub that game devs everywhere can take advantage of. This includes the complete source for DirectX 12, and the source of an FSR 3 Unreal Engine 5 plugin. With it, the company also released extensive documentation that helps developers understand the inner workings of FSR 3, so they could better integrate the tech with their games and applications. With this announcement, AMD also unveiled FSR 3 support for even more new and upcoming games, which include "Black Myth: Wukong," the three latest titles from the "Warhammer" franchise, including "Darktide," "Space Marine II," and "Realms of Ruin;" "Starfield," "Pax Dei," and "Crimson Desert."

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is excited today to showcase the best graphics card and motherboard combo for work efficiency and home entertainment.

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