For the first time in its storied legacy, John Marston's beloved journey can be experienced on PC in stunning, new detail, with both Red Dead Redemption and its iconic zombie-horror companion story, Undead Nightmare, arriving to PC on October 29. In collaboration with Double Eleven, this new version adds PC-specific enhancements including native 4K resolution at up to 144hz on compatible hardware, monitor support for both Ultrawide (21:9) and Super Ultrawide (32:9), HDR10 support, and full keyboard and mouse functionality.

There's also support for NVIDIA DLSS 3.7 and AMD FSR 3.0 upscaling technologies, NVIDIA DLSS Frame Generation, adjustable draw distances, shadow quality settings, and more. Check out the new trailer above and stay tuned for more details, including information later this week on how to pre-purchase Red Dead Redemption and Undead Nightmare at the Rockstar Store, Steam, or the Epic Games Store.

After Apple, we just learned that AMD is the next company in line for US-based manufacturing in the TSMC Arizona facility. Industry analyst Tim Culpan reports that TSMC's Fab 21 in Arizona will soon be producing AMD's high-performance computing (HPC) processors, with tape out and manufacturing expected to commence on TSMC's 5 nm node next year. This move comes after previously reported Apple's A16 SoC production, which is already in progress at the facility and could see shipments before the end of this year, significantly ahead of the initially projected early 2025 schedule. The production of AMD's HPC chips in Arizona marks a crucial step towards establishing an AI-hardware supply chain operating entirely on American soil, which is expected to further expand with Intel Foundry and Samsung Texas facility.

Making HPC processors domestically serves as a significant milestone in reducing dependence on overseas semiconductor manufacturing and strengthening the US's position in the global chip industry. Adding to the momentum, TSMC and Amkor recently announced a collaboration on advanced packaging technologies, including Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS), which are vital for high-performance AI chips. However, as Amkor facilities are yet to be built, these chips are going to be shipped back to Taiwan for packaging before being integrated into the final product. Once the Amkor facility is up and running, Arizona will become the birthplace of fully manufactured and packaged silicon chips.

AMD today introduced the Radeon PRO V710, the newest member of AMD's family of visual cloud GPUs. Available today in private preview on Microsoft Azure, the Radeon PRO V710 brings new capabilities to the public cloud. The AMD Radeon PRO V710's 54 Compute Units, along with 28 GB of VRAM, 448 GB/s memory transfer rate, and 54 MB of L3 AMD Infinity Cache technology, support small to medium ML inference workloads and small model training using open-source AMD ROCm software.

With support for hardware virtualization implemented in compliance with the PCI Express SR-IOV standard, instances based on the Radeon PRO V710 can provide robust isolation between multiple virtual machines running on the same physical GPU and between the host and guest environments. The efficient RDNA 3 architecture provides excellent performance per watt, enabling a single slot, passively cooled form factor compliant with the PCIe CEM spec.

It's finally here! ASUSTOR NAS devices with AMD Ryzen CPUs have finally launched! With four to ten drive bays; the Lockerstor Gen3 series arrives with both flexibility and performance. The Lockerstor Gen3 series is designed for extreme performance while maintaining extreme efficiency. In a first for ASUSTOR, the Lockerstor Gen3 features a Quad-Core AMD Ryzen Embedded SoC that boosts to 3.8 GHz. Take advantage of four to ten drive bays, and four M.2 slots for NVMe SSDs that use PCIe 4.0, dual 10GbE, dual 5GbE, and dual USB4. 16 GB of ECC DDR5-4800 memory that's expandable to 64 GB. This combination of powerful hardware is not only faster, but sets the new performance standard.

The AMD Ryzen V3C14 SoC is built on a 6 nm process for maximum performance and efficiency. At a 25 W maximum TDP, it achieves energy savings even when crunching high-performance tasks. All Lockerstor Gen3 devices are equipped with dual 10GbE and dual 5GbE network ports, with single-port 10 GbE read/write speeds reaching up to 1176 MB/s and 1018 MB/s, while SMB multi-channel performance using RAID 5 can reach up to 2005 MB/s and 1090 MB/s respectively.

High-resolution die-shots of the AMD "Zen 5" 8-core CCD were released and annotated by Nemez, Fitzchens Fitz, and HighYieldYT. These provide a detailed view of how the silicon and its various components appear, particularly the new "Zen 5" CPU core with its 512-bit FPU. The "Granite Ridge" package looks similar to "Raphael," with up to two 8-core CPU complex dies (CCDs) depending on the processor model, and a centrally located client I/O die (cIOD). This cIOD is carried over from "Raphael," which minimizes product development costs for AMD at least for the uncore portion of the processor. The "Zen 5" CCD is built on the TSMC N4P (4 nm) foundry node.

The "Granite Ridge" package sees the up to two "Zen 5" CCDs snuck up closer to each other than the "Zen 4" CCDs on "Raphael." In the picture above, you can see the pad of the absent CCD behind the solder mask of the fiberglass substrate, close to the present CCD. The CCD contains 8 full-sized "Zen 5" CPU cores, each with 1 MB of L2 cache, and a centrally located 32 MB L3 cache that's shared among all eight cores. The only other components are an SMU (system management unit), and the Infinity Fabric over Package (IFoP) PHYs, which connect the CCD to the cIOD.

A new rumor circulating via VideoCardz reveals alleged Cinebench R23 rendering scores for the upcoming AMD Ryzen 9 9800X3D CPU series. The lineup supposedly includes 8-core, 12-core, and 16-core models, all featuring Zen5 architecture and 3D V-Cache technology. The leak consists of Cinebench R23 benchmark scores, however, there are no screenshots, so it should be treated with caution as it comes from CodeCommando, a relatively new source with only one verified leak to his name—the Ryzen 9000 slides that emerged shortly before AMD's official announcement.

Comparing the results posted from CodeCommando with TechPowerUp review data of the previous generation, the picture presents itself in a promising way for the upcoming AMD CPUs. The Ryzen 9 9950X3D is around 10% faster in single-core and 17% faster in multi-core compared with Ryzen 9 7950X3D, while Ryzen 7 9800X3D seems to be 20% faster in single-core and 28% faster in multi-core than Ryzen 7 7800X3D. These initial benchmark results show notable performance gains for the 8-core SKU, with both X3D models demonstrating higher multi-core scores than their non-X3D counterparts. While the 9800X3D shows slightly lower single-core performance than the 8-core 9700X, it exceeds the 9700X in multi-core tests. This multi-core advantage likely comes from a higher TDP, though specific power specifications haven't been revealed yet.

Firaxis Games has published full PC system requirements for the upcoming Sid Meier's Civilization VII strategy game that will be launched on February 11th next year, and it looks like it won't need a powerful hardware, at least unless you want to run it at 4K/UHD resolution and with high graphics preset. Unfortunately, Firaxis Games has not revealed any details regarding support for NVIDIA DLSS or AMD FSR, at least not yet.

According to details, you'll need at least an Intel Core i3-10100 or AMD Ryzen 3 1200 CPU, 8 GB of RAM, and either an NVIDIA GeForce GTX 1050, AMD Radeon RX 460, or an Intel Arc A380 graphics card. Of course, these are minimum requirements so expect the game to run at 1080p resolution at 30 FPS and Low graphics preset. The game will also need 20 GB of SSD storage and Windows 10/11 64-bit OS. The recommended requirements, which should run the game at Medium graphics preset, 1080p resolution, and 60 FPS, include an Intel Core i5-10400 or AMD Ryzen 5 3600X CPU, 16 GB of RAM, and an NVIDIA GeForce RTX 2060, AMD Radeon RX 6600, or an Intel Arc A750 graphics card.

The mid-range graphics card segment is seeing some interesting moves by board partners of AMD and NVIDIA in recent times, making it possible to get a 1440p-class contemporary graphics card under $400. AMD markets the Radeon RX 7700 XT as a 1440p-class GPU, and our review agrees with this notion. VideoCardz spotted the card going for as cheap as $349, a $100 (22%) drop in price from its $449 launch price. The card in question is a PowerColor RX 7700 XT Fighter, the company's affordable custom-design based on the GPU, which is listed on Newegg for $349. The card comes with a triple-slot cooling solution with a triple-fan setup. It sticks to AMD reference clock speeds for the RX 7700 XT. Here's the kicker, even at this price, you are eligible for a game bundle worth $60 with this card, the current offer includes copies of both "Warhammer 40000: Space Marine II," and "Unknown 9 Awakening."

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

AMD continually sets the industry standard with its EPYC Embedded processors, offering exceptional performance, efficiency, connectivity, and innovation for networking, storage, and industrial applications. Today we are extending that leadership with the fourth-generation, AMD EPYC Embedded 8004 Series processors.

The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded systems, delivering exceptional performance for high-demand workloads while maximizing power efficiency in a compact form factor for space- and power-constrained applications. It also integrates a comprehensive suite of embedded features to further enhance system performance and reliability. Engineered to excel in the most demanding embedded environments, the AMD EPYC Embedded 8004 Series is perfectly suited for networking systems, routers, security appliances, enterprise and cloud warm/cold storage, and industrial edge applications, ensuring seamless handling of dynamic workloads.

The leaks and rumors surrounding Intel's upcoming Arrow Lake desktop CPU line-up are starting to heat up, with recent rumors tipping the existence of the Core Ultra 9 285K as the top-end chip in the upcoming launch. A new set of Geekbench 6 scores spotted by BenchLeaks on X, however, suggests the Core Ultra 9 285 non-K variant of this CPU might lag its Ryzen 9 counterparts significantly.

The Geekbench 6 test results, which were apparently achieved on an ASUS Prime Z890-P motherboard, reveal performance that falls short of even the current-generation AMD Ryzen 7 9700X, never mind any of the Ryzen 9 variants. The Geekbench 6 multicore score came in at an unimpressive 14,150, while the single-core score was a mere 3,081, falling short of the likes of the AMD Ryzen 7 9700X, which scored up to 19,381 and 3,624 in multi- and single-core tests, respectively. However, there appears to be more to this story—namely an odd test configuration that could heavily skew the test results, since the "stock" Intel Core Ultra 9 285K scores significantly higher in the Geekbench 6 charts than this particular 285 seems to.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.

The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

Huawei has reportedly started shipping its Ascend 910C accelerator—the company's domestic alternative to NVIDIA's H100 accelerator for AI training and inference. As the report from China South Morning Post notes, Huawei is shipping samples of its accelerator to large NVIDIA customers. This includes companies like Alibaba, Baidu, and Tencent, which have ordered massive amounts of NVIDIA accelerators. However, Huawei is on track to deliver 70,000 chips, potentially worth $2 billion. With NVIDIA working on a B20 accelerator SKU that complies with US government export regulations, the Huawei Ascend 910C accelerator could potentially outperform NVIDIA's B20 processor, per some analyst expectations.

If the Ascend 910C receives positive results from Chinese tech giants, it could be the start of Huawei's expansion into data center accelerators, once hindered by the company's ability to manufacture advanced chips. Now, with foundries like SMIC printing 7 nm designs and possibly 5 nm coming soon, Huawei will leverage this technology to satisfy the domestic demand for more AI processing power. Competing on a global scale, though, remains a challenge. Companies like NVIDIA, AMD, and Intel have access to advanced nodes, which gives their AI accelerators more efficiency and performance.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

Earlier this week, we got rumors that AMD is rushing in the Ryzen 7 9800X3D 8-core/16-thread "Zen 5" processor with 3D V-cache for a late-October debut. The 9800X3D succeeds the popular 7800X3D, and AMD probably hopes it will have a competitive gaming processor in time for Intel's Core Ultra 2-series "Arrow Lake-S" launch. In the previous article, it was reported that the higher core-count 9000X3D series processor models, the Ryzen 9 9950X3D and Ryzen 9 9900X3D, would arrive some time in Q1 2025, because it was reported that the chips have certain "new features" compared to their predecessors, the 7950X3D and 7900X3D. At the time, we even explored the possibility of AMD giving both 8-core CCDs on the processor 3D V-cache. Turns out, this is where things are headed.

A new report by Benchlife.info claims that the higher core-count 9950X3D and 9900X3D will implement 3D V-cache on both CCD chiplets, giving these processors an impressive 192 MB of L3 cache (96 MB per CCD), and 208 MB or 204 MB of "total cache" (L2+L3). The report also says that AMD is planning a Ryzen 5 9600X3D chip, its second attempt at taking on Intel's Core i5 lineup, following its very recent release of the Ryzen 5 7600X3D, which ended up 1-3% short of the Core i5-14600K in gaming workloads. There's no word on whether the 9600X3D will launch in October alongside the 9800X3D, or in Q1-2025 with the Ryzen 9 9000X3D series.

T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.

T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.

AMD today announced that Oracle Cloud Infrastructure (OCI) has chosen AMD Instinct MI300X accelerators with ROCm open software to power its newest OCI Compute Supercluster instance called BM.GPU.MI300X.8. For AI models that can comprise hundreds of billions of parameters, the OCI Supercluster with AMD MI300X supports up to 16,384 GPUs in a single cluster by harnessing the same ultrafast network fabric technology used by other accelerators on OCI. Designed to run demanding AI workloads including large language model (LLM) inference and training that requires high throughput with leading memory capacity and bandwidth, these OCI bare metal instances have already been adopted by companies including Fireworks AI.

"AMD Instinct MI300X and ROCm open software continue to gain momentum as trusted solutions for powering the most critical OCI AI workloads," said Andrew Dieckmann, corporate vice president and general manager, Data Center GPU Business, AMD. "As these solutions expand further into growing AI-intensive markets, the combination will benefit OCI customers with high performance, efficiency, and greater system design flexibility."

According to a new research report from leading analyst firm Jon Peddie Research (JPR), unit shipments in the add-in board (AIB) market increased in Q2'24 from last quarter and increased year over year. Meanwhile, Nvidia slightly increased market share from last quarter, as well as year over year. In Q2'24, total graphics card shipments increased to 9.5 million units, up from 8.7 million units last quarter.

AMD's quarter-to-quarter total desktop AIB unit shipments increased 9% and increased 3% from last year. Nvidia's quarter-to-quarter unit shipments increased 9.7% and increased 61.9% from last year while continuing to hold a dominant market share position at 88%. Intel, which entered the AIB market in Q3'22 with the Arc A770 and A750, remained flat, as the company has yet to gain significant traction in the add-in board market.Market share changes quarter to quarter and year to year.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Intel has released version 1.2 of its X86S architecture specification. The X86S project, first announced last year, aims to modernize the x86 architecture that has been the heart of PCs since the late 1970s. Over the decades, Intel and AMD have continually expanded x86's capabilities, resulting in a complex instruction set that Intel now sees as partially outdated. The latest specification primarily focuses on removing legacy features, particularly 16-bit and 32-bit support. This radical departure from x86's long-standing commitment to backward compatibility aligns with the simplification of x86. While the specification does mention a "32-bit compatibility mode," we are yet to how would 32-bit apps run. This ambiguity raises questions about how X86S might handle existing 32-bit applications, which, despite declining relevance, still play a role in many computing environments.

The potential transition to X86S comes at a time when the industry is already moving away from 32-bit support. However, the proposed changes are subject to controversy. The x86 architecture's strength has long been its extensive legacy support, allowing older software to run on modern hardware. A move to X86S could disrupt this ecosystem, particularly for users relying on older applications. Furthermore, introducing X86S raises questions about the future relationship between Intel and AMD, the two primary x86 CPU designers. While Intel leads the initiative, AMD's role in the potential transition remains uncertain, given its significant contributions to the current x86-64 standard.

Nintendo's next-generation Switch 2 handheld gaming console is nearing its release. As leaks intensify about its future specifications, we get information about its planning stages. According to Moore's Law is Dead YouTube video, we learn that Nintendo didn't choose AMD APU to be the powerhouse behind Switch 2 due to poor battery life. In a bid to secure the best chip at a mere five watts of power, the Japanese company had two choices: NVIDIA Tegra or AMD APU. With some preliminary testing and evaluation, AMD APU wasn't reportedly power-efficient at 5 Watt TDP, while the NVIDIA Tegra chip was maintaining sufficient battery life and performance at target specifications.

Allegedly the AMD APU was good for 15 W design, but Nintendo didn't want to place a bigger battery so that the device remains lighter and cheaper. The final design will likely carry a battery with a 20 Wh capacity, which will be the main power source behind the NVIDIA Tegra T239 SoC. As a reminder, the Tegra T239 SoC features eight-core Arm A78C cluster with modified NVIDIA Ampere cores in combination with DLSS, featuring some of the latest encoding/decoding elements from Ada Lovelace, like AV1. There are likely 1536 CUDA cores paired with 128-bit LPDDR5 memory running at 102 GB/s bandwidth. For final specifications, we have to wait for the official launch, but with rumors starting to intensify, we can expect to see it relatively soon.

In case you missed it, AMD's new madcap enthusiast silicon engineering effort, the "Strix Halo," is real, and comes with the Ryzen AI Max 300 series branding. These are chiplet-based mobile processors with one or two "Zen 5" CCDs—same ones found in "Granite Ridge" desktop processors—paired with a large SoC die that has an oversized iGPU. This arrangement lets AMD give the processor up to 16 full-sized "Zen 5" CPU cores, and an iGPU with as many as 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5/x memory interface for UMA.

"Strix Halo" is designed for ultraportable gaming notebooks or mobile workstations where low PCB footprint is of the essence, and discrete GPU is not an option. For enthusiast gaming notebooks with discrete GPUs, AMD is designing the "Fire Range" processor, which is essentially a mobile BGA version of "Granite Ridge," and a successor to the Ryzen 7045 series "Dragon Range." The Ryzen AI Max series has three models based on CPU and iGPU CU counts—the Ryzen AI Max 395+ (16-core/32-thread with 40 CU), the Ryzen AI Max 390 (12-core/24-thread with 40 CU), and the Ryzen AI Max 385 (8-core/16-thread, 32 CU). An alleged Ryzen AI Max 390 engineering sample surfaced on the Geekbench AI benchmark online database.