According to the market research firm Mercury Research, the desktop CPU market has witnessed a remarkable transformation, with AMD seizing a substantial 28.7% market share in Q3 of 2024—a giant leap since the launch of the original Zen architecture in 2017. This 5.7 percentage point surge from the previous quarter is a testament to the company's continuous innovation against the long-standing industry leader, Intel. Their year-over-year growth of nearly ten percentage points, fueled by the success of their Ryzen 7000 and 9000 series processors, starkly contrasts Intel's Raptor Lake processors, which encountered technical hurdles like stability issues. AMD's revenue share soared by 8.5 percentage points, indicating robust performance in premium processor segments. Intel, witnessing a decline in its desktop market share to 71.3%, attributes this shift to inventory adjustments rather than competitive pressure and still holds the majority.

AMD's success story extends beyond desktops, with the company claiming 22.3% of the laptop processor market and 24.2% of the server segment. A significant milestone was reached as AMD's data center division generated $3.549 billion in quarterly revenue, a new record for a company not even present in the data center in any considerable quantity just a decade ago. Stemming from strong EPYC processor sales to hyperscalers and cloud providers, along with Instinct MI300X for AI applications, AMD's acceleration of data center deployments is massive. Despite these shifts, Intel continues to hold its dominant position in client computing, with 76.1% of the overall PC market, held by its strong corporate relationships and extensive manufacturing infrastructure. OEM partners like Dell, HP, Lenovo, and others rely heavily on Intel for their CPU choice, equipping institutions like schools, universities, and government agencies.

Unlike the Ryzen 7 9700X, which was off to a glacial start when it launched, the new Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache is flying off the shelves. This is the fastest gaming processor you can buy, and gamers want their best machines in place when the next generation of GPUs make landfall starting January 2025. As of this writing, the 9800X3D is out of stock on Newegg, Amazon, and Micro Center. The chip is, however, available through systems integrators and OEMs, who probably secured their inventory of the chip separately. A quick look over at eBay suggests that the 9800X3D is being scalped—the practice where individuals buy up inventory of the processor at retail prices, and re-sell it at a mark-up. We are seeing prices in the range of $670 to $800. There are probably limits to how high scalpers can price the 9800X3D, because at a high enough price, buyers could simply not be interested in the chip, and simply pick up a much cheaper 7800X3D, or the versatile 7950X3D, or even go Intel with the i9-14900K.

The leading system integrator iBUYPOWER, a company focusing on building high-performance gaming computers, announced today that new PCs equipped with the AMD Ryzen 7 9800X3D Series CPU, AMD's fastest gaming desktop processor, can now be purchased on its official website. By integrating the new processor into an iBUYPOWER system that is backed by an extensive warranty of three-years labor and two-years parts, customers can look forward to top-of-the-line gaming performance powered by AMD "Zen 5" architecture and built on 4 nm technology.

The AMD Ryzen 7 9800X3D Series processor is built with exclusive 2nd gen AMD 3D V-Cache technology, which enables up to 104 MB of on-chip memory and provides increased frequencies for higher and smoother frame rates when paired with AMD EXPO technology. The new CPU is designed for the AMD AM5 platform, which allows for breakneck DDR5 memory speeds, PCIe 5.0 integration for high-speed bandwidth, and is built for long-lasting performance against the latest gaming releases.

AMD Ryzen 7 9800X3D will be available to purchase from today, November 7, 2024. The 8-core/16-thread processor features 3D V-Cache technology, and is based on the "Zen 5" microarchitecture. AMD has priced the 9800X3D at $480 (MSRP). The processor was reviewed by TechPowerUp yesterday, we conclude that it is the fastest processor for a gaming PC build, posting the highest frame-rates at any resolution. It is 12% faster than Intel's flagship Core Ultra 9 285K "Arrow Lake" processor at gaming (at 1080p), although the processor falls behind in productivity workloads due to its significantly lower CPU core count than other CPUs, such as the cheaper Core i7-14700K or Core Ultra 7 265K. The 9800X3D is only around 5% faster than its predecessor, the 7800X3D, at gaming, although it is 13% faster than the 5800X3D.

You can read all about the AMD Ryzen 7 9800X3D in its TechPowerUp Review.

After spending some time testing the feature in the Steam Beta client, Valve has finally made native recording via the Steam game overlay public in the mainline Steam client. In the latest Steam client update, which landed on November 5, game recording finally went live for all versions of Steam. While the new feature is undoubtedly helpful for gamers on all platforms, it's particularly useful for Linux and Steam Deck gamers, who have, until now, had to rely on myriad third-party software, which can be a hassle to set up and present additional overhead that may cause issues in games.

Similar to the likes of NVIDIA's GeForce Experience (soon to be replaced by the NVIDIA App) and AMD's Adrenaline Software, Steam offers a number of different options to record entire sessions or just short gameplay clips. Unsurprisingly, Steam game recording works with the Steam Deck (and thus many other Linux distributions), but perhaps not as expected is that it also works with non-Steam games that allow the Steam overlay to work. Valve also put some thought into the technical side of things, with optimizations to minimize CPU usage and rely on NVIDIA and AMD GPU video encoding wherever possible. This should minimize any performance impacts and increase power efficiency where applicable—as in the case of gaming handhelds. Valve does note that non-AMD and -NVIDIA GPUs may see significant performance impacts, which is not great news for Intel Xe owners.

The latest update to CPU-Z, the popular system information and diagnostic tool, has rolled out comprehensive support for upcoming processor architectures from both AMD and Intel, along with new memory standards. Among the notable additions is support for AMD's Ryzen 7 9800X3D, which builds upon AMD's successful 3D V-Cache technology and is scheduled to launch tomorrow. The update also covers Intel's "Arrow Lake" processors, including both HX and H series variants. The Arrow Lake lineup integration spans multiple performance tiers, from the flagship Core Ultra 9 285HX down to the mainstream Core Ultra 5 series. The H-series mobile processors, including the Core Ultra 9 285H and various Ultra 7 and Ultra 5 models, are also fully supported.

Additionally, CPU-Z now recognizes Intel's complete Raptor Lake refresh, covering an extensive range of processors across different power segments. This includes the Core 7 series (160HL through 150U), Core 5 series (130HL through 120U), and Core 3 series (100HL through 100U), catering to various computing needs from high-performance to energy-efficient applications. The update extends beyond processors to support CUDIMM ((Clocked Unbuffered DIMM) DDR5 memory. CUDIMMs represent a modified DDR5 memory featuring an integrated Client Clock Driver (CKD) that generates its clock signal to minimize noise and jitter at speeds of 6400 MT/s and above, ensuring better stability and data integrity than traditional DDR5 modules.

DOWNLOAD CPU-Z 2.12 here.

A new ultraportable notebook model powered by the AMD Ryzen AI 300 series "Strix Point" processor coming this December, will feature LPDDR5X-8000 memory, a memory speed above the LPDDR5-7500 that was standard for the processor. Hoang Anh Phu did some digging, and found that AMD has quietly updated the product pages of these processors on its website, now showing support for LPDDR5X-8000. Older versions of these pages accessed by The Wayback Machine showed them to mention 7500 MT/s as the top speed for LPDDR5X.

While regular DDR5 SO-DIMM speeds remain unchanged at dual-channel DDR5-5600, it's pertinent to note that mainstream and enthusiast-segment gaming notebooks tend to use faster DDR5 SO-DIMMs than spec using OEM-level memory overclocking, however, LPDDR5X speeds do not tend to be higher than what the processor is capable of. An OEM would only use LPDDR5X-8000 chips if the processor officially supports it, which it now does with this stealthy specs update. The notebook in question is an HP EliteBook X G1a, a 14-inch premium ultraportable that not just uses LPDDR5X-8000 with "Strix Point" processors, but also seems to have overclocked its NPU. By AMD's specs, the XDNA 2 NPU should be capable of 50 TOPS, but HP has stepped its performance up by 10%.

Thanks to a recent report from VideoCardz, we learned that AMD has introduced a series of prebuilt desktop computers in China featuring their new Ryzen 7 9800X3D processor. The systems are being sold through AMD's store on JD.com rather than through traditional computer manufacturers. The Ryzen 7 9800X3D processor, which launches November 7 at $479, will be the centerpiece of these systems. For the components, AMD partnered with several manufacturers: ASUS supplies motherboards and graphics cards, Thermalright provides the 360 mm 360 Frozen Infinity AIO liquid cooling system, and LOONGTR makes the computer cases, which include Ryzen branding. The company is offering seven different configurations. Each system includes 32 GB of DDR5-6000 memory and uses an ASUS TUF Gaming B650M-Plus motherboard with 1 TB storage, except for one model with a Prime X670E-Pro motherboard with 2 TB storage.

Prices range from $1,000 for the base model without a graphics card to $2,100 for the version with AMD's RX 7900 XTX graphics card. Some models include NVIDIA graphics cards instead of AMD's own, specifically the RTX 4070 Super and RTX 4070 Ti Super. The computers will be available starting November 7, just before Singles' Day on November 11, a major shopping event in China. It overlaps with the Ryzen 7 9800X3D launch, given that it is the heart of the system. AMD already sells other prebuilt systems in the Chinese market, including models with various Ryzen processors and graphics cards, such as the China-only RX 6750 GRE.

Many gamers have been skeptical of the recently announced Sony PS5 Pro since the day it was announced, largely due to the high price and the perceived lack of meaningful improvements. It seemed to many as though the PS5 Pro was simply a meaningless mid-cycle cash-grab with a few extra features tacked onto the top, however, it looks like Sony and its development partners have put in the work to make the PS5 Pro experience fresh and worthwhile. According to a new post on the official PlayStation Blog, the new console will launch with at least 50 confirmed "Enhanced" games.

What exactly Sony means by Enhanced is rather nebulous, since many of the Enhanced games for the PS5 Pro have a mishmash of different Pro features. For example, Resident Evil Village gets the full 120 FPS treatment, while Horizon Forbidden West only gets a bump up to 4K at 60 FPS. Stellar Blade, on the other hand, only gets an FPS boost to 80 FPS or 50 FPS at 4K. It's likely that, like Stellar Blade, all the titles aiming for higher refresh rates on the PS5 Pro are using some mix of PSSR, dedicated AI acceleration, and traditional rasterization rendering techniques to achieve the increased frame rates. Both The Last of Us Part I and The Last of Us II Remastered will run at 60 FPS on the PS5 Pro, but they will render at 1440p and use PSSR to upscale to 4K output.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

Even as AMD is giving final touches the 2nd generation Ryzen Z2 Extreme processor for gaming handhelds with a wacky 3+5 CPU core-configuration, some manufacturers like OneXPlayer couldn't wait, and went ahead to implement the Ryzen AI 9 HX 370 mobile processor with a cTDP of 15 W. On the upside, the HX 370 is better kitted out than the Z2 Extreme, having all 12 cores enabled (4+8), but on the downside, it lacks much of the power optimization AMD put into the Ryzen Z2 Extreme. The OneXFly F1 Pro implements the Ryzen AI HX 370, and packs a 7-inch Full HD 144 Hz touchscreen. It was recently benchmarked by One-Netbook, where it yielded some surprising results, including a 58 FPS average frame-rate in "Black Myth Wukong" with low settings.

AMD and Fujitsu Limited today announced that they have signed a memorandum of understanding (MOU) to form a strategic partnership to create computing platforms for AI and high-performance computing (HPC). The partnership, encompassing aspects from technology development to commercialization, will seek to facilitate the creation of open source and energy efficient platforms comprised of advanced processors with superior power performance and highly flexible AI/HPC software and aims to accelerate open-source AI and/or HPC initiatives.

Due to the rapid spread of AI, including generative AI, cloud service providers and end-users are seeking optimized architectures at various price and power per performance configurations. From end-to-end, AMD supports an open ecosystem, and strongly believes in giving customers choice. Fujitsu has worked to develop FUJITSU-MONAKA, a next-generation Arm-based processor that aims to achieve both high performance and low power consumption. With FUJITSU-MONAKA, together with AMD Instinct accelerators, customers have an additional choice to achieve large-scale AI workload processing to whilst attempting to reduce the data center total cost of ownership.

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About EZ-DIY Features - Motherboard, Liquid Cooling, PC Case
MSI has unveiled a new lineup of DIY-friendly products designed to simplify PC building for everyone, from beginners to experienced enthusiasts. The X870 (E) & Z890 motherboards come equipped with the EZ M.2 CLIP II, which enables quick, tool-free M.2 SSD installation, along with the EZ PCIe Release for easy and secure graphics card removal at the push of a button. The MAG CORELIQUID I series liquid cooling system features a universal UNI Bracket compatible with both Intel and AMD sockets. Its pre-installed fans simplify cable management to just one cable, while optional cable covers provide a clean and personalized look. Additionally, MSI's MAG PANO series PC cases offer tool-free panels on the front, side, and top, ensuring unrestricted access for adding side fans or radiators. MSI's user-friendly lineup aims to make PC building smoother, faster, and more enjoyable for everyone.

Just last week, AMD announced the arrival of its upcoming Ryzen 9000 series of CPUs with 3D V-Cache for November 7. However, we might be in for a treat, as AMD could be preparing Threadripper 9000WX/X series of CPUs with 3D V-Cache. According to VideoCardz, the ASUS Pro WS WRX90E-SAGE SE board appears to include an intriguing feature in its settings—there's a configuration option related to 3D V-Cache control, though this setting currently doesn't have any practical application with the available Threadripper 7000WX and 7000X processors. The presence of this setting hasn't been officially documented by ASUS, showing that this feature could indeed end up in future iterations of Threadripper processors, namely the 9000WX/X series.

AMD currently offers 3D V-Cache treatment in its high-end Genoa-X CPUs, with up to 96 cores and 192 threads, and 1,152 MB of L3 cache. These CPUs were praised for their capabilities in the high-performance computing sector, performing calculations at unprecedented rates thanks to the massive cache size and bandwidth. If AMD decides to opt-in for the HEDT market with 3D V-Cache, we might see an appearance with the upcoming Threadripper generation. However, right now, it is only speculation based on undocumented features in ASUS's high-end board. Even if these CPUs are planned, we are not near their launch as the priority is launching and shipping the consumer-oriented Ryzen 7 9800X3D CPU on November 7.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

AMD is about to launch the Ryzen 7 9800X3D 8-core/16-thread processor with 3D V-cache on November 7, 2024, and it is widely expected to extend AMD's leadership with gaming performance. Hoang Anh Phu, a reliable source with PC hardware leaks, says that the 9800X3D comes with a launch price that's $30 higher than the 7800X3D, which had launched at $450. This would put the 9800X3D at $480. At this price, the 9800X3D is priced $80 higher than the Core Ultra 7 265K, and exactly $100 less than the Core Ultra 9 285K. It would also launch about $40 higher than the current street price of the Core i9-14900K, and $120 higher than the Core i7-14700K. The 9800X3D is also a whopping $150 pricier than the Ryzen 7 9700X.

The Ryzen 7 7800X3D remains the fastest PC processor for gaming; neither Intel's limited-edition Core i9-14900KS nor the latest Core Ultra 9 285K could beat it. The 9800X3D has three things going for it—firstly, it's the new "Zen 5" microarchitecture and the IPC uplift that comes with it; secondly, it has a 500 MHz higher base frequencies, and 200 MHz higher maximum boost frequencies than the 7800X3D; and lastly, AMD has inverted the way it stacks the 3D V-cache die with the CPU complex die (CCD), with the CCD now stacking on top of the L3D, which is expected to give the 9800X3D thermal behavior similar to non-X3D processors such as the 9700X.Update 14:29 UTC: This is confirmed by AMD's official announcement, which just went live.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, announced today that its AM5 series motherboards are fully compatible with the AMD Ryzen 7 9800X3D processor, maximizing its impressive gaming performance. This allows PC enthusiasts worldwide to be among the first to experience the exceptional capabilities brought by the AMD Ryzen 7 9800X3D processor. The AMD Ryzen 7 9800X3D is the first model released in the 9000X3D processor series. ASRock AM5 motherboards will continue to receive updates to ensure seamless compatibility with upcoming Ryzen 9000 Series X3D processors, delivering outstanding performance for gaming enthusiasts.

Users can download and install the latest AGESA 1.2.0.2a BIOS from the ASRock website or use the BIOS Flashback and Instant Flash features for an easy upgrade. ASRock recommends updating to the latest BIOS version promptly to ensure optimal system compatibility and performance.

AMD today announced revenue for the third quarter of 2024 of $6.8 billion, gross margin of 50%, operating income of $724 million, net income of $771 million and diluted earnings per share of $0.47. On a non-GAAP basis, gross margin was 54%, operating income was $1.7 billion, net income was $1.5 billion and diluted earnings per share was $0.92.

"We delivered strong third quarter financial results with record revenue led by higher sales of EPYC and Instinct data center products and robust demand for our Ryzen PC processors," said AMD Chair and CEO Dr. Lisa Su. "Looking forward, we see significant growth opportunities across our data center, client and embedded businesses driven by the insatiable demand for more compute."

Ultra Accelerator Link (UALink ) Consortium, led by Board Members from AMD, Amazon Web Services (AWS), Astera Labs, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft, have announced the incorporation of the Consortium and are extending an invitation for membership to the community. The UALink Promoter Group was founded in May 2024 to define a high-speed, low-latency interconnect for scale-up communications between accelerators and switches in AI pods & clusters. "The UALink standard defines high-speed and low latency communication for scale-up AI systems in data centers"

A Chinese tech forum ChipHell user who goes by zcjzcj11111 sprung up a fascinating take on what the next-generation AMD "Navi 48" GPU could be, and put their imagination on a render. Apparently, the "Navi 48," which powers AMD's series-topping performance-segment graphics card, is a dual chiplet-based design, similar to the company's latest Instinct MI300 series AI GPUs. This won't be a disaggregated GPU such as the "Navi 31" and "Navi 32," but rather a scale-out multi-chip module of two GPU dies that can otherwise run on their own in single-die packages. You want to call this a multi-GPU-on-a-stick? Go ahead, but there are a couple of changes.

On AMD's Instinct AI GPUs, the chiplets have full cache coherence with each other, and can address memory controlled by each other. This cache coherence makes the chiplets work like one giant chip. In a multi-GPU-on-a-stick, there would be no cache coherence, the two dies would be mapped by the host machine as two separate devices, and then you'd be at the mercy of implicit or explicit multi-GPU technologies for performance to scale. This isn't what's happening on AI GPUs—despite multiple chiplets, the GPU is seen by the host as a single PCI device with all its cache and memory visible to software as a contiguously addressable block.

The upcoming AMD Ryzen 7 9800X3D processor is already in the hands of hardware modders, who have put the chip through de-lidding (removal of the integrated heatspreader or IHS), revealing what's underneath. In the 9800X3D de-lidded picture, the CCD appears plain, with no apparent L3D on top, unlike on the 7800X3D (second picture, below). We'd been hearing reports that with the 9000X3D series, AMD has redesigned the way the 3D V-cache die (L3D) and the CPU complex die (CCD) are stacked together, by inverting their arrangement, such that the CCD is on top, and the L3D below.

In past generations of X3D processors, such as the 7800X3D and the 5800X3D, the L3D is stacked on top of the CCD, with structural silicon handling the crucial task of transferring heat from the CPU cores to the IHS. This inversion in stacking should ensure better thermals for the CPU cores, the 9800X3D boosting behavior should be similar to that of non-X3D chips, such as the 9700X. AMD has given the 9800X3D a 120 W TDP and 5.20 GHz boost frequency. This inversion of the CCD and L3D stacking is probably what is behind the "X3D Reimagined" teaser blurb by AMD.

ASUS over the weekend introduced its third custom-design AMD Radeon RX 7600 graphics card, the RX 7600 DUAL EVO OC. This card is visually the largest, most spruced-up custom-design for this GPU from the company's DUAL series. It's positioned a notch below the premium ROG Strix RX 7600 OC, which remains the only ROG branded graphics card based on the RX 7000 series. The DUAL EVO OC is 22.9 cm in length, and 12.3 cm in height, and is 2.5 slots thick. Its cooling solution features an aluminium fin-stack heatsink, which is ventilated by a pair of 80 mm Axial-Tech fans. The cooler offers idle fan-stop.

Out of the box, the ASUS RX 7600 DUAL EVO OC comes with a 2280 MHz Game clock, and 2695 MHz maximum boost frequency, compared to AMD reference clock speeds of 2250 MHz Game clocks and 2655 MHz boost. The card draws power from a single 8-pin PCIe power connector, and puts out display outputs that include three DisplayPort 1.4a, and one HDMI 2.1. Based on the 6 nm "Navi 33" silicon and driven by the RDNA 3 graphics architecture, the RX 7600 features 2,048 stream processors across 32 CU, along with 64 AI accelerators, and 32 ray accelerators. It comes with 8 GB of 18 Gbps GDDR6 memory across a 128-bit wide memory bus. ASUS didn't reveal pricing.

Specifications of the upcoming AMD Ryzen 7 9800X3D processor were leaked to the web by a Geizhals listing. The chip comes with a processor base frequency of 4.70 GHz, and a maximum boost frequency of 5.20 GHz. The base frequency of 4.70 GHz is a significant increase from the 4.20 GHz of the current 7800X3D, while the maximum boost frequency has moved up a couple of notches from the 5.05 GHz of the 7800X3D. The TDP of the processor is set at 120 W, same as the 7800X3D, and higher than the 105 W revised-spec cTDP of the non-X3D Ryzen 7 9700X.

The specs sheet also confirms that the 3D V-cache size is unchanged generationally. The stacked 3D V-cache die adds 64 MB to the on-die 32 MB L3 cache, which is exposed to software as a 96 MB contiguously addressable L3 cache. The per-core L2 cache size remains 1 MB per core. The biggest contributor to generational gaming performance increases will rest on the increase in frequencies, the new "Zen 5" microarchitecture and any IPC improvements on offer, plus L3 cache performance improvements AMD introduced with "Zen 5." We recently reported a spectacular theory that AMD has designed the 9800X3D such that the stacked 3D V-cache is positioned below the 8-core CPU complex die chiplet, and not above it, which should significantly improve thermals, and clock speeds.

Much of the Ryzen 7 9800X3D teaser material from AMD had the recurring buzzwords "X3D Reimagined," causing us to speculate what it could be. 9550pro, a reliable source with hardware leaks, says that AMD has redesigned the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked together. In past generations of X3D processors, such as the 5800X3D "Vermeer-X" and the 7800X3D "Raphael-X," the L3D is stacked on top of the CCD. It would stack above the central region of the CCD that has the on-die 32 MB L3 cache, while blocks of structural silicon would be placed on top of the edges of the CCD that have the CPU cores, with these structural silicon blocks performing the crucial task of transferring heat from the CPU cores to the IHS above. This is about to change.

If the leaks are right, AMD has inverted the CCD-L3D stack with the 9000X3D series such that the "Zen 5" CCD is now on top, the L3D is below it, under the central region of the CCD. The CPU cores now dissipate heat to the IHS as they do on regular 9000 series processors without the 3D V-cache technology. The way we imagine they achieved this is by enlarging the L3D to align with the size of the CCD, and serve as a kind of "base tile." The L3D would have to be peppered with TSVs that connect the CCD to the fiberglass substrate below. We know where AMD is going with this in the future. Right now, the L3D "base tile" contains the 64 MB 3D V-cache that gets appended to the 32 MB on-die L3 cache, but in the future (probably with "Zen 6"), AMD could design the CCDs with TSVs even for the per-core L2 caches.