AMD has silently disabled the loop buffer feature in its Zen 4 processor architecture through an AGESA microcode update. This development, first reported by the website Chips and Cheese, affects the entire Ryzen 7000 series processors and related EPYC models. The loop buffer, a power-optimization feature capable of storing 144 entries (72 per thread with SMT enabled), was implemented for the first time in AMD's Zen 4 architecture but has been notably absent from the newer Zen 5 design. The feature's primary function was to allow the processor's front end to power down while maintaining operational efficiency. The change was discovered when testing an ASRock B650 PG Lightning motherboard paired with a Ryzen 9 7950X3D processor. Hardware performance monitoring showed the loop buffer was active in BIOS version 1.21 (AGESA 1.0.0.6) but ceased to function after updating to BIOS 3.10 with AGESA 1.2.0.2a.

In a performance test conducted by Chips and Cheese, we learned that there is no significant impact from the feature's deactivation, suggesting the existing op cache provides sufficient bandwidth for optimal processor operation. AMD's architectural design has historically relied on its op cache for similar functionality. The feature appeared experimental, given the lack of documentation and the absence of programming guides for loop buffer optimization. Unlike competitors Intel and Arm, who have extensively documented their loop buffer implementations, AMD's approach appeared less developed. While the exact reasoning behind the deactivation remains unclear, disabling undocumented features is a step in the right direction, mainly as future Zen architecture iteration doesn't rely on a loop buffer, as seen with Zen 5.

In Q1 2025, AMD is expected to expand its Ryzen 9000 series "Granite Ridge" desktop processor family with new 65 W processor models, alongside the introduction of the new cost-effective AMD B850 motherboard chipset. The B850 is expected to be a single-chip solution, just like the X870, but makes PCIe Gen 5 optional for the x16 PEG slot. You still get at least one Gen 5 M.2 NVMe slot. USB4 is made optional for this chipset model, too. The B850, hence, is essentially a rebadged B650. CPU and memory overclocking are supported, so you can expect features like "X3D Boost" to carry over from the X870 series motherboards. Videocardz scored clear images of one of the first production AMD B850 chipset motherboards, the GIGABYTE B850M AORUS Elite Ice. This particular variant comes with integrated Wi-Fi 6E, and the "Ice" denotes a white PCB, along with white slots and connectors. You can expect variations of this board with black PCB, and other wireless networking solutions, or lacking one altogether.

The Micro-ATX board appears feature-packed, including an easy ejection lever for the PCIe x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors. Expansion slots include what is very likely a Gen 4 PCI-Express x16 slot, a Gen 4 x4 (physical x16) PCIe slot, and the space between them being dominated by an M.2 SSD heatsink that very likely conceals a Gen 5 M.2 slot wired to the CPU, and a Gen 4 M.2 slot that's either wired to the CPU (since there's no discrete USB4 controller), or the FCH. USB connectivity consists of 20 Gbps USB 3.2 for a few type-C ports (including a type-C header), and a combination of 10 Gbps and 5 Gbps USB 3.x ports.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced a groundbreaking update to its X3D Turbo Mode feature, providing users with an intuitive new method to activate advanced gaming performance optimization directly through the AORUS AI SNATCH software.

Users can now easily enable the X3D Turbo Mode with a streamlined process:

• Run live update on GCC to get the latest AORUS AI SNATCH version B24.11.19.01
• Navigate to the flag icon in the lower-left corner
• Click the flag icon to activate X3D Turbo Mode
• Confirm the pop-up window by clicking "OK"
• System will automatically restart to activate the feature

For users who wish to cancel the action, a "Discard" button is available to immediately halt the process.

It looks like Sony is joining Xbox in the development of a standalone handheld gaming console to compete with the likes of the Nintendo Switch and Valve Steam Deck. According to a Bloomberg's insider sources, a Sony gaming handheld is already in development, and would be designed with Sony PlayStation 5 games in mind. Unlike the PlayStation Portal, the future gaming console wouldn't be dependent on game streaming and would, instead, run games locally, meaning it would likely need significantly more powerful hardware than the Portal has. This would be Sony's first true foray into the portable gaming console market since the likes of the PS Vita, which is largely considered to be a commercial disappointment.

Sony isn't the first of the console giants looking into creating its own gaming handheld after Nintendo's Switch. Obviously, Valve, traditionally more of a software company, already has the immensely popular Steam Deck, but we also recently reported that Microsoft is in the early stages of developing its own handheld gaming console. Details on the future Sony gaming handheld are scant, and there has been no official word from Sony about the console. That said, it wouldn't be surprising to see it equipped with an AMD APU, similar to the likes of the Steam Deck and the PS5, since Sony already has history and a commercial relationship with AMD hardware.

AMD has released the new ROCm 6.3 version which introduces several new features and optimizations, including SGLang integration for accelerated AI inferencing, a re-engineered FlashAttention-2 for optimized AI training and inference, the introduction of multi-node Fast Fourier Transform (FFT), new Fortran compiler, and enhanced computer vision libraries like rocDecode, rocJPEG, and rocAL.

According to AMD, the SGLang, a runtime that is now supported by ROCm 6.3, is purpose-built for optimizing inference on models like LLMs and VLMs on AMD Instinct GPUs, and promises 6x higher throughput and much easier usage thanks to Python-integrated and pre-configured ROCm Docker containers. In addition, the AMD ROCm 6.3 also brings further transformer optimizations with FlashAttention-2, which should bring significant improvements in forward and backward pass compared to FlashAttention-1, a whole new AMD Fortran compiler with direct GPU offloading, backward compatibility, and integration with HIP Kernels and ROCm libraries, a whole new multi-node FFT support in rocFFT, which simplifies multi-node scaling and improved scalability, as well as enhanced computer vision libraries, rocDecode, rocJPEG, and rocAL, for AV1 codec support, GPU-accelerated JPEG decoding, and better audio augmentation.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, announces the COLORFIRE B650M-MEOW WIFI motherboard that supports the latest AMD Ryzen 9000 Series processors. COLORFUL is excited to expand the beloved COLORFIRE MEOW Series which now includes a motherboard for the AMD Ryzen platform. The COLORFIRE B650M-MEOW WIFI motherboard adopts the design and colors of Bobi the orange tabby cat making it easy to color-match with the existing COLORFIRE MEOW Series components. The COLORFIRE B650 MEOW motherboard is perfect for AMD enthusiasts and cat-lovers alike!

The COLORFIRE B650M-MEOW WIFI motherboard features the new MEOW UI BIOS Design, exclusive to the MEOW Series motherboards. The custom MEOW BIOS has been redesigned for improved usability, reducing menu levels from three to two for a more intuitive experience. Related sub-items are now grouped within the same menu, minimizing page navigation.

AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

Today, Lenovo announced the introduction of ThinkShield Firmware Assurance as part of its portfolio of enterprise-grade cybersecurity solutions. ThinkShield Firmware Assurance is one of the only computer OEM solutions to enable deep visibility and protection below the operating system (OS) by embracing Zero Trust Architecture (ZTA) component-level visibility to generate more accurate and actionable risk management insights.

As a security paradigm, ZTA explicitly identifies users and devices to grant appropriate levels of access so a business can operate with less risk and minimal friction. ZTA is a critical framework to reduce risk as organizations endeavor to complete Zero-Trust implementations.

Microsoft has announced its new Azure HBv5 virtual machines, featuring unique custom hardware made by AMD. CEO Satya Nadella made the announcement during Microsoft Ignite, introducing a custom-designed AMD processor solution that achieves remarkable performance metrics. The new HBv5 virtual machines deliver an extraordinary 6.9 TB/s of memory bandwidth, utilizing four specialized AMD processors equipped with HBM3 technology. This represents an eightfold improvement over existing cloud alternatives and a staggering 20-fold increase compared to previous Azure HBv3 configurations. Each HBv5 virtual machine boasts impressive specifications, including up to 352 AMD EPYC "Zen4" CPU cores capable of reaching 4 GHz peak frequencies. The system provides users with 400-450 GB of HBM3 RAM and features doubled Infinity Fabric bandwidth compared to any previous AMD EPYC server platform. Given that each VM had four CPUs, this yields 88 Zen 4 cores per CPU socket, with 9 GB of memory per core.

The architecture includes 800 Gb/s of NVIDIA Quantum-2 InfiniBand connectivity and 14 TB of local NVMe SSD storage. The development marks a strategic shift in addressing memory performance limitations, which Microsoft identifies as a critical bottleneck in HPC applications. This custom design particularly benefits sectors requiring intensive computational resources, including automotive design, aerospace simulation, weather modeling, and energy research. While the CPU appears custom-designed for Microsoft's needs, it bears similarities to previously rumored AMD processors, suggesting a possible connection to the speculated MI300C chip architecture. The system's design choices, including disabled SMT and single-tenant configuration, clearly focus on optimizing performance for specific HPC workloads. If readers can recall, Intel also made customized Xeons for AWS and their needs, which is normal in the hyperscaler space, given they drive most of the revenue.

While the current generation of AMD graphics cards employs RDNA 3 at its core, and the upcoming RX 8000 series will feature RDNA 4, the latest leaks suggest RDNA 5 is not in development. Instead, UDNA will succeed RDNA 4, simplifying AMD's GPU roadmap. A credible source on the Chiphell forums, zhangzhonghao, reports that the UDNA-based RX 9000 series and Instinct MI400 AI accelerator will incorporate the same advanced Arithmetic Logic Unit (ALU) designs in both products, reminiscent of AMD's earlier GCN architectures before the CDNA and RDNA split. Sony's next-generation PlayStation 6 is also rumored to adopt UDNA technology. The PS5 and PS5 Pro currently utilize RDNA 2, while the Pro variant integrates elements of RDNA 4 for enhanced ray tracing. The PS6's CPU configuration remains unclear, but speculation revolves around Zen 4 or Zen 5 architectures.

The first UDNA gaming GPUs are expected to enter production by Q2 2026. Interestingly, AMD's RDNA 4 GPUs are anticipated to focus on entry-level to mid-range markets, potentially leaving high-end offerings until the UDNA generation. This strategic pause may allow AMD to refine AI-accelerated technologies like FidelityFX Super Resolution (FSR) 4, aiming to compete with NVIDIA's DLSS. This unification is inspired by NVIDIA's CUDA ecosystem, which supports cross-platform compatibility from laptops to high-performance servers. As AMD sees it, the decision addresses the challenges posed by maintaining separate architectures, which complicate memory subsystem optimizations and hinder forward and backward compatibility. Putting developer resources into RDNA 5 is not economically or strategically wise, given that UDNA is about to take over. Additionally, the company is enabling ROCm software support across all products ranging from consumer Radeon to enterprise Instinct MI. Accelerating software for one platform will translate to the entire product stack.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive Lineup for AI and HPC Success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that are powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

MSI, a leading global provider of high-performance server solutions, is excited to unveil its latest AMD EPYC 9005 Series CPU-based server boards and platforms at SC24 (SuperComputing 2024), Booth #3655, from November 19-21. Built on the OCP Modular Hardware System (DC-MHS) architecture, these new platforms deliver high-density, AI-ready solutions, including multi-node, enterprise, CXL memory expansion, and GPU servers, designed to meet the intensive demands of modern data centers.

"As AI continues to reshape the landscape of data center infrastructure, MSI's servers, powered by the AMD EPYC 9005 Series processors, offer unmatched density, energy efficiency, and cost optimization—making them ideal for modern data centers," said Danny Hsu, General Manager of Enterprise Platform Solutions. "Our servers optimize thermal management and performance for virtualized and containerized environments, positioning MSI at the forefront of AI and cloud-based workloads."

The 64th edition of the TOP500 reveals that El Capitan has achieved the top spot and is officially the third system to reach exascale computing after Frontier and Aurora. Both systems have since moved down to No. 2 and No. 3 spots, respectively. Additionally, new systems have found their way onto the Top 10.

The new El Capitan system at the Lawrence Livermore National Laboratory in California, U.S.A., has debuted as the most powerful system on the list with an HPL score of 1.742 EFlop/s. It has 11,039,616 combined CPU and GPU cores and is based on AMD 4th generation EPYC processors with 24 cores at 1.8 GHz and AMD Instinct MI300A accelerators. El Capitan relies on a Cray Slingshot 11 network for data transfer and achieves an energy efficiency of 58.89 GigaFLOPS/watt. This power efficiency rating helped El Capitan achieve No. 18 on the GREEN500 list as well.

ASRock Rack Inc., a leading innovative server company, today announces its presence at SC24, held at the Georgia World Congress Center in Atlanta from November 18-21. At booth #3609, ASRock Rack will showcase a comprehensive high-performance portfolio of server boards, systems, and rack solutions with NVIDIA accelerated computing platforms, helping address the needs of enterprises, organizations, and data centers.

Artificial intelligence (AI) and high-performance computing (HPC) continue to reshape technology. ASRock Rack is presenting a complete suite of solutions spanning edge, on-premise, and cloud environments, engineered to meet the demand of AI and HPC. The 2U short-depth MECAI, incorporating the NVIDIA GH200 Grace Hopper Superchip, is developed to supercharge accelerated computing and generative AI in space-constrained environments. The 4U10G-TURIN2 and 4UXGM-GNR2, supporting ten and eight NVIDIA H200 NVL PCIe GPUs respectively, are aiming to help enterprises and researchers tackle every AI and HPC challenge with enhanced performance and greater energy efficiency. NVIDIA H200 NVL is ideal for lower-power, air-cooled enterprise rack designs that require flexible configurations, delivering acceleration for AI and HPC workloads regardless of size.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, shows off at SC24 how the GIGABYTE enterprise portfolio provides solutions for all applications, from cloud computing to AI to enterprise IT, including energy-efficient liquid-cooling technologies. This portfolio is made more complete by long-term collaborations with leading technology companies and emerging industry leaders, which will be showcased at GIGABYTE booth #3123 at SC24 (Nov. 19-21) in Atlanta. The booth is sectioned to put the spotlight on strategic technology collaborations, as well as direct liquid cooling partners.

The GIGABYTE booth will showcase an array of NVIDIA platforms built to keep up with the diversity of workloads and degrees of demands in applications of AI & HPC hardware. For a rack-scale AI solution using the NVIDIA GB200 NVL72 design, GIGABYTE displays how seventy-two GPUs can be in one rack with eighteen GIGABYTE servers each housing two NVIDIA Grace CPUs and four NVIDIA Blackwell GPUs. Another platform at the GIGABYTE booth is the NVIDIA HGX H200 platform. GIGABYTE exhibits both its liquid-cooling G4L3-SD1 server and an air-cooled version, G593-SD1.

Today, AMD showcased its ongoing high performance computing (HPC) leadership at Supercomputing 2024 by powering the world's fastest supercomputer for the sixth straight Top 500 list.

The El Capitan supercomputer, housed at Lawrence Livermore National Laboratory (LLNL), powered by AMD Instinct MI300A APUs and built by Hewlett Packard Enterprise (HPE), is now the fastest supercomputer in the world with a High-Performance Linpack (HPL) score of 1.742 exaflops based on the latest Top 500 list. Both El Capitan and the Frontier system at Oak Ridge National Lab claimed numbers 18 and 22, respectively, on the Green 500 list, showcasing the impressive capabilities of the AMD EPYC processors and AMD Instinct GPUs to drive leadership performance and energy efficiency for HPC workloads.

IBM and AMD have announced a collaboration to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud. This offering, which is expected to be available in the first half of 2025, aims to enhance performance and power efficiency for Gen AI models such as and high-performance computing (HPC) applications for enterprise clients. This collaboration will also enable support for AMD Instinct MI300X accelerators within IBM's watsonx AI and data platform, as well as Red Hat Enterprise Linux AI inferencing support.

"As enterprises continue adopting larger AI models and datasets, it is critical that the accelerators within the system can process compute-intensive workloads with high performance and flexibility to scale," said Philip Guido, executive vice president and chief commercial officer, AMD. "AMD Instinct accelerators combined with AMD ROCm software offer wide support including IBM watsonx AI, Red Hat Enterprise Linux AI and Red Hat OpenShift AI platforms to build leading frameworks using these powerful open ecosystem tools. Our collaboration with IBM Cloud will aim to allow customers to execute and scale Gen AI inferencing without hindering cost, performance or efficiency."

AMD has claimed the top ten spots in Amazon's best-selling and most wished-for category with its Ryzen processors. The success of AMD's CPUs can be attributed to the competitive pricing, top-tier performance, and overall features provided by Team Red. In its best-sellers category, Amazon lists the following CPUs: AMD Ryzen 7 5700X, Ryzen 5 5600X, Ryzen 7 7800X3D, Ryzen 5 7600X, Ryzen 7 9800X3D, Ryzen 9 5900X, Ryzen 7 5700X3D, Ryzen 7 7700X, Ryzen 7 5800X, Ryzen 5 7600, and Ryzen 5 5500. The first Intel CPU to appear in the list, at the time of writing, is the Intel Core i5-13600KF CPU, sitting in the spot number 12 in the best-selling department.

Another interesting list to look at is the most wished-for, where Amazon shoppers put CPUs on their wishlist and wait for a purchase. The number one most wished-for CPU is the AMD Ryzen 7 9800X3D with 3D V-Cache. The eight spots are occupied by: AMD Ryzen 7 7800X3D, Ryzen 7 5700X3D, Ryzen 9 5900X, Ryzen 7 5800X, Ryzen 7 7700X, Ryzen 5 7600X, Ryzen 9 9900X, and Ryzen 5 5600X. Intel Core i9-14900K CPU currently occupies the number ten spot. This truly shows the enthusiasm of Amazon shoppers towards AMD's CPU offerings and the company's current mindshare. With an increasing market share, AMD is challenging Intel in the CPU department, providing great competition to tech enthusiasts.

LG Electronics (LG) is unveiling its latest, premium UltraGear OLED gaming monitor GX7 (model 27GX790A). Designed for serious gamers, the new model features a 27-inch, QHD resolution (2,560 x 1,440) WOLED display with a 0.03milliseconds Gray-to-Gray (GTG) response time and a 480 Hz refresh rate - the fastest of any QHD OLED monitor. The 27GX790A, the most compact UltraGear OLED display yet, delivers enhanced gaming immersion with exceptional picture quality, silky-smooth performance and 4-side virtually borderless design. It also works seamlessly with the newest graphics cards, thanks to an array of advanced connectivity options, including DisplayPort 2.1.

The all-new 27GX790A is equipped with LG's WOLED display technology, which employs a white OLED light source with color filters to produce accurate RGB colors and impressive screen brightness. This technology provides a high contrast ratio, vibrant colors, deep blacks and excellent motion clarity - even during the most fast-paced gaming action - LG's WOLED tech has earned the new UltraGear OLED gaming monitor both VESA DisplayHDR True Black 400 certification and highest VESA ClearMR tier.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today launched the cutting-edge GIGABYTE AMD Radeon PRO W7800 AI TOP 48G. GIGABYTE has taken a significant leap forward with the release of the Radeon PRO W7800 AI TOP 48G graphics card, featuring AMD's RDNA 3 architecture and a massive 48 GB of GDDR6 memory. This significant increase in memory capacity, compared to its predecessor, provides workstation professionals, creators, and AI developers with incredible computational power to effortlessly handle complex design, rendering, and AI model training tasks.

⁠GIGABYTE stands as the AMD professional graphics partner in the market, with a proven ability to design and manufacture the entire Radeon PRO series. Our dedication to quality products, unwavering business commitment, and comprehensive customer service empower us to deliver professional-grade GPU solutions, expanding user's choices in workstation and AI computing.⁠

AMD has published a blog post about its latest AMD Ryzen AI 300 series processors, claiming they are changing the game for portable devices. To back these claims, Team Red has compared its Ryzen AI 9 HX 370 processor to Intel's latest Core Ultra 7 258V, using the following games: Assassin's Creed Mirage, Baldur's Gate 3, Borderlands 3, Call of Duty: Black Ops 6, Cyberpunk 2077, Doom Eternal, Dying Light 2 Stay Human, F1 24, Far Cry 6, Forza Horizon 5, Ghost of Tsushima, Hitman 3, Hogwarts Legacy, Shadow of the Tomb Raider, Spider-Man Remastered, and Tiny Tina's Wonderlands. The conclusion was that AMD's Ryzen AI 9 HX 370, with its integrated Radeon 890M graphics powerhouse, outperformed the Intel "Lunar Lake" Core Ultra 7 258V with Intel Arc Graphics 140V by 75% on average.

To support this performance leap, AMD also relies on software technologies, including FidelityFX Super Resolution 3 (FSR 3) and HYPR-RX, to unlock additional power and gaming efficiency. FSR 3 alone enhances visuals in over 95 games, while HYPR-RX, with features like AMD Fluid Motion Frames 2 (AFMF 2) and Radeon Anti-Lag, provides substantial performance boosts across thousands of games. The company has also compared its FSR/HYPR-RS combination with Intel's XeSS, which is available in around 130 games. AMD claims its broader suite supports 415+ games and is optimized for smoother gameplay. The AFMF 2 claims support with thousands of titles, while Intel's GPU software stack lacks a comparison point. Of course, these marketing claims are to be taken with a grain of salt, so independent testing is always the best to compare the two.

With over 250 million devices sold globally, Amazon expands its Fire TV lineup with a brand-new Omni Mini-LED Series and refreshed 4-Series—plus, the new Soundbar Plus Series.

Since launching Fire TV 10 years ago, we've been on a mission to make TVs more intelligent, accessible, and connected. Our approach is unique: We put content—not apps—at the center of the experience, and make it incredibly easy to find something to watch, including with just your voice. What started with the first Fire TV device in 2014 has evolved into a versatile lineup of devices, from Cubes and Sticks to smart TVs made by some of the world's strongest TV brands including Panasonic, Hisense, Toshiba, and TCL. And it's no understatement to say customers love Fire TV—customers around the world have purchased well over 250 million Fire TV devices.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive line-up for AI and HPC success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

According to CRN, AMD is looking to make some cuts to its workforce of approximately 26,000 employees. The company hasn't announced a specific number, but in a comment to the publication AMD said that "as a part of aligning our resources with our largest growth opportunities, we are taking a number of targeted steps that will unfortunately result in reducing our global workforce by approximately 4 percent". In actual headcount numbers that should be just north of a thousand people that the company will let go. It's not clear which departments or divisions at AMD will be affected the most, but the cutback appears to be a response to AMD's mixed quarterly report.

AMD's statement also doesn't make it clear on exactly what the company will be putting its focus on moving forward, but CRN seems to suggest that the embedded and gaming business is where AMD is struggling. That said, it's not likely that AMD will put an increased focus on those businesses, but instead the company is more likely to invest more into its server products, least not to try and catch up with NVIDIA in the AI server market. According to CRN, AMD has also seen a strong demand in AI PCs, such as the Ryzen AI 300-series of mobile SoCs, so it's possible AMD will put an extra effort into is mobile product range. The Ryzen 9000-series is thankfully also doing well, so it's unlikely there will be any big cutbacks here. We already know that AMD is not going after NVIDIA with a new flagship GPU to compete with NVIDIA's GeForce RTX 5000-series flagship SKU, so it's possible that the company will cut back on some people in its consumer GPU team for the time being, but this should become clear come CES in January.