GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

At the 2023 International CES, market leader Kingston expanded their FURY line of enthusiast-gaming PC memory with the introduction of several new DDR5 memory kits. The top-of-the-line FURY Renegade series comes in RGB and non-RGB trims, and with speeds of up to DDR5-7200 with Intel XMP 3.0 support. For the AMD crowd, the company showed off the FURY Beast RGB, which comes in speeds of up to DDR5-6000, and features AMD EXPO profiles along with extensive validation with Ryzen 7000 series processors.

For those still making the transition between DDR4 and DDR5, Kingston introduced the FURY Beast DDR4 RGB, which looks visually similar to their DDR5 FURY Beast, but comes with speeds of up to DDR4-3600, with validation on AMD Ryzen 5000 series processors. It also supports an Intel XMP 2.0 profile. For high-end gaming notebooks and SFF platforms, including the Intel NUC 12 Extreme, Kingston introduced the FURY Impact line of DDR5 SO-DIMM memory, which comes in speeds of up to DDR5-5600.

Here's the first look at the retail PIB package of an AMD Ryzen 9 7950X3D processor with 3D Vertical Cache technology. These chips come in box design that's distinct from the rest of the Ryzen 7000 lineup. Bright orange and silver accents make up the front face of the box, with "3D Vertical Cache technology" being mentioned prominently. With the Ryzen 7 5800X3D, the PIB package design was probably found to look too similar to the rest of the lineup and practically indistinguishable from those of the 5000G "Cezanne" desktop APUs, which is probably why AMD took this route.

It's very likely that we'll see Socket AM5 desktop APUs based on the "Phoenix Point" monolithic silicon later this year, with its 12 CU RDNA3 iGPU and 8-core/16-thread "Zen 4" CPU that has a 32 MB on-die L3 cache. These processors will have yet another distinguishable retail PIB packaging. AMD's then technical marketing director, Robert Hallock, assured us that the company will continue to invest in desktop APUs (processors with powerful iGPUs), despite Ryzen 7000 desktop processors coming with a low-power iGPU as standard.

MSI was conspicuous in its lack of a Radeon RX 7900 series RDNA3 graphics card when AMD launched these cards on December 13, 2022. The company later came out with a clarification that while it was skipping reference-design made-by-AMD (MBA) graphics cards under its marquee, it would release custom-design RX 7900 series cards in the first half of 2023 with some of the first cards being unveiled at CES. Well, here they are.

The MSI Radeon RX 7900 XTX and RX 7900 XT Gaming Trio Classic gets the latter part of its name from the fact that MSI used the older Tri Frozr 2.0 cooling solution from the previous-generation of graphics cards (RX 6000 series and RTX 30-series), rather than the latest Tri Frozr 3.0 it unveiled with the RTX 40-series. This cooler also gets the slightly older TorX 4.0 fan compared to newer TorX 5.0 fans with the RTX 40-series. This cooler has dealt with 350 W-ish TDP cooling requirements of GPUs such as the RX 6950 XT or the RTX 3090, so we reckon they could suit the RX 7900 series. There's still a brand new custom-design PCB underneath it, which pulls power from a trio of 8-pin PCIe power connectors, and so we could expect a fairly good power-limit for these cards.

ASUS today announced the all-new TUF Gaming A16 Advantage Edition, an all-AMD gaming laptop with a redesigned chassis and an incredibly immersive 16-inch display. The TUF Gaming A15, A17, F15 and F17 laptops also make a triumphant return, sporting the latest silicon from AMD, Intel, and NVIDIA to power players into the next generation of gaming performance.

TUF A16 Advantage Edition announced
Built for serious gaming with subtle styling, the TUF Gaming A16 Advantage Edition is a sleek gaming laptop built to demolish the competition. Powered completely by AMD, the TUF Gaming A16 features up to an AMD Ryzen 9 Zen 4 processor and AMD Radeon RDNA 3 mobile graphics. "AMD and ASUS have partnered to deliver our latest 'Zen 4' and RDNA 3 technologies into the most innovative form factors," said Jason Banta, CVP and GM OEM PC. "The TUF Gaming A16 Advantage Edition delivers blistering gaming performance and outstanding power efficiency in a sleek portable chassis."

Today at CES 2023, HP Inc is announcing new products and solutions designed to recharge hybrid experiences so people can thrive in today's digital world. "Hybrid provides us with greater flexibility and freedom in our personal lives, but brings its own set of challenges for people to stay productive and connected to others," said Alex Cho, President, Personal Systems, HP Inc. "HP is taking the headache out of hybrid by delivering powerful and best-in-class ecosystem experiences and industry-leading innovations - including the new HP Dragonfly Pro portfolio for freelancers, the Poly Voyager Free 60 Series Wireless Earbuds for exceptional audio experiences, and the HP E-Series monitors to help take productivity to the next level - while ensuring we continue to advance our world's most sustainable PC portfolio."4

Powering Freelancers with HP Dragonfly Pro
The freelancer community continues to grow exponentially, and by 2027 freelancers will make up more than 50% of the total U.S. workforce. That's why HP is bringing the power of its award-winning Dragonfly brand to freelancers wanting elevated experiences in their hybrid lives. This group of consumers wants technology with the power they need for multitasking and heavy workloads, coupled with built-in support and services for peace of mind.

During its CES 2023 keynote, AMD announced its latest Instinct MI300 APU, a first of its kind in the data center world. Combining the CPU, GPU, and memory elements into a single package eliminates latency imposed by long travel distances of data from CPU to memory and from CPU to GPU throughout the PCIe connector. In addition to solving some latency issues, less power is needed to move the data and provide greater efficiency. The Instinct MI300 features 24 Zen4 cores with simultaneous multi-threading enabled, CDNA3 GPU IP, and 128 GB of HBM3 memory on a single package. The memory bus is 8192-bit wide, providing unified memory access for CPU and GPU cores. CLX 3.0 is also supported, making cache-coherent interconnecting a reality.

The Instinct MI300 APU package is an engineering marvel of its own, with advanced chiplet techniques used. AMD managed to do 3D stacking and has nine 5 nm logic chiplets that are 3D stacked on top of four 6 nm chiplets with HBM surrounding it. All of this makes the transistor count go up to 146 billion, representing the sheer complexity of a such design. For performance figures, AMD provided a comparison to Instinct MI250X GPU. In raw AI performance, the MI300 features an 8x improvement over MI250X, while the performance-per-watt is "reduced" to a 5x increase. While we do not know what benchmark applications were used, there is a probability that some standard benchmarks like MLPerf were used. For availability, AMD targets the end of 2023, when the "El Capitan" exascale supercomputer will arrive using these Instinct MI300 APU accelerators. Pricing is unknown and will be unveiled to enterprise customers first around launch.

MSI announcing today a new lineup of AMD Ryzen 7000 Series processors that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen CPU will include the AMD Ryzen 9 7900, Ryzen 7 7700, and the Ryzen 5 7600 which will have a default TDP of 65 W. Even with a lower TDP, these CPUs will up to 12 cores and 24 threads as their respective CPUs and be able to hit their theoretical max boost clock of over 5 GHz. All X670 and B650 motherboards from MSI will be compatible and ready at launch with the newest BIOS version "AGESA COMBO PI-1.0.0.4" update.

MSI has 3 unique features to help users to overclock their systems which are called Performance Switch, PBO Thermal Point, and Config TDP with the new launch of AMD Ryzen 7000 Series processors. Earlier this year, MSI introduced a brand-new function called Performance Switch within the MSI BIOS. Performance Switch provides 3 levels of preset and an advanced option for users to choose from. Then combines both AMD's default PBO "Precision Boost Overdrive" and MSI's OC settings to provide a much higher CPU performance in both single-core and multi-core.

AMD today announced its new Ryzen 7000X3D high-end desktop processors to much fanfare, with availability slated for February 2023, you can read all about them in our older article. In our coverage, we noticed something odd about the cache sizes of the 12-core 7900X3D and 16-core 7950X3D. Whereas the 8-core, single-CCD 7800X3D comes with 104 MB of total cache (L2+L3), which works out to 1 MB L2 cache per core and 96 MB of L3 cache (32 MB on-die + 64 MB stacked 3DV cache); the dual-CCD 7900X3D and 7950X3D was shown with total caches of 140 MB and 144 MB, while they should have been 204 MB or 208 MB, respectively.

In our older article, we explored two possibilities—one that the 3DV cache is available on both CCDs but halved in size for whatever reason; and the second more outlandish possibility that only one of the two CCDs has stacked 3DV cache, while the other is a normal planar CCD with just the on-die 32 MB L3 cache. As it turns out, the latter theory is right! AMD put out high-resolution renders of the dual-CCD 7000X3D processors, where only one of the two CCDs is shown having the L3D (L3 cache die) stacked on top. Even real-world pictures of the older "Zen 3" 3DV cache CCDs from the 5800X3D or EPYC "Milan-X" processors show CCDs with 3DV caches having a distinct appearance with dividing lines between the L3D and the structural substrates over the regions of the CCD that have the CPU cores. In these renders, we see these lines drawn on only one of the two CCDs.

Besides the sensational Ryzen 7000X3D processors taking the fight to Intel's "Raptor Lake," AMD expanded the desktop Ryzen 7000 even downwards, with the introduction of three new 65 W processor SKUs that include boxed stock coolers. These include the Ryzen 5 7600 6-core/12-thread, the Ryzen 7 7700 8-core/16-thread, and the Ryzen 9 7900 12-core/24-thread. There's no 16-core part in this segment. These processors come with TDP values set at just 65 W, and PPT values in the range of 90 W to 120 W, and so their clock speeds and maximum boost speeds are lower compared to the 7000X series, with more aggressive power-management.

The 7600 boosts up to 5.10 GHz, and packs a 65 W-capable Wraith Stealth boxed cooling solution. The 7700 boosts up to 5.30 GHz, and the 7900 up to 5.40 GHz. Both the 7700 and 7900 include a Wraith Prism RGB cooler that can handle thermal loads of up to 140 W. The three chips are priced lower than their 7000X series cousins, with the 7600 going for USD $229, the 7700 at $329, and the 7900 at $429. The three chips are drop-in compatible with existing Socket AM5 motherboards without needing any BIOS update.

AMD today released its first mobile discrete GPUs based on its latest RDNA3 graphics architecture, the Radeon RX 7600M series, and the RX 7600S series. Although based on the latest architecture, AMD decided to built these GPUs on monolithic 6 nm dies, along with many of the power-management features incorporated from Ryzen 6000-series "Rembrandt" processors. The unnamed silicon these GPUs are based on physically features 32 RDNA3 compute units (2,048 stream processors), along with the updated dual instruction-issue rate SIMD components, 2nd generation Ray Accelerators, and AI acceleration. The silicon also features a 128-bit GDDR6 memory interface, supporting speeds of up to 18 Gbps.

The Ryzen 7600M series consists of the top RX 7600M XT with 32 CU, and the slightly lower RX 7600M with 28 CU. Both come with 8 GB of GDDR6 memory across the chip's 128-bit memory interface. The RX 7600M XT uses 18 Gbps memory clocks, while the RX 7600M uses 16 Gbps. The RX 7600M XT has a power band of 75 W to 120 W, while the RX 7600M needs 50 W to 90 W. The RX 7700S and RX 7600S have the same core-configurations as the RX 7600M XT and RX 7600M, respectively, but lower power draw (up to 100 W for the RX 7700S, and up to 75 W for the RX 7600S). Both GPUs feature updated display- and media-acceleration engines, with support for QHD+ displays up to 240 Hz. AMD claims that the RX 7600M XT beats the performance of desktop NVIDIA GeForce RTX 3060 12 GB.

AMD today launched two distinct kinds of mobile processors, the Ryzen 7045 "Dragon Range" serves the 45 W H- and HX-segments of performance and enthusiast notebooks with CPU core counts of up to 16-core/32-thread; while the U-segment, P-segment, and a portion of the H-segment (ranges of 15 W, 28 W, and 35 W), will be led by the Ryzen 7040 "Phoenix Point." Unlike the "Dragon Range" MCM, "Phoenix Point" is a monolithic silicon built entirely on the TSMC 4 nm EUV foundry node, and introduces a wealth of process-level and system-level power-management features.

AMD "Phoenix Point" combines an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a powerful iGPU based on the latest RDNA3 graphics architecture, and a feature-packed AI acceleration engine based on the XDNA architecture AMD built after the Xilinx acquisition. The CPU component is a fully-fledged "Zen 4" CCX, with 8 CPU cores featuring 1 MB of dedicated L2 cache per-core, and sharing a large 32 MB L3 cache. This is an increase from the previous generation "Rembrandt" and "Cezanne" dies that had a reduced 16 MB L3 shared among the eight "Zen 3" or "Zen 3+" CPU cores.

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

We are coming to you live from the 2023 International CES! AMD CEO Dr Lisa Su is kicking things off with her Keynote address, where her company is expected to announce its next generation Ryzen 7000 series "Zen 4" mobile processors, a much broader range of Ryzen 7000 desktop processors, including the fabled X3D processors; and much more!02:29 UTC: The show is about to begin with AMD CEO Dr Lisa Su taking centerstage, as CEA inaugurates its 2023 show.02:38 UTC: "Intelligence needs computing power"

ASUS Republic of Gamers (ROG) today announced a wide range of exclusive performance-focused products during the For Those Who Dare: Maxed Out virtual launch event for CES 2023. During the event, ROG showcased multiple product premieres, including impressively fast and stunning displays, powerhouse laptops with latest-gen processors and graphics, faster-than-ever routers, and a wide variety of peripherals to complete the most maxed-out gaming setups. This wide array of innovations includes the ROG Swift Pro PG248QP and ROG Swift OLED PG27AQDM gaming displays; ROG Azoth gaming keyboard; ROG Raikiri Pro PC controller; ROG Destrier Ergo gaming chair; ROG G22CH gaming desktop; and much more.

This year more than ever, ROG is evolving its gaming lineup to drive performance beyond limits. New additions presented during the event include Strix Scar and Strix G series gaming laptops, in 16-, 17-, and 18-inch versions. These gaming powerhouses host up to AMD Ryzen 9 Zen 4 and 13th Gen Intel Core processors, liberating more power than ever before for maxed-out performance, and NVIDIA GeForce RTX 40 Series Laptop GPUs, working in concert with a MUX Switch and NVIDIA Advanced Optimus to deliver never-before-seen performance on a laptop.

Alienware and Dell today reveal six new gaming laptops including: Alienware m18 and m16, Alienware x16 and x14, and Dell G16 and G15. And these aren't small updates either - the roster debuts updated form factors and materials, best-in-class performance upgrades, design and comfort enhancements, as well as an overhauled Alienware Command Center.

As what defines preeminent gaming experiences constantly evolves, Alienware and Dell continue to set itself apart with meaningful high-impact innovation that meets the changing needs of gamers. Whether you're a competitive or hobby gamer, if freedom without compromise is what you value most, look no further than our intrepid new fleet of high-performance laptops.

Today, Alienware crushes new barriers with the introduction of the world's fastest refresh rate of 500Hzi on a Fast IPS Gaming Monitor and the evolved Aurora R15 gaming desktop with AMD technology. These industry-leading display and desktop advancements further Alienware's competitive edge, underscoring our longtime legacy as both technology pioneers and gamers at heart. Following last year's incredible portfolio upgrades, we're full throttle into 2023 with no signs of slowing down.

Introducing the monitor with the world's fastest refresh rate of 500Hzi, the Alienware 500 Hz Gaming Monitor (AW2524H), a CES 2023 Innovation Award and Best of Innovation winner, delivers the world-class speed today's champions demand. Coming in at a 24.5-inch full high-definition (FHD) resolution with a supersonic refresh rate of 500 Hz overclocked (480 Hz native) on a Fast IPS panel, this elite display offers incredible frame rates to deliver stunning motion clarity in fast-paced games and help gamers clinch victory.

Acer announced two powerful Predator Helios gaming laptops and a pair of Predator gaming monitors. The laptops feature an all-new design with 16-inch and 18-inch display sizes, the latest 13th Gen Intel Core mobile processors and NVIDIA GeForce RTX 40 Series GPUs, making them Acer's most powerful gaming laptops to date. The Predator X45 showcases a massive 800R curved monitor and has earned a CES Innovation Award in the "Computer Peripherals & Accessories" category. Along with the Predator X27U, both monitors include OLED technology with fast 240 Hz refresh rates.

Predator Helios 16, Predator Helios 18 Laptops
The all-new Predator Helios 16 (PH16-71) and Predator Helios 18 (PH18-71) bring the latest and greatest tech to Acer's most powerful gaming laptop series. Sporting a completely new design and upgraded thermals, they both offer models that include 13th Gen Intel Core i9 or i7 HX processors paired with up to NVIDIA GeForce RTX 4080 Laptop GPU (MGP up to 165 W) and a plethora of must-have top-of-the-line gaming features.

AMD's latest GPUs have been reported to be experiencing overheating issues, with many users claiming that the vapor chamber cooler works better in a vertical rather than a horizontal position. Regardless of orientation, vapor chamber coolers should equal roughly the same heat dissipation performance and move the heat away from the source; however, testing showed that some reference AMD Radeon RX 7900 XTX GPUs feature defect coolers. According to the testing conducted by Roman "der8auer" Hartung, AMD's Radeon RX 7900 XTX RDNA3 GPUs are experiencing problems with overheating caused by a faulty vapor chamber design.

What der8auer found is that these coolers could have a defect in the manufacturing process, where the liquid inside the vapor chamber faces problems in circulation after condensation. It could relate to manufacturing issues of the cooler itself, with an inadequate amount of fluid or insufficient pressure inside the chamber. For more in-depth testing and performance benchmarks, see the video below. It is important to note that we didn't see other reports that replicate this behavior, so always take these reports with a dash of salt.

Just over a month ago, news broke that NVIDIA is planning to move its logistics center from Hong Kong to Taiwan and it now looks like AMD is getting ready to follow suit. The news is coming via Taiwan's United Daily News (UDN) and the paper claims that AMD will be setting up its logistics center in the Farglory free trade zone area in the Dayuan district of Taoyuan, which is next to Taiwan's main international airport. Currently companies like ASML and Asus operate inside the free trade zone and Farglory is currently in the last phase of an expansion of the free trade zone, which should be finalised sometime early in 2023. As such, there should be plenty of space for both NVIDIA and AMD to set up their logistics centers there.

The move for AMD doesn't seem to make as much sense as that of NVIDIA, as AMD's main graphics card partners, which should be Sapphire and XFX (Pine Group), are Hong Kong based companies. That said, AMD still has PowerColor, ASRock, Asus, Gigabyte and MSI in Taiwan, but only PowerColor is an exclusive AMD partner. This does of course not take motherboards or servers into account, where its Taiwanese partners are key. On the other hand, just as NVIDIA, AMD produces its GPUs at TSMC, so for products that doesn't end up in the PRC, it would make more sense to have them go straight to a logistics center in Taiwan, rather than having to ship them out to Hong Kong and then back to Taiwan again. According to UDN it's apparently also cheaper for AMD to shop goods directly from Taiwan to the PRC, as it's apparently quite costly to ship via Hong Kong. Another reason is of course the ongoing trade war between the US and the PRC, which could lead to future issues for both AMD and NVIDIA. Hong Kong has also slowly lost its importance as a key center in the electronics business, with Taiwan and Singapore having become more important hubs, according to UDN.

EK, the premium liquid cooling gear manufacturer, is releasing yet another unique pump-reservoir-water block combo. This time for AMD AM5 Socket, Ryzen 7000-series CPUs, and AM5 socket-based motherboards. It features the latest socket-specific EK-Quantum Velocity² cooling engine, while the CPU water block has an integrated DDC 4.2 PWM pump that is cooled by the metal part of the water block acting as a heatsink. The combo is the perfect companion for ITX (SFF) builds where space for a dedicated pump and reservoir is an issue. This product effectively combines four different products into a single small enclosure for ultimate space-saving.

The product combines a Velocity² CPU water block, a genuine DDC 4.2 PWM pump with a reservoir, and a DDC heatsink. All this is contained in an assembly significantly smaller than the sum of its parts. A total of four products in a footprint of a hefty CPU water block that fits perfectly. EK-Quantum Velocity² series CPU water blocks embed the next-generation cooling engine. They use a specific combination of mounting pressure and coldplate geometry tailored for the IHS and chiplet layout of AMD AM5 socket processors. Low hydraulic flow restriction enables these products to be used in setups with weaker water pumps or lower pump speeds for added silent operation while still being able to easily achieve top performance. The lathe-turned coldplate is made with precision to cover the IHS effectively and put pressure on the die area.

A few months ago, AMD has launched its highly anticipated Ryzen 7000 series of processors based on Zen 4 architecture. However, the company only launched the "X" SKUs (example being 7900X) for now, while the remaining ones are awaiting a launch date. Today, we have information from VideoCardz that confirm AMD's new launch on January 10th, when team red plans to update its remaining processor family with Ryzen 7000 series non-X SKUs. There will be three initial models to choose from Ryzen 9 7900 (12C/24T), Ryzen 7 7700 (8C/16T), and Ryzen 5 7600 (6C/12T). These SKUs follow the traditional Zen 4 path; however, the only distinction from their "X" counterparts is the reduced TDP to 65 Watts, down from up to 170 Watt TDP in some of those models.

A leaked slide from AMD's product presentation regarding these SKUs is a comparison between AMD's own Ryzen 9 5900X and Ryzen 9 7900, where the Zen 4 variant successfully beat the older SKU by a significant percentage. Pricing and further details are listed on the slides below.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B650M-SILVER motherboard. Designed based on the AMD M5 socket, the B650M-SILVER motherboard is fully stacked to enable the latest Ryzen 7000 series processors. Leveraging the latest DDR5 memory technology, it performs exceptionally well at any given task, powered by advanced design elements like support for both AMD EXPO and Intel XMP RAM modules.

The B650M-SILVER, despite its Micro-ATX form factor, offers top-shelf features like a PCI-E Gen4 x16 slot with iron protection. The SILVER series motherboard combines 14 phase (10+2+2) power design with a 90 A power stage VRM solution to match today's power-hungry hardware, thanks to the company's signature DIGITAL PWM and 90 A Dr.MOS technologies.

TechPowerUp today released the latest version of TechPowerUp GPU-Z, the popular PC graphics information, monitoring, and diagnostics utility. Version 2.52.0 adds support for AMD Radeon RX 7900 XTX, RX 7900 XT, RX 6300 OEM; NVIDIA GeForce RTX 4070 Ti, and a few rare "Ampere" based GPUs in circulation these days, including the RTX 3080 Ti 20 GB, RTX 3070 Ti based on GA102 silicon, RTX 3050 based on GA107, and the PCIe AIC version of the A800 80 GB accelerator. Detection is improved for the Xe LP-based iGPU of Intel Core "Raptor Lake" processors. NVIDIA GPUs with ECC memory now have ECC status reported in the Advanced panel. On GPUs where the boost frequency can't be read, the base frequency will be used to calculate fillrates. Clock speed detection for Intel Arc "Alchemist" GPUs has been improved. Vendor detection has been added for several new graphics card brands such as Corsair (gaming notebooks), Maxsun, and Wingtech.

DOWNLOAD: TechPowerUp GPU-Z v2.52.0

AMD released the Adrenalin 22.12.2 WHQL drivers exclusively for the recently launched Radeon RX 7900 XTX and RX 7900 XT graphics cards. These drivers do not support any other product series (which is why TechPowerUp isn't hosting them in our Downloads section). Compared to the previous 22.11.2 WHQL drivers from mid-December (which lack RX 7900 series support), the 22.12.2 WHQL doesn't pack any game-specific optimizations, but corrects a handful of issues.

To begin with, AMD has improved the power-consumption of the RX 7900 series cards during hardware-accelerated video playback. Display corruption observed for Virtual Super Resolution (VSR) with multi-display configurations, has been fixed. A system crash observed when changing display modes in machines with 4 display, has been fixed. An application crash or driver timeout observed with Marvel's Spider-Man: Miles Morales after enabling ray tracing, has been fixed. Grab the driver from the link below.

DOWNLOAD: AMD Software Adrenalin 22.12.2 WHQL (for RX 7900 series only)