AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

An AMD Ryzen 7 5800X3D processor that's been de-lidded (has its integrated heatspreader or IHS removed), posts vastly better thermals, according to Madness7771 on Twitter, who succeeded in de-lidding their 5800X3D. The stock 5800X3D posts significantly higher CPU core temperatures than a regular 5800X, due to its 3D Vertical Cache (3DV Cache) chiplet design, in which heat from the CPU cores is conducted through structural silicon, to the surface of the die-stack, from where the STIM conducts heat onward to the IHS.

A de-lidded 5800X3D reveals the 8-core "Zen 3" 3DV chiplet (CCD) next to a blob of structural material in the vacant area meant for a second CCD. With the residual STIM cleaned off, Madness7771 used a Conductonaut TIM and a Noctua NH-D14 to cool the processor. Madness7771 also posted some before and after temperature numbers for the processor (using the same cooler). It sees a maximum temperature drop from 80 °C to 70 °C, and average temperature drop from 78 °C to 67 °C, tested with a Forza Horizon 5 gaming workload. They also note that the peak temperature of the 5800X3D no longer reaches over 90 °C. De-lidding processors with STIM is a very risky process, and will destroy your processor if not done right.

It would appear that we're slowly getting closer to the launch of AMD's AM5 platform, as ASRock just put up its first X670E motherboard on its website. The page still has very limited information and there's only a single picture of the motherboard, which is the same one that the company shared at Computex. However, we now get a few more details with regards to what to expect in terms of additional features. For starters, ASRock has gone for a 26-phase SPS Dr.MOS power design, which should be plenty even for the most avid overclocker. The board has a pair of PCIe 5.0 x16 slots that operate in dual x8 mode when both slots are used. In addition to this there are four M.2 slots, where ASRock has decided to call the CPU connected slot for Blazing, as it's PCIe 5.0, whereas the three PCIe 4.0 slots are using the Hyper name the company has used so far.

The board also has eight SATA ports, two Thunderbolt 4 ports, which apparently are USB4 certified as well and a header for a USB 3.2 Gen 2x2 (20 Gbps) case mounted port. Furthermore the board has five rear USB 3.2 Gen 2 (10 Gbps) USB-A ports around the back, plus three USB 3.2 Gen 1 (5 Gbps) ports and a further four via headers, as well as a single HDMI port of unknown version. ASRock has gone for an Intel Killer E3100G 2.5 Gbps Ethernet controller and an Intel Killer AX1675X WiFi 6E and Bluetooth card, with the combo having Killer DoubleShot Pro support. Finally audio is via a Realtek ALC4082 USB connected audio codec and an ESS Sabre 9218 DAC. Overall this looks like a pretty kitted out board without too much excessive bling and will hopefully be priced accordingly.

According to fresh benchmark numbers from someone on bilibili, Intel's Arc A380 cards perform even worse when paired with an AMD CPU compared to when paired with an Intel CPU. The card was tested using an AMD Ryzen 5 5600 on an ASUS TUF B550M motherboard paired with 16 GB of DDR4 3600 MHz memory. The Intel system it was tested against consisted of a Core i5-12400 on an ASUS TUF B660M motherboard with the same type of memory. Both test systems had resizable BAR support set to auto and above 4G decoding enabled. Windows 11 21H2 was also installed on both systems.

In every single game out of the 10 games tested, except League of Legends, the AMD system was behind the Intel system by anything from a mere one percent to as much as 15 percent. The worst performance disadvantage was in Forza Horizon 5 and Total War Three Kingdoms, both were 14 to 15 percent behind. The games that were tested, in order of the graph below are: League of Legends, Dota 2, Rainbow 6 Extraction, Watch Dogs Legions, Far Cry 6, Assassin's Creed Valhalla, Total War Three Kingdoms, Shadow of the Tomb Raider, CS:GO and Forza Horizon 5. For comparison, an NVIDIA GeForce GTX 1650 was also used, but only tested on the Intel based system and the Arc A380 only beat it on Total War Three Kingdoms, albeit by a seven percent margin. It appears Intel has a lot of work to do when it comes to its drivers, but at last right now, mixing Intel Arc graphics cards and AMD processors seems to be a bad idea.

Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), introduces the D3723-R Mini-ITX industrial motherboard at embedded world 2022, based on the AMD Ryzen Embedded R2000 line, which was developed in Germany and will also be produced there in the future. Compared to V/R1000 APUs (Accelerated Processing Units) from AMD, it delivers higher performance. Besides the lower price, the new model also convinces with Windows 11 support and a long life cycle of seven years. Like all Kontron motherboards with the denomination D3xxx or K3xxx, the D3723-R is produced in Germany.

Thanks to AMD Radeon Vega Graphics, the solution is particularly suitable for embedded graphics applications such as professional casino gaming systems, medical displays, thin clients and industrial PCs as well as for kiosk, infotainment or digital signage systems. Compared to the previous model based on the R1000 and V1000 series, the R2000 shows similar features to the V1000 SKUs. These include 16 PCIe lanes, up to four display ports and scalability of the available APU SKUs (R2312, R2314, R2514 and R2544) from 12 to 54 W (TDP - Thermal Design Power). Windows 11 support and an attractive price/performance ratio clearly speak for the R2000.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

Today marks a year since gamers could try out AMD FidelityFX Super Resolution technology for themselves with our spatial upscaler - FSR 1. With the introduction of FSR 2, our temporal upscaling solution earlier this year, there are now over 110 games that support FSR. The rate of uptake has been very impressive - FSR is AMD's fastest adopted software gaming technology to date.

So it seems fitting that we should pick this anniversary day to share the source code for FSR 2, opening up the opportunity for every game developer to integrate FSR 2 if they wish, and add their title to the 24 games which have already announced support. As always, the source code is being made available via GPUOpen under the MIT license, and you can now find links to it on our dedicated FSR 2 page.

Back in January, Intel overturned an antitrust ruling by the EU and didn't have to pay the $1.2 billion fine, but it seems like the company isn't satisfied with getting out of having to pay a huge fine, but is now asking the EU to compensate the company for interest lost. As such, Intel has filed for "payment of compensation and consequential interest for the damage sustained because of the European Commissions refusal to pay Intel default interest" with the EU General Court. The sum of money Intel is asking for is based on the European Central Bank's refinancing rate and as the original fine was levied back in 2009, Intel claims they're owed more than half of the value of the fine.

Intel is also expecting further interest on the money, if the payment is late from the EU. It should be noted that the European Commission has already paid Intel €38 million in interest on the fine that was paid back in 2009, but Intel is clearly not happy and is asking for a much greater sum. However, the battle between the European Commission and Intel isn't over, as the Commission is working on appealing the ruling, so depending on the outcome of that appeal, Intel might have to pay back the fine to the EU. For those that don't remember the original reason for the antitrust fine, Intel was accused of giving rebates to certain partners and system integrators to make sure they didn't use AMD products in their systems, among other things.

YouTuber Matt Perks, known as DIY Perks on Google's video-sharing platform, has achieved the title of owning the world's first "PS5 Slim" console... by creating a custom watercooling system that's aimed at keeping the AMD-designed chip in check while rendering some of the most impressive games of this generation. Thanks to the custom watercooling unit, the PS5's usual 4-inch width was reduced to a mere inch - and due to improved operating temperatures, it's likely the hardware will see increased longevity. Barring any catastrophic leakage, of course.

Perks made use of a copper sheet to channel water over the PS5's APU, while also including thermal bridges that distributed the contained water throughout the consoles' SSD and power delivery subsystem. There is a secret to the consoles' slim profile, however, which should also answer one question you're holding on your mind: where, in that single inch frame, did he fit the pump and radiator for the embedded watercooling?

AMD today announced the Ryzen Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000 Series doubles the core count and delivers a significant performance uplift compared to the prior generation, with the new R2514 model exhibiting up to 81 percent higher CPU and graphics performance than the comparable R1000 series processor. Performance-per-watt efficiency is also optimized using "Zen+" core architecture with AMD Radeon graphics for rich and versatile multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in brilliant 4K resolution.

Embedded R2000 Series processors are scalable up to four "Zen+" CPU cores with eight threads, 2 MB of L2 cache and 4 MB of shared L3 cache. This gives embedded system designers great flexibility to scale performance and power efficiencies with a single processing platform. With support for up to 3200 MT/s DDR4 dual-channel memory and expanded I/O connectivity, the Ryzen Embedded R2000 Series processors deliver 33 percent higher memory bandwidth and up to 2X greater I/O connectivity compared to R1000 series processors.

Graphics card prices have been on a steady decline in the past few months, following their peak in May of last year when we saw double and triple pricing compared to the baseline MSRP value. According to the 3DCenter.org report, which tracks graphics card prices in Germany and Austria, we have information that AMD GPU prices have dipped below MSRP, while NVIDIA GPUs are very close to baseline listed prices. The report tracks Ethereum mining profitability and displays it in the yellow line. As the line is declining, so are the GPU prices. For AMD, the prices are now 8% below the 100% of MSRP. At 92%, consumers can find AMD GPUs at a slight discount. While AMD cards are slightly cheaper, NVIDIA GPUs are now at 102% of the MSRP, the lowest price point since the launch.

AMD is allegedly preparing an upgraded quad-core APU with Zen 4 and RDNA3 architectures for a next-generation Steam Deck device according to Moore's Law is Dead. The report claims that the chip is referred to as a "Van Gogh Successor" internally with a die size between 110 mm² and 150 mm² resulting in an increased production cost. The chip should feature 4 Zen 4 cores and 8 threads offering 25% - 35% higher performance per clock (PPC) with a maximum boost of 4 GHz. The RDNA3 graphics will include 8 Compute Units with significantly higher PPC compared to their RDNA2 counterparts which combined with the updated CPU could see a performance improvement up to 50%. These rumors have not been confirmed with any potential Steam Deck processor far from being announced or released anytime soon.

15th September, 2022, is when AMD will debut its Ryzen 7000 "Zen 4" desktop processors. The launch strategy of these chips looks similar to that of the Ryzen 5000 series. The company is preparing a lean launch lineup with just four SKUs—the Ryzen 9 7950X, the Ryzen 9 7900X, Ryzen 7 7800X, and the Ryzen 5 7600X. These SKUs succeed the 5950X, 5900X, 5800X, and 5600X, which made up the previous launch lineup. AMD in its recent interview with us, made it clear that 16-core/32-thread is the maximum core-count for the 7000 series, which would make the 7950X such a chip. The core-counts of the other SKUs are not known. All these models are built in the Socket AM5 package, featuring PCI-Express Gen 5 and DDR5 interfaces. But wait, there's more.

Although AMD led us to believe that it's going all-in with DDR5, we're hearing a spectacular rumor that suggests otherwise. Apparently, the company is designing Socket AM4 processors with "Zen 4" chiplets, possibly paired with the existing cIOD that supports PCI-Express Gen 4 and DDR4 interfaces. The rumor surfaced among sources lower down the supply-chain (resellers). It seems like AMD isn't convinced it could target the lower-end of the market with AM5 just yet, and isn't 100% confident that affordable DDR5 memory will come through in time. The "Zen 4" + AM4 processors would compete with Intel 600-series chipset motherboards that have DDR4 and PCIe Gen 4 connectivity. Trouble is, you can upgrade your Intel LGA1700 motherboard to one that has DDR5+PCIe Gen5 while keeping your processor; but you can't do so with an AM4 Zen 4 processor (you're stuck on AM4). AMD still gets to sell some processors, and those with AM4 platforms can rejoice.

An engineering sample of AMD's next-generation Ryzen "Phoenix Point" mobile processor has been powered up, and made its first appearance on the Geekbench user-database. "Phoenix Point" is a monolithic silicon mobile processor built on the TSMC N5 (5 nm EUV) process, featuring "Zen 4" CPU cores, and a significantly faster iGPU based on the RDNA3 graphics architecture; along with a DDR5/LPDDR5 memory interface, and PCI-Express Gen 5.0 capability. An engineering sample with an 8-core/16-thread CPU, with the OPN code "100-000000709-23_N," hit the radar. AMD could debut Ryzen "Phoenix Point" in the first quarter of 2023, possibly with an International CES announcement.

AMD for long has been perceived as lagging behind NVIDIA in OpenGL API graphics performance, as is evident in synthetic benchmarks that let you choose between various APIs, such as DirectX 11, DirectX 12, Vulkan, and OpenGL. It's being reported that the company has made a technical breakthrough that could significantly improve OpenGL application performance, bringing Radeon GPUs on par with GeForce in GL applications. Besides a few old games, several productivity applications continue to use OpenGL, such as Adobe Creative Cloud suite; as well as certain 3D renderers.

AMD is incorporating its OpenGL performance enhancement in drivers bound for Windows 11 22H2 (the major release bound for the second half of 2022). With this release, Microsoft is debuting WDDM 3.1, and AMD is already out with a Preview driver meant for Windows Insiders, bearing version 31.0.12000.20010. A quick Unigine Valley benchmark run with the OpenGL renderer reveals an incredible 49.5% increase in frame-rates, bringing the RX 6800 XT sample to performance-levels you'd expect from the RTX 3080. An identical 49.5% frame-rate increase was seen in Unigine Superposition.

In 2017, the semiconductor world was shocked to discover new vulnerabilities in modern Intel, AMD, and Arm processors. Dubbed Spectre and Meltdown, these exploits used cache-based side-channel attacks to steal information from the system. Today, we are getting a more advanced side-channel vulnerability hidden in every CPU capable of boosting frequencies. Interestingly called "Heartzbleed," the new exploit can steal secret AES cryptographic keys when observing CPU's boost frequencies. The attack works by monitoring the power signature of any cryptographic workload. As with any other element in a CPU, the workload's power varies according to the processor's frequency scaling in different situations. Observing this power information can be converted into timing data, allowing an attacker to steal cryptographic keys. This is done using Dynamic Voltage Frequency Scaling (DVFS), a part of any modern processor.

Intel and AMD already published that their systems are vulnerable and affected by Heartzbleed exploit. It is labeled Intel-SA-00698 ID and CVE-2022-24436 ID for Intel CPUs and CVE-2022-23823 for AMD CPUs. It affects all Intel processors, and Zen 2 and Zen 3 AMD CPUs. The attacker can exploit this vulnerability remotely without requiring physical access. Intel and AMD will not offer microcode mitigations that should prevent this type of exploit from executing successfully. Additionally, Intel stated that this attack is not very practical outside of laboratory research, as it allegedly takes hours to days to steal cryptographic keys. The performance penalty for mitigating this attack ranges from high to low, depending on the type of implementation.

One of AMD's big announcements this fall has been its entry-level "Mendocino" Ryzen 3 mobile processor, which enables the company to compete with Intel's latest-generation Pentium Gold-powered notebooks by combining older-generation IP with the latest I/O and fabrication node. The chip has possibly surfaced on the UserBenchmark database, as the Ryzen 3 7320U processor.

Built on the TSMC N6 (6 nm) silicon fabrication process, the "Mendocino" chip features a 4-core/8-thread CPU based on the older "Zen 2" microarchitecture. This CPU is a single CCX with four "Zen 2" cores sharing a 4 MB L3 cache. It features an iGPU based on the latest RDNA2 graphics architecture, but with just two compute units (128 stream processors). The chip also features a single-channel DDR5 memory interface, and a PCI-Express Gen 3 interface with four PCIe 3.0 general-purpose lanes, besides some USB and display outputs.

AMD formally launched the "Raise the Game" (2022) game bundle. Get up to three AAA games for free, when you buy a Radeon RX 6000 series graphics card. As described in the table below, new purchases of the Radeon RX 6700, RX 6700 XT, RX 6750 XT, RX 6800, RX 6800 XT, RX 6900 XT, and RX 6950 XT, gets you three titles—"Saints Row," "Sniper Elite 5," and "Forspoken." New purchases of the RX 6600, RX 6600 XT, and RX 6650 XT, gets you "Forspoken," and "Saints Row." An RX 6500 XT and RX 6400 gets you "Saints Row." The bundle was announced on May 10, when the company launched its Summer 2022 refresh of the RX 6000 series. At the time, qualifying retailers had already started giving out redemption codes, asking buyers to hold on to them until the bundle is released.

AMD's Malaysian joint venture, TF-AMD Microelectronics is in the middle of the construction of a US$452 million manufacturing plant on the island of Penang off the west coast of Malaysia. The facility itself is said to cover 139,000 square metres and is said to create some 3,000 jobs related to advanced semiconductor engineering. The new plant will bring TF-AMD's total manufacturing space in Penang to 210,000 square metres, as the company already has a prior facility on the island.

The plant will allow AMD to expand the chip packaging side of its business, something that is going to be key for many of its future products, considering AMD appears to be focusing on manufacturing a wider range of chips that are made up from multiple chiplets. The TF in the name stands for TongFu, which is a Chinese IC assembly and testing company that AMD has partnered up with in Malaysia. The current plant does everything from wafer sorting to wafer level chip scale packaging to final testing and AMD chips made in Malaysia would have been assembled here.

AMD is planning to debut its next-generation RDNA3 graphics architecture with the Radeon RX 7000 series desktop graphics cards, some time in late-October or early-November, 2022. This, according to Greymon55, a reliable source with AMD and NVIDIA leaks. We had known about a late-2022 debut for AMD's next-gen graphics, but now we have a finer timeline.

AMD claims that RDNA3 will repeat the feat of over 50 percent generational performance/Watt gains that RDNA2 had over RDNA. The next-generation GPUs will be built on the TSMC N5 (5 nm EUV) silicon fabrication process, and debut a multi-chip module design similar to AMD's processors. The logic dies with the GPU's SIMD components will be built on the most advanced node, while the I/O and display/media accelerators will be located in separate dies that can make do on a slightly older node.

AMD over the weekend reportedly released the AGESA V2 PI 1.2.0.7 microcode to motherboard vendors and PC OEMs. This particular version of AGESA gains importance to those on Windows 11, as it corrects a performance-stuttering issue caused due to frequent polling of the fTPM by the OS. The new version of AGESA is also bound for AMD 300-series chipset motherboards, where it adds official (stable) support for Ryzen 5000 series processors, letting those on the 5-year old platform enjoy an IPC uplift as much as 60% (Zen 3 vs. Zen). 1.2.0.7 is also rumored to address certain stability issues with the Ryzen 7 5800X3D, and enables BCLK overclocking on the chip, as long as the processor doesn't draw more than 1.35 V in the Vcore voltage domain. It's now over to the motherboard vendors and PC OEMs, to encapsulate 1.2.0.7 with their firmware and release to end-users.

May 12, 2022, was a big day for AMD FidelityFX Super Resolution (FSR) -- DEATHLOOP was the first game to be updated with FSR 2.0, and we were thrilled to see the incredible response to the next generation of our open-source upscaling technology. Now we are extremely excited to tell you that two more games have been updated to add support for FSR 2.0, Farming Simulator 22 by GIANTS Software and God of War by Santa Monica Studio and PlayStation Studios.

FSR 2.0 is the next-level AMD temporal upscaling technology designed to deliver similar or better than native image quality and boost framerates in supported games across a wide range of products and platforms. Along with the two new FSR 2.0 game updates above, five more games have now joined the list of upcoming FSR 2.0 titles - Abyss World, Hitman 3, Rescue Party: Live!, Super People, and The Callisto Protocol. In addition, more games have been updated to support FSR 1.0.

AMD in its 2022 Financial Analyst Day presentation announced the codename for the second generation of Ryzen desktop processors for Socket AM5, which is "Granite Ridge." A successor to the Ryzen 7000 "Raphael," the next-generation "Granite Ridge" processor will incorporate the "Zen 5" CPU microarchitecture, with its CPU complex dies (CCDs) built on the 4 nm silicon fabrication node. "Zen 5" will feature several core-level designs as detailed in our older article, including a redesigned front-end with greater parallelism, which should indicate a much large execution stage. The architecture could also incorporate AI/ML performance enhancements as AMD taps into Xilinx IP to add more fixed-function hardware backing the AI/ML capabilities of its processors.

The "Zen 5" microarchitecture makes its client debut with Ryzen "Granite Ridge," and server debut with EPYC "Turin." It's being speculated that AMD could give "Turin" a round of CPU core-count increases, while retaining the same SP5 infrastructure; which means we could see either smaller CCDs, or higher core-count per CCD with "Zen 5." Much like "Raphael," the next-gen "Granite Ridge" will be a series of high core-count desktop processors that will feature a functional iGPU that's good enough for desktop/productivity, though not gaming. AMD confirmed that it doesn't see "Raphael" as an APU, and that its definition of an "APU" is a processor with a large iGPU that's capable of gaming. The company's next such APU will be "Phoenix Point."

AMD in its 2022 Financial Analyst Day presentation unveiled its next-generation CDNA3 compute architecture, which will see something we've been expecting for a while—a compute accelerator that has a large number of compute units for scalar processing, and a large number of x86-64 CPU cores based on some future "Zen" microarchitecture, onto a single package. The presence of CPU cores on the package would eliminate the need for the system to have an EPYC or Xeon processor at its head, and clusters of Instinct CDNA3 processors could run themselves without the need for a CPU and its system memory.

The Instinct CDNA3 processor will feature an advanced packaging technology that brings various IP blocks together as chiplets, each based on a node most economical to it, without compromising on its function. The package features stacked HBM memory, and this memory is shared not just by the compute units and x86 cores, but also forms part of large shared memory pools accessible across packages. 4th Generation Infinity Fabric ties it all together.

AMD in its 2022 Financial Analyst Day presentation claimed that it will repeat the over-50% generational performance/Watt uplift feat with the upcoming RDNA3 graphics architecture. This would be a repeat of the unexpected return to the high-end and enthusiast market-segments of AMD Radeon, thanks to the 50% performance/Watt uplift of the RDNA2 graphics architecture over RDNA. The company also broadly detailed the various new specifications of RDNA3 that make this possible.

To begin with, RDNA3 debuts on the TSMC N5 (5 nm) silicon fabrication node, and will debut a chiplet-based approach that's somewhat analogous to what AMD did with its 2nd Gen EPYC "Rome" and 3rd Gen Ryzen "Matisse" processors. Chiplets packed with the GPU's main number-crunching and 3D rendering machinery will make up chiplets, while the I/O components, such as memory controllers, display controllers, media engines, etc., will sit on a separate die. Scaling up the logic dies will result in a higher segment ASIC.