The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.

ASUS has released an official statement regarding the recently discovered issues with AMD Ryzen 7000 series CPUs, especially the Ryzen 7000X3D series. ASUS has also released EFI updates on Friday, that include thermal monitoring mechanism to protect motherboards and CPUs and is working on new updates that should be available soon and define new rules for AMD Expo and SoC voltage, which appear to be the main issue related to the CPU VDDIO/MC voltages.

We have already covered the first reports of damaged Ryzen 7000X3D series CPUs that suffered physical damage, and some motherboard manufacturers have already released new BIOS updates, including MSI. In the meantime, Roman "Der8auer" Hartung has also discovered that the issue might not be just limited to the Ryzen 7000X3D series, but could also impact the Ryzen 7000 X-series CPUs. Although there were no earlier reports on such issues, AMD Expo appears to be the main source of the problem and users can either disable it or manually set the SoC voltage, at least until motherboard makers come up with new BIOS updates or we hear an official statement from AMD.

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.

A memory mod for the NVIDIA GeForce RTX 3070 that doubles the amount of VRAM showed some impressive performance gains, especially in the most recent games. While the mod was more complicated than earlier ones, since it required some additional PCB soldering, the one tested game shows incredible performance boost, especially in the 1%, 0.1% lows, and the average frame rate.

Modding the NVIDIA GeForce RTX 3070 to 16 GB VRAM is not a bad idea, since NVIDIA already planned a similar card (RTX 3070 Ti 16 GB), but eventually cancelled it. With today games using more than 8 GB of VRAM, it means that some RTX 30 series graphics card can struggle with pushing playable FPS. The modder benchmarked the new Resident Evil 4 at very high settings, showing that those additional 8 GB of VRAM is the difference between stuttering and smooth gameplay.

AMD is likely to skip the launch of a Radeon RX 7700 series for now, and prioritize the RX 7600 series. Sources tell Igor's Lab that AMD's dedicated AIB partners (such as ASRock, Sapphire, PowerColor, and XFX), are expected to have custom-design boards based on Radeon RX 7600 series ready to show by Computex 2023 (June), although multi-brand board partners, such as MSI, ASUS, and GIGABYTE, are expected to take a wait-and-watch approach toward the series. AMD is likely yet to figure out the economics of an RX 7700 series product that could compete with NVIDIA's GeForce RTX 4070 series, offering competitive performance and energy-efficiency, but the introduction of the RTX 4060 series could see NVIDIA reap the sub-$500 market, where AMD possibly has a competitive silicon.

GEEKOM is thrilled to announce the release of the GEEKOM AS 6, an AMD-powered mini PC. This powerful, feature-packed PC is the result of an exclusive collaboration between GEEKOM and ASUS, with these two industry-leading companies teaming up to co-develop a Mini PC with better overall performance than the Intel NUC 13 Pro Arena Canyon, making it the best choice for the gaming and office of the future!

GEEKOM and ASUS always strive to bring users the most optimal mini PC experience, and the AS 6 is proof of that commitment. The AS 6, powered by the AMD Ryzen 9 6900HX processor, delivers unprecedented levels of performance to effortlessly handle any task-from playing the latest games to intensive office work. It is truly eye-opening to discover that the AMD Radeon Graphics 680M in the AS 6 boasts a staggering performance improvement of nearly 90% compared to Intel Iris Xe Graphics in the NUC 13 Pro. And the new Radeon graphics technology combined with ultrafast DDR5 memory offers up to 2x faster game performance than the last gen.

A Reddit user has shared their experience of passively cooling an AMD Ryzen 9 7950X, with some modifications to the setup. Using the Streacom DB4 passively cooled case, the user u/AromaticImpress7778 pulled off cooling a processor with 16 cores and 32 threads with a TDP of 170 Watts. Interestingly, the Streacom DB4 case rates CPU support for only 65 Watts, meaning some modifications were in place. To support the high-TDP CPU, the user used two of the one-kilogram copper bars and attached them to the case. Heat is transferred to the two one-kilogram blocks using the case's default plate and an additional 233-gram copper plate for the CPU and motherboard. These big copper blocks are not soldered to the case, but instead, the user puts Thermal Grizzly Conductonaut liquid metal between copper parts and Arctic MX-6 between the case and copper.

To cool the AMD Ryzen 9 7950X and MSI B650I board, accompanied by HDPlex GaN 250 W and 64 GB of memory, the system did well enough for a passive build. After running the system at full load, the CPU reached 95 degrees Celsius for CCD1 and 95 degrees Celsius for CCD2. The external panels of the Streacom DB4 case were getting 50C to 60C of heat. Additionally, the user noted that the usage of this system will be more relaxed, as it will not run under full load for a prolonged period. Regarding the system's total weight, the entire build weighs around 13 KG, with 4.4 KG of that being only copper. The case weighs 7.5 KG, and the other parts weigh about one kilogram.

In the height of the crypto-mining GPU shortage of 2021-22, the Radeon RX 6900 XT and its refresh the RX 6950 XT, were scalped and resold for upward of $2,000. You can get one for as low as $600 on Newegg. The ASRock Radeon RX 6950 XT Phantom Gaming OC is now listed on U.S. retailer Newegg.com at $630, with a coupon code that shaves $30 off, bringing the effective price down to $600, which is the MSRP of the recently announced NVIDIA GeForce RTX 4070 "Ada."

Our testing shows that the RTX 4070 offers performance on-par with previous-generation RTX 3080 and the Radeon RX 6800 XT. The RX 6900 XT is about 6% faster than the RTX 4070 at 1440p (averaged over our test suite), and the RX 6950 XT from our older reviews is about 6-7% faster than the RX 6900 XT at 1440p. This is, however, performance with raster 3D graphics (which makes up the majority of gaming graphics), the ray tracing performance of the RX 6950 XT is closer to that of the RTX 3070 Ti, or about 23% slower than the RTX 4070. The RTX 4070 is a more efficient GPU, and also offers next-gen features such as DLSS 3 Frame Generation.

MINISFORUM is proud to announce the release of its latest device, the B550 PRO, an upgraded version of the B550 model. This Mini PC can be transformed into a full-sized gaming desktop when connected to an SFX power supply and discrete graphics card, offering users a versatile and powerful computing experience. Powered by the AMD B550 chipset and supporting Ryzen 5000 series CPU and APU (Up to 5800X processor), the B550 PRO is capable of handling daily office tasks and large-scale gaming.

This device's standout feature is its versatility, with a PCIe 3.0 x16 slot allowing direct connection of desktop discrete graphics cards through the PCIe 3.0 x16 interface on the chassis and the PCIe 3.0 x16 slot on the included expansion dock. The device also includes a PCIe 3.0 x4 slot, which is added into the docking station, enabling the addition of an SSD or network card expansion card, and enhancing the device's overall versatility.

CD Projekt RED, the developer of Cyberpunk 2077, has advertised including various super sampling technologies like NVIDIA DLSS, AMD FSR, and now Intel XeSS supersampling. With the inclusion of XeSS version 1.1, Intel's Arc Alchemist graphics cards can record a significant performance uplift. Thanks to the Intel game blog, we compare XeSS enabled versus XeSS disabled, measuring the ability to play Cyberpunk 2077 at 1080p Ultra settings with medium ray tracing enabled. The FPS comparison was conducted with Intel Arc A750 Limited Edition GPU, which was paired with Intel Core i9-13900K and 32 GB of RAM.

With XeSS off, the A750 GPU struggled and only reached 39 FPS. However, with XeSS set to performance, the number jumped to 67 FPS, making for a smooth user experience and gameplay. This is a 71% performance uplift, enabled by a new update in the game. Interestingly, Intel XeSS is computed on Arc's XMX Units, while NVIDIA and AMD compute their super sampling on shader units.

ASUS today announced the all-new Zenbook 15 OLED (UM3504), a premium thin and light 15.6-inch laptop powered by up to the latest AMD Ryzen 7 7735U processor. This powerful and compact laptop is designed for on-the-go productivity and creativity, featuring a durable all-metal chassis with a 14.9 mm-thin profile and a weight of just 1.4 kg. The 15.6-inch 16:9 120 Hz 2.8K ASUS Lumina OLED NanoEdge display is Pantone Validated for accurate color rendering and VESA DisplayHDR True Black 500 certified for the deepest blacks. It's also SGS and TÜV Rheinland certified for eye care.

To complement its Ryzen processor and AMD Radeon graphics, Zenbook 15 OLED has up to 32 GB of RAM and a 1 TB PCIe 4.0 SSD. Fast reliable connectivity is provided by WiFi 6E (802.11ax) enhanced with ASUS WiFi Master Premium. The premium design of Zenbook 15 OLED includes a choice of two finishes: a high-tech eco-friendly Basalt Gray plasma ceramic aluminium, or anodized Ponder Blue. To keep the laptop hygienic it's protected with ASUS Antimicrobial Guard plus, which reduces growth of viruses and bacteria by up to 99%. Conferencing is made easier with the FHD IR webcam and ASUS 3D Noise Reduction (3DNR) technology, along with the Harman Kardon-certified Dolby Atmos speaker system.

An intriguing entry has appeared on the Geekbench Browser site, the information was uploaded with a timestamp from this morning (11:07 am on April 20 to be specific) pointing to a mobile ASUS device that was tested in GeekBench 5. The archived info dump reveals that the subject matter of the benchmark was the ASUS ROG Ally handheld gaming console, which has received a lot of attention in recent weeks - with it being touted as a very serious alternative to Valve's Steam Deck, a handheld gaming PC that is quite popular with enthusiasts. The ROG Ally will need to offer a potent hardware package if it stands to compete directly with the Steam Deck, and the latest information confirms that this new contender is very promising in that department. Geekbench 5 awarded an impressive OpenCL score of 35498 to the RC71L variant of the ROG Ally, an RC71X-assigned model is known to exist but details of its exact nature have not been revealed. This particular ROG Alloy unit was running Windows 11 Home (64-bit) under the operating system's performance power plan.

The new entry on Geekbench Browser shows that the Ally is packing an AMD Ryzen Z1 Extreme APU, which appears to be a customized version of the Ryzen 7 7840U APU mobile platform chipset - previous rumors have indicated that the latter would be in the driving seat. Both Phoenix range SoCs share the basic 8 cores and 16 thread makeup, but the Z1 Extreme is capable of boosting up to 5.062 GHz from a base frequency of 3.30 GHz. AMD's Radeon 780M iGPU (RDNA 3) is expected to deal with the Ally's graphical aspect, but the benchmark info dump only provides scant details about the GPU (codenamed "gfx1103") - most notably the presence of six computer units, an 800 MHz max frequency, and access to 8.20 GB of video memory. Number crunching boffins have calculated that the Ally could field 768 FP32 cores, courtesy of the dual issue SIMD design inherent to RDNA 3.

Acer today announced the new Acer Swift X 16 (SFX16-61G), designed to bring out one's creativity through a suite of performance-packed features for graphic designing, 3D rendering and video editing. The creator laptop brings captivating color and clarity with an option for a 16:10 OLED display supporting 100% DCI-P3 and 500 nits peak brightness.

Combining an attractive design and powerful performance, the Swift X 16 comes in a refined 17.9 mm thin design with up to the AMD Ryzen 9 7940H processor and NVIDIA GeForce RTX 4050 Laptop GPUs with NVIDIA Studio Drivers to help take creative projects to the next level. It also comes packed with a TwinAir cooling system, a larger battery, and all the vital connection ports for enhanced productivity. Video calls and streaming have never been better as the RTX laptop utilizes a 1080p FHD camera that uses Acer's Temporal Noise Reduction (TNR) and its suite of AI technologies for clear and crisp videos.

AMD today announced the availability of its high-performance AMD Ryzen Embedded 5000 Series, a new solution for customers requiring power-efficient processors optimized for "always on" networking firewalls, network-attached storage systems and other security applications. The Ryzen Embedded 5000 Series rounds out the "Zen 3"-based AMD embedded processor portfolio which also includes the Ryzen Embedded V3000 and EPYC Embedded 7000 series families.

Built on 7 nm technology with planned five-year manufacturing availability, and equipped with 6, 8, 12 or 16 cores and 24 lanes of PCIe Gen 4 connectivity, Ryzen Embedded 5000 Series processors are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers. Ryzen Embedded 5000 Series processors include robust reliability, availability and serviceability (RAS) features, including an ECC-supported memory subsystem. With a thermal design power (TDP) profile ranging from 65 W to 105 W, Ryzen Embedded 5000 processors enable the reduction of overall system cooling footprint for space-constrained and cost-sensitive applications.

Thermaltake today introduced its ToughRAM D5 RGB series DDR5 memory in multiple color options that it had shown off in its 2023 CES booth. Today's release sees the memory modules in six color variants—Turquoise, Racing Green, Metallic Gold, Racing Red, White, and Black. These come with the distinctive Thermaltake "TT" design, and are capped with silicone diffusers for the 8 RGB LEDs that you can control using the TT RGB Plus 2.0 app.

Thermaltake sells these only in 32 GB (2 x 16 GB) kits, rated for DDR5-5600, 36-36-36-76 timings, and 1.1 V to 1.25 V DRAM voltage. These are based on SK Hynix M-die DRAM chips in single-rank 8x 16 Gbit configuration. What's interesting is that even to achieve its rather modest DDR5-5600 speed, Thermaltake included both Intel XMP 3.0 and AMD EXPO profiles. The company didn't reveal pricing.

A tech reviewer, ETA PRIME, managed to get its hands on the ASUS TUF A15 laptop, based on the AMD Ryzen 9 7940HS APU, and run some benchmarks on the integrated Radeon 780M RDNA 3 iGPU, showing that it is capable of delivering playable framerates in some popular games at 1080p resolution. The Ryzen 9 7940HS is an 8-core/16-thread Zen 4 APU with a base clock of 4.0 GHz and a maximum boost clock of 5.2 GHz. It features the Radeon 780M RDNA 3 iGPU with 12 CUs (768 stream processors) working at 2800 MHz. The APU in the ASUS TUF A15 laptop was paired up with 32 GB of DDR5-5600 memory. The system comes with an NVIDIA GeForce RTX 4060 GPU, but the review was focused on the AMD Radeon 780M.

In 3DMark Fire Strike and Time Spy benchmark, the Radeon 780M GPU was 12 and 15 percent faster than the Radeon 680M, despite the other system being equipped with faster LPDDR5 memory. ETA PRIME was also keen to note that the early driver was obviously not ready, and it did crash in some games, so the performance could be even higher when the official driver is released. ETA PRIME benchmarked a couple of popular games with the CPU limited to 80 W, resulting in playable framerates in most of the games at 1080p and medium to high graphics settings. Bear in mind that the system was tested in Performance Mode set via ASUS Armory Crate software. According to ETA PRIME, the integrated GPU was easily overclocked up to 3 GHz, and it would crash at 3.25 GHz, which shows great promise and might be more stable with the final launch driver.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced a lineup of powerful GPU-centric servers with the latest AMD and Intel CPUs, including NVIDIA HGX H100 servers with both 4-GPU and 8-GPU modules. With growing interest in HPC and AI applications, specifically generative AI (GAI), this breed of server relies heavily on GPU resources to tackle compute-heavy workloads that handle large amounts of data. With the advent of OpenAI's ChatGPT and other AI chatbots, large GPU clusters are being deployed with system-level optimization to train large language models (LLMs). These LLMs can be processed by GIGABYTE's new design-optimized systems that offer a high level of customization based on users' workloads and requirements.

The GIGABYTE G-series servers are built first and foremost to support dense GPU compute and the latest PCIe technology. Starting with the 2U servers, the new G293 servers can support up to 8 dual-slot GPUs or 16 single-slot GPUs, depending on the server model. For the ultimate in CPU and GPU performance, the 4U G493 servers offer plenty of networking options and storage configurations to go alongside support for eight (Gen 5 x16) GPUs. And for the highest level of GPU compute for HPC and AI, the G393 & G593 series support NVIDIA H100 Tensor Core GPUs. All these new two CPU socket servers are designed for either 4th Gen AMD EPYC processors or 4th Gen Intel Xeon Scalable processors.

AMD announced it has joined the Amazon Web Services (AWS) Independent Software Vendor (ISV) Accelerate Program, a co-sell program for AWS Partners - like AMD - who provide integrated solutions on AWS. The program helps AWS Partners drive new business by directly connecting participating ISVs with the AWS Sales organization.

Through the AWS ISV Accelerate Program, AMD will receive focused co-selling support from AWS, including, access to further sales enablement resources, reduced AWS Marketplace listing fees, and incentives for AWS Sales teams. The program will also allow participating ISVs access to millions of active AWS customers globally.

Earlier this month, AMD wrapped up the launch of its incredible Ryzen 7000X3D processor series, which storms the company's gaming performance competitiveness against Intel back to the top, setting it up for the crucial Spring-Summer season, when PC gamers tend to upgrade and play the latest games. The 3D Vertical Cache memory deployed on the Ryzen 9 7950X3D, 7900X3D, and Ryzen 7 7800X3D, supercharges the gaming performance of these processors, and our testing has shown that the 7800X3D is all that an elite gaming PC build needs if all you're doing is playing games with some domestic productivity on the side; whereas the 7950X3D is for those into heavy content creation and application workloads besides gaming, which means AMD levels up to Intel on both fronts.

We have extensively covered the technical aspects of what 3D Vertical Cache is, and how it works, in our reviews of the 7950X3D and 7800X3D. It is a fast 64 MB slice of SRAM cache stacked on top of the 32 MB on-die L3 cache of "Zen 4" chiplets, which extends the L3 cache size to 96 MB. This has a profound impact on gaming workloads, as the CPU cores have more amount of game data at much lower latency than DRAM. As part of our coverage of the Ryzen 7000X3D processor series, we had the opportunity to interview AMD on some of the technical aspects of Ryzen 7000X3D processor series. We also took the opportunity to ask a few general questions about the Ryzen 7000 desktop processor series itself. You can also catch our interview with Robert Hallock, the former technical marketing head, for some additional questions that you may find relevant.

A strong growth in AI server shipments has driven demand for high bandwidth memory (HBM). TrendForce reports that the top three HBM suppliers in 2022 were SK hynix, Samsung, and Micron, with 50%, 40%, and 10% market share, respectively. Furthermore, the specifications of high-end AI GPUs designed for deep learning have led to HBM product iteration. To prepare for the launch of NVIDIA H100 and AMD MI300 in 2H23, all three major suppliers are planning for the mass production of HBM3 products. At present, SK hynix is the only supplier that mass produces HBM3 products, and as a result, is projected to increase its market share to 53% as more customers adopt HBM3. Samsung and Micron are expected to start mass production sometime towards the end of this year or early 2024, with HBM market shares of 38% and 9%, respectively.

AI server shipment volume expected to increase by 15.4% in 2023
NVIDIA's DM/ML AI servers are equipped with an average of four or eight high-end graphics cards and two mainstream x86 server CPUs. These servers are primarily used by top US cloud services providers such as Google, AWS, Meta, and Microsoft. TrendForce analysis indicates that the shipment volume of servers with high-end GPGPUs is expected to increase by around 9% in 2022, with approximately 80% of these shipments concentrated in eight major cloud service providers in China and the US. Looking ahead to 2023, Microsoft, Meta, Baidu, and ByteDance will launch generative AI products and services, further boosting AI server shipments. It is estimated that the shipment volume of AI servers will increase by 15.4% this year, and a 12.2% CAGR for AI server shipments is projected from 2023 to 2027.

The second-hand market in China is always full of gems, but we never expected to see an unreleased 5 nm 96-core EPYC 9684X Genoa-X CPU with 1152 MB of L3 cache. According to the seller, the CPU is "almost new" and in working condition.

In case you missed it earlier, AMD is working on 5 nm Genoa-X EPYC CPUs which will feature up to 96 Zen 4 cores in 5 nm with over 1 GB of L3 cache per socket. These are scheduled to release this year, optimized for technical computing and databases. AMD is also working on Siena CPUs, which should also come this year, featuring up to 64 Zen 4 cores with optimized performance-per-watt, meant for intelligent edge and telco markets.

According to the latest information, it appears that first laptops with AMD Ryzen 7040 series APUs, code name Phoenix, will launch in late April, with U-series coming in May. AMD has previously delayed the Phoenix APUs in order to "align with platform readiness and ensure the best possible user experience," the first notebooks powered by Ryzen 7040HS series processors are expected in April.

According to Golden Pig Upgrade from Bilibili, at least the Ryzen 7840HS will launch on April 30th, and the 7840U SKU is probably expected on May 1st. As noted, AMD has announced the 7040 HS- and H-series SKUs, and has previously briefly mentioned the 15 W U-series SKUs, but has not officially unveiled any specifications. So far, three 7040 U-series SKUs have leaked online. Hopefully, AMD will share a bit more details by the end of this month.

ASUS is keeping the hype up for its upcoming ROG Ally handheld console, and now it has confirmed the worldwide release and teased that it could come sooner than anyone expected, which is pretty impressive. Announced on April 1st, the ASUS ROG Ally has impressive specifications, running on yet to be detailed AMD 4 nm custom APU based on Zen 4 CPU and RDNA 3 GPU architecture.

The ASUS ROG Ally measures at 280 x 133 x 39 mm and weighs 608 grams, making it shorter, narrower, thinner, and lighter than its competitor, Valve's Steam Deck. It has a 7-inch display with 1920x1080 resolution, 120 Hz refresh rate, 5 ms response time, and 500 nits of brightness. According to earlier hands-on previews of the prototype from Dave2D and LinusTechTips, ASUS did a great job with the dual-fan cooling solution, making it very quite. It will also have a dedicated PCIE Gen 3 x8 XG connector, which allows it to connect to the recently launched XG Mobile GPU, an external RTX 4090 GPU which retails at $1999.99 in the US. Linus also noted that the ROG Ally will offer 50 percent higher performance at 15 W and twice the performance at 35 W, compared to the Steam Deck. As noted, ASUS has now confirmed that the ROG Ally will launch worldwide, and that it might be sooner that we expect, linking to Best Buy for those that live in North America.

AMD has published an exciting development for its Radeon Open Compute Ecosystem (ROCm) users today. Now, ROCm is coming to the Windows operating system, and the company has extended ROCm support for consumer graphics cards instead of only supporting professional-grade GPUs. This development milestone is essential for making AMD's GPU family more competent with NVIDIA and its CUDA-accelerated GPUs. For those unaware, AMD ROCm is a software stack designed for GPU programming. Similarly to NVIDIA's CUDA, ROCm is designed for AMD GPUs and was historically limited to Linux-based OSes and GFX9, CDNA, and professional-grade RDNA GPUs.

However, according to documents obtained by Tom's Hardware (which are behind a login wall), AMD has brought support for ROCm to Radeon RX 6900 XT, Radeon RX 6600, and R9 Fury GPU. What is interesting is not the inclusion of RX 6900 XT and RX 6600 but the support for R9 Fury, an eight-year-old graphics card. Also, what is interesting is that out of these three GPUs, only R9 Fury has full ROCm support, the RX 6900 XT has HIP SDK support, and RX 6600 has only HIP runtime support. And to make matters even more complicated, the consumer-grade R9 Fury GPU has full ROCm support only on Linux and not Windows. The reason for this strange selection of support has yet to be discovered. However, it is a step in the right direction, as AMD has yet to enable more functionality on Windows and more consumer GPUs to compete with NVIDIA.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announces the launch of the brand new B650MP-E PRO motherboard, designed to cater to the needs of home, office, and business users. The B650MP-E PRO motherboard supports the latest AMD Ryzen 7000 series processors with the AMD B650 single-chip architecture, making it an excellent choice for users who demand high performance and stability. It supports 4-DIMM DDR5 memory up to 128 GB, PCIe 4.0, and PCIe M.2 4.0 (64 Gb/s) for lightning-fast DATA transfer speeds.

Offering flag-ship tier features and exceptional computing performance, the B650MP-E PRO motherboard incorporates advanced technology, such as the A.I FAN, CPU OPT Header, 55 A Dr. MOS, Debug LED, Digital PWM, LED ROCK ZONE, VIVID LED DJ with RGB Sync, and 2.5Guard. These features ensure superior efficiency and performance, allowing users to optimize their computing needs to the next level. Moreover, the SMART BIOS UPDATE button and USB port ensure hassle-free BIOS updates, ensuring a reliable and error-free operation.