With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.

The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.

The new Lenovo ThinkBook 16p Gen 3 will help content creators and power users unleash their creativity without limitations. The latest supercharged ThinkBook features up to AMD Ryzen 9 6000 H-series processors and NVIDIA GeForce RTX 3060 discrete graphics to deliver flagship performance with Windows 11. The immersive narrow-bezel 16-inch 2.5K IPS display options include TÜV Rheinland Low Blue Light and TÜV Eyesafe certifications to maximize eye comfort and include an Ambient Light Sensor that adjusts screen and keyboard backlight brightness. Two display options are available including a 400nit 60 Hz panel and a new 500nit 165 Hz VESA Certified HDR400 panel offers vivid colors and increased shadow and highlight detail. Both display options are also X-Rite Pantone Certified and support Dolby Vision content.

Super processing power of the AMD Ryzen 6000 Series Mobile Processors and NVIDIA GeForce RTX graphics help users tackle the most arduous demands of hybrid working. The addition of up to 32 GB dual-channel LPDDR5 memory, up to 2 TB through dual SSD storage and a 71Wh battery should keep users powered throughout the day. New working styles also require high-speed reliable connectivity and port availability for flexible and versatile connections. Conveniently connect to wireless networks, peripherals, and AV equipment thanks to Wi-Fi 6 support and two USB Type-C ports including one USB4, two USB-A 3.2 Gen 2 and an HDMI 2.1 port.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

The U.S. Government has imposed restrictions on the export of AI compute GPUs to China and Russia without Government-authorization in the form of a waiver or a license. This impacts sales of products such as the NVIDIA A100, H100; AMD Instinct MI100, MI200; and the upcoming Intel "Ponte Vecchio," among others. The restrictions came to light when NVIDIA on Wednesday disclosed that it has received a Government notification about licensing requirements for export of its AI compute GPUs to Russia and China.

The notification doesn't specify the A100 and H100 by name, but defines AI inference performance thresholds to meet the licensing requirements. The Government wouldn't single out NVIDIA, and so competing products such as the AMD MI200 and the upcoming Intel Xe-HP "Ponte Vecchio" would fall within these restrictions. For NVIDIA, this is impacts $400 million in TAM, unless the Government licenses specific Russian and Chinese customers to purchase these GPUs from NVIDIA. Such trade restrictions usually come with riders to prevent resale or transshipment by companies outside the restricted region (eg: a distributor in a third waived country importing these chips in bulk and reselling them to these countries).

Samsung Electronics will unveil the Odyssey OLED G8 (Model Name: G85SB)—another premium addition to the Odyssey lineup—at IFA 2022 in Berlin, Germany, further reinforcing the Odyssey's industry-leading position. The Odyssey OLED G8 is the company's first OLED gaming monitor and will be available in an ultra-thin, 34-inch form factor, delivering brilliant brightness on an OLED panel partnered with Quantum Dot Technology and packed full of premium gaming features including an incredibly low 0.1 ms response time and 175 Hz refresh rate.

The new 34-inch Odyssey OLED G8 is built to an ultra-slim thickness of 3.9 mm at its thinnest part—the slimmest in its product category—and finished with a sleek, metal frame. The monitor requires no backlighting, while delivering true RGB and true black for maximum color accuracy and brightness—all without a color filter. The lighting is controlled in pixels which can be expressed in black with a near-infinite contrast ratio.

We already know that AMD is working on a variant of the "Zen 4" CPU complex die (CCD) featuring 3D Vertical Cache (3DV-cache) memory, through company roadmaps, and AMD even confirmed to us that the technology continues to be a part of the client roadmap of the company. We're now getting news that the first Ryzen 7000X3D ("Zen 4" with 3DV cache) processors could be unveiled by the 2023 International CES (January next year). It appears like while the conventional Ryzen 7000 series beats the 12th Gen Core "Alder Lake" at gaming, it might trade blows with the 13th Gen "Raptor Lake," and AMD will count on the 3DV cache technology to give it a competitive edge.

Greymon55, a reliable source with AMD leaks, hints at the possibility of three 7000X3D-series SKUs: the Ryzen 7 7800X3D (8-core/16-thread) positioned above the 7700X; the Ryzen 9 7900X3D (12-core/24-thread), and the Ryzen 9 7950X3D (16-core/32-thread). Older reports suggest the 3DV cache on these processors will be a generation more advanced to keep sync with the on-die L3 cache of the "Zen 4" CCD, and the L3D (the die on which the 3DV cache is located), will likely be built on the 6 nm process.

With AMD announcing an October 2022 debut of its mid-range Socket AM5 motherboard chipset, the AMD B650E and B650; manufacturers appear to be ready with a fairly broad selection of products targeting various price-points. The B650E and B650 are expected to have a lighter I/O feature-set than the X670E/X670, and will enable manufacturers to sell motherboards at prices starting at $125. Two of the leading manufacturers, ASUS and ASRock, are ready with their product lists.

The initial ASUS motherboard lineup for the AMD B650E and B650 chipsets include just one product in the mainline Prime series, as many as four from the TUF Gaming series, and two from the ROG Strix series. From these, only one is based on the B650E (meaning, it gets a PCI-Express 5.0 x16 slot besides the M.2 Gen 5 slot). The others are based on the vanilla B650 (PCI-Express 4.0 x16 slot besides M.2 Gen 5 slots). None of the boards has more than 4 SATA 6 Gbps ports. The board to watch out for will be the ROG Strix B650E-E Gaming WiFi, as it could bring several high-end features into the mid-range, and if previous generations of AMD chipset are anything to go by, the B650/E retains CPU overclocking support.

At IFA 2022, MSI introduces its latest products, tailor-made for gamers, creators, and professionals, to the world. From gaming laptops, desktops, and components, to business monitors, industrial computers, and automotive and commercial solutions, MSI is revealing the most powerful, capable new products, covering every need and every aspect of technology.

Exhibition Date: Sep 2nd - Sep 6th, 2022
Opening Hours: 10:00 AM - 06:00 PM
Location: Stand 102, Hall 11.2 @ Messe Berlin, Germany
"IFA 2022 is one of the world's most important consumer electronics trade shows. After years of virtual and distanced living, MSI is especially well-prepared to support all industries and professions with our innovations and solutions, to help them adapt to new ways of working, living and entertaining," said Sam Chern, MSI Marketing Vice President.

An AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processor was put through the Geekbench 5.4.5 benchmark, and it's becoming all too clear that AMD has a highly competitive product on its hands. The 7950X yielded a single-threaded score of 2217 points, and 24396 points in the multi-threaded tests. With these scores, the 7950X is about 14% faster than the "Golden Cove" P-cores of the i9-12900K "Alder Lake" processor in the single-threaded tests, and comes out as being 41% faster than it in the multi-threaded test. Against the leaked i9-13900K "Raptor Lake," the 7950X is shown being about 4% slower in the single-threaded test (against the "Raptor Cove" P-cores); and about 7.8% slower in the multi-threaded test.

ASRock is planning to introduce a new line of motherboards probably targeted at value-conscious creators, with the new LiveMixer series. The company's first LiveMixer product is based on the AMD B650 mid-range chipset. The Socket AM5 motherboard's PCB was leaked to the web, revealing a fairly mid-range feature-set, notwithstanding the 17-phase VRM. We spy at least three M.2 slots, from which one should be Gen 5, an M.2 E-key slot for the WLAN card; addon slots that include a PCI-Express 4.0 x16, and two Gen 3 x4 slots. For all its talk of live-mixing, the onboard audio solution appears to be rather basic, with jacks for just 6-channels, and the CODEC pin-out seems to be made out for an entry-level CODEC, such as the ALC892.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

The latest version 2.02 of CPU-Z adds support for a handful unreleased Ryzen 7000 series "Zen 4" processors. These include "non-X" SKUs, namely the Ryzen 9 7950, and Ryzen 9 7900. Keeping up with past trends, these are possibly 65 W TDP variants of the 7900X and 7950X to be released only in the OEM market, and will make it to pre-built desktops. In the past, OEM processors by AMD have found their way to brick-and-mortar retail stores, where they're sold off the tray. The retailers get these chips from AMD by claiming to be SI (system integrators). They tend to bundle these with motherboards, memory kits, and SSDs. AMD in its announcement presentation for the Ryzen 7000 underscored the extreme levels of efficiency "Zen 4" exhibits in chips with 65 W power limits. Single-threaded or lightly threaded performance is mostly unaffected, but heavy multi-threaded workloads could see lower performance in comparison to the retail "X" chips.

AMD announced that the AMD Pensando Distributed Services Card, powered by the industry's most advanced data processing unit (DPU)1, will be one of the first DPU solutions to support VMware vSphere 8 available from leading server vendors including Dell Technologies, HPE and Lenovo.

As data center applications grow in scale and sophistication, the resulting workloads increase the demand on infrastructure services as well as crucial CPU resources. VMware vSphere 8 aims to reimagine IT infrastructure as a composable architecture with a goal of offloading infrastructure workloads such as networking, storage, and security from the CPU by leveraging the new vSphere Distributed Services Engine, freeing up valuable CPU cycles to be used for business functions and revenue generating applications.

As we await technical documents from AMD detailing its new "Zen 4" microarchitecture, particularly the all-important CPU core Front-End and Branch Prediction units that have contributed two-thirds of the 13% IPC gain over the previous-generation "Zen 3" core, the tech enthusiast community is already decoding images from the Ryzen 7000 series launch presentation. "Skyjuice" presented the first annotation of the "Zen 4" core, revealing its large branch-prediction unit, enlarged micro-op cache, TLB, load/store unit, and dual-pumped 256-bit FPU that enables AVX-512 support. A quarter of the core's die-area is also taken up by the 1 MB dedicated L2 cache.

Chiakokhua (aka Retired Engineer) posted a table detailing the various caches and their latencies, comparing it with those of the "Zen 3" core. As AMD's Mark Papermaster revealed in the Ryzen 7000 launch event, the company has enlarged the micro-op cache of the core from 4 K entries to 6.75 K entries. The L1I and L1D caches remain 32 KB in size, each; while the L2 cache has doubled in size. The enlargement of the L2 cache has slightly increased latency, from 12 cycles to 14. Latency of the shared L3 cache is also up, from 46 cycles to 50 cycles. The reorder buffer (ROB) in the dispatch stage has been enlarged from 256 entries to 320 entries. The L1 branch target buffer (BTB) has increased in size from 1 KB to 1.5 KB.

GeIL is readying a fairly large lineup of its EVO V and Polaris RGB DDR5 memory lines featuring the AMD EXPO technology. These modules will pack both AMD EXPO and Intel XMP 3.0 profiles, but their advertised specs will apply on AMD Ryzen 7000-series platforms, whereas the XMP 3.0 profiles included will be an approximation of these specs. GeIL's lineup includes 32 GB dual-channel kits of two 16 GB modules. Frequencies include DDR5-4800 (JEDEC native), DDR5-5200 (JEDEC native), and EXPO-backed DDR5-5600, DDR5-6000, DDR5-6000 with tighter timings, DDR5-6200, and DDR5-6400. The exact part number, timings, and module voltages, are in the table below.

AMD in its Ryzen 7000 series launch event shared its near-future CPU architecture roadmap, in which it confirmed that the "Zen 4" microarchitecture, currently on the 5 nm foundry node, will see an optical-shrink to the 4 nm process in the near future. This doesn't necessarily indicate a new-generation CCD (CPU complex die) on 4 nm, it could even be a monolithic mobile SoC on 4 nm, or perhaps even "Zen 4c" (high core-count, low clock-speed, for cloud-compute); but it doesn't rule out the possibility of a 4 nm CCD that the company can use across both its enterprise and client processors.

The last time AMD hyphenated two foundry nodes for a single generation of the "Zen" architecture, was with the original (first-generation) "Zen," which debuted on the 14 nm node, but was optically shrunk and refined on the 12 nm node, with the company designating the evolution as "Zen+." The Ryzen 7000-series desktop processors, as well as the upcoming EPYC "Genoa" server processors, will ship with 5 nm CCDs, with AMD ticking it off in its roadmap. Chronologically placed next to it are "Zen 4" with 3D Vertical Cache (3DV Cache), and the "Zen 4c." The company is planning "Zen 4" with 3DV Cache both for its server- and desktop segments. Further down the roadmap, as we approach 2024, we see the company debut the future "Zen 5" architecture on the same 4 nm node, evolving into 3 nm on certain variants.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of DOMINATOR PLATINUM RGB DDR5 for AMD, VENGEANCE RGB DDR5 for AMD and VENGEANCE DDR5 for AMD, featuring new AMD EXPO technology and ready to power the next generation of Ryzen 7000-series powered PCs.

Available in frequencies up to a screaming-fast 6,000MT/s, and even higher in the future, all CORSAIR DDR5 for AMD kits offer AMD EXPO (Extended Profiles for Overclocking), allowing these modules to be set to their rated speed and performance in just a few clicks. AMD EXPO technology makes setup simple and ensures users can easily run their memory at the speed it was created to run at.

AMD in its Ryzen 7000 launch event teased its next-generation Radeon graphics card based on the RDNA3 graphics architecture. Built on an advanced process node just like "Zen 4," AMD is hoping to repeat the magic of the RX 6000 series, by achieving a 50% performance-per-Watt gain over the previous generation. which allows it either to build some really efficient GPUs, or consume the power headroom to offer significantly higher performance at power levels similar as the current-gen.

AMD's teaser included a brief look at the air-cooled RDNA3 flagship reference-design, and it looks stunning. The company showed off a live demo of the card playing "Lies of P," a AAA gaming title that made waves at Gamescom for its visuals. The game was shown playing on an RDNA3 graphics card running on a machine with a Ryzen 9 7950X processor at 4K, with extreme settings. AMD CEO Dr Lisa Su confirmed a 2022 launch for RDNA3.

AMD today announced the Ryzen 7000 series "Zen 4" desktop processors. These debut the company's new "Zen 4" architecture to the market, increasing IPC, performance, with new-generation I/O such as DDR5 and PCI-Express Gen 5. AMD hasn't increased core-counts over the previous-generation, the Ryzen 5 series is still 6-core/12-thread, the Ryzen 7 8-core/16-thread, and Ryzen 9 either 12-core/24-thread, or 16-core/32-thread; but these are all P-cores. AMD is claiming a 13% IPC uplift generation over generation, which coupled with faster DDR5 memory, and CPU clock speeds of up to 5.70 GHz, give the Ryzen 7000-series processor an up to 29% single-core performance gain over the Ryzen 5000 "Zen 3."

At their press event, AMD showed us an up to 35% increase in gaming performance over the previous-generation, and an up to 45% increase in creator performance (which is where it gets the confidence to stick to its core-counts from). The "Zen 4" CPU core dies (CCDs) are built on the TSMC 5 nm EUV (N5) node. Even the I/O die sees a transition to 6 nm (N6), from 12 nm. The switch to 5 nm gives "Zen 4" 62 percent lower power for the same performance, or 49% more performance for the same power. versus the Ryzen 5000 series on 7 nm. The "Zen 4" core along with its dedicated L2 cache is 50% smaller, and 47% more energy efficient than the "Golden Cove" P-core of "Alder Lake."

EK, the leading computer cooling solutions provider, is announcing the latest generation of EK-Quantum Velocity² water blocks. These socket-specific water blocks are engineered specifically for the upcoming AMD AM5 socket and Ryzen 7000-series CPUs. Like its AM4 predecessor, the AM5 water block features EK-Matrix7 compatibility, which means it's designed according to the standard where the product's height and port distance are managed in 7 mm increments.

The product deploys a modified Velocity² cooling engine optimized for Ryzen 7000-series CPUs to ensure the best cooling performance and optimal coolant flow. While the mounting hole pattern of the new AM5 socket is still 54 x 90 mm, the AM5 motherboards now have an integrated CPU socket backplate with #UNC 6-32 threads, therefore requiring a new mounting system.

A screenshot of an alleged AMD Ryzen 9 7950X "Zen 4" processor surfaced on the web, courtesy of OneRaichu, and this time there's no blur-out with the score field—15645 points. When compared to the alleged CPU-Z Bench scores of the Core i9-13900K "Raptor Lake" from last week, the Intel 8P+16E hybrid processor ends up 7.9% faster than this score, but still a very close second.

The Ryzen 9 7950X ends up a significant 23.47% faster than the leaked score of the Core i7-13700K (8P+8E), and the AMD flagship scores 33.5% faster than the previous-gen Intel flagship Core i9-12900K. While both the i7-13700K and i9-12900K are 8P+8E, the "Raptor Lake" gets ahead with higher IPC for the P-cores, slightly higher clocks, and more cache for the E-core clusters. The 7950X is also 32.12% faster than its predecessor, the Ryzen 9 5950X "Zen 3," and a whopping 58.39% faster than the Core i7-12700K (8P+4E).

Possible launch SEP pricing of AMD's Ryzen 7000 series "Zen 4" desktop processors leaked to the web by Wccftech, which appear to be similar to those of the Ryzen 5000 "Zen 3" at launch. AMD will launch a slim set of four SKUs in its first round of these processors—the flagship Ryzen 9 7950X (16-core/32-thread), followed by the second-best Ryzen 9 7900X (12-core/24-thread), the Ryzen 7 7700X (8-core/16-thread), and the mid-range Ryzen 5 7600X (6-core/12-thread).

Apparently, the series debuts with the Ryzen 5 7600X at $299, or the same SEP of the Ryzen 5 5600X at launch. The Ryzen 7 7700X launches at $449. The Ryzen 9 7900X comes in at $549, and the flagship Ryzen 9 7950X at $799, which again, is identical to that of the 5950X. Besides processors, motherboard vendors are expected to launch their first Socket AM5 motherboards, debuting with the AMD X670E and X670 chipsets. There's talk of mid-range chipsets such as the B650 and B650E, but we haven't seen any confirmed products show up on motherboard vendors' websites, yet. Pre-launch pricing for the X670E and X670 put them at a significant premium over the current Socket AM4 flagship boards based on the X570. Besides processors and motherboards, we could see announcements from memory vendors launching their first DDR5 memory products to feature AMD EXPO technology.

AMD's upcoming launch of Ryzen 7000 series processors will bring an entirely new AM5 platform that will enable newer technologies and protocols. We have DDR5 memory and PCIe 5.0 connection with everything at level five. However, the upcoming chipsets AMD has designed to work alongside the new processors will be available in several variants. There will be regular X670 and B650 versions that support either a PCIe 5.0 GPU or a PCIe 5.0 M.2 NVIMe SSD. Today, we got a confirmation that not only the big X670 chipset has an "E" or "Extreme" version, but its smaller brother B650 as well. With X670E and B650E, users get both PCIe 5.0 connectivity for their GPU and M.2 NVIMe SSD. For more information, we have to wait for AMD's official launch information later today.

Fmax (or Frequency max), is the maximum clock speed an AMD "Zen" processor will automatically boost/overclock to, at stock multiplier settings. To go beyond this, you'll have to increase the multiplier value, and overclock the traditional way. The Fmax value for AMD's upcoming flagship desktop processor, the Ryzen 9 7950X "Zen 4," is reportedly set at 5.85 GHz. To facilitate this, you'll have to enable settings such as Precision Boost Overdrive (PBO), to eke out the power limits needed to get here. Competing Intel parts, such as the "Raptor Lake" Core i9-13900K, is reported to have a similar maximum boost frequency, of 5.80 GHz, but that's just for its 8 P-cores.