AMD is working on the AGESA 1.0.0.7 BIOS update that should resolve issues and bring support for 24 GB and 48 GB DDR5 memory modules and kits on the AM5 platform. The latest report, coming from Twitter, suggest that AMD is working hard on the AGESA release, so motherboard manufacturers could push BIOS updates early next month or in May. While Intel's 600- and 700-series motherboards are happily working with 24 GB and 48 GB DDR5 memory modules and kits, allowing users to use up to 192 GB (4x48 GB) of memory in their systems, it comes as a surprise that AMD did not release an official, or even a BETA BIOS update for such modules.

There were already reports that such 24 GB and 48 GB DDR5 modules are having issues on AMD's AM5 platform and while the BIOS can detect the memory, it simply will not boot into Windows. This latest report originally comes from hardware leaker chi11eddog over at Twitter, and suggests that AMD and its motherboard partners are well aware of the issue and the AGESA BIOS firmware v1.0.0.7 should bring full support for so-called "non-binary" 24 GB and 48 GB DDR5 memory modules.

Support for AMD's Smart Access Memory and the overarching Resizable BAR technologies has been removed from the RadeonSI Gallium3D OpenGL driver as of today's Mesa 22.3.7 release. The comment in the announcement simply reads, "Disable Smart Access Memory because CPU access has large overhead." The nail in the coffin seems to have been this bug ticket submitted last month for the game Hyperdimension Neptunia Re;Birth1, in which the user reported the game running oddly slow on their RX 6600 while previously they had no issues on the much older R9 380. The solution provided was to simply disable ReBAR/SAM either with radeonsi_disable_sam=true or via UEFI. In the comments of the ticket lead RadeonSI developer Marek Olšák states, "We've never tested SAM with radeonsi, and it's not necessary there."

Apparently the performance advantages weren't panning out for RadeonSI, and since direct optimizations of these features was not a primary goal the decision was made to cut them out. Attempts to optimize SAM with RadeonSI date as far back as December 2020 and Mesa 21.0, but support for SAM under Linux goes further back. None of the changes to RadeonSI will affect other drivers such as RADV, the open-source Radeon Vulkan driver, and this code change is limited to only the RadeonSI OpenGL driver.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

Avalanche Software has released the latest March 8 patch for Hogwarts Legacy, that fixes various bugs and improves gameplay, performance, and stability. The extensive update also includes fixes for online, gameplay, audio, UI, cinematics, ray tracing, save game, display and miscellaneous issues.

The changelog includes major reworks, from patching out memory leaks, improved VRAM usage, to VFX crashes, lighting optimizations with NVIDIA drivers, improved stability and performance with ray tracing, directional light shadows and shadows on trees with ray tracing, various Ansel issues, and plenty of gameplay issues, including missions, broom flight, world events, and characters. The new patch also updates the minimum Nvidia and AMD graphics driver recommendations, which could be directly connected to the improved VRAM usage, as the game was easily going over 14 GB with RT enabled on 1080p, 1440p, and 2160p resolutions.

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.

AMD has released its latest Adrenalin drivers for Radeon graphics cards. With support dating back to RX 400, the latest Adrenalin 23.3.1 WHQL drivers bring a lot of improvements to the table, as well as support for Halo Infinite Ray Tracing Update and Wo Long: Fallen Dynasty game. Most importantly, the new driver has a series of fixes, including intermittent driver timeout, system freeze, or BSOD, with the latest Radeon RX 7000 series. Problems in games such as Premium Gold Packs in EA SPORTS FIFA 23 and Dying Light 2 lighting effects corruption have been fixed. As far as Radeon RX 6000 series goes, this driver release manages to fix corruption in certain scenes with ray tracing enabled observed in the Returnal game. Check the list below for the entire set of changes.Download: AMD Radeon Graphics Drivers 23.3.1 WHQL here.

AMD could tease its next-generation graphics performance enhancement rivaling NVIDIA DLSS 3, at the 2023 Game Developers Conference (GDC 2023), slated for March 23. While the company didn't name it, its GDC 2023 session brief references an "exciting sneak peek of new FidelityFX technologies" that will be "available soon," meaning that it isn't the recently released FSR 2.2. We expect this to be the very first look at FSR 3.0.

AMD frantically dropped in the first mention of FSR 3.0 in its Radeon RX 7900 series RDNA3 announcement presentation (slide below). The company let out precious little details of the new technology except the mention that it offers double the frame-rate versus FSR 2 (at comparable image quality). Does this involve a frame-rate doubling technology similar to DLSS 3? We don't know yet. It could just be a more advanced upscaling algorithm that doubles performance at a given quality target compared to FSR 2. We'll know for sure later this month. It would be a coup of sorts for AMD if FSR 3.0 doesn't require RX 7000 series GPUs, and can run on older Radeon GPUs, whereas DLSS 3 requires the latest GeForce RTX 40-series GPUs.

Although it has already been available in some games, AMD's FidelityFX Super Resolution 2.2 is now available as an Unreal Plugin over on GPUOpen. AMD's FidelityFX Super Resolution 2 has been already used in some games ever since AMD released the source code for the technology, which includes the titles like Forza Horizon 5, Need For Speed Unbound, and F1 22, but implementation in various engines can take time, and now it is available as a plugin for Unreal Engine. AMD's FSR 2.2 brings several improvements including new logic that should reduce "High-Velocity Ghosting," an issue that usually plagues racing games. It also feature a new Debug API Checker, which should provide much easier debugging for developers.

Prices of the AMD Radeon RX 7900 XT RDNA3 graphics card are on a downward slope, with the card now starting at $800 on US computer hardware retailer Newegg. The ASRock RX 7900 XT Phantom Gaming, a custom-design graphics card, has been holding at $799.99 for roughly a week now, while the next cheapest card, an XFX co-branded AMD reference graphics card, is going for $839.99 on the site. These prices put the RX 7900 XT in a direct clash with the NVIDIA GeForce RTX 4070 Ti. The RX 7900 XT was launched with an AMD MSRP of $899.99, with a performance level that compelled NVIDIA to re-position the RTX 4070 Ti (originally announced as the $900 RTX 4080 12 GB), to $800. In our testing, the RX 7900 XT is about 5% faster than the RTX 4070 Ti in conventional raster 3D graphics, but with a ray tracing performance that's comparable to the previous-generation RTX 3080 Ti.

AMD updated its game bundle campaign for Radeon graphics cards to include "The Last of Us Part 1." The new bundle went live as the previous one for "The Callisto Protocol" and "Dead Island 2" ended on February 4. The new bundle includes the latest RX 7000 series graphics cards in its list of eligible products. Starting February 5, new purchases of AMD Radeon graphics cards or prebuilt gaming desktops with them, in select markets and through participating retailers, will be eligible to a free copy of "The Last of Us Part 1." Eligible graphics cards include Radeon RX 7900 XTX, RX 7900 XT, RX 6950 XT, RX 6900 XT, RX 6800 XT, RX 6800, RX 6750 XT, RX 6700 XT, RX 6700, RX 6650 XT, RX 6600 XT, RX 6600, RX 6500 XT, and RX 6400, so the full stack of desktop AMD Radeon RX 6000 series and RX 7000 series products, are eligible.

Although we've known most of the details of AMD's I/O die in its Zen 4 processors, until now, AMD hadn't shared a die shot of the cIOD, but thanks to its ISSCC 2023 presentation, we not only have a die shot of the cIOD, but some friendly people on the internet have also made annotations for us mere mortals. There are no big secrets here, but based on the annotations by @Locuza_ we now know for certain that it's not possible to use the current I/O die with three CCDs, as it only has two GMI3 interfaces, to which the CCDs are connected.

If you're wondering about the 2x 40-bit memory interface, it's for ECC memory support outside of the on-die ECC support of DDR5 memory. Also note that DDR5 memory is two times 32-bit in non ECC mode. That said, it's up to the motherboard makers to implement support for ECC memory, but it would appear all Zen 4 CPUs support it. The addition of a GPU, even a basic one like this, takes up a fair bit of space inside the cIOD, especially once you add things like video decoders/encoders and so on. In fact, it appears that the parts related to the GPU and video decoders/encoders take up at least a third of the space inside the I/O die, yet thanks to a significant die shrink from the Zen 3 era cIOD, it's physically smaller in the Zen 4 processors, while having an estimated 58 percent increase in transistors.

Once upon a time, the data center market represented a duopoly of x86-64 makers AMD and Intel. However, in recent years companies started developing custom Arm-based processors to handle workloads as complex within smaller power envelopes and doing it more efficiently. According to Counterpoint Research firm, we have the latest data highlighting a significant new player called Ampere Computing in the data center world. With the latest data center revenue share report, we get to see Intel/AMD x86-64 and AWS/Ampere Arm CPU revenue. For the first time, we see that a 3rd party company, Ampere Computing, managed to capture as much as 1.54% market revenue share of the entire data center market in 2022. Thanks to having CPUs in off-the-shelf servers from OEMs, enterprises and cloud providers are able to easily integrate Ampere Altra processors.

Intel, still the most significant player, saw a 70.77% share of the overall revenue; however, that comes as a drop from 2021 data which stated an 80.71% revenue share in the data center market. This represents a 16% year-over-year decline. This reduction is not due to the low demand for server processors, as the global data center CPU market's revenue registered only a 4.4% YoY decline in 2022, but due to the high demand for AMD EPYC solutions, where team red managed to grab 19.84% of the revenue from 2022. This is a 62% YoY growth from last year's 11.74% revenue share. Slowly but surely, AMD is eating Intel's lunch. Another revenue source comes from Amazon Web Services (AWS), which the company filled with its Graviton CPU offerings based on Arm ISA. AWS Graviton CPUs accounted for 3.16% of the market revenue, up 74% from 1.82% in 2021.

Even more performance now also for RX 7900XTX Merc 310 GPU! Alphacool expands the assortment with the new and innovative Eisblock Aurora cooler for active water cooling of AMD RX 7900XTX Merc 310 graphics cards.

The enormous waste heat of the new graphics card generation is excellently dissipated with the cooler. Thanks to the particularly filigree fin structure, the cooling surface was increased and a very good water flow was made possible. The jet plate with revised inflow engine also distributes the water perfectly on the cooling fins. The full chrome plating of the copper base not only provides resistant protection against acids, scratches and damage, but also achieves remarkable homogeneity and significant gloss.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

YEYIAN Gaming, the prominent designer and manufacturer of innovative pre-built gaming PCs, peripherals, and computer components, is thrilled to announce the market launch of their latest offering, the ODACHI Gaming PCs. These high-performance gaming machines are powered by the cutting-edge AMD Ryzen 9 7900X3D and 7950X3D gaming CPUs, providing gamers with a remarkable gaming experience. The ODACHI Gaming PCs are available in three impressive models, the ODACHI 795DC-490, ODACHI 790DC-480, and ODACHI 790DC-79W. Each model is expertly crafted to meet the specific needs and preferences of discerning gamers who demand nothing but the best.

These new additions to flagship ODACHI gaming PCs are designed to meet the fluctuating demands of pro gamers, content creators, and streamers. Powered by the latest AMD Ryzen 9 7900X3D and 7950X3D gaming processors incorporating next-gen AMD 3D V-Cache. The new ODACHI gaming desktop PCs are integrated with the latest AMD RX 7900XTX and NVIDIA RTX 4000 series graphic cards, supporting the fastest DDR5-6000 memory and Gen 4 x4 M.2 NVMe SSD for unparalleled system performance and reliability. Gamers can now enjoy the latest games, live stream broadcasts, and multitask with ease, without experiencing any lags or slowdowns.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

ASRock has released new BIOS to support the latest AMD Ryzen 7000 Series Processors with AMD 3D V-Cache Technology, with new BIOS on ASRock X670E/B650E/B650 motherboards, you may enjoy the enhanced gaming performance powered by AMD Ryzen 7000X3D series processors. The latest BIOS is already available to download on ASRock website, be sure to update to the latest BIOS to enjoy the ultimate gaming experience with AMD 3D V-Cache Technology.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce a list of compatible motherboards for AMD's newly announced AMD Ryzen 7000X3D processors. AMD Ryzen 7000X3D processors, which include the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D, promise unparalleled gaming and compute performance thanks to their groundbreaking 3D V-Cache technology. Expected to provide top-of-the-line performance for demanding users, BIOSTAR announces that their AMD-AM5 motherboards are ready to support these new processors.

Flagship tier X670E VALKYRIE, RACING series B650EGTQ, and B650M-SILVER motherboards are the first batch of compatible BIOSTAR motherboards, ready to take on the shiny new AMD Ryzen 7000X3D processors. They are engineered with cutting-edge technology to ensure smooth and efficient performance for high-end gaming and professional applications.

Jon Peddie Research reports that the growth of the global PC-based graphics processor unit (GPU) market reached 64.2 million units in Q4'22 and PC CPU shipments decreased by -35% year over year. Overall, GPUs will have a compound annual growth rate of 0.19% during 2022-2026 and reach an installed base of 3,013 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in PCs will grow to reach a level of 32%.

Year to year, total GPU shipments, which include all platforms and all types of GPUs, decreased by -38%, desktop graphics decreased by -24%, and notebooks decreased by -43%—the largest decrease since its peak in 2011. AMD's overall market share percentage from last quarter increased 0.4%, Intel's market share decreased by -1.1%, and Nvidia's market share increased 0.68%, as indicated in the following chart.

AMD's top two new desktop processors, the Ryzen 9 7950X3D 16-core/32-thread; and the Ryzen 9 7900X3D 12-core/24-thread, go on sale later today (starting 3 PM Central European time, 9 AM EST). The two "Zen 4" processors feature the company's 3D Vertical Cache technology, which significantly improves gaming performance. The 7950X3D in particular attains parity with the Intel Core i9-13900K in both gaming and multi-threaded productivity performance.

3D Vertical Cache is a 64 MB SRAM die that augments the 32 MB on-die L3 cache of one of the two CCDs in these processors. The combined 96 MB cache has a profound impact on compute latencies for gaming. In our testing, the 7950X3D matches the gaming performance of the i9-13900K "Raptor Lake," which means AMD now has a truly competitive processor with Intel's latest. It also matches or exceeds the I/O feature-set, including DDR5 memory, PCIe Gen 5 (including for the CPU-attached NVMe slot); and an iGPU, although it loses out on DDR4 memory support. The Ryzen 9 7950X3D commands an MSRP of USD $700, and the 7900X3D $600.

Catch the TechPowerUp Review of the AMD Ryzen 9 7950X3D.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GELID Solutions unveils the new GELID Liquid 240 Ultimate AIO CPU Cooler as a product of the GELID Solutions GAMER product line. The epitome of superior liquid cooling technologies the GELID Liquid 240. Ultimate cooling performance is provided by its premium-class high-density radiator, connected with two 120 mm quiet fans (Smart ARGB PWM control) and high-class water pump with the most demanding modern needs being handled by the integrated cooling.

The low noise water pump includes a temperature display. Further the 2 ARGB PWM Fans provide 750-1800 RPM and low noise level at 29.6dBA, AIO240 is the masterpiece of top-notch liquid cooling technologies. The all-in-one cooling handles the latest requirements, even the most powerful LGA 1700 CPU from Intel( ) and AM5 from AMD, a truely multi compatible All-in-One CPU water cooler. The support of TDP over 240 W makes the GELID Liquid 240 an overkill CPU AIO cooling solution for pro gamers and overclockers.